CN112151656A - LED support machining method - Google Patents
LED support machining method Download PDFInfo
- Publication number
- CN112151656A CN112151656A CN202010948910.8A CN202010948910A CN112151656A CN 112151656 A CN112151656 A CN 112151656A CN 202010948910 A CN202010948910 A CN 202010948910A CN 112151656 A CN112151656 A CN 112151656A
- Authority
- CN
- China
- Prior art keywords
- led
- support
- die bonding
- material belt
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Abstract
The invention discloses a processing method of an LED bracket, and relates to the technical field of LEDs. The method comprises the following steps: the support die bonding pad is punched and formed in a metal material belt mode, after a plating layer is formed, the support die bonding pad enters a die bonding machine in a material belt mode, the transient diode TVS is fixed on the support pad through the die bonding machine and soldering flux, eutectic welding is conducted through reflow soldering, then an injection molding process is conducted, injection molding is conducted on the metal material belt, the transient diode TVS is contained in a plastic frame body, and the LED support is manufactured. The LED support manufactured by the invention does not influence the arrangement of the light-emitting chips and the light-emitting efficiency of the lamp beads, and the LED device produced based on the LED support has excellent voltage-stabilizing and pulse-resisting capabilities and wide application prospect.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a method for processing an LED bracket.
Background
At present, a conventional LED support does not have a voltage-stabilizing and pulse-resisting function, if the function needs to be added, a common method is that a process of fixing a Zener diode is added in an LED packaging procedure, so that the space of a support bonding pad needs to be occupied, the arrangement of a light-emitting chip can be influenced, and the Zener diode can absorb a part of light to influence the light-emitting efficiency of a lamp bead. In order to solve the problems, a novel method for processing the LED bracket is particularly necessary.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the LED support processing method which does not influence the arrangement of the light-emitting chips and the light-emitting efficiency of the lamp beads, has excellent voltage-stabilizing and pulse-resisting capabilities and is easy to popularize and use.
In order to achieve the purpose, the invention is realized by the following technical scheme: a processing method of an LED bracket comprises the following steps: the support die bonding pad is punched and formed in a metal material belt mode, after a plating layer is formed, the support die bonding pad enters a die bonding machine in a material belt mode, the transient diode TVS is fixed on the support pad through the die bonding machine and soldering flux, eutectic welding is conducted through reflow soldering, then an injection molding process is conducted, injection molding is conducted on the metal material belt, the transient diode TVS is contained in a plastic frame body, and the LED support is manufactured.
Preferably, the metal material belt is formed by punching a copper material belt; the metal material belt is formed by adopting a metal plating process of electrolytic plating or chemical plating, and the plating material is silver or silver nickelate.
Preferably, the transient diode TVS adopts a unidirectional TVS tube or a bidirectional TVS tube, the transient diode TVS has the optional working voltage of 1-9999V, and the electrode pad is a gold-tin alloy pad.
Preferably, the die bonding action of the die bonder is completed through an LED die bonder or a chip mounter, the soldering flux needs to be matched with the required characteristics of eutectic soldering of gold-tin alloy materials, and the eutectic soldering is completed through the temperature matched with reflow soldering.
Preferably, the metal material belt is subjected to injection molding by using an LED bracket profile mold, and the injection molding is made of one of PPA, PCT, UP and EMC plastics for the LED bracket.
The invention has the beneficial effects that: the method is simple to operate, the manufactured LED support does not influence the arrangement of the light-emitting chips and the light-emitting efficiency of the lamp beads, and the LED device produced based on the LED support has excellent voltage-stabilizing and pulse-resisting capabilities and wide application prospect.
Drawings
The invention is described in detail below with reference to the drawings and the detailed description;
FIG. 1 is a schematic view of an LED support made in accordance with the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is a side view of FIG. 2;
fig. 4 is a schematic structural diagram of a single support pad intrinsic transient diode TVS according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1 to 4, the following technical solutions are adopted in the present embodiment: a processing method of an LED bracket comprises the following steps: the support die bonding pad is punched and formed in a metal material belt mode, after a plating layer is formed, the support die bonding pad enters a die bonding machine in a material belt mode, the transient diode TVS is fixed on the support pad through the die bonding machine and soldering flux, eutectic welding is conducted through reflow soldering, then an injection molding process is conducted, injection molding is conducted on the metal material belt, the transient diode TVS is contained in a plastic frame body, and the LED support is manufactured.
The metal material belt is formed by punching a copper material belt, and a position matched with the requirement of a transient diode TVS pad is reserved at a position where the transient diode TVS is required to be fixed; the metal material belt is formed by adopting a metal plating process of electrolytic plating or chemical plating, and the plating material is silver or silver nickelate.
It is worth noting that the transient diode TVS adopts a unidirectional TVS tube or a bidirectional TVS tube, the transient diode TVS can select the working voltage of 1-9999V, and the electrode bonding pad is a gold-tin alloy bonding pad.
It is worth noting that the die bonding action of the die bonder is completed through an LED die bonder or a chip mounter, the transient diode TVS is fixed on the bonding pad in a die bonder mode, the soldering flux needs to be matched with the required characteristics of gold-tin alloy eutectic soldering, and the eutectic soldering is completed through the temperature adapted to reflow soldering.
In addition, the metal material belt is injected and molded by adopting an LED bracket outline mold, and the injection molding adopts one of PPA, PCT, UP and EMC plastics for the LED bracket.
In the specific embodiment, the transient diode TVS is fixed on the bracket bonding pad, the formed metal material belt is placed in a die bonding machine, the transient diode die bonding is carried out by using the soldering flux, then the transient diode die bonding enters reflow soldering equipment, the temperature curve of the reflow soldering needs to be consistent with the temperature curve required by the soldering flux, and the eutectic soldering process is completed in a soldering flux and reflow soldering mode. And (2) carrying out a mold injection molding process on the basis of fixing a transient state diode (TVS) on the bracket bonding pad to manufacture the LED bracket, and then cutting the pins of each bracket to form an independent LED bracket.
According to the specific embodiment, an original injection mold is not required to be changed, the transient diode TVS is hidden in the bracket plastic body, and the appearance of the manufactured LED bracket is the same as that of a conventional bracket; according to the method, a process line is added in the original LED support processing process, the transient diode is welded, so that the voltage-stabilizing and anti-pulse capacity of the manufactured LED support is increased, the process of embedding the Zener voltage-stabilizing diode in LED packaging is replaced, the problem that the arrangement of a light-emitting chip and the light emitting efficiency of a lamp bead are influenced by the traditional LED packaging is effectively solved, an LED device produced based on the LED support has excellent voltage-stabilizing and anti-pulse capacity, the breakdown current of the LED device is much larger than that of the Zener diode embedded in the later packaging process, and the LED device has wide market application prospect.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A processing method of an LED support is characterized in that a support die bonding pad is punched and formed in a metal material belt mode, after a plating layer is formed, the support die bonding pad enters a die bonding machine in a material belt shape, a transient diode TVS (1) is fixed on a support pad (2) through the die bonding machine and soldering flux, eutectic welding is carried out through reflow soldering, then an injection molding process is carried out, injection molding is carried out on the metal material belt, and the transient diode TVS (1) is contained in a plastic frame body (3) to manufacture the LED support.
2. The method according to claim 1, wherein the metal strip is formed by stamping a copper strip.
3. The method as claimed in claim 1, wherein the metal tape is formed by an electrolytic plating or chemical plating process, and the plating material is silver or silver nickel.
4. The LED bracket processing method according to claim 1, wherein the die bonding action of the die bonder is completed by an LED die bonder or a chip mounter.
5. The processing method of the LED bracket according to claim 1, wherein the transient diode TVS (1) adopts a unidirectional TVS tube or a bidirectional TVS tube, the working voltage of the transient diode TVS (1) is 1-9999V, and the electrode pad is a gold-tin alloy pad.
6. The method as claimed in claim 1, wherein the injection molding of the metal material strip is performed by using an LED bracket profile mold, and the injection molding plastic is one of PPA, PCT, UP, and EMC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010948910.8A CN112151656A (en) | 2020-09-10 | 2020-09-10 | LED support machining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010948910.8A CN112151656A (en) | 2020-09-10 | 2020-09-10 | LED support machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112151656A true CN112151656A (en) | 2020-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010948910.8A Pending CN112151656A (en) | 2020-09-10 | 2020-09-10 | LED support machining method |
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| CN (1) | CN112151656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707791A (en) * | 2021-09-02 | 2021-11-26 | 鸿利智汇集团股份有限公司 | LED manufacturing process |
-
2020
- 2020-09-10 CN CN202010948910.8A patent/CN112151656A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707791A (en) * | 2021-09-02 | 2021-11-26 | 鸿利智汇集团股份有限公司 | LED manufacturing process |
| CN113707791B (en) * | 2021-09-02 | 2023-05-26 | 鸿利智汇集团股份有限公司 | LED manufacturing process |
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