CN110364462B - Semiconductor epitaxial film patch type packaging equipment - Google Patents
Semiconductor epitaxial film patch type packaging equipment Download PDFInfo
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- CN110364462B CN110364462B CN201910652243.6A CN201910652243A CN110364462B CN 110364462 B CN110364462 B CN 110364462B CN 201910652243 A CN201910652243 A CN 201910652243A CN 110364462 B CN110364462 B CN 110364462B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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Abstract
The invention discloses a semiconductor epitaxial film surface mount type packaging device, which comprises a main framework supporting platform, a packaging execution module and a packaging disc group, wherein the main framework supporting platform comprises a main framework supporting platform body and a main framework supporting platform body, and the main framework supporting platform body comprises a main framework supporting platform body, a packaging execution module body and a packaging disc group: the main framework supporting tables are symmetrically arranged with the saddles as axes, the pneumatic rod is pneumatically connected with a second connecting rod which horizontally and transversely extends, and the second connecting rod is provided with an encapsulation executing module in a sliding manner. And the packaging execution module is used for operating a pasting process between the integrated circuit chip transferred at the upper layer working section and the packaging substrate or the pin frame. The semiconductor epitaxial film surface mount type packaging equipment adopts transistor inner shape grid array packaging, is different from packaging modes such as transistor outer shape packaging and pin grid array packaging, has the advantages of reducing the epitaxial rate of a chip film and reducing the large error rate of chip packaging, and adopts a point contact cutting mode of linear cutting to cut off pins, pins or surplus upper extending film tissues at one time, so that the destructiveness is low, the cutting speed is higher, and the efficiency is higher.
Description
Technical Field
The invention relates to semiconductor packaging equipment, in particular to semiconductor epitaxial film surface mount type packaging equipment.
Background
At present, the electronic chip is coming to the highly developed era, the microelectronic packaging technology is used in the field of semiconductor packaging, the sub-packaging modes of SOP, PLCC, PQFP, LCCC, SOJ, QFJ and the like used by the traditional single-sided mother plate are gradually replaced by the sub-packaging technology of PQFN and BGA, etc., on the basis of adopting a large number of three-dimensional packaging, the semiconductor mother plate or each basic unit is pressed and filmed, because of the secondary pressed film after bonding, the film which is originally cut and pasted after the film is pressed and diffused and extended outwards, and the film is baked after the secondary pressed film, meanwhile, in order to obtain the best chip mounting rate, the back surface of the IC chip not only needs to be plated and a reserved chip is implanted on a bearing seat firstly, which leads to the difficult removability of the epitaxial film to exist all the time, when the electroplating pin is formed and cut, the residual film can not be removed by the ADPE corrosion technology, the problems of pin positioning deviation, over-thick chip, over-large package and the like can be caused, and the problems of flash, pin flying and the like caused by the over-large cutting surface of the redundant pin after the pin is formed can be solved.
Disclosure of Invention
In order to solve the above problems, the present invention provides a semiconductor epitaxial thin film surface mount type packaging device.
In order to realize the purpose of the invention, the adopted technical scheme is as follows: the utility model provides a SMD encapsulation equipment of semiconductor epitaxial film, includes that the main framework props up a supporting bench, encapsulation execution module and package dish group:
the main framework supporting platform is used for framework composition of the whole packaging equipment, transition with an electrical connection part and composition of a connection structure, and a packaging execution module and a pneumatic rod are fixedly installed on the main framework supporting platform;
the main framework supporting tables are symmetrically arranged with the saddles as axes, the pneumatic rod is pneumatically connected with a second connecting rod which horizontally and transversely extends, and the second connecting rod is provided with an encapsulation executing module in a sliding manner.
The packaging execution module is used for operating a pasting procedure between the integrated circuit chip transferred at the upper layer working section and the packaging substrate or the pin frame, and comprises a rotating motor connecting end used for being connected with a power source motor, so that the packaging execution module has dynamic energy supply and is convenient to work;
the bearing transmission of rotating electrical machines link bottom is connected with perpendicular slide, perpendicular slide extends to grinding and cutting dish pine sword end from rotating electrical machines link department to the bolt is twisted soon and is gone into in grinding and cutting dish pine sword end.
The packaging disc group is used for carrying out a passive transmission operating mechanism when a base plate and a mother-son plate carry out pin operation, lead wire adhesion and pin cutting, and comprises an upper disc, a PCB and a lifting plate, wherein the upper disc is in a round cake shape, a through hole is formed in the upper disc from the axis center, the upper disc comprises a pin trimming line wheel and a cutting line wound on the pin trimming line wheel and a main line wheel, and the upper disc is buckled at two ends of the PCB from top to bottom;
the bottom of the PCB is clamped in the lifting plate; the two ends of the stitch trimming line wheel and the main line wheel self-lifting plate are oppositely arranged on the periphery of the upper plate, and the cutting lines are axially distributed along the inner periphery of the upper plate;
the lifting plate and the upper plate are arranged in parallel in the same plane in a crossed manner, the saddle is fixedly connected with the lifting plate, and PTH holes penetrating through the PCB are equidistantly distributed on the PCB.
The bottom side of the interior of the saddle is provided with a conveying wheel belt for radial conveying, the middle part of the saddle is provided with a material conveying hole for replacing a substrate, the conveying wheel belt is connected with a speed actuator for detecting and limiting the self conveying speed, and the speed actuator is arranged at a limiting position at the outer end of the saddle.
Preferably, a material box for storing pin operation materials and manufacturing bridge lead materials is arranged on the main framework supporting platform, and the material box is communicated with the discharging power strip fixedly arranged on the main framework supporting platform through thread solidification.
Preferably, the vertical slide has a longitudinal vertical length no greater than the longitudinal travel path length of the loose end of the abrasive cutting disc.
Preferably, the vertical sliding seat comprises a rotating main shaft which is connected with a connecting end of a rotating motor in a transmission manner, the rotating main shaft is connected with a driven fulcrum shaft in a transmission manner, and the loosening end of the grinding and cutting disc comprises a grinding and cutting disc.
Preferably, grind the cutting disc and lead to the axle and grind the cutting head including the heat dissipation and constitute, grind the cutting head and agree with in the through-hole of last piece dish, it leads to the axle to have the heat dissipation of release heat energy between cutting head and the perpendicular slide, grind cutting head internally mounted has the stitch cartridge leading end of lining up whole grinding and cutting disc, stitch cartridge leading end is linked together with the passage.
Preferably, the blowing row of inserting is including dissolving workbin and passage, dissolve the workbin and be rectangle form concrete block structure, and its passage is thick tubular column structure down, and a plurality of passage interlude are dissolved the workbin along the length direction equidistance of dissolving the workbin and through connection, dissolve workbin one side and install the kicking block that has the startability, the inside and protrusion of bulldozing block embedding dissolve workbin dissolves workbin lateral wall plane.
Preferably, the length of the rod body of the second connecting rod is not greater than the length of the transverse movement path of the encapsulating execution module, and the second connecting rod is used for controlling and guiding the transverse walking path of the encapsulating execution module and determining the transverse path range of the encapsulating execution module.
Preferably, the upper disc and the PCB are arranged in a vertical opposite mode, the PCB is of a square structure, the axis of the upper disc is consistent with the cross center point formed by the horizontal axis and the longitudinal axis of the PCB on the same vertical line, the connecting ends of the upper disc and the PCB except two sides are attached to each other, and the rest connecting ends are provided with hanging gaps.
Compared with the prior art, the invention has the beneficial effects that: the semiconductor epitaxial film surface mount type packaging equipment adopts transistor inner shape grid array packaging, is different from the traditional packaging modes such as dual in-line type packaging, transistor outer shape packaging, contact pin grid array packaging and the like, has the advantages of reducing the epitaxial rate of a chip film and the large error rate of chip packaging, can be plastically packaged with a lead chip carrier, can effectively sub-package square and round or inner sleeve type packaging units, can be generally suitable for semiconductor base materials of stack type packaging in modern society with more advanced and refined modern microelectronic information technology, can thin the film under the support of an upper plate, reduces the thickness of the chip, stabilizes the heat dissipation of the chip, shortens connecting lines between elements, realizes higher performance, scribes after thinning, can reduce the workload of scribes and the condition of chip chipping, and adopts a point contact cutting mode of linear cutting to carry out point contact cutting on the pins, The redundant thin film tissues of the stitches or the upper pieces are cut off at one time, so that the destructiveness is small, the cutting speed is higher, and the efficiency is higher.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure of the package execution module of the present invention;
FIG. 3 is an enlarged schematic view of the top view of the abrasive cutting head of the present invention;
FIG. 4 is an enlarged bottom view of the package tray assembly of the present invention;
FIG. 5 is an enlarged schematic view of the top view of the upper plate of the present invention;
FIG. 6 is an enlarged view of the discharging row of the present invention.
In the figure: 1. the main frame structure supporting platform, 2, the encapsulation execution module, 21, the rotating electrical machines connecting end, 22, the vertical slide seat, 221, the rotating main shaft, 2211, the driven fulcrum shaft, 23, the grinding and cutting disc loosening end, 231, the grinding and cutting disc, 2311, the heat dissipation through shaft, 2312, the grinding and cutting head, 23121, the stitch insertion guiding end, 3, the work bin, 31, the discharging and inserting row, 311, the material dissolving box, 312, the material guiding pipe, 3121, the pushing block, 4, the pneumatic rod, 41, the second connecting rod, 5, the saddle, 6, the encapsulation plate group, 61, the loading plate, 611, the stitch alignment cutting wheel, 6111, the cutting line, 612, the main line wheel, 62, the PCB plate, 621, the PTH hole, 63, the lifting plate, 7, the conveying wheel belt, 71, and the speed executor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Those of ordinary skill in the art will recognize that the directional terms "upper," "lower," "outer," "inner," etc., are used in a descriptive sense with respect to the drawings and are not intended to limit the scope of the claims.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a SMD encapsulation equipment of semiconductor epitaxial film, includes main framework brace table 1, encapsulation execution module 2 and package dish group 6: the main framework supporting platform 1 is used for the framework composition of the whole packaging equipment, and is in transition with an electrical connection part and forms a connection structure, a packaging execution module 2 and an air rod 4 are fixedly installed on the main framework supporting platform 1, a bin 3 for storing pin operation materials and manufacturing bridge lead wires is installed on the main framework supporting platform 1, the bin 3 is communicated with a discharging extension socket 31 fixed on the main framework supporting platform 1 through thread solidification, the discharging extension socket 31 comprises a material dissolving box 311 and material guide pipes 312, the material dissolving box 311 is of a rectangular concrete block structure, the material guide pipes 312 are of a tubular column structure with a thick upper part and a thin lower part, a plurality of material guide pipes 312 are inserted into the material dissolving box 311 at equal intervals along the length direction of the material dissolving box 311 and are in through connection, the material inside the material dissolving box 311 is a corresponding material base material required in the process of pins during semiconductor packaging, preferably, the base material is in a liquid form, and the material inside the, Conductive materials with good electrical properties such as copper and gold.
The pushing block 3121 with starting performance is installed on one side of the material dissolving box 311, the pushing block 3121 is embedded into the material dissolving box 311 and protrudes out of the plane of the outer side wall of the material dissolving box 311, the pushing block 3121 is pushed by air pressure to perform reciprocating extrusion action towards the interior of the material dissolving box 311, so that the internal pressure of the material dissolving box 311 is increased, the speed of leading out the material in the material dissolving box 311 from the material guide pipe 312 due to extrusion of the increased pressure is increased, the temperature is reduced when the material is conveyed to the material dissolving box 311 from the material box 3, and therefore the pin material in a semi-solidified state or a micro-solidified state at each conveying interface is conveyed into the material dissolving box 311 to be heated, so that the material is reformed into a liquid state which can be dredged by flowing.
The main framework supporting platform 1 is arranged symmetrically with respect to each other by taking the saddle 5 as an axis, the pneumatic rod 4 is connected with a second connecting rod 41 which horizontally and transversely extends in a pneumatic mode, the encapsulation execution module 2 is installed on the second connecting rod 41 in a sliding mode, the rod body length of the second connecting rod 41 is not larger than the transverse movement path length of the encapsulation execution module 2, and the second connecting rod 41 is used for controlling and guiding the transverse walking path of the encapsulation execution module 2 and determining the transverse path range of the encapsulation execution module 2.
The packaging execution module 2 is an active mechanism module used for operating a pasting process between an integrated circuit chip and a packaging substrate or a pin frame, which are transmitted at an upper layer working section, and the packaging execution module 2 comprises a rotating motor connecting end 21 used for being connected with a power source motor, so that the packaging execution module 2 has dynamic energy supply and is convenient to work;
when the pins are formed, in order to increase the smoothness of the pin section when the redundant structure of the pins is cut off and reduce the generation of burrs and burrs of a conductor plate, a linear cutting mode is adopted in the pin forming stage, the pin trimming line wheel 611 is used for driving the cutting line 6111 to perform one-step integral cutting on the redundant pin modules exceeding the height limit of the upper plate 61, when the linear rounded cutting end of the cutting line 6111 contacts the pins and needs to cut the contact surface, the original cutting contact state of the linear rounded cutting end and the pins generated in one moment is a point contact state, so that the series problems of pin lifting, pin flying, pin inclination and the like caused by the overlarge cutting surface during cutting are reduced to the maximum extent, the askew pin structure layer is easier to break through, the cutting speed is higher, and the efficiency is higher.
The bottom of the rotating motor connecting end 21 is in transmission connection with a vertical sliding seat 22 through a bearing, the vertical sliding seat 22 extends from the rotating motor connecting end 21 to a grinding and cutting disc loosening blade end 23 and is screwed into the grinding and cutting disc loosening blade end 23 through a bolt, the longitudinal vertical length of the vertical sliding seat 22 is not more than the longitudinal walking path length of the grinding and cutting disc loosening blade end 23, the vertical sliding seat 22 is used for controlling and guiding the longitudinal walking path of the grinding and cutting disc loosening blade end 23 and determining the longitudinal path range of a grinding and cutting disc 231, the vertical sliding seat 22 comprises a rotating main shaft 221 in transmission connection with the rotating motor connecting end 21, the rotating main shaft 221 is in transmission connection with a driven fulcrum 2211, the grinding and cutting disc loosening blade end 23 comprises the grinding and cutting disc 231, the grinding and cutting disc 231 is connected with a kinetic energy power source through the rotating motor connecting end to form a high-speed dynamic working state, the grinding and cutting disc 231 completes the adjustment, the grinding and cutting disc 231 is driven to transversely move by the electric control pneumatic rod 4, so that the left and right positions of the grinding and cutting disc 231 are controlled to move and adjust;
the grinding and cutting disc 231 comprises a heat dissipation through shaft 2311 and a grinding and cutting head 2312, the grinding and cutting head 2312 is matched with a through hole of the upper disc 61, the heat dissipation through shaft 2311 for releasing heat energy is arranged between the grinding and cutting head 2312 and the vertical sliding seat 22, the heat dissipation through shaft 2311 releases sliding heat energy generated when the vertical sliding seat 22 frequently slides up and down, the temperature is reduced by pneumatically guiding cold substances such as condensation or water cooling to the heat dissipation through shaft 2311, meanwhile, the working hot pressing is prevented from being overlarge, a pin insertion leading end 23121 penetrating through the whole grinding and cutting disc 231 is installed in the grinding and cutting head 2312, the pin insertion leading end 23121 is communicated with a material guide pipe 312, materials required by leads of internal circuits of semiconductor chips and peripheral circuits required by a pin process when the chips are injected into the chip packaging process of the work bin 3 are orderly guided into the material dissolving bin 311 through an electrical connection control program to preserve heat or heat and dissolve, the dissolving bin 311 is injected into the leading end, during which the material solution is subjected to pressure and flow rate compensation micromanipulation by the pusher block 3121 externally connected to the solution tank 311.
The packaging disc group 6 is used for performing pin operation, lead wire adhesion and pin cutting on a substrate and a mother-son board, the packaging disc group 6 comprises an upper disc 61, a PCB 62 and a lifting board 63, the upper disc 61 is in a circular cake shape, a through hole is formed in the upper disc 61 from the axis, the upper disc 61 comprises a pin trimming wheel 611 and a cutting line 6111 wound on the pin trimming wheel 611 and a main line wheel 612, the upper disc 61 is buckled at two ends of the PCB 62 from top to bottom, the PCB 62 is transmitted into the packaging disc group 6 through a material transmitting hole 51, the upper disc 61 is buckled at two ends of the PCB 62 and fixed above, when a film is covered on the PCB 62 or semiconductor boards such as the substrate, the film is covered at the upper disc 61 at the same time, the grinding disc 231 is continuously close to the upper disc 61 downwards and passes through a circular hollow hole formed in the upper disc 61 to reach the upper part of the PCB 62, the film is simultaneously brought into the hollow hole and adsorbed on the PCB 62, in the process of continuously approaching the PCB 62, the pin inserting leading end 23121 in the grinding and cutting disc 231 extrudes the raw material fed from the feeding tube 312 to form pins or leads, the through film is adhered to the inside of each PTH hole 621 on the PCB 62, the grinding and cutting disc 231 is driven to rotate by the rotating main shaft 221 and the driven fulcrum 2211, the film covering the upper disc 61 is continuously ground or cut, the thickness of the chip is reduced, and the remainder is automatically separated by the ADPE.
The bottom of the PCB 62 is clamped into the lifting plate 63; the stitch line aligning wheel 611 and the main line wheel 612 are oppositely arranged around the upper disc 61 from two ends of the lifting plate 63, the cutting lines 6111 are axially distributed along the inner circumference of the upper disc 61, one end of the lifting plate 63 is provided with a cylindrical connecting protruding edge extending downwards, the other end of the lifting plate 63 is provided with a trapezoidal section end, and the section end is provided with a through connecting hole;
the lifting plate 63 and the upper plate disc 61 are arranged in parallel in the same plane in a crossed manner, the saddle 5 is fixedly connected with the lifting plate 63, PTH holes 621 which penetrate through the PCB 62 are equidistantly distributed, preferably plated copper or plated gold metalized holes are arranged on the inner side and act inside through hole direct-insert type elements, the upper plate disc 61 and the PCB 62 are arranged in an up-down opposite manner, the PCB 62 is in a square structure, and the axis 61 of the upper disc is consistent with the crossed central point formed by the horizontal axis and the longitudinal axis of the PCB 62 on the same vertical line, and the connecting ends of the upper disc 61 and the PCB 62 except the two sides are clung, all other connecting ends have suspension gaps, PTH holes 621 need pin insertion, PTH holes 621 are equidistantly distributed on the PCB 62, conducting layers of the PTH holes 621 are electrically connected, pin procedures and the previous pin insertion are all carried out in the PTH holes 621, and internal pins are inserted into the PCB through pin insertion guiding ends 23121.
The conveying wheel belt 7 for radial conveying is mounted on the bottom side of the interior of the saddle 5, the material conveying hole 51 for replacing a base plate is formed in the middle of the saddle 5, the conveying wheel belt 7 is connected with a speed actuator 71 for detecting and limiting the self conveying speed, the speed actuator 71 is mounted at a limiting position of the outer end of the saddle 5, the lifting plate 63 serves as a guide structure connected between the saddle 5 and the PCB 62 and used for bearing the PCB 62 and fixing the PCB 62 on the surface of the saddle 5, and each extending foot extending outwards from the lower side of the lifting plate 63 is inserted into and fixed on the surface of the saddle 5, and the extending part is pulled out of the saddle 5 to release the bearing state of the PCB 62 or release the connection state between the lifting plate 63 and the saddle 5, so that a person can take up the PCB 62 on the lifting plate 63 or the lifting plate 63 to clean and maintain the lifting plate 63 or package a lower section of the PCB 62.
The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (8)
1. The utility model provides a SMD encapsulation equipment of semiconductor epitaxial film, includes that main framework brace table (1), encapsulation execution module (2) and encapsulation dish group (6):
the main framework supporting platform (1) is used for framework composition of the whole packaging equipment, transition of an electrical connection part and composition of a connection structure, and a packaging execution module (2) and an air rod (4) are fixedly installed on the main framework supporting platform (1);
the main framework supporting platform (1) is symmetrically arranged with a saddle (5) as an axis, the pneumatic rod (4) is pneumatically connected with a second connecting rod (41) which horizontally and transversely extends, the second connecting rod (41) is provided with an encapsulation executing module (2) in a sliding way,
the packaging execution module (2) is an active mechanism module used for operating a pasting process between an integrated circuit chip and a packaging substrate or a pin frame, which are transmitted at an upper layer working section, and the packaging execution module (2) comprises a rotating motor connecting end (21) used for being connected with a power source motor, so that the packaging execution module (2) has dynamic energy supply and is convenient to work;
the bottom of the rotating motor connecting end (21) is in bearing transmission connection with a vertical sliding seat (22), the vertical sliding seat (22) extends to a grinding and cutting disc loosening end (23) from the rotating motor connecting end (21) and is screwed into the grinding and cutting disc loosening end (23) through bolts,
the packaging disc set (6) is used for a passive transmission operating mechanism when a base plate and a mother-son plate are subjected to pin operation, lead adhesion and pin cutting, the packaging disc set (6) comprises an upper disc (61), a PCB (62) and a lifting plate (63), the upper disc (61) is in a round cake shape, a through hole is formed in the upper disc (61) from the axis, the upper disc (61) comprises a pin trimming wheel (611) and a cutting line (6111) wound on the pin trimming wheel (611) and a main line wheel (612), and the upper disc (61) is buckled at two ends of the PCB (62) from top to bottom;
the bottom of the PCB (62) is clamped into the lifting plate (63); the stitch aligning and cutting line wheel (611) and the main line wheel (612) are oppositely arranged around the upper sheet disc (61) from two ends of the lifting plate (63), and the cutting lines (6111) are axially distributed along the inner circumference of the upper sheet disc (61);
the lifting plate (63) and the upper plate (61) are arranged in parallel in the same plane in a crossed manner, the saddle (5) is fixedly connected with the lifting plate (63), PTH holes (621) which penetrate through the PCB (62) are equidistantly distributed,
the bottom side of the interior of the saddle (5) is provided with a conveying wheel belt (7) for radial conveying, the middle part of the saddle (5) is provided with a material conveying hole (51) for replacing a base plate, the conveying wheel belt (7) is connected with a speed actuator (71) for detecting and limiting the self conveying speed, and the speed actuator (71) is arranged at a limiting position at the outer end of the saddle (5).
2. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 1, wherein: the main framework supporting platform (1) is provided with a material box (3) for storing pin operation materials and manufacturing bridge lead materials, and the material box (3) is communicated with a discharging power strip (31) which is fixed on the main framework supporting platform (1) through thread solidification.
3. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 1, wherein: the longitudinal vertical length of the vertical sliding seat (22) is not more than the longitudinal travel path length of the loosening end (23) of the grinding and cutting disc.
4. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 1, wherein: perpendicular slide (22) are connected with rotating electrical machines link (21) including the transmission and rotate main shaft (221), rotating main shaft (221) transmission is connected with driven fulcrum shaft (2211), grinding and cutting dish pine sword end (23) are including grinding and cutting dish (231).
5. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 4, wherein: the grinding and cutting disc (231) comprises a heat dissipation through shaft (2311) and a grinding and cutting head (2312), the grinding and cutting head (2312) is matched with a through hole of the upper disc (61), the heat dissipation through shaft (2311) for releasing heat energy is arranged between the grinding and cutting head (2312) and the vertical sliding seat (22), a stitch inserting and guiding end (23121) penetrating through the whole grinding and cutting disc (231) is installed inside the grinding and cutting head (2312), and the stitch inserting and guiding end (23121) is communicated with the material guide pipe (312).
6. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 2, wherein: blowing power strip (31) is including dissolving workbin (311) and passage (312), dissolve workbin (311) and be rectangle form concrete block structure, and thick thin tubular column structure down is in its passage (312), and a plurality of passage (312) are inserted along the length direction equidistance of dissolving workbin (311) and are dissolved workbin (311) and through connection, dissolve workbin (311) one side and install bulldozing piece (3121) that have start-up performance, bulldozing piece (3121) embedding is dissolved workbin (311) inside and protrusion in dissolving workbin (311) lateral wall plane.
7. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 1, wherein: the length of the rod body of the second connecting rod (41) is not more than the length of the transverse movement path of the packaging execution module (2).
8. The semiconductor epitaxial thin film patch type packaging apparatus according to claim 1, wherein: the upper disc (61) and the PCB (62) are arranged up and down oppositely, the PCB (62) is of a square structure, the axis of the upper disc (61) is consistent with the crossed central point formed by the horizontal axis and the longitudinal axis of the PCB (62) on the same vertical line, meanwhile, the upper disc (61) and the PCB (62) are attached to each other except for the connecting ends on the two sides, and the other connecting ends are provided with suspended gaps.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910652243.6A CN110364462B (en) | 2019-07-18 | 2019-07-18 | Semiconductor epitaxial film patch type packaging equipment |
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| CN201910652243.6A CN110364462B (en) | 2019-07-18 | 2019-07-18 | Semiconductor epitaxial film patch type packaging equipment |
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| CN110364462A CN110364462A (en) | 2019-10-22 |
| CN110364462B true CN110364462B (en) | 2020-08-28 |
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| CN112466785B (en) * | 2020-11-23 | 2022-09-02 | 江西世星科技有限公司 | Integrated circuit V-shaped groove grooving machine |
| CN113601773B (en) * | 2021-09-30 | 2021-12-07 | 南通鑫晶电子科技有限公司 | Transmission type chip packaging device |
| CN114999981B (en) * | 2022-08-02 | 2022-10-25 | 四川晁禾微电子有限公司 | Automatic conveying and processing equipment for plastic package triodes |
| CN116344366B (en) * | 2023-02-16 | 2024-03-19 | 北京聚睿众邦科技有限公司 | Chip patch packaging method and device |
| CN116810270B (en) * | 2023-08-02 | 2024-02-27 | 湖南迈克森伟电子科技有限公司 | Electronic fuze assembly coaxiality and height control tool and method |
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| CN204596769U (en) * | 2015-05-14 | 2015-08-26 | 江苏钜芯集成电路技术有限公司 | Cut muscle tool |
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| KR20140004387A (en) * | 2012-07-02 | 2014-01-13 | 삼성디스플레이 주식회사 | Manufacturing apparatus and method of organic light emitting diode display |
| CN105810655A (en) * | 2014-12-31 | 2016-07-27 | 无锡华润安盛科技有限公司 | Lead frame pin cutting structure and cutting method thereof |
| CN107305916A (en) * | 2016-04-22 | 2017-10-31 | 中山市泓昌光电科技有限公司 | A kind of CSP encapsulation LED chip mounter and its processing technology |
| US9653660B1 (en) * | 2016-06-30 | 2017-05-16 | Shu-Hung Lin | Chip scale LED packaging method |
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