CN105177690A - Continuous automatic silver plating structural line of LED support - Google Patents
Continuous automatic silver plating structural line of LED support Download PDFInfo
- Publication number
- CN105177690A CN105177690A CN201510598265.0A CN201510598265A CN105177690A CN 105177690 A CN105177690 A CN 105177690A CN 201510598265 A CN201510598265 A CN 201510598265A CN 105177690 A CN105177690 A CN 105177690A
- Authority
- CN
- China
- Prior art keywords
- silver plating
- conveying belt
- led support
- plating bath
- bath body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a continuous automatic silver plating structural line of an LED support, and discloses a full-automatic continuous silver plating structural line of the LED support. The continuous automatic silver plating structural line comprises an opening silver plating bath body (1). A left conveying belt (2) and a right conveying belt (3) distributed in a spaced manner are arranged in the opening silver plating bath body in the length direction and are located on the same horizontal plane. The left conveying belt and the right conveying belt are driven by a left motor (4) and a right motor (5) respectively, and the left motor (4) and the right motor (5) are synchronous in rotating speed. A pressing plate (6) is fixedly connected to the part, above the left conveying belt and the right conveying belt, in the opening silver plating bath body along the longitudinal axis of the opening silver plating bath body, and the LED support can pass a vertical gap among the pressing plate, the left conveying belt and the right conveying belt. The continuous automatic silver plating structural line has the beneficial effects that the LED support to be electroplated advances on the left conveying belt and the right conveying belt according to the rate set by the motors, the staying time in an electroplating tank can be controlled in advance, and automatic continuous silver plating is achieved.
Description
Technical field
The present invention relates to silver plating device, particularly relate to the silver-plated structure lines of LED support.
Background technology
At present, general LED light source module is welded on substrate by some LEDs chips with paster or plug-in type, and the power of single LEDs luminous element is 0.03 ~ 5W, and its substrate is pcb board, flexible PCB or the metal substrate that adopts the metallic substance such as aluminium, copper to make; Or be directly packaged on various substrate with LED chip, i.e. general alleged COB (chipsonboard).The above-mentioned substrate for being fixedly mounted with LED chip, adopts heat radiation structure design, normally adopts aluminium base to add aluminium section bar radiator element, additional natural heat dissipation, wind-cooling heat dissipating or heat pipe heat radiation, also has and adopt semiconductor refrigeration radiating.The Making programme of LED luminous element is as follows: prejudge metal substrate by all, metal substrate carries out plastic packaging and makes LED support, chip is inserted in LED support by some glue die bond one by one, through pressure welding routing aluminium wire or spun gold welding machine, chip electrode is connected to LED support electrode foot, then encapsulating encapsulation is to LED chip and aluminium wire or spun gold packaging protection, carry out again cutting company's muscle also interior bending leg that muscle cuts off LED support electrode foot, all LED luminous elements are taken off from metal substrate, and LED luminous element that is SMD to single or plug-in type makes photoelectric parameter testing respectively, finally LED luminous element is carried out counting band dress to improve to client, so far LED luminous element completes.Before LED chip is welded on LED support, often to carry out electroplating processes to LED support, at the metal that the plated surface last layer activity of LED support is more weak, prevent LED support use process in the aging or oxidized work-ing life affecting LED chip.Because plating tank adopts enclosed construction mostly, automatization when LED support is electroplated is more weak, and electroplate liquid uses for a long time, causes foreign ion enrichment in electroplate liquid, affects electroplating effect.
Summary of the invention
The technical problem to be solved in the present invention is that the automatization of existing LED silver-plating bath is more weak, and electroplate liquid can not upgrade automatically, affects electroplating effect, provides a kind of LED support continuous automatic silver-plated structure lines for this reason.
Technical scheme of the present invention is: the continuous automatic silver-plated structure lines of LED support, it comprises opening silver-plating bath body, Left Drive band spaced apart and right transmission belt is provided with along its length in described opening silver-plating bath body, described Left Drive band and right transmission belt are positioned in same level, described Left Drive band and right transmission belt are respectively by left motor and the driving of right motor of synchronization, pressing plate is connected with along opening silver-plating bath body longitudinal center line above Left Drive band and right transmission belt in described opening silver-plating bath body, described pressing plate and the vertical gap between Left Drive band and right transmission belt can be passed through for LED support.
The improvement of such scheme is that described opening silver-plating bath body two ends are respectively equipped with the through hole being positioned at same level, and described through hole is positioned under Left Drive band and right transmission belt, and described through hole is communicated with by connecting hose, and described connecting hose is provided with filter tap.
The invention has the beneficial effects as follows that the speed that the LED support of electroplated sets by motor on left and right transmission belt is advanced, the time stopped in plating tank can pre-control, realize automatization silver-plated continuously, electroplate liquid can form circulation loop between plating tank and connecting hose, foreign ion in electroplate liquid can filter by filter tap, ensures the validity of electroplate liquid.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention;
In figure, 1, opening silver-plating bath body, 2, Left Drive band, 3, right transmission belt, 4, left motor, 5, right motor, 6, pressing plate, 7, through hole, 8, connecting hose, 9, filter tap.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described.
As shown in Figure 1, the present invention includes opening silver-plating bath body 1, Left Drive band 2 spaced apart and right transmission belt 3 is provided with along its length in described opening silver-plating bath body, described Left Drive band and right transmission belt are positioned in same level, described Left Drive band and right transmission belt are driven by the left motor 4 of synchronization and right motor 5 respectively, be connected with pressing plate 6 along opening silver-plating bath body longitudinal center line above Left Drive band and right transmission belt in described opening silver-plating bath body, described pressing plate and the vertical gap between Left Drive band and right transmission belt can be passed through for LED support.
Workflow of the present invention is as follows: the distance that the LED support of electroplated enters after in plating tank between its width and left and right transmission belt is adaptive, make LED support can level be placed on the transmission belt of left and right, left and right motor drives left and right conveyor belt motion respectively, LED support is driven to advance in plating tank, in order to ensure the stability run on left and right transmission belt between LED, the pressing plate be positioned on plating tank longitudinal center line is provided with above left and right transmission belt, ensure that LED support can not tilt from upper and lower both direction, cause LED support upper surface silver-plated.
In order to ensure that the electroplating effect of electroplate liquid can not lose efficacy along with the prolongation of duration of service, opening silver-plating bath body two ends are respectively equipped with the through hole 7 being positioned at same level, described through hole is positioned under Left Drive band and right transmission belt, described through hole is communicated with by connecting hose 8, and described connecting hose is provided with filter tap 9.Connecting hose and plating tank form loop, electroplate liquid is made to come back in plating tank after filter tap impurity screening, realize the online self-cleaning of electroplate liquid, in order to ensure that electroplate liquid can be got back in plating tank smoothly, pump can be provided with in connecting hose, provide motivating force to the electroplate liquid in connecting hose.
Claims (2)
- The continuous automatic silver-plated structure lines of 1.LED support, it comprises opening silver-plating bath body (1), it is characterized in that being provided with Left Drive band (2) spaced apart and right transmission belt (3) along its length in described opening silver-plating bath body, described Left Drive band and right transmission belt are positioned in same level, described Left Drive band and right transmission belt are respectively by left motor (4) and right motor (5) driving of synchronization, pressing plate (6) is connected with along opening silver-plating bath body longitudinal center line above Left Drive band and right transmission belt in described opening silver-plating bath body, described pressing plate and the vertical gap between Left Drive band and right transmission belt can be passed through for LED support.
- 2. the continuous automatic silver-plated structure lines of LED support as claimed in claim 1, it is characterized in that described opening silver-plating bath body two ends are respectively equipped with the through hole (7) being positioned at same level, described through hole is positioned under Left Drive band and right transmission belt, described through hole is communicated with by connecting hose (8), and described connecting hose is provided with filter tap (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510598265.0A CN105177690A (en) | 2015-09-18 | 2015-09-18 | Continuous automatic silver plating structural line of LED support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510598265.0A CN105177690A (en) | 2015-09-18 | 2015-09-18 | Continuous automatic silver plating structural line of LED support |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105177690A true CN105177690A (en) | 2015-12-23 |
Family
ID=54900095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510598265.0A Pending CN105177690A (en) | 2015-09-18 | 2015-09-18 | Continuous automatic silver plating structural line of LED support |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105177690A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110797268A (en) * | 2019-11-05 | 2020-02-14 | 启明星半导体技术(西安)有限公司 | Diode with NTC temperature detection and preparation method thereof |
CN116334733A (en) * | 2022-04-12 | 2023-06-27 | 鑫巨(深圳)半导体科技有限公司 | Electrochemical additive reaction control device |
-
2015
- 2015-09-18 CN CN201510598265.0A patent/CN105177690A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110797268A (en) * | 2019-11-05 | 2020-02-14 | 启明星半导体技术(西安)有限公司 | Diode with NTC temperature detection and preparation method thereof |
CN116334733A (en) * | 2022-04-12 | 2023-06-27 | 鑫巨(深圳)半导体科技有限公司 | Electrochemical additive reaction control device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104685615B (en) | The manufacturing method and semiconductor devices of semiconductor devices | |
CN102683509B (en) | Led module | |
CN110364462B (en) | Semiconductor epitaxial film patch type packaging equipment | |
CN108989511B (en) | Base with electronic element and voice coil motor | |
EP2980845B1 (en) | A leadless semiconductor package and method | |
MY144642A (en) | Multilayered lead frame for a semiconductor light-emitting device | |
TW200730052A (en) | Method of fabricating a vertically mountable IC package | |
CN105177690A (en) | Continuous automatic silver plating structural line of LED support | |
CN102361026A (en) | Copper-based bonding wire with anti-oxidation function | |
TW202034476A (en) | Semiconductor package having side wall plating | |
CN105280626A (en) | Ultra-small ultra-thin high-luminous-efficiency lateral-emission-type high-light white-light LED element | |
EP2228842B1 (en) | Light emitting device package | |
CN204982120U (en) | In succession automatic silver -plated structure line of LED support | |
CN209056543U (en) | A kind of novel positive and negative electrode assembly for button cell and its used braid | |
CN203787456U (en) | Flip chip packaging structure | |
CN103441116A (en) | Semiconductor package piece and manufacturing method thereof | |
JP2013219270A (en) | Substrate for mounting light emitting element and led package | |
CN112151656A (en) | LED support machining method | |
CN202169452U (en) | Automatic double-row double-material feeding mechanism of automatic LED (light emitting diode) wire bonder | |
CN106848034A (en) | A kind of LED component and its manufacture method | |
CN205009490U (en) | LED is drive mechanism for injection molding machine | |
CN104465955A (en) | LED lamp belt and manufacturing method thereof | |
CN101831680B (en) | Double-pulse electroplating solution of single metal Au and Sn and preparation method of Au-Sn alloy solder | |
CN111785822A (en) | LED flip chip packaging device and packaging process thereof | |
CN112151662A (en) | Circuit board module manufactured by LED lamp beads of glass diffusion cover and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151223 |
|
WD01 | Invention patent application deemed withdrawn after publication |