WO2009025471A4 - Apparatus for attaching adhesion film for manufacturing semiconductor packages - Google Patents

Apparatus for attaching adhesion film for manufacturing semiconductor packages Download PDF

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Publication number
WO2009025471A4
WO2009025471A4 PCT/KR2008/004740 KR2008004740W WO2009025471A4 WO 2009025471 A4 WO2009025471 A4 WO 2009025471A4 KR 2008004740 W KR2008004740 W KR 2008004740W WO 2009025471 A4 WO2009025471 A4 WO 2009025471A4
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive film
suction plate
attaching
manner
block
Prior art date
Application number
PCT/KR2008/004740
Other languages
French (fr)
Other versions
WO2009025471A3 (en
WO2009025471A2 (en
Inventor
Hyun Gyun Jung
Young Hyun Kim
Kyoung Hyun Shin
Hae Geun Jung
Dong Ki Jang
Original Assignee
Hanmi Semiconductor Co Ltd
Hyun Gyun Jung
Young Hyun Kim
Kyoung Hyun Shin
Hae Geun Jung
Dong Ki Jang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd, Hyun Gyun Jung, Young Hyun Kim, Kyoung Hyun Shin, Hae Geun Jung, Dong Ki Jang filed Critical Hanmi Semiconductor Co Ltd
Publication of WO2009025471A2 publication Critical patent/WO2009025471A2/en
Publication of WO2009025471A3 publication Critical patent/WO2009025471A3/en
Publication of WO2009025471A4 publication Critical patent/WO2009025471A4/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0047—Preventing air-inclusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
  • Labeling Devices (AREA)

Abstract

Disclosed is an apparatus for attaching an adhesive film for manufacturing a semiconductor package, which automatically perform a process of attaching an adhesive film, which is used for adhesion of a different subplate, on one surface of a lead frame attached on a subplate. The apparatus includes a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.

Claims

AMENDED CLAIMS received by the International Bureau on 14 April 2009 (14.04.09)
[1] An apparatus for attaching an adhesive film for manufacturing semiconductor packages, the apparatus comprising: a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the auction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus picks up an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table. [2] The apparatus as claimed in claim 1 , further comprising an attaching roller, which is installed at one end of the suction plate in such a manner that the attaching roller can freely rotate, and rolls along an upper surface of the adhesive film so as to press the adhesive film when the horizontal movement block allows the adhesive film to be attached to an upper surface of the attachment object while horizontally moving. [3] The apparatus as claimed in claim .1 or 2, wherein the suction plate is rotated about the hinge shaft at a predetermined angle by a pneumatic cylinder installed at one side of the head block. [4] The apparatus as claimed in claim 1 or 2, wherein an eccentric vacuum hole is formed at a position of a lower surface of the suction plate, the position being deviated from a center of the lower surface with, a predetermined distance, and a plurality of vent holes having a channel-shape are formed at the eccentric vacuum hole in such a manner that they radially extend. [5] The apparatus as claimed in claim 4, further comprising a vent hole having a channel-shape, which is formed at an opposite side of the vent holes based on the eccentric vacuum hole in such a manner that the vent hole extends in a side direction. [6] (Amended) The apparatus as claimed in claim 5, wherein the eccentric vacuum hole is closed by a. shielding plate fixed in the lower surface of the suction plate. |7] The apparatus as claimed in claim 1 or 2, wherein a first vacuum hole group is formed by a plurality of vacuum holes formed at the lower surface, of the suction
PCT/KR2008/004740 2007-08-17 2008-08-14 Apparatus for attaching adhesion film for manufacturing semiconductor packages WO2009025471A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070083036A KR101404664B1 (en) 2007-08-17 2007-08-17 Apparatus for Manufacturing Semiconductor Packages
KR10-2007-0083036 2007-08-17

Publications (3)

Publication Number Publication Date
WO2009025471A2 WO2009025471A2 (en) 2009-02-26
WO2009025471A3 WO2009025471A3 (en) 2009-04-16
WO2009025471A4 true WO2009025471A4 (en) 2009-05-28

Family

ID=40378814

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/004740 WO2009025471A2 (en) 2007-08-17 2008-08-14 Apparatus for attaching adhesion film for manufacturing semiconductor packages

Country Status (2)

Country Link
KR (1) KR101404664B1 (en)
WO (1) WO2009025471A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101511294B1 (en) * 2013-08-12 2015-04-13 (주)피엔티 Apparatus and method for fabricating semiconductor chip package with film attached on
KR101670267B1 (en) * 2016-05-11 2016-11-09 (주) 에스에스피 an apparatus and system of detaping
KR102229964B1 (en) * 2020-10-12 2021-03-19 제너셈(주) Film mounter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4417028B2 (en) 2003-05-22 2010-02-17 株式会社タカトリ Device for attaching dicing tape to dicing frame
KR100722969B1 (en) 2006-04-06 2007-05-30 주식회사 아바코 Encapsulation system of organic light emitting diodes
KR100741168B1 (en) 2006-07-05 2007-07-20 주식회사 다이나테크 A detaping apparatus using a peeling bar

Also Published As

Publication number Publication date
WO2009025471A3 (en) 2009-04-16
KR101404664B1 (en) 2014-06-11
WO2009025471A2 (en) 2009-02-26
KR20090018539A (en) 2009-02-20

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