WO2009025471A2 - Apparatus for attaching adhesion film for manufacturing semiconductor packages - Google Patents

Apparatus for attaching adhesion film for manufacturing semiconductor packages Download PDF

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Publication number
WO2009025471A2
WO2009025471A2 PCT/KR2008/004740 KR2008004740W WO2009025471A2 WO 2009025471 A2 WO2009025471 A2 WO 2009025471A2 KR 2008004740 W KR2008004740 W KR 2008004740W WO 2009025471 A2 WO2009025471 A2 WO 2009025471A2
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WO
WIPO (PCT)
Prior art keywords
adhesive film
suction plate
dual
subplate
attaching
Prior art date
Application number
PCT/KR2008/004740
Other languages
French (fr)
Other versions
WO2009025471A4 (en
WO2009025471A3 (en
Inventor
Hyun Gyun Jung
Young Hyun Kim
Kyoung Hyun Shin
Hae Geun Jung
Dong Ki Jang
Original Assignee
Hanmi Semiconductor Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co., Ltd. filed Critical Hanmi Semiconductor Co., Ltd.
Publication of WO2009025471A2 publication Critical patent/WO2009025471A2/en
Publication of WO2009025471A3 publication Critical patent/WO2009025471A3/en
Publication of WO2009025471A4 publication Critical patent/WO2009025471A4/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0047—Preventing air-inclusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a semiconductor package manufacturing apparatus, and more particularly to an apparatus for adhesive film attachment in manufacturing semiconductor packages, which is included in a semiconductor package manufacturing apparatus, and automatically attaches a dual- faced adhesive film for attachment of the second subplate onto an upper surface of a lead frame (hereinafter, referred to as "material") attached to a first subplate, so that the semiconductor package manufacturing apparatus can attach the second subplate to the lead frame, which has been attached to the first subplate and has undergone a predetermined package manufacturing process, and separate the first subplate from the lead frame.
  • material hereinafter, referred to as "material"
  • a semiconductor package is manufactured in such a manner that a plurality of semiconductor chips, at which a high integrated circuit, such as a transistor, a capacitor, etc. is formed, are attached to a lead frame, and these semiconductor chips are electrically connected with a pad of the lead frame through a wire bonding process and are molded by resin, and semiconductor packages on the lead frame are cut into each package unit through a singulation process so as to be individualized.
  • a lead frame for forming a semiconductor package is made from conductive metal having a thin thickness. Therefore, if the size of the lead frame becomes larger, it is possible that the lead frame is easily bent during processes.
  • a large sized lead frame is sequentially attached to a plurality of reinforcing subplates for providing sufficient strength, and predetermined processes are performed while moving the lead frame on the reinforcing subplates to each position for a corresponding process.
  • the present invention has been made so as to implement a new packaging technique as described above, and it is an object of the present invention to provide an apparatus for attaching an adhesive film for manufacturing semiconductor packages, which can automatically and rapidly attach a dual-faced adhesive film, which is used for adhering a second subplate, to one surface of a lead frame (hereinafter, referred to as 'material'), which has been attached to a first subplate and has undergone a predetermined package manufacturing process.
  • an apparatus for attaching an adhesive film for manufacturing semiconductor packages comprising: a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuum suction of an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.
  • a lower liner and an upper liner of a dual-faced adhesive film are exfoliated so that the dual-faced adhesive film is rapidly and strongly attached to an upper surface of an attachment- object, i.e. an upper surface of material attached to a first subplate. Accordingly, a series of operational processes of attaching a second subplate can be automatically and rapidly performed. Therefore, there is an advantage in that a semiconductor package manufacturing process is automatically and rapidly performed so that productivity can be improved, and manufacturing unit cost can be reduced.
  • FIG. 1 is a schematic plane view of a semiconductor package manufacturing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a sectional view of a main body of a loading part of the semiconductor package manufacturing apparatus shown in FIG. 1, in which the main body is shown in a side direction of the loading part;
  • FIG. 3 is a side view illustrating a structure of a transfer of the semiconductor package manufacturing apparatus shown in FIG. 1 ;
  • FIGs. 4 to 15 are side sectional views the structure of a main body of an adhesive film attaching part included in the semiconductor package manufacturing apparatus shown in FIG. 1, in which operation of the adhesive film attaching part is sequentially shown;
  • FIG. 16 is a side view illustrating a main part of an adhesive film attaching apparatus of the adhesive film attaching part shown in FIG. 4;
  • FIG. 17 is a bottom view of a suction plate of the adhesive film attaching apparatus shown in FIG. 16;
  • FIG. 18 is a view illustrating a procedure for attaching a dual faced adhesive film to material at the suction plate shown in FIG. 17;
  • FIGs. 19 and 20 are views illustrating a state where a lower liner is exfoliated from the dual faced adhesive film attached to the adhesive film attaching apparatus shown in FIG. 16, in which an enlarged view of the state is shown;
  • FIGs.21A to 21C are schematic sectional views of each main body of a first pressing roller and the adhesive film attaching apparatus, in which relative operation between the first pressing roller, which allows a lower liner of the dual-faced adhesive film attached to the adhesive film attaching apparatus shown in FIG. 16 to be smoothly exfoliated, and the adhesive film attaching apparatus is sequentially shown.
  • Mode for the Invention
  • the semiconductor package manufacturing apparatus includes: a main body 10; a loading part 100, which picks out a first subplate Sl having material L laminated on an upper surface thereof from a magazine Ml so as to supply the first subplate Sl to a side position for a subsequent process; an adhesive film attaching part 200 for attaching a dual-face adhesive film F for adhesion to an upper surface of material L of the first subplate Sl -material L laminated body, which is transmitted from the loading part 100; a second subplate attaching part 300 for attaching a second subplate S2 on an upper surface of the material L of the first subplate Sl transmitted from the adhesive film attaching part 200; a first subplate separate part 400 for separating the first subplate S 1 and the material L from each other by heating the first subplate Sl
  • FIGs. 2 and 3 illustrate the structure of the loading part 100.
  • a laminated body stacking part 110 at which the magazine Ml is positoned, is arranged at the loading part 100, and the material L- first subplate Sl laminated body is vertically received into the magazine Ml with predetermined intervals.
  • An elevator 11 l (See FIG. 1), which allows the magazine Ml to perform elevation movement toward a certain upper or lower position, is included in the laminated body stacking part 110.
  • the elevator 111 may include an elevation plate 112, on which the magazine Ml is seated, and a Z axis linear movement device including a Z axis ball screw (not shown), a Z axis motor (not shown), and a Z axis guide rail 113 so as to move the elevation plate 112 to move in up and down directions.
  • a Z axis linear movement device including a Z axis ball screw (not shown), a Z axis motor (not shown), and a Z axis guide rail 113 so as to move the elevation plate 112 to move in up and down directions.
  • the material L of the material L- first subplate Sl laminated body is in a state where a predetermined packaging process has been performed, and has a circular shape.
  • the first subplate Sl is made from insulating hard material and has a rectangular shape.
  • the material L is attached on an upper surface of the first subplate Sl by a plurality of dual-faced tapes, and one piece of tape among the plurality of dual faced tapes has a property that it is melted by heat so that its adhesive property is removed.
  • the loading part 100 includes: a first pick-out plate 120, which is installed at the main body 10 in such a manner that it can horizontally move in a Y axial direction so as to pick out the material L-first subplate S 1 laminated body from the magazine Ml of the laminated body stacking part 110; a pair of X axis guide rails 130 where the material L-first subplate Sl laminated body picked out by the first pick-out plate 120 is seated and is movably supported; a plurality of first support bars 140 (the number of which is four in the present embodiment), which are installed between the X axis guide rails 130 in such a manner that they can move in up and down directions so that first support bars 140 receive the material L-first subplate Sl laminated body from the first pick-out plate 120 so as to seat it on the axis guide rails 130; and a transfer 150 installed between the X axis guide rails 130 in such a manner that it can move in an X axial direction so as to transmit the material
  • the first pick-out plate 120 is structured in such a manner that it performs horizontal movement in a Y axial direction by a Y axis linear movement device including a Y axis ball screw (not shown), a Y axis motor (not shown), a Y axis guide frame 125, etc. Also, the first pick-out plate 120 has an oblong shape having a width smaller than each interval between the first support bars 140.
  • a position decision stepped jaw 121 is formed at an upper surface of the first pick-out plate 120 while having a step, the position decision stepped jaw 121 making contact with a front end of the first subplate Sl so as to decide a position of the first subplate S 1 respective to the first pick-out plate 120 when the first pick-out plate 120 enters the inner side of the magazine M of the laminated body stacking part 110 so as to extract the material L-first subplate Sl laminated body.
  • a plurality of vacuum holes 122 for vacuously sucking a lower surface of the first subplate Sl so as to fix it are formed at the first pick-out plate 120.
  • Each X axis guide rail 130 extends from the loading part 100 to the adhesive film attaching part 200 and the second subplate attaching part 300 so as to perform an operation of guiding movement of the first subplate S 1 in the X axial direction.
  • a plurality of vertical rollers 131 and a plurality of horizontal rollers 132 are installed at inner side surface and upper surface of the axis guide rails 130, respectively, in such a manner that they can freely rotate.
  • a lower surface of the first subplate Sl is seated on the vertical rollers 131, and the horizontal rollers 132 guide movement of the first subplate Sl while performing rolling movement in contact with front, rear, side parts of the first subplate Sl.
  • first support bars 140 support and elevate each corner of the first subplate
  • a Z axis linear movement device such as a ball screw 142 installed at a lower part of the main body 10 in such a manner that it extends in the Z axial direction and a motor 143 for rotating the ball screw 142.
  • the transfer 150 includes: a moving member 151, which has an rectangular shape and is horizontally moved in the X axial direction by a conventional X axis linear movement device 160 installed between the X axis guide rails 130; a clamp block 153, which is movably installed at the other end of the fixing block 152 so as to support both side surfaces of the first subplate Sl seated on the X axis guide rails 130, together with the fixing block 152.
  • the clamp block 153 pushes one side of the first subplate Sl toward the fixing block 152 while performing horizontal movement through a pneumatic cylinder 154 so that the first subplate Sl is stably supported between the clamp block 153 and the fixing block 152.
  • the adhesive film attaching part 200 includes: a first work table 210, at which the material L- first subplate Sl laminated body transmitted by the transfer 150 of the loading part 100 is seated and fixed; an adhesive film stacking part 220, on which dual-faced adhesive films F to be attached on the material L are stacked; a first detaching part 230 for removing a lower liner BL (see FIG.
  • an adhesive film attaching apparatus 250 which is installed at an upper side of the adhesive film attaching part 200 in such a manner that it can move in Y and Z axial directions so as to transmit a dual-faced adhesive film F and attach it onto the material L; and a second detaching part 240, which is installed at one side of the adhesive film attaching apparatus 250 so as to remove an upper liner UL (see FIG. 15) of the dual- faced adhesive film F, which is attached on the material L of the first work table 210, while moving together with the adhesive film attaching apparatus 250.
  • a liner collecting box 260 for collecting liners separated from the dual- faced adhesive film F is installed at one side of the first detaching part 230.
  • the first work table 210 has a structure divided into two blocks so as to allow the transfer 150 to move and performs elevation movement in up and down directions through a Z axis linear movement device, such as a ball screw 214 installed at a lower part of the main body 10 in such a manner that it extends in the Z axial direction and a motor 215 for rotating the ball screw 214.
  • the non-described numeral reference 213 are guide shafts, which perpendicularly extend from the lower part of the first work table 210 and have each lower part connected with the Z axis linear movement device so as to be elevated in up and down directions.
  • a plurality of vacuum holes and a vacuum pad 212 are formed at an upper surface of the first work table 210 so as to vacuously suck a lower surface of the first subplate S 1 and fix it.
  • a plurality of arrangement pushers 216 which presses the first subplate Sl toward other X axis guide rail 130 so as to arrange the position of the first subplate Sl, is included at an X axis guide rail 130 positioned at one side of the first work table 210 in such a manner that it can be horizontally moved by a pneumatic cylinder.
  • Each dual-faced adhesive film F stacked on the adhesive film stacking part 220 has a circular shape and a size corresponding to the material L and has upper and lower liners UL and BL (see FIG. 20) for protecting an adhesive layer AL (see FIG. 20), which are attached on upper and lower surfaces thereof, respectively.
  • the first detaching part 230 allows a separate detachable tape (DT) having an adhesive property to make contact with an end of the lower liner BL of the dual-faced adhesive film F sucked in the adhesive film attaching apparatus 250 so that the end of the lower liner BL is detached from a contact surface of the dual- faced adhesive film F. Then, the first detaching part 230 allows the adhesive film attaching apparatus 250 to move in a state where the detached end of the lower liner is fixedly caught so that the lower liner BL is detached from the dual-faced adhesive film F.
  • DT detachable tape
  • the first detaching part 230 includes: a first feeding roller 231, on which a non-used DT is rolled up; a first pressing roller 232, which is installed at the main body 10 (see FIG. 1) in such a manner that it can be elevated with a predetermined distance in up and down directions, and allows the DT released from the first feeding roller 231 to pass therethrough; a first recovery roller 233, by which the DT released through the first pressing roller 232 after use is rolled; and a first liner gripper 235, which is installed at one side of the first pressing roller 232 so as to firmly grip one end of the lower liner separated from the dual-faced adhesive film F sucked into the adhesive film attaching apparatus 250 positioned at upper part of the apparatus.
  • the first recovery roller 233 After performing a liner detaching operation, the first recovery roller 233 allows the
  • a non-used DT is always provided on an outer circumferential surface of the first pressing roller 232.
  • the first pressing roller performs elevation movement with a predetermined distance in up and down directions through a linear movement device, such as a pneumatic cylinder 234, and allows the DT to make contact with the lower liner BL of the dual- faced adhesive film F immobilized in the adhesive film attaching apparatus 250.
  • a linear movement device such as a pneumatic cylinder 2344
  • the first liner gripper 235 includes a fixed gripper 236 fixed in the main body
  • a movable gripper 237 which is installed at one side of the fixed gripper 236 in such a manner that it horizontally moves so as to grip one end of a liner, together with the fixed gripper 237, and a pneumatic cylinder 238 that allows the movable gripper 237 to perform horizontal and reciprocating movement.
  • the fixed gripper 236 and the movable gripper 237 have each end part shaped similar to a 'U'.
  • the first pressing roller 232 makes contact with an end of the lower liner BL of the dual-faced adhesive film F while moving in up and down directions through an opened central part between the fixed gripper 236 and the movable gripper 237.
  • the second detaching part 240 includes a mount block 249 assembled with the horizontal movement block 251 of the adhesive film attaching apparatus 250 so as to move together with the adhesive film attaching apparatus 250, and has a configuration similar to the configuration of the first detaching part 230.
  • the second detaching part 240 includes a second feeding roller 241 supplying a DT for detaching the upper liner UL from the dual-faced adhesive film F while making contact with an end of the upper liner UL, a second pressing roller 242, a second recovery roller 243, and a second liner gripper 245 for gripping the end of the detached upper liner UL.
  • the second liner gripper 245 includes a fixed gripper 246 fixed in a lower end of the mount block 249 and a movable gripper 247 installed at one side of the fixed gripper 246 in such a manner that it is horizontally moved by a pneumatic cylinder 248 so as to grip the end of the upper liner, together with the fixed gripper 246.
  • the adhesive film attaching apparatus 250 vacuously holds a dual-faced adhesive film from the adhesive film stacking part 220 so as to transmit the film to the first detaching part 230 and transmits the dual-faced adhesive film, from which the lower liner has been detached at the first detaching part 230, to the first work table 210 so as to attach the film to the material L.
  • the adhesive film attaching apparatus 250 includes: a horizontal movement block
  • the suction plate 253 is rotated about a hinge shaft 253 a with a predetermined angle by a pneumatic cylinder 253b installed at one side of the head block 252 so that the suction plate 253 is slanted with a predetermined angle respective to a horizontal plane when the dual-faced adhesive film F is attached on an upper surface of the material L.
  • the suction plate 253 is slanted so as to allow the attaching roller 258 to be positioned at the lowest side (see FIG. 10).
  • a plurality of vacuum holes 254A, 254B, 254C for vacuously sucking a dual-faced adhesive film F is formed at a lower surface of the suction plate 253.
  • the vacuum holes are arranged along the peripheral part of the suction plate 253 in a circumferential direction.
  • the vacuum holes include a first vacuum hole group 254A and a second vacuum hole group 254B, which are formed at one side of the suction plate 253, particularly, at one side opposite to the attaching roller 258 so as to vacuously suck one side part of the dual- faced adhesive film F.
  • the third vacuum hole group 254C for strongly and vacuously sucking one side end of the dual-faced adhesive film F is formed at an outer side of the second vacuum hole group 254B.
  • the part where the third vacuum hole group 254C is formed is a part where the lower liner starts to be exfoliated in such a manner that the DT of the first detaching part 230 makes contact with the lower liner. Therefore, in order to allow only one end of the lower liner, and not the whole dual-faced adhesive film F, to be exfoliated when the lower liner is exfoliated by making contact with such DT, the end of the dual-faced adhesive film F has to be fixedly immobilized.
  • vacuum holes 254C- 1 of the third vacuum hole group 254C are formed at very close intervals.
  • First vent holes 254C-2 which extend toward the outside of the suction plate 253, are formed at each vacuum hole 254C- 1 in such a manner that they communicate with the outside Therefore, when vacuum pressure is generated through the vacuum hole 254C- 1 of the third vacuum hole group 254C, outer air is introduced through the first vent holes 254C-2, and the end part of the dual- faced adhesive film F is fixedly sucked by the negative pressure of inflow air.
  • the third vacuum hole group 254c having the first vent hole 254C-2 is formed at the end of the suction plate 253 so that the end part of the upper liner of the dual-faced adhesive film F can be firmly fixed.
  • a tape which allows the end of the upper liner of the dual-faced adhesive film F to be adhered and fixed, is mounted at the end part of the suction plate 253 so that it is possible to prevent the upper liner UL together with the lower liner BL from being detached when the lower liner BL is detached from the first detaching part 230.
  • a stopper 257 roughly shaped similar to an 'L' is assembled with an end of the suction plate 253, at which the third vacuum hole group 254c is formed.
  • the stopper 257 makes contact with the DT so as to prevent the DT from making contact with the end of the upper liner UL in such a manner that the DT excessively presses the end of the dual- faced adhesive film F. As a result, the DT is prevented from detaching the upper liner.
  • a sensor (not shown), which senses a state of the dual-faced adhesive film F being sucked through pressure generated at a vacuum line, is installed at the vacuum line (not shown) where the vacuum holes 254C- 1 of the third vacuum hole group 254C are connected with each other.
  • an air-blower 259 which ejects high pressure air between the lower liner BL and the adhesive layer AL when the lower BL is detached from the dual-faced adhesive film F, may be assembled with a lower part of an outer side of the stopper 257.
  • the first pressing roller 232 is elevated so as to make contact with one inner point of an end part of the lower liner BL of the DT.
  • the suction plate 253 of the adhesive attaching apparatus 250 is horizontally moved in a left side based on the drawing.
  • the first pressing roller 232 is elevated downward with a predetermine degree, and the suction plate 253 of the adhesive attaching apparatus 250 is simultaneously moved to an original position.
  • the operation shown in FIG. 21 is repeatedly performed a predetermined number of times.
  • an eccentric vacuum hole 255 is formed at a position of a lower surface of the suction plate 253, the position being deviated toward the attaching roller 258 from the center of the lower surface.
  • a plurality of second vent holes 256 is formed at the eccentric vacuum hole 255 in such a manner that they radially extend or extend toward a side.
  • the second vent holes 256 are formed at a lower surface of the suction plate 253 while having each shape of an open channel, and have each end part extending toward an outer side of the suction plate 253 so as to suck outer air. Therefore, when vacuum pressure is generated through the eccentric vacuum hole 255, an inner surface of the dual-faced adhesive film F is vacuously sucked to a lower surface of the suction plate 253 while outer air is introduced through the second vent holes 256.
  • the eccentric vacuum hole 255 is closed by a shielding plate 255a fixed in the lower surface of the suction plate 253 so as to allow the eccentric vacuum hole 255 having a large diameter to be closed. Therefore, only second vent holes 265 are opened so that the uniform area of the vacuum channel is secured. As a result, the dual-faced adhesive film F is regularly sucked, and any part of the dual- faced adhesive film F is prevented from being wrinkled.
  • the second vent holes 256 perform a function of vacuously sucking and fixing the dual-face adhesive film F when the adhesive film attaching apparatus 250 transmits the dual-faced adhesive film F after vacuously sucking it, the second vent holes 256 also perform a function of maintaining a state where the dual-faced adhesive film F is uniformly unfolded and attached at the lower surface of the suction plate 253 when the adhesive film attaching apparatus 250 attaches the dual-face adhesive film F on an upper surface of the material L.
  • the adhesive film attaching apparatus 250 gradually adheres the dual-face adhesive film F to the material L in a direction from an end of one side of the dual-face adhesive film F to the whole part thereof while the attaching roller 258 presses the upper surface of the dual-faced adhesive film F, and the adhesive film attaching apparatus 250 is slowly and horizontally moved respective to the material L.
  • the dual-faced adhesive film F gradually slides along the lower surface of the suction plate 253. During this process, vacuum pressure is formed in a radial shape while outer air is sucked through each second vent hole 256. Therefore, the dual-faced adhesive film F is continuously unfolded on the lower surface of the suction plate 253, and a state of the dual-faced adhesive film F being sucked can be maintained. Accordingly, it is possible for the dual-faced adhesive film F to be uniformly adhered to the material L.
  • the attaching roller 258 is installed at a level a little higher than the lower surface of the suction plate 253 so as to secure better adhesion efficiency when the dual-faced adhesive film F is adhered. This is because the dual-face adhesive film F is adhered to the material in a state where the dual-face adhesive film F is unfolded without winkles while maintaining a state of an end of the suction plate 253 making complete contact with the upper surface of the dual-faced adhesive film F when the suction plate 253 is slanted.
  • a magazine Ml receiving a first subplate Sl -material L laminated body is elevated by an elevator 11 at a laminated body stacking part 110 of a loading part 100, and the first subplate Sl -material L laminated body of an inner side of the magazine Ml, which will be picked out, is arranged with the first pick-out plate 120.
  • the first pick-out plate 120 is moved toward the laminated body stacking part 110 along a Y guide frame 125 by a Y axis linear movement device so as to enter the inner side of the magazine Ml. Then, the first pick-out plate 120 vacuously sucks the first subplate Sl -material L laminated body so as to pick it out of the magazine Ml and arranges the first subplate Sl -material L laminated body at an upper side of the X axis guide rail 130.
  • vacuum pressure of the first pick-out plate 120 is released, and simultaneously, a first support bar 140 moves up with a predetermined distance so as to lift the first subplate Sl -material L laminated body on the first pick-out plate 120. Subsequently, the first pick-out plate 120 moves back in the Y axial direction and moves toward an outer side of the first subplate Sl-mateirial L laminated body. Also, the first support bar 140 moves down so as to allow the first subplate Sl -material L laminated body to be seated on the X axis guide rail 130. Simultaneously, a clamp block 153 (see FIG. 3) of a transfer 150 moves toward a fixed block 152 (see FIG. 3) so that the first subplate Sl is supported in such a manner that it is fixed in the transfer 150.
  • the first subplate Sl -material L laminated body is smoothly moved in a horizontal direction while both side edges of the first subplate S 1 are guided by the vertical roller 131 and the horizontal roller 132 of the X axis guide rail 130.
  • the transfer 150 moved to the adhesive film attaching part 200 is stopped at the upper side of the first work table 210.
  • the arrangement pusher 216 is operated by a pneumatic cylinder so as to push on edge of one side of the first subplate S 1 in the Y axial direction.
  • an edge of the other side of the first subplate S 1 is pressed by the X axis guide rail 130 so that the position of the first subplate Sl -material L laminated body is arranged.
  • the degree of elevation of the first work table 210 is a degree allowing the lower surface of the first subplate Sl to be positioned at a position lower than an upper end of the horizontal roller 132 (see FIG. 2) of the axis guide rail 130.
  • the adhesive film attaching apparatus 250 of the adhesive film attaching part 200 is moved down from the upper side of the adhesive film stacking part 220 so as to vacuously suck a dual-faced adhesive film F. Then, the film attaching apparatus 250 is again moved up so as to move to the first detaching part 230. At this time, the upper liner UL of the dual- faced adhesive film F is sucked to a lower surface of the suction plate 253 of the adhesive film attaching apparatus 250.
  • the adhesive film attaching apparatus 250 is moved to the first detaching part 230 and is stopped at a predetermined position, as shown in FIG. 7, the first pressing roller 232 of the first detaching part 230 is elevated with a predetermined distance through a 'U'-shaped space of the first liner gripper 235. Accordingly, the DT makes contact with an end of one side of the dual-faced adhesive film F, particularly with an end of a lower liner of a part corresponding to the third vacuum hole group 254c (see FIG. 21) of the suction plate 253.
  • vacuum pressure is not formed through a vacuum line (not shown) of the third vacuum hole group 254c, and a sensor (not shown) installed at the vacuum line (not shown) senses the fact that the vacuum pressure is not formed so as to allow the user to take a predetermined measurement.
  • the reason why the dual-faced adhesive film F can slide while maintaining a state of the dual-faced adhesive film F being continuously sucked to the suction plate 253 in a unfolded state is that vacuum pressure is uniformly applied to the dual-faced adhesive film F through the second vent holes 256 formed at the lower surface of the suction plate 253 toward a side thereof or in a radial shape (see FIG. 18).
  • the attaching roller 258 attaches the dual-faced adhesive film F to the material L in such a manner that the attaching roller 259 allows dual-faced adhesive film F sequentially to make linear contact with the material L in a direction from one end of the film F to the whole part thereof, air flowing into an interface between the dual-faced adhesive film F and the material L in the process of attaching the dual-faced adhesive film F can be prevented. Therefore, there is an advantage in that defects in adhesion can be prevented.
  • the suction plate 253 rotates about the hinge shaft 253a so as to be transmitted to an original position in a horizontal state. Also, the adhesive film attaching apparatus 250 and the second detaching part 240 horizontally move in the Y axial direction so that the second pressing roller 242 of the second detaching part 240 is arranged at an upper side of one end of the material L.
  • the second pressing roller 242 moves downward so that the DT makes contact with an end of the upper liner UL of the dual-faced adhesive film F attached to the material L through space of the second liner gripper 245.
  • the second detaching part 240 performs a horizontal and reciprocal movement with a predetermined distance in the Y axial direction
  • the second pressing roller 242 performs rolling movement along the upper surface of the material L so as to allow the end of the upper liner UL to be detached a little by the DT.
  • the movable gripper 247 moves toward the fixed gripper 246 so as to firmly grip the detached end of the upper liner UL.
  • the first work table 210 moves down so that the first subplate Sl -material L laminated body is seated on the X axis guide rail 130. Also, the transfer 150 is moved by the X axis linear movement device in the X axial direction so as to transfer the first subplate Sl -material L laminated body to the upper side of a second work table 310 of the second subplate attaching part 300.
  • An apparatus for attaching an adhesive film for manufacturing semiconductor packages accordingly to the present invention can be used for rapidly and firmly attaching an adhesive film (particularly, a dual-faced adhesive film) to an attachment object in a semiconductor package manufacturing apparatus.

Abstract

Disclosed is an apparatus for attaching an adhesive film for manufacturing a semiconductor package, which automatically perform a process of attaching an adhesive film, which is used for adhesion of a different subplate, on one surface of a lead frame attached on a subplate. The apparatus includes a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.

Description

Description
APPARATUS FOR ATTACHING ADHESION FILM FOR MANUFACTURING SEMICONDUCTOR PACKAGES
Technical Field
[1] The present invention relates to a semiconductor package manufacturing apparatus, and more particularly to an apparatus for adhesive film attachment in manufacturing semiconductor packages, which is included in a semiconductor package manufacturing apparatus, and automatically attaches a dual- faced adhesive film for attachment of the second subplate onto an upper surface of a lead frame (hereinafter, referred to as "material") attached to a first subplate, so that the semiconductor package manufacturing apparatus can attach the second subplate to the lead frame, which has been attached to the first subplate and has undergone a predetermined package manufacturing process, and separate the first subplate from the lead frame. Background Art
[2] In general, a semiconductor package is manufactured in such a manner that a plurality of semiconductor chips, at which a high integrated circuit, such as a transistor, a capacitor, etc. is formed, are attached to a lead frame, and these semiconductor chips are electrically connected with a pad of the lead frame through a wire bonding process and are molded by resin, and semiconductor packages on the lead frame are cut into each package unit through a singulation process so as to be individualized.
[3] As fierce competition has been recently caused in a semiconductor field, new packaging techniques for forming a further large number of semiconductor packages on a large-sized lead frame so as to reduce manufacturing cost of a semiconductor package and increase productivity thereof have been developed.
[4] However, a lead frame for forming a semiconductor package is made from conductive metal having a thin thickness. Therefore, if the size of the lead frame becomes larger, it is possible that the lead frame is easily bent during processes.
[5] Therefore, in order to apply such a new packaging technique, a large sized lead frame is sequentially attached to a plurality of reinforcing subplates for providing sufficient strength, and predetermined processes are performed while moving the lead frame on the reinforcing subplates to each position for a corresponding process.
[6] However, in a conventional semiconductor package manufacturing process, there has been no process for moving a lead frame attached to any one subplate to another subplate and mounting the lead frame thereon so that an apparatus for automatically performing such a process has not been developed or used yet. Disclosure of Invention Technical Problem
[7] Therefore, the present invention has been made so as to implement a new packaging technique as described above, and it is an object of the present invention to provide an apparatus for attaching an adhesive film for manufacturing semiconductor packages, which can automatically and rapidly attach a dual-faced adhesive film, which is used for adhering a second subplate, to one surface of a lead frame (hereinafter, referred to as 'material'), which has been attached to a first subplate and has undergone a predetermined package manufacturing process. Technical Solution
[8] According to an aspect of the present invention, there is provided an apparatus for attaching an adhesive film for manufacturing semiconductor packages, the apparatus comprising: a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuum suction of an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.
Advantageous Effects
[9] According to the present invention, a lower liner and an upper liner of a dual-faced adhesive film are exfoliated so that the dual-faced adhesive film is rapidly and strongly attached to an upper surface of an attachment- object, i.e. an upper surface of material attached to a first subplate. Accordingly, a series of operational processes of attaching a second subplate can be automatically and rapidly performed. Therefore, there is an advantage in that a semiconductor package manufacturing process is automatically and rapidly performed so that productivity can be improved, and manufacturing unit cost can be reduced.
Brief Description of the Drawings
[10] FIG. 1 is a schematic plane view of a semiconductor package manufacturing apparatus according to an embodiment of the present invention;
[11] FIG. 2 is a sectional view of a main body of a loading part of the semiconductor package manufacturing apparatus shown in FIG. 1, in which the main body is shown in a side direction of the loading part;
[12] FIG. 3 is a side view illustrating a structure of a transfer of the semiconductor package manufacturing apparatus shown in FIG. 1 ;
[13] FIGs. 4 to 15 are side sectional views the structure of a main body of an adhesive film attaching part included in the semiconductor package manufacturing apparatus shown in FIG. 1, in which operation of the adhesive film attaching part is sequentially shown;
[14] FIG. 16 is a side view illustrating a main part of an adhesive film attaching apparatus of the adhesive film attaching part shown in FIG. 4;
[15] FIG. 17 is a bottom view of a suction plate of the adhesive film attaching apparatus shown in FIG. 16;
[16] FIG. 18 is a view illustrating a procedure for attaching a dual faced adhesive film to material at the suction plate shown in FIG. 17;
[17] FIGs. 19 and 20 are views illustrating a state where a lower liner is exfoliated from the dual faced adhesive film attached to the adhesive film attaching apparatus shown in FIG. 16, in which an enlarged view of the state is shown; and
[18] FIGs.21A to 21C are schematic sectional views of each main body of a first pressing roller and the adhesive film attaching apparatus, in which relative operation between the first pressing roller, which allows a lower liner of the dual-faced adhesive film attached to the adhesive film attaching apparatus shown in FIG. 16 to be smoothly exfoliated, and the adhesive film attaching apparatus is sequentially shown. Mode for the Invention
[19] Hereinafter, exemplary embodiments of an apparatus for attaching an adhesive film for manufacturing semiconductor packages according to the present invention will be described with reference to the accompanying drawings.
[20] Firstly, with reference to FIG. 1, one embodiment of a structure of a semiconductor package manufacturing apparatus, to which the adhesive film attaching apparatus according to the present invention is applied, will be described. The semiconductor package manufacturing apparatus according to the present invention, which is shown in FIG. 1, includes: a main body 10; a loading part 100, which picks out a first subplate Sl having material L laminated on an upper surface thereof from a magazine Ml so as to supply the first subplate Sl to a side position for a subsequent process; an adhesive film attaching part 200 for attaching a dual-face adhesive film F for adhesion to an upper surface of material L of the first subplate Sl -material L laminated body, which is transmitted from the loading part 100;a second subplate attaching part 300 for attaching a second subplate S2 on an upper surface of the material L of the first subplate Sl transmitted from the adhesive film attaching part 200; a first subplate separate part 400 for separating the first subplate S 1 and the material L from each other by heating the first subplate Sl -material L-second subplate S2 laminated body, which has been transmitted from the second subplate attaching part 300; and an off-loading part 500 for removing the remaining tape from the second subplate S2-material L Ia minated body, which has been transmitted from a first subplate separate part 400. A cleaning device for cleaning the second subplate S2-matierl L laminated body, from which the tape has been removed at the off-loading part 500, can be included in one side of the off-loading part 500.
[21] A main configuration of the semiconductor package manufacturing apparatus will be described below in detail.
[22] FIGs. 2 and 3 illustrate the structure of the loading part 100. A laminated body stacking part 110, at which the magazine Ml is positoned, is arranged at the loading part 100, and the material L- first subplate Sl laminated body is vertically received into the magazine Ml with predetermined intervals. An elevator 11 l(See FIG. 1), which allows the magazine Ml to perform elevation movement toward a certain upper or lower position, is included in the laminated body stacking part 110. The elevator 111 may include an elevation plate 112, on which the magazine Ml is seated, and a Z axis linear movement device including a Z axis ball screw (not shown), a Z axis motor (not shown), and a Z axis guide rail 113 so as to move the elevation plate 112 to move in up and down directions.
[23] Herein, the material L of the material L- first subplate Sl laminated body is in a state where a predetermined packaging process has been performed, and has a circular shape. Also, the first subplate Sl is made from insulating hard material and has a rectangular shape. The material L is attached on an upper surface of the first subplate Sl by a plurality of dual-faced tapes, and one piece of tape among the plurality of dual faced tapes has a property that it is melted by heat so that its adhesive property is removed.
[24] Also, the loading part 100 includes: a first pick-out plate 120, which is installed at the main body 10 in such a manner that it can horizontally move in a Y axial direction so as to pick out the material L-first subplate S 1 laminated body from the magazine Ml of the laminated body stacking part 110; a pair of X axis guide rails 130 where the material L-first subplate Sl laminated body picked out by the first pick-out plate 120 is seated and is movably supported; a plurality of first support bars 140 (the number of which is four in the present embodiment), which are installed between the X axis guide rails 130 in such a manner that they can move in up and down directions so that first support bars 140 receive the material L-first subplate Sl laminated body from the first pick-out plate 120 so as to seat it on the axis guide rails 130; and a transfer 150 installed between the X axis guide rails 130 in such a manner that it can move in an X axial direction so as to transmit the material L-first subplate S 1 laminated body along the X axis guide rails 130. [25] The first pick-out plate 120 is structured in such a manner that it performs horizontal movement in a Y axial direction by a Y axis linear movement device including a Y axis ball screw (not shown), a Y axis motor (not shown), a Y axis guide frame 125, etc. Also, the first pick-out plate 120 has an oblong shape having a width smaller than each interval between the first support bars 140. A position decision stepped jaw 121 is formed at an upper surface of the first pick-out plate 120 while having a step, the position decision stepped jaw 121 making contact with a front end of the first subplate Sl so as to decide a position of the first subplate S 1 respective to the first pick-out plate 120 when the first pick-out plate 120 enters the inner side of the magazine M of the laminated body stacking part 110 so as to extract the material L-first subplate Sl laminated body. Also, a plurality of vacuum holes 122 (see FIG. 1) for vacuously sucking a lower surface of the first subplate Sl so as to fix it are formed at the first pick-out plate 120.
[26] Each X axis guide rail 130 extends from the loading part 100 to the adhesive film attaching part 200 and the second subplate attaching part 300 so as to perform an operation of guiding movement of the first subplate S 1 in the X axial direction.
[27] In order to allow the first subplate Sl to be smoothly moved and to prevent damage of the first subplate Sl, such as scratches, etc. when the first subplate Sl moves along the X axis guide rails 130, a plurality of vertical rollers 131 and a plurality of horizontal rollers 132 are installed at inner side surface and upper surface of the axis guide rails 130, respectively, in such a manner that they can freely rotate. A lower surface of the first subplate Sl is seated on the vertical rollers 131, and the horizontal rollers 132 guide movement of the first subplate Sl while performing rolling movement in contact with front, rear, side parts of the first subplate Sl.
[28] Also, the first support bars 140 support and elevate each corner of the first subplate
Sl on the first pick-out plate 120 while simultaneously performing elevation movement in up and down directions through a Z axis linear movement device, such as a ball screw 142 installed at a lower part of the main body 10 in such a manner that it extends in the Z axial direction and a motor 143 for rotating the ball screw 142.
[29] As shown in FIG. 3, the transfer 150 includes: a moving member 151, which has an rectangular shape and is horizontally moved in the X axial direction by a conventional X axis linear movement device 160 installed between the X axis guide rails 130; a clamp block 153, which is movably installed at the other end of the fixing block 152 so as to support both side surfaces of the first subplate Sl seated on the X axis guide rails 130, together with the fixing block 152. The clamp block 153 pushes one side of the first subplate Sl toward the fixing block 152 while performing horizontal movement through a pneumatic cylinder 154 so that the first subplate Sl is stably supported between the clamp block 153 and the fixing block 152. [30] Hereinafter, with reference to FIGs. 4 to 21, the configuration and operation of the adhesive film attaching part 200 will be described.
[31] Firstly, with reference to FIGs. 1 to 4, the adhesive film attaching part 200 includes: a first work table 210, at which the material L- first subplate Sl laminated body transmitted by the transfer 150 of the loading part 100 is seated and fixed; an adhesive film stacking part 220, on which dual-faced adhesive films F to be attached on the material L are stacked; a first detaching part 230 for removing a lower liner BL (see FIG. 8) of the dual-faced adhesive film F transmitted from the adhesive film stacking part 220; an adhesive film attaching apparatus 250 according to the present invention, which is installed at an upper side of the adhesive film attaching part 200 in such a manner that it can move in Y and Z axial directions so as to transmit a dual-faced adhesive film F and attach it onto the material L; and a second detaching part 240, which is installed at one side of the adhesive film attaching apparatus 250 so as to remove an upper liner UL (see FIG. 15) of the dual- faced adhesive film F, which is attached on the material L of the first work table 210, while moving together with the adhesive film attaching apparatus 250. A liner collecting box 260 for collecting liners separated from the dual- faced adhesive film F is installed at one side of the first detaching part 230.
[32] The first work table 210 has a structure divided into two blocks so as to allow the transfer 150 to move and performs elevation movement in up and down directions through a Z axis linear movement device, such as a ball screw 214 installed at a lower part of the main body 10 in such a manner that it extends in the Z axial direction and a motor 215 for rotating the ball screw 214. The non-described numeral reference 213 are guide shafts, which perpendicularly extend from the lower part of the first work table 210 and have each lower part connected with the Z axis linear movement device so as to be elevated in up and down directions.
[33] Also, a plurality of vacuum holes and a vacuum pad 212 are formed at an upper surface of the first work table 210 so as to vacuously suck a lower surface of the first subplate S 1 and fix it.
[34] A plurality of arrangement pushers 216, which presses the first subplate Sl toward other X axis guide rail 130 so as to arrange the position of the first subplate Sl, is included at an X axis guide rail 130 positioned at one side of the first work table 210 in such a manner that it can be horizontally moved by a pneumatic cylinder.
[35] Each dual-faced adhesive film F stacked on the adhesive film stacking part 220 has a circular shape and a size corresponding to the material L and has upper and lower liners UL and BL (see FIG. 20) for protecting an adhesive layer AL (see FIG. 20), which are attached on upper and lower surfaces thereof, respectively.
[36] In order to easily and surely remove the lower liner BL, the first detaching part 230 allows a separate detachable tape (DT) having an adhesive property to make contact with an end of the lower liner BL of the dual-faced adhesive film F sucked in the adhesive film attaching apparatus 250 so that the end of the lower liner BL is detached from a contact surface of the dual- faced adhesive film F. Then, the first detaching part 230 allows the adhesive film attaching apparatus 250 to move in a state where the detached end of the lower liner is fixedly caught so that the lower liner BL is detached from the dual-faced adhesive film F.
[37] In more detail, the first detaching part 230 includes: a first feeding roller 231, on which a non-used DT is rolled up; a first pressing roller 232, which is installed at the main body 10 (see FIG. 1) in such a manner that it can be elevated with a predetermined distance in up and down directions, and allows the DT released from the first feeding roller 231 to pass therethrough; a first recovery roller 233, by which the DT released through the first pressing roller 232 after use is rolled; and a first liner gripper 235, which is installed at one side of the first pressing roller 232 so as to firmly grip one end of the lower liner separated from the dual-faced adhesive film F sucked into the adhesive film attaching apparatus 250 positioned at upper part of the apparatus.
[38] After performing a liner detaching operation, the first recovery roller 233 allows the
DT to be rolled up the roller while rotating with a predetermined angle through a rotating means, such as a motor (not shown) so that a non-used DT is always provided on an outer circumferential surface of the first pressing roller 232.
[39] The first pressing roller performs elevation movement with a predetermined distance in up and down directions through a linear movement device, such as a pneumatic cylinder 234, and allows the DT to make contact with the lower liner BL of the dual- faced adhesive film F immobilized in the adhesive film attaching apparatus 250.
[40] Also, the first liner gripper 235 includes a fixed gripper 236 fixed in the main body
10, a movable gripper 237, which is installed at one side of the fixed gripper 236 in such a manner that it horizontally moves so as to grip one end of a liner, together with the fixed gripper 237, and a pneumatic cylinder 238 that allows the movable gripper 237 to perform horizontal and reciprocating movement.
[41] The fixed gripper 236 and the movable gripper 237 have each end part shaped similar to a 'U'. The first pressing roller 232 makes contact with an end of the lower liner BL of the dual-faced adhesive film F while moving in up and down directions through an opened central part between the fixed gripper 236 and the movable gripper 237.
[42] The second detaching part 240 includes a mount block 249 assembled with the horizontal movement block 251 of the adhesive film attaching apparatus 250 so as to move together with the adhesive film attaching apparatus 250, and has a configuration similar to the configuration of the first detaching part 230. Particularly, the second detaching part 240 includes a second feeding roller 241 supplying a DT for detaching the upper liner UL from the dual-faced adhesive film F while making contact with an end of the upper liner UL, a second pressing roller 242, a second recovery roller 243, and a second liner gripper 245 for gripping the end of the detached upper liner UL. The second liner gripper 245 includes a fixed gripper 246 fixed in a lower end of the mount block 249 and a movable gripper 247 installed at one side of the fixed gripper 246 in such a manner that it is horizontally moved by a pneumatic cylinder 248 so as to grip the end of the upper liner, together with the fixed gripper 246.
[43] Meanwhile, the adhesive film attaching apparatus 250 vacuously holds a dual-faced adhesive film from the adhesive film stacking part 220 so as to transmit the film to the first detaching part 230 and transmits the dual-faced adhesive film, from which the lower liner has been detached at the first detaching part 230, to the first work table 210 so as to attach the film to the material L.
[44] The adhesive film attaching apparatus 250 includes: a horizontal movement block
251, which is positioned at an upper side of the adhesive film attaching part 200 and is horizontally moved in the Y axis direction by a Y axis linear movement device; a head block 252 included at the horizontal movement block 251 in such a manner that it performs elevation movement in up and down directions; a suction plate 253 rotatably installed at a lower part of the head block 252; and an attaching roller 258 installed at one end of the suction plate 253 in such a manner that it can freely rotate.
[45] The suction plate 253 is rotated about a hinge shaft 253 a with a predetermined angle by a pneumatic cylinder 253b installed at one side of the head block 252 so that the suction plate 253 is slanted with a predetermined angle respective to a horizontal plane when the dual-faced adhesive film F is attached on an upper surface of the material L. At this time, the suction plate 253 is slanted so as to allow the attaching roller 258 to be positioned at the lowest side (see FIG. 10).
[46] With reference to FIGs. 17 to 19, a plurality of vacuum holes 254A, 254B, 254C for vacuously sucking a dual-faced adhesive film F is formed at a lower surface of the suction plate 253. In this embodiment, the vacuum holes are arranged along the peripheral part of the suction plate 253 in a circumferential direction. The vacuum holes include a first vacuum hole group 254A and a second vacuum hole group 254B, which are formed at one side of the suction plate 253, particularly, at one side opposite to the attaching roller 258 so as to vacuously suck one side part of the dual- faced adhesive film F.
[47] The third vacuum hole group 254C for strongly and vacuously sucking one side end of the dual-faced adhesive film F is formed at an outer side of the second vacuum hole group 254B. The part where the third vacuum hole group 254C is formed is a part where the lower liner starts to be exfoliated in such a manner that the DT of the first detaching part 230 makes contact with the lower liner. Therefore, in order to allow only one end of the lower liner, and not the whole dual-faced adhesive film F, to be exfoliated when the lower liner is exfoliated by making contact with such DT, the end of the dual-faced adhesive film F has to be fixedly immobilized.
[48] In order to do this, vacuum holes 254C- 1 of the third vacuum hole group 254C are formed at very close intervals. First vent holes 254C-2, which extend toward the outside of the suction plate 253, are formed at each vacuum hole 254C- 1 in such a manner that they communicate with the outside Therefore, when vacuum pressure is generated through the vacuum hole 254C- 1 of the third vacuum hole group 254C, outer air is introduced through the first vent holes 254C-2, and the end part of the dual- faced adhesive film F is fixedly sucked by the negative pressure of inflow air.
[49] As such, when the first vent hole 254C-2 is formed at each vacuum hole 254C- 1 of the third vacuum hole group 254C, the end part of the dual-faced adhesive film F as well as main part thereof can be strongly vacuously sucked at the lower surface of the suction plate 253. Therefore, a phenomenon that, when the DT of the first detaching part 230 makes contact with the end part of the dual-faced adhesive film F, the end of the upper liner UL of the dual-faced adhesive film F is detached from the suction plate 253 so that whole end part of the dual-faced adhesive film F is detached, disappears. As a result, it can be possible to obtain an advantage in that only the end part of the lower liner BL is accurately detached.
[50] Of course, according to this embodiment, the third vacuum hole group 254c having the first vent hole 254C-2 is formed at the end of the suction plate 253 so that the end part of the upper liner of the dual-faced adhesive film F can be firmly fixed. However, alternatively, a tape, which allows the end of the upper liner of the dual-faced adhesive film F to be adhered and fixed, is mounted at the end part of the suction plate 253 so that it is possible to prevent the upper liner UL together with the lower liner BL from being detached when the lower liner BL is detached from the first detaching part 230.
[51] Also, as shown in FIGs, 19 and 20, a stopper 257 roughly shaped similar to an 'L' is assembled with an end of the suction plate 253, at which the third vacuum hole group 254c is formed.
[52] When the DT makes contact with an end of the dual-faced adhesive film F at the first detaching part 230, the stopper 257 makes contact with the DT so as to prevent the DT from making contact with the end of the upper liner UL in such a manner that the DT excessively presses the end of the dual- faced adhesive film F. As a result, the DT is prevented from detaching the upper liner.
[53] A sensor (not shown), which senses a state of the dual-faced adhesive film F being sucked through pressure generated at a vacuum line, is installed at the vacuum line (not shown) where the vacuum holes 254C- 1 of the third vacuum hole group 254C are connected with each other.
[54] Also, an air-blower 259, which ejects high pressure air between the lower liner BL and the adhesive layer AL when the lower BL is detached from the dual-faced adhesive film F, may be assembled with a lower part of an outer side of the stopper 257.
[55] If the air-blower 259 is included as described above, when the lower liner BL is detached by the first pressing roller 232 of the first detaching part 230 and the DT passing through the roller, high pressure air is ejected through the air-blower 259 as shown in FIG. 20 so that it is possible to allow the lower liner BL to be further smoothly detached from the dual-faced adhesive film F.
[56] Also, differently, as shown in FIG. 21, without an additional component, such as the air blower 259 (see FIGs. 19 and 20), it is possible to allow the lower liner BL to be further smoothly detached by repetitive elevation movement of the first pressing roller 232 and relative movement between the first pressing roller 232 and the suction plate 253.
[57] Particularly, as shown in FIG. 21A, the first pressing roller 232 is elevated so as to make contact with one inner point of an end part of the lower liner BL of the DT. At this state, as shown in FIG. 21B, the suction plate 253 of the adhesive attaching apparatus 250 is horizontally moved in a left side based on the drawing. Then, as shown in FIG. 21C, the first pressing roller 232 is elevated downward with a predetermine degree, and the suction plate 253 of the adhesive attaching apparatus 250 is simultaneously moved to an original position. Afterward, the operation shown in FIG. 21 is repeatedly performed a predetermined number of times.
[58] If performing such operation, the DT of the first pressing roller 232 is repeatedly attach to and detach from the end of the lower liner BL. Therefore, the adhesive force between the lower liner BL and the adhesive layer AL is gradually weakened so that a state where the lower liner BL can be easily detached is secured.
[59] After the adhesive force between the lower liner BL and the adhesive layer AL is weakened through such operation, if the DT is adhered to the lower liner BL in such a manner that the first pressing roller 232 is moved up, and the first pressing roller 232 is moved down while the adhesive film attaching apparatus 250 is moved in a left side based on FIG. 21A and is again moved in a right side based on the drawing, the end of the lower liner BL can be smoothly separated from the dual-faced adhesive film F.
[60] Meanwhile, as shown in FIGs. 17 and 18, an eccentric vacuum hole 255 is formed at a position of a lower surface of the suction plate 253, the position being deviated toward the attaching roller 258 from the center of the lower surface. Also, a plurality of second vent holes 256 is formed at the eccentric vacuum hole 255 in such a manner that they radially extend or extend toward a side. The second vent holes 256 are formed at a lower surface of the suction plate 253 while having each shape of an open channel, and have each end part extending toward an outer side of the suction plate 253 so as to suck outer air. Therefore, when vacuum pressure is generated through the eccentric vacuum hole 255, an inner surface of the dual-faced adhesive film F is vacuously sucked to a lower surface of the suction plate 253 while outer air is introduced through the second vent holes 256.
[61] The eccentric vacuum hole 255 is closed by a shielding plate 255a fixed in the lower surface of the suction plate 253 so as to allow the eccentric vacuum hole 255 having a large diameter to be closed. Therefore, only second vent holes 265 are opened so that the uniform area of the vacuum channel is secured. As a result, the dual-faced adhesive film F is regularly sucked, and any part of the dual- faced adhesive film F is prevented from being wrinkled.
[62] Although the second vent holes 256 perform a function of vacuously sucking and fixing the dual-face adhesive film F when the adhesive film attaching apparatus 250 transmits the dual-faced adhesive film F after vacuously sucking it, the second vent holes 256 also perform a function of maintaining a state where the dual-faced adhesive film F is uniformly unfolded and attached at the lower surface of the suction plate 253 when the adhesive film attaching apparatus 250 attaches the dual-face adhesive film F on an upper surface of the material L.
[63] Particularly, in a state where the suction plate 253 is slanted with a predetermined angle, the adhesive film attaching apparatus 250 gradually adheres the dual-face adhesive film F to the material L in a direction from an end of one side of the dual-face adhesive film F to the whole part thereof while the attaching roller 258 presses the upper surface of the dual-faced adhesive film F, and the adhesive film attaching apparatus 250 is slowly and horizontally moved respective to the material L.
[64] At this time, as shown in FIG. 18, the dual-faced adhesive film F gradually slides along the lower surface of the suction plate 253. During this process, vacuum pressure is formed in a radial shape while outer air is sucked through each second vent hole 256. Therefore, the dual-faced adhesive film F is continuously unfolded on the lower surface of the suction plate 253, and a state of the dual-faced adhesive film F being sucked can be maintained. Accordingly, it is possible for the dual-faced adhesive film F to be uniformly adhered to the material L.
[65] Meanwhile, as described above, if the dual-faced adhesive film F is adhered to the upper surface of the material L in such a manner that the suction plate 253 of the adhesive film attaching apparatus 250 is slanted, and the attaching roller 258 moves respective to the material L in one direction in a state of the attaching roller 258 pressing the upper surface of the dual-faced adhesive film F, bubbles are not generated between the dual-faced adhesive film F and the material L during the adhering process so that adhesion defects can be prevented.
[66] It is preferable that the attaching roller 258 is installed at a level a little higher than the lower surface of the suction plate 253 so as to secure better adhesion efficiency when the dual-faced adhesive film F is adhered. This is because the dual-face adhesive film F is adhered to the material in a state where the dual-face adhesive film F is unfolded without winkles while maintaining a state of an end of the suction plate 253 making complete contact with the upper surface of the dual-faced adhesive film F when the suction plate 253 is slanted.
[67] The operation of the semiconductor package manufacturing apparatus according to the present invention, which is structured as described above, will be described below.
[68] Firstly, as shown in FIG. 2, a magazine Ml receiving a first subplate Sl -material L laminated body is elevated by an elevator 11 at a laminated body stacking part 110 of a loading part 100, and the first subplate Sl -material L laminated body of an inner side of the magazine Ml, which will be picked out, is arranged with the first pick-out plate 120.
[69] Subsequently, the first pick-out plate 120 is moved toward the laminated body stacking part 110 along a Y guide frame 125 by a Y axis linear movement device so as to enter the inner side of the magazine Ml. Then, the first pick-out plate 120 vacuously sucks the first subplate Sl -material L laminated body so as to pick it out of the magazine Ml and arranges the first subplate Sl -material L laminated body at an upper side of the X axis guide rail 130.
[70] Also, vacuum pressure of the first pick-out plate 120 is released, and simultaneously, a first support bar 140 moves up with a predetermined distance so as to lift the first subplate Sl -material L laminated body on the first pick-out plate 120. Subsequently, the first pick-out plate 120 moves back in the Y axial direction and moves toward an outer side of the first subplate Sl-mateirial L laminated body. Also, the first support bar 140 moves down so as to allow the first subplate Sl -material L laminated body to be seated on the X axis guide rail 130. Simultaneously, a clamp block 153 (see FIG. 3) of a transfer 150 moves toward a fixed block 152 (see FIG. 3) so that the first subplate Sl is supported in such a manner that it is fixed in the transfer 150.
[71] As such, when the first subplate Sl -material L laminated body is seated on the transfer 150 of the loading part 100 and is supporte, the transfer 150 is horizontally moved in an X axial direction by the X axis linear movement device 160 so as to move to the adhesive film attaching part 200.
[72] At this time, the first subplate Sl -material L laminated body is smoothly moved in a horizontal direction while both side edges of the first subplate S 1 are guided by the vertical roller 131 and the horizontal roller 132 of the X axis guide rail 130.
[73] The transfer 150 moved to the adhesive film attaching part 200 is stopped at the upper side of the first work table 210. Then, the arrangement pusher 216 is operated by a pneumatic cylinder so as to push on edge of one side of the first subplate S 1 in the Y axial direction. As a result, an edge of the other side of the first subplate S 1 is pressed by the X axis guide rail 130 so that the position of the first subplate Sl -material L laminated body is arranged.
[74] Subsequently, the first work table 210 moves upward so that the first subplate
Sl -material L laminated body is seated on the first work table 210. Also, vacuum pressure is generated by the vacuum hole 211 and the vacuum pad 212 so that the first subplate Sl -material L laminated body is immobilized on the first work table 210. At this time, it is preferable that the degree of elevation of the first work table 210 is a degree allowing the lower surface of the first subplate Sl to be positioned at a position lower than an upper end of the horizontal roller 132 (see FIG. 2) of the axis guide rail 130.
[75] While the first subplate Sl -material L laminated body is transmitted from the loading part 100 to the adhesive film attaching part 200 and is immobilized on the first work table 210, as shown in FIGs. 4 to 6, the adhesive film attaching apparatus 250 of the adhesive film attaching part 200 is moved down from the upper side of the adhesive film stacking part 220 so as to vacuously suck a dual-faced adhesive film F. Then, the film attaching apparatus 250 is again moved up so as to move to the first detaching part 230. At this time, the upper liner UL of the dual- faced adhesive film F is sucked to a lower surface of the suction plate 253 of the adhesive film attaching apparatus 250.
[76] If, in a state where the adhesive film attaching apparatus 250 sucks the dual-faced adhesive film F, the adhesive film attaching apparatus 250 is moved to the first detaching part 230 and is stopped at a predetermined position, as shown in FIG. 7, the first pressing roller 232 of the first detaching part 230 is elevated with a predetermined distance through a 'U'-shaped space of the first liner gripper 235. Accordingly, the DT makes contact with an end of one side of the dual-faced adhesive film F, particularly with an end of a lower liner of a part corresponding to the third vacuum hole group 254c (see FIG. 21) of the suction plate 253.
[77] In this state, if the adhesive film attaching apparatus 250 reciprocally moves with a predetermined distance in the Y axis direction, the DT allows the end of the lower liner BL of the dual-faced adhesive film F to be detached a little while the first pressing roller 232 performs rolling movement respective to a lower surface of the suction plate 253. Subsequently, as shown in FIG. 8, if the first pressing roller 232 is again moved down, the DT allows the end of the lower liner BL to be detached from the dual-faced adhesive film F, and the separated end of the lower liner drops between the fixed gripper 236 and the movable gripper 237 of the first liner gripper 235. At this time, as shown in FIG. 20, high pressure air is ejected toward the lower liner BL through the air-blower 259. As a result, the end of the lower liner BL can be accurately detached from the adhesive layer AL of the dual-faced adhesive film F.
[78] Again, with reference to FIG. 8, when the end of the lower liner BL is detached from the dual-faced adhesive film F as described above, the movable gripper 237 of the first liner gripper 235 is moved toward the fixed gripper 236 so as to strongly grip the end of the lower liner BL.
[79] In this state, as shown in FIG. 9, when the adhesive film attaching apparatus 250 is horizontally moved toward the first work table 210, the lower liner BL is detached from the dual-faced adhesive film F. The detached lower liner BL is smoothly discharged into the liner collecting box 260 when the movable gripper 237 of the first liner gripper 235 is transmitted to an original position.
[80] Meanwhile, when the first pressing roller 232 allows the DT to make contact with the end of the lower liner so as to detach the end of the lower liner from the dual-faced adhesive film F, a high vacuum pressure is formed at the dual-faced adhesive film F up to an end of outer peripheral part thereof through the third vacuum hole group 254C (see FIG. 17) of the suction plate 253. Therefore, a phenomenon where an end of the upper liner UL of the dual-faced adhesive film F together with the lower liner is detached rarely occurs. If the phenomenon where the end of the upper liner UL is detached from the suction plate 253 occurs in this process, vacuum pressure is not formed through a vacuum line (not shown) of the third vacuum hole group 254c, and a sensor (not shown) installed at the vacuum line (not shown) senses the fact that the vacuum pressure is not formed so as to allow the user to take a predetermined measurement.
[81] Again, with reference to FIG. 10, the adhesive film attaching apparatus 250 for attaching the adhesive film, from which the lower liner BL has been detached at the first detaching part 230, moves to the upper side of the first work table 210 and is arranged on material L. Subsequently, the suction plate 253 of the adhesive film attaching apparatus 250 is rotated about a hinge shaft 253a by the operation of a pneumatic cylinder 253b so as to be slanted at a predetermined angle, and together with this operation, a head block 252 of the adhesive film attaching apparatus 250 is moved downward. Accordingly, the attaching roller 258 of one side of the suction plate 253 presses and adheres one end of the dual-faced adhesive film F to an upper surface of an end of the material L.
[82] At this state, as shown in FIGs. 11 and 12, when the adhesive film attaching apparatus 250 is horizontally moved in the Y axial direction, the dual-faced adhesive film F slides along the lower surface of the suction plate 253 while continuously maintaining a state where dual-faced adhesive film F is adhered to the lower surface of the suction plate 253. Simultaneously, the attaching roller 258 presses and adheres the dual-faced adhesive film F in such a manner that the attaching roller 259 allows the dual- faced adhesive film F to make linear contact with the upper surface of the material L while performing rolling movement along the dual-faced adhesive film F. At this time, as described above, the reason why the dual-faced adhesive film F can slide while maintaining a state of the dual-faced adhesive film F being continuously sucked to the suction plate 253 in a unfolded state is that vacuum pressure is uniformly applied to the dual-faced adhesive film F through the second vent holes 256 formed at the lower surface of the suction plate 253 toward a side thereof or in a radial shape (see FIG. 18).
[83] As such, if the attaching roller 258 attaches the dual-faced adhesive film F to the material L in such a manner that the attaching roller 259 allows dual-faced adhesive film F sequentially to make linear contact with the material L in a direction from one end of the film F to the whole part thereof, air flowing into an interface between the dual-faced adhesive film F and the material L in the process of attaching the dual-faced adhesive film F can be prevented. Therefore, there is an advantage in that defects in adhesion can be prevented.
[84] If the dual-faced adhesive film F is attached to the upper surface of the material L on the first work table 210 as described above, as shown in FIG. 13, the suction plate 253 rotates about the hinge shaft 253a so as to be transmitted to an original position in a horizontal state. Also, the adhesive film attaching apparatus 250 and the second detaching part 240 horizontally move in the Y axial direction so that the second pressing roller 242 of the second detaching part 240 is arranged at an upper side of one end of the material L.
[85] Subsequently, the second pressing roller 242 moves downward so that the DT makes contact with an end of the upper liner UL of the dual-faced adhesive film F attached to the material L through space of the second liner gripper 245.
[86] Then, if the second detaching part 240 performs a horizontal and reciprocal movement with a predetermined distance in the Y axial direction, the second pressing roller 242 performs rolling movement along the upper surface of the material L so as to allow the end of the upper liner UL to be detached a little by the DT.
[87] At this time, as shown in FIG. 14, if the second pressing roller 242 is moved up, the end of the upper liner UL is exfoliated from the dual-faced adhesive film F so that it is positioned between the movable gripper 247 and the fixed gripper 246 of the second liner gripper 245.
[88] Also, the movable gripper 247 moves toward the fixed gripper 246 so as to firmly grip the detached end of the upper liner UL.
[89] In this state, when the second detaching part 240 horizontally moves in the Y axial direction, the upper liner UL is detached from the dual-faced adhesive film F, and only the adhesive layer remains in the dual-faced adhesive film F. The upper liner UL detached by the second detaching part 240 is discharged into the liner collecting box 260 as shown in FIG. 15.
[90] If the dual-faced adhesive film F is attached on the material L through the process as described above, the first work table 210 moves down so that the first subplate Sl -material L laminated body is seated on the X axis guide rail 130. Also, the transfer 150 is moved by the X axis linear movement device in the X axial direction so as to transfer the first subplate Sl -material L laminated body to the upper side of a second work table 310 of the second subplate attaching part 300.
[91] Then, an operation of attaching a second subplate S2 onto the upper surface of the material L of the first subplate Sl at the second subplate attaching part 300, an operation of heating a first subplate Sl -material L-second subplate S2 laminated body so as to separate the first subplate S 1 and the material L from each other at the first subplate separating part 400, and an operation of removing the remaining tape from the second subplate S2-material L laminated body at an off-loading part 500 are sequentially performed. Industrial Applicability
[92] An apparatus for attaching an adhesive film for manufacturing semiconductor packages accordingly to the present invention can be used for rapidly and firmly attaching an adhesive film (particularly, a dual-faced adhesive film) to an attachment object in a semiconductor package manufacturing apparatus.

Claims

Claims
[1] An apparatus for attaching an adhesive film for manufacturing semiconductor packages, the apparatus comprising: a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus picks up an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.
[2] The apparatus as claimed in claim 1, further comprising an attaching roller, which is installed at one end of the suction plate in such a manner that the attaching roller can freely rotate, and rolls along an upper surface of the adhesive film so as to press the adhesive film when the horizontal movement block allows the adhesive film to be attached to an upper surface of the attachment object while horizontally moving.
[3] The apparatus as claimed in claim 1 or 2, wherein the suction plate is rotated about the hinge shaft at a predetermined angle by a pneumatic cylinder installed at one side of the head block.
[4] The apparatus as claimed in claim 1 or 2, wherein an eccentric vacuum hole is formed at a position of a lower surface of the suction plate, the position being deviated from a center of the lower surface with a predetermined distance, and a plurality of vent holes having a channel- shape are formed at the eccentric vacuum hole in such a manner that they radially extend.
[5] The apparatus as claimed in claim 4, further comprising a vent hole having a channel-shape, which is formed at an opposite side of the vent holes based on the eccentric vacuum hole in such a manner that the vent hole extends in a side direction.
[6] The apparatus as claimed in claim 4 or 5, wherein the eccentric vacuum hole is closed by a shielding plate fixed in the lower surface of the suction plate.
[7] The apparatus as claimed in claim 1 or 2, wherein a first vacuum hole group is formed by a plurality of vacuum holes formed at the lower surface of the suction plate in such a manner that they are arranged along a periphery of the lower surface in a circumferential direction, a second vacuum hole group is formed by a plurality of vacuum holes arranged at one side part of the suction plate, and a third vacuum hole group is formed by a plurality of vacuum holes arranged with an interval further closer together than an interval of the second vacuum hole group so as to generate suction force much larger than suction force of the second vacuum hole group.
[8] The apparatus as claimed in claim 7, wherein vent holes, which communicate with an outside of the suction plate so as to suck outer air, are formed at each vacuum hole of the third vacuum hole group.
[9] The apparatus as claimed in claim 7, further comprises a stopper for preventing a tape of the detaching part from making contact with an end of the upper liner of the adhesive film when the tape of the detaching part, which is used for removing the lower liner of the adhesive film, makes contact with the end of the lower liner of the adhesive film, the stopper being assembled with the end of the sucking plate, at which the third vacuum hole group is formed, and having a lower end positioned lower than the surface of the suction plate.
PCT/KR2008/004740 2007-08-17 2008-08-14 Apparatus for attaching adhesion film for manufacturing semiconductor packages WO2009025471A2 (en)

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