CN212860288U

CN212860288U - Adhesive removing device for surface mount diode

Info

Publication number: CN212860288U
Application number: CN202021453025.4U
Authority: CN
Inventors: 曾尚文; 陈久元; 杨利明; 李洪贞
Original assignee: Sichuan Jinghui Semiconductor Co ltd
Current assignee: Sichuan Jinghui Semiconductor Co ltd
Priority date: 2020-07-22
Filing date: 2020-07-22
Publication date: 2021-04-02
Anticipated expiration: 2030-07-22

Abstract

The application provides a paster diode removes mucilage binding and puts includes: workstation, bed die and top die. A lifting device is arranged above the workbench; the lower die is arranged on the workbench and is positioned below the lifting device, the lower die is provided with a template, the template is provided with an avoidance groove and a plurality of parallel-arrayed grooves, and a supporting surface is arranged between every two adjacent grooves; go up the mould and include fixed plate and connecting plate, the fixed plate connect in the elevating gear push rod, a plurality of drifts are worn to be equipped with by the connecting plate, the drift is in the projection of bed die bottom surface is in dodge in groove or the recess. The efficiency and the quality of the degumming have been effectually improved, the operator working strength can also be reduced and the eyesight damage is avoided, and the drift adopts single design and installation, changes after being convenient for wear and tear.

Description

Adhesive removing device for surface mount diode

Technical Field

The utility model belongs to diode production field especially relates to a paster diode removes mucilage binding and puts.

Background

After die bonding, soldering and packaging processes of the chip diode are completed, a main pouring channel for packaging liquid flowing and a plurality of auxiliary pouring channels for connecting each chip diode package body are formed on the lead frame, and all the pouring channels need to be removed before the diode is punched and cut from the lead frame. At present, the glue is removed by adopting a manual removing mode, so that the efficiency is lower; the glue removal quality is inconsistent, and a small amount of residue exists; because the same lead frame can be densely distributed with a plurality of diodes and auxiliary pouring channels, the eyes of operators are tested, and the eyesight of the operators is easily damaged.

SUMMERY OF THE UTILITY MODEL

For solving prior art not enough, the utility model provides a paster diode removes mucilage binding and puts utilizes the principle of punching press to remove gluey, removes to glue efficiently, and the quality uniformity is good moreover, can effectively reduce operator's intensity of labour.

In order to realize the purpose of the utility model, the following scheme is proposed:

a paster diode removes mucilage binding and puts includes: workstation, bed die and top die.

A lifting device is arranged above the workbench;

the lower die is arranged on the workbench and is positioned below the lifting device, the lower die is provided with a template, the template is provided with an avoidance groove and a plurality of parallel-arrayed grooves, and a supporting surface is arranged between every two adjacent grooves;

go up the mould and include fixed plate and connecting plate, the fixed plate connect in the elevating gear push rod, a plurality of drifts are worn to be equipped with by the connecting plate, the drift is in the projection of bed die bottom surface is in dodge in groove or the recess.

Furthermore, the lower die is provided with a limiting groove, the template is arranged in the limiting groove, the bottom surface of the limiting groove is provided with a discharge hole, and the bottom of the workbench is provided with a discharge pipe corresponding to the discharge hole.

Furthermore, a plurality of limiting pads are arranged on the upper surface of the lower die.

Furthermore, the workbench is provided with a pair of guide rods, the guide rods penetrate through the lower die, and the fixed plate is provided with guide holes corresponding to the guide rods.

Furthermore, a rectangular counter bore is formed in the contact surface of the connecting plate and the fixing plate, a knife hole is formed in the bottom of the rectangular counter bore, and the knife hole corresponds to the position, needing glue removal, of the diode.

Furthermore, the punch comprises a limiting head and a tool bit, the limiting head is located in the rectangular counter bore, the height of the limiting head is the same as the depth of the rectangular counter bore, and the tool bit penetrates through the tool bore.

Further, the punch is divided into a punch a and a punch b, wherein the punch a is used for removing the main pouring channel, and the punch b is used for removing the auxiliary pouring channel.

Furthermore, the lifting device adopts an air cylinder or a hydraulic cylinder or a motor.

Furthermore, a positioning pin is arranged between the fixing plate and the connecting plate.

The beneficial effects of the utility model reside in that:

1. the lifting device is utilized to drive the upper die to be matched with the lower die, and the main pouring channel and the auxiliary pouring channel on the lead frame are removed through the punch, so that the glue removing efficiency and quality are effectively improved, and the working strength of an operator can be reduced to avoid visual damage;

2. the punch is designed and installed singly, so that the punch is convenient to replace after being worn;

3. the workstation is equipped with row material pipe, is convenient for retrieve the vice sprue of getting rid of, and retention device's is clean and tidy, still can carry out recycle not only environmental protection but also reduction in production cost with the sprue.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

FIG. 1 illustrates a state diagram of use of the present application;

FIG. 2 shows the overall construction diagram of the present application;

FIG. 3 shows a bottom view of the present situation;

FIG. 4 shows the structure of the lower mold;

FIG. 5 shows the configuration of the upper mold;

FIG. 6 shows the manner in which the punch is mounted within the web;

FIG. 7 shows a top view of a chip diode prior to glue removal;

fig. 8 shows a block diagram of a chip diode after the removal of the primary runner.

The labels in the figure are: 10-workbench, 11-lifting device, 12-discharging pipe, 13-guide rod, 20-lower die, 21-template, 22-avoiding groove, 23-groove, 24-supporting surface, 25-limiting groove, 26-limiting pad, 30-upper die, 31-fixing plate, 311-guide hole, 32-connecting plate, 321-rectangular counter bore, 322-knife hole, 33-punch, 331-limiting head, 332-knife head, 34-punch a, 35-punch b, 36-positioning pin, 40-lead frame, 41-diode, 42-main pouring channel, 43-auxiliary pouring channel and 44-process hole.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are some embodiments of the present invention, not all embodiments.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the product of the present invention is usually placed when in use, and this is only for the convenience of description of the present invention and simplification of the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Examples

In order to facilitate understanding of the structure of the present application, the structure of the chip diode and the portion requiring glue removal will be briefly described with reference to fig. 7 and 8. The chip diode is formed by mounting a chip on the lead frame 40, soldering, and packaging, and then separating the diode 41 from the lead frame 40 to form a single chip diode, wherein the diodes 41 are regularly arranged on the lead frame 40. In the packaging process, a main gate 42 and a sub-gate 43 are formed on the lead frame 40, the main gate 42 connects the left and right diodes 41 of each layer by the main channel, the sub-gate 43 is provided between the adjacent diodes 41, and the diodes 41 on the left and right sides of the main gate 42 are communicated with the remaining diodes 41. To facilitate the detachment of the main runner 42, the lead frame 40 is provided with a process hole 44 on the surface contacting the main runner 42, and the main runner 42 can be ejected by a tool through the process hole 44.

As shown in fig. 1-6, a paster diode removes mucilage binding and puts, its characterized in that includes: table 10, lower mold 20, and upper mold 30:

specifically, a lifting device 11 is arranged above the workbench 10, and the lifting device 11 adopts an air cylinder or a hydraulic cylinder or a motor, and the air cylinder is adopted in the embodiment.

Specifically, the lower mold 20 is disposed on the working table 10 and located below the lifting device 11, the lower mold 20 is provided with a mold plate 21, the mold plate 21 is provided with an avoiding groove 22 and a plurality of parallel-arrayed grooves 23, and a supporting surface 24 is disposed between adjacent grooves 23. The lead frame 40 prevents the sub gate 43 from being positioned directly above the escape groove 22, the diode 41 from being in contact with the support surface 24, and the main gate 42 from being positioned above the escape groove 22 in the lower mold 20. After the glue is removed, the secondary runner 43 falls into the groove 23 and the primary runner 42 falls to the bottom of the escape groove 22.

Specifically, the upper mold 30 includes a fixing plate 31 and a connecting plate 32, the fixing plate 31 is connected to the push rod of the lifting device 11, the connecting plate 32 is provided with a plurality of punches 33 in a penetrating manner, the projections of the punches 33 on the bottom surface of the lower mold 20 are located in the avoiding grooves 22 or the grooves 23, and the punches 33 are used for flushing the main sprue channel 42 and the auxiliary sprue channel 43. Two positioning pins 36 are disposed between the fixing plate 31 and the connecting plate 32 to ensure the accurate position between the connecting plate 32 and the fixing plate 31.

The specific implementation process comprises the following steps: placing the lead frame 40 on the template 21 with the front surface facing downward, wherein the main pouring channel 42 is positioned in the avoiding groove 22; the lifting device 11 is started, the upper die 30 starts moving downwards, and the main pouring channel 42 and the auxiliary pouring channel 43 are punched away from the lead frame 40 through the punch 33.

Preferably, the lower mold 20 is provided with a limiting groove 25, a projection profile of the limiting groove 25 on the bottom surface of the lower mold 20 is the same as the outer profile of the lead frame 40, and the limiting groove 25 is used for limiting the processing position of the lead frame 40. The template 21 is arranged in the limiting groove 25, a discharge hole is formed in the bottom surface of the limiting groove 25, a discharge pipe 12 is arranged at the bottom of the workbench 10 corresponding to the discharge hole, the flushed auxiliary pouring channel 43 is recovered through the discharge hole and the discharge pipe 12, the main pouring channel 42 is a whole with a large structure and is inconvenient to discharge from the discharge pipe 12, after the glue of the lead frame 40 is removed, the lead frame 40 and the main pouring channel 42 are taken out from the upper side of the lower die 20, and at the moment, only the diode 41 is left on the lead frame 40.

Preferably, the lower mold 20 is provided at an upper surface thereof with a plurality of position limiting pads 26, and the height of the position limiting pads 26 is a minimum distance that the upper mold 30 can approach the lower mold 20, so as to prevent the upper mold 30 from descending beyond a predetermined height and causing damage to the product.

Preferably, workstation 10 is equipped with a pair of guide bar 13, guide bar 13 accessible threaded connection or interference fit's mode is installed in workstation 10, guide bar 13 is the cylinder pole, guide bar 13 passes lower mould 20, guiding hole 311 has been seted up to fixed plate 31 corresponding guide bar 13, in operation, go up mould 30 downstream, guide bar 13 inserts guiding hole 311 before beginning to remove gluey, the laminating position of accurate control cope match-plate pattern 30 and lower bolster 20, prevent the skew and cause the damage of paster diode or remove gluey thoroughly inadequately.

Preferably, a rectangular counter bore 321 is formed in a surface, which contacts the fixing plate 31, of the connecting plate 32, a cutter hole 322 is formed in the bottom of the rectangular counter bore 321, and the cutter hole 322 is arranged corresponding to a position, which needs to be subjected to glue removal, on the diode. The punch 33 comprises a limiting head 331 and a tool bit 332, the limiting head 331 is located in the rectangular counter bore 321, the height of the limiting head 331 is the same as the depth of the rectangular counter bore 321, the projection profile of the limiting head 331 is greater than the profile of the tool hole 322, the limiting head 331 can be of a cylindrical structure or a polygonal cylindrical structure, the tool bit 332 penetrates through the tool hole 322, and the tool bit 332 and the tool hole 322 are in clearance fit. When the punch 33 is first installed or replaced, the punch 33 is simply inserted into the tool hole 322, and then the connecting plate 32 is installed on the fixing plate 31, with the top of the stopper 331 contacting the bottom surface of the fixing plate 31.

More specifically, the punch 33 is divided into a punch a34 and a punch b35, the punch a34 is disposed corresponding to the escape groove 22 for removing the main gate runner, and the cutting head 332 of the punch a34 can pass through the process hole 44; punch b35 is positioned to correspond to groove 23 for removing the secondary runner, and the width of cutting tip 332 of punch b35 is less than the spacing between adjacent diodes 41.

The foregoing is only a preferred embodiment of the invention and is not intended to be the only or limiting embodiment of the invention. It should be understood by those skilled in the art that various changes and equivalent substitutions made herein may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a paster diode removes mucilage binding and puts which characterized in that includes: a table (10), a lower mold (20), and an upper mold (30):

a lifting device (11) is arranged above the workbench (10);

the lower die (20) is arranged on the workbench (10) and is positioned below the lifting device (11), the lower die (20) is provided with a template (21), the template (21) is provided with an avoidance groove (22) and a plurality of parallel-arrayed grooves (23), and a supporting surface (24) is arranged between every two adjacent grooves (23);

go up mould (30) including fixed plate (31) and connecting plate (32), fixed plate (31) connect in elevating gear (11) push rod, a plurality of drifts (33) are worn to be equipped with by connecting plate (32), drift (33) are in the projection of lower mould (20) bottom surface is in dodge in groove (22) or recess (23).

2. The device for removing glue from a surface-mounted diode according to claim 1, wherein the lower die (20) is provided with a limiting groove (25), the template (21) is arranged in the limiting groove (25), a discharge hole is formed in the bottom surface of the limiting groove (25), and a discharge pipe (12) is arranged at the bottom of the workbench (10) corresponding to the discharge hole.

3. A device as claimed in claim 1, wherein the lower mold (20) has a plurality of position-limiting pads (26) on its upper surface.

4. The adhesive removing device for the chip diode according to claim 1, wherein the worktable (10) is provided with a pair of guide rods (13), the guide rods (13) penetrate through the lower die (20), and the fixing plate (31) is provided with guide holes (311) corresponding to the guide rods (13).

5. The adhesive removing device for the chip diode according to claim 1, wherein a rectangular counter bore (321) is formed in the surface of the connecting plate (32) contacting the fixing plate (31), a knife hole (322) is formed in the bottom of the rectangular counter bore (321), and the knife hole (322) is arranged corresponding to the position of the diode needing adhesive removing.

6. The adhesive removing device for the chip diode according to claim 5, wherein the punch (33) comprises a limiting head (331) and a cutter head (332), the limiting head (331) is located in the rectangular counterbore (321), the height of the limiting head (331) is the same as the depth of the rectangular counterbore (321), and the cutter head (332) penetrates through the cutter hole (322).

7. Glue removing device for chip diodes according to claim 1 or 5, characterised in that the punch (33) is divided into a punch a (34) and a punch b (35), the punch a (34) being used to remove the primary runner and the punch b (35) being used to remove the secondary runner.

8. A patch diode glue removing device according to claim 1 or 5, characterized in that the lifting device (11) adopts a cylinder or a hydraulic cylinder or a motor.

9. A patch diode glue removing device according to claim 1 or 5, characterized in that a positioning pin (36) is arranged between the fixing plate (31) and the connecting plate (32).