CN116334733A - Electrochemical additive reaction control device - Google Patents
Electrochemical additive reaction control device Download PDFInfo
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- CN116334733A CN116334733A CN202310345570.3A CN202310345570A CN116334733A CN 116334733 A CN116334733 A CN 116334733A CN 202310345570 A CN202310345570 A CN 202310345570A CN 116334733 A CN116334733 A CN 116334733A
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- 239000000654 additive Substances 0.000 title claims abstract description 62
- 230000000996 additive effect Effects 0.000 title claims abstract description 59
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 claims abstract description 53
- 238000009713 electroplating Methods 0.000 claims abstract description 43
- 230000003287 optical effect Effects 0.000 claims abstract description 32
- 230000000694 effects Effects 0.000 claims abstract description 13
- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 239000005416 organic matter Substances 0.000 claims abstract description 7
- 230000001737 promoting effect Effects 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 6
- 238000005282 brightening Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims description 2
- 230000002401 inhibitory effect Effects 0.000 abstract description 4
- 239000010949 copper Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000002000 Electrolyte additive Substances 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses an electrochemical additive reaction control device, which comprises an electroplating bath for electroplating a production plate and an optical component capable of irradiating the production plate; the electroplating bath contains an electroplating solution for carrying out electroplating reaction with the production plate and an electrochemical additive for promoting the electroplating reaction; the optical component is used for emitting light and irradiating the light onto the production plate so as to enable the light to react with the electrochemical additive around the production plate correspondingly, thereby adjusting the organic matter activity of the electrochemical additive. The invention can adjust the organic matter activity of the electrochemical additive by the corresponding chemical reaction of the light emitted by the optical component and the electrochemical additive, thereby obtaining better thickness variation control on a tiny electroplating attachment area by inhibiting or accelerating the electrochemical electroplating additive, and improving the electroplating treatment precision of the production plate.
Description
Technical Field
The invention relates to the technical field of circuit board and IC substrate production, in particular to an electrochemical additive reaction control device.
Background
Currently, with the development of PCB and IC carrier industries in a more microscopic direction, there is a strong need in the industry for more advanced and more controlled electroplating tools. Particularly for the production processes of the mSAP (modified semi-additive process) and the SAP (semi-additive process), a key influencing factor is the problem of uniformity of metal distribution during electroplating. Different carrier board line pattern designs often also mean metal surface conditions that vary between non-wiring areas (groups) and wiring areas (fine features), as well as the need for current densities and, for example: electrochemical additives such as inhibitors, flatting agents, brighteners and accelerators are more finely tuned to accommodate the evolving needs of the industry. In addition, with the development trend of the miniaturization of the lines, the number of blind holes (Via) or Through Holes (TH) is also increased, and thus, the heat management schemes are also the attention of the related field in the industry. That is, how to make the PCB, IC carrier board, etc. more refined is a problem that the skilled person needs to solve.
Disclosure of Invention
The embodiment of the invention provides an electrochemical additive reaction control device, which aims to control the electroplating treatment process of a production plate so as to improve the electroplating treatment precision of the production plate.
The embodiment of the invention provides an electrochemical additive reaction control device, which comprises an electroplating bath for electroplating a production plate and an optical component capable of irradiating the production plate;
the electroplating bath contains an electroplating solution for carrying out electroplating reaction with the production plate and an electrochemical additive for promoting the electroplating reaction;
the optical component is used for emitting light and irradiating the light onto the production plate so as to enable the light to react with the electrochemical additive around the production plate correspondingly, thereby adjusting the organic matter activity of the electrochemical additive.
Further, the optical component is disposed in the plating tank or disposed outside the plating tank.
Further, the optical assembly includes a plurality of light source emitters that are uniformly or randomly distributed around the production plate.
Further, the optical assembly further comprises a plurality of light splitters which can rotate or not rotate and can control the light emitted by the light source emitter to irradiate on the production plate.
Further, the wavelength range of the light source emitted by the light source emitter is 180 nm-450 nm and 800 nm-15 mu m.
Further, the number of the light source emitters is 4, and the 4 light sources are uniformly or randomly arranged around the production plate; the number of the light splitters is 8, and each 2 light splitters are arranged corresponding to one light source, so that light rays emitted by each light source are irradiated onto the production plate after the light paths of the light splitters are changed twice.
Further, the light source emitter is a laser light source.
Further, the beam splitter is a prism, a plane mirror or a light reflector.
Further, the optical assembly further comprises LED lamp panels arranged on two sides of the production plate.
Further, the electrochemical additive is a carrier, inhibitor, leveler, accelerator, and/or brightener.
The embodiment of the invention provides an electrochemical additive reaction control device, which comprises an electroplating bath for electroplating a production plate and an optical component capable of irradiating the production plate; the electroplating bath contains an electroplating solution for carrying out electroplating reaction with the production plate and an electrochemical additive for promoting the electroplating reaction; the optical component is used for emitting light and irradiating the light onto the production plate so as to enable the light to react with the electrochemical additive around the production plate correspondingly, thereby adjusting the organic matter activity of the electrochemical additive. According to the embodiment of the invention, the light emitted by the optical component and the electrochemical additive react correspondingly to adjust the activity of the organic matters of the electrochemical additive, so that better thickness variation control on a tiny electroplating attachment area is obtained by inhibiting or accelerating the electrochemical electroplating additive, and the electroplating treatment precision of a production plate can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an electrochemical additive reaction control device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a test of an electrochemical additive reaction control device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring now to fig. 1, fig. 1 is a schematic block diagram of an electrochemical additive reaction control apparatus according to an embodiment of the present invention, which includes a plating tank 1 for performing a plating process on a production board 3 and an optical assembly 2 that can be irradiated onto the production board 3;
the electroplating bath 1 contains an electroplating solution for carrying out electroplating reaction with the production plate and an electrochemical additive for promoting the electroplating reaction;
the optical assembly 2 is configured to emit light and irradiate the light onto the production plate 3 to cause the light to react with the electrochemical additive around the production plate 3, thereby adjusting the organic activity of the electrochemical additive.
In this embodiment, the electrochemical additive reaction control device includes a plating tank 1 and an optical component 2, wherein the plating reaction is performed between the plating solution and the electrochemical additive in the plating tank 1 and the production plate 3, and the optical component 2 controls the activity of the organic matters in the electrochemical additive to adjust the progress of the plating reaction.
In this embodiment, the light emitted by the optical component 2 and the electrochemical additive react correspondingly to adjust the activity of the organic matters of the electrochemical additive, so that better thickness variation control on the tiny electroplating adhesion area is obtained by inhibiting or accelerating the electrochemical electroplating additive, and thus the electroplating treatment precision on the production plate can be improved. The production board 3 in this embodiment may be an IC carrier board or other type of high-end PCB single-sided or double-sided product, and the electrochemical additive is an electrolyte additive.
It should be noted that, in this embodiment, only the electrochemical additive reaction control device is described, but the chemical reaction between light and the electrochemical additive is not particularly limited, and it is clearly known that the activity of the organic matter is changed by light, for example, the catalytic oxidation reaction of the organic matter by light, etc.
In an embodiment, the optical component 2 is disposed inside the plating tank 1 or outside the plating tank 1.
In this embodiment, the optical component 2 is either inside the plating tank 1 or outside the plating tank 1, and only the light emitted from the optical component is required to irradiate the area on the production plate 3, so that the reaction of the irradiated area is preactivated or suppressed.
In an embodiment, the optical assembly 2 comprises a plurality of light source emitters 21, the plurality of light source emitters 21 being uniformly or randomly distributed around the production plate.
Of course, in other embodiments, a larger area LED light board 22 may be selected to be disposed directly on the side of the production board. Preferably, a large area of LED light board 22 is distributed on both sides of the production board.
Further, in an embodiment, the optical assembly 2 further includes a plurality of light splitters 211 that can be rotated or not rotated and can control the light emitted from the light source emitters 21 to irradiate onto the production board 3.
In this embodiment, by providing the beam splitter 211, the direction of the light path can be changed by reflecting or refracting the light emitted by the light source emitter 21, and the angle of the light path can be adjusted according to the actual requirement, so that the light can be irradiated to the desired area without moving to adjust the position angle of the light source generator 21, and the flexibility and performance of the electroplating process are improved.
In one embodiment, the light source emitter 21 emits light in the wavelength range of 180nm to 450nm and 800nm to 15 μm.
In the present embodiment, the effect of the light source emitter 21 covering different wavelength bands is achieved by controlling the light source wavelength range emitted by the light source emitter 21. For example, a light source wavelength range of 180nm to 450nm may cover blue to ultraviolet light, and a light source wavelength range of 800nm to 15 μm may cover near infrared spectrum to far infrared spectrum.
Referring to fig. 1, in an embodiment, the number of the light source emitters 21 is 4, and the 4 light source emitters 21 are uniformly or randomly arranged around the production plate 3; the number of the optical splitters is 2, and each 2 optical splitters 211 is arranged corresponding to one light source emitter 21, so that the light emitted by each light source emitter 21 passes through the optical splitter 211 to change the optical path twice and then irradiates onto the production plate 3.
In this embodiment, a light source emitter 21 is disposed around the production board 3, and each light source emitter 21 is provided with two beam splitters 211, that is, the light emitted from the light source emitter 21 is scanned across the relevant area of the production board in a scan-like manner similar to a Cathode Ray Tube (CRT) after two light paths are changed. Preferably, the light source 21 is adjusted to a light spot, so that the control effect can be enhanced.
Specifically, the light source emitter 21 is a laser light source, and the beam splitter 211 is a prism, a plane mirror, or a light reflector. Of course, in other application scenarios, the light source emitter 21 may be other light source systems similar to a laser light source, and the beam splitter 21 may be other devices capable of changing the direction of the light path.
In one embodiment, the electrochemical additive is a carrier, inhibitor, leveler, accelerator, and/or brightener.
In this embodiment, the inhibitor (also referred to as retarder) is a substance for retarding or reducing the chemical reaction rate, and acts as a negative catalyst, which does not stop the plating reaction process but slows down the plating reaction process, thereby inhibiting or moderating the chemical reaction. The flattening agent is a substance added to the plating solution to improve the flatness of the plating layer and to make the obtained plating layer smoother than the surface of the substrate. The accelerator can rapidly deposit copper and can protect copper deposition liquid. Brightening agents are a class of organic compounds which complex metal ions and catalytically precipitate metalsIs deposited on the cathode surface and is therefore also referred to as an electroplating "accelerator" which primarily reduces Cu 2+ Energy for reduction to metallic copper Cu. The electrochemical additive reaction control device provided by the embodiment can control the activity of the organic matters of each electrochemical additive, for example, the reaction process of each electrochemical additive is quickened or slowed down, so that the electroplating thickness is precisely controlled. The electrochemical additive reaction control device can also change the loading affinity of amine, amide flattening agent or other types of polarized carrier components, etc.
In a specific application scenario, whether the acceleration attribute of the light agent (bright agent) changes under the condition of illumination is verified by a concept verification method (POC) by the following steps: the relevant area (spot irradiation area) is irradiated by 405nm laser, and the thickness difference of the copper metal reduction deposition of approximately 2 microns is formed in the irradiated area, namely, the electrochemical additive reaction control device provided by the embodiment of the invention can well control the thickness change of a tiny electroplating adhesion area.
In the verification process, the thicknesses of copper layer measuring points at different positions are measured by using a PHASCope (thickness gauge), and the thickness values of the copper layer measuring points are combined with a copper layer measuring point distribution schematic diagram shown in fig. 2 and are shown in the following table 1, wherein the measuring point corresponding to 26.1 is the measuring point processed by the electrochemical additive reaction control device provided by the embodiment of the invention, and the thickness of the measuring point is obviously different from that of other areas.
In addition, the plating solution used in the verification process is configured as follows:
copper (coppers): 20-80 g/L;
sulfuric acid (H2 SO 4): 50-150 ml/L;
chlorine (Cloride): 50-100 mg/L;
brightener (Brightner): 1-8 ml/L;
flatting agent (level): 2-20 ml/L;
inhibitors (supplressor): 2-20 ml/L.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section. It should be noted that it would be obvious to those skilled in the art that various improvements and modifications can be made to the present application without departing from the principles of the present application, and such improvements and modifications fall within the scope of the claims of the present application.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. An electrochemical additive reaction control apparatus comprising a plating bath for performing a plating process on a production board and an optical component that can be irradiated onto the production board;
the electroplating bath contains an electroplating solution for carrying out electroplating reaction with the production plate and an electrochemical additive for promoting the electroplating reaction;
the optical component is used for emitting light and irradiating the light onto the production plate so as to enable the light to react with the electrochemical additive around the production plate correspondingly, thereby adjusting the organic matter activity of the electrochemical additive.
2. The electrochemical additive reaction control apparatus of claim 1, wherein the optical assembly is disposed within the plating cell or disposed outside the plating cell.
3. The electrochemical additive reaction control apparatus of claim 1, wherein the optical assembly comprises a plurality of light source emitters that are uniformly or randomly distributed around the production plate.
4. An electrochemical additive reaction control apparatus according to claim 3, wherein the optical assembly further comprises a plurality of light splitters rotatable or non-rotatable and operable to control the illumination of the light source emitters onto the production plate.
5. An electrochemical additive reaction control device according to claim 3, wherein the light source emitter emits light in the wavelength range of 180nm to 450nm and 800nm to 15 μm.
6. The electrochemical additive reaction control apparatus of claim 4, wherein the light source emitters are provided in 4 numbers, and 4 light sources are uniformly or randomly arranged around the production plate; the number of the light splitters is 8, and each 2 light splitters are arranged corresponding to one light source, so that light rays emitted by each light source are irradiated onto the production plate after the light paths of the light splitters are changed twice.
7. The electrochemical additive reaction control device of claim 4, wherein the light source emitter is a laser light source.
8. The electrochemical additive reaction control apparatus of claim 4, wherein the beam splitter is a prism, a flat mirror, or a light reflector.
9. The electrochemical additive reaction control of claim 1, wherein the optical assembly further comprises LED light panels disposed on both sides of the production board.
10. The electrochemical additive reaction control device of claim 1, wherein the electrochemical additive is a carrier, an inhibitor, a leveler, an accelerator, and/or a brightening agent.
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| CN2022103814148 | 2022-04-12 | ||
| CN202210381414.8A CN114525575A (en) | 2022-04-12 | 2022-04-12 | Electrochemical additive reaction control device and method |
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| CN113061881A (en) * | 2021-03-18 | 2021-07-02 | 鑫巨(深圳)半导体科技有限公司 | Copper treatment device and method for electrolytic copper plating |
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