CN205159289U - Light -duty chip eutectic bonding anchor clamps - Google Patents
Light -duty chip eutectic bonding anchor clamps Download PDFInfo
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- CN205159289U CN205159289U CN201520993175.7U CN201520993175U CN205159289U CN 205159289 U CN205159289 U CN 205159289U CN 201520993175 U CN201520993175 U CN 201520993175U CN 205159289 U CN205159289 U CN 205159289U
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- pressure
- fixture
- eutectic
- pressure sensor
- digital display
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Abstract
The utility model discloses a light -duty chip eutectic bonding anchor clamps, it has the eutectic anchor clamps to place board (1) and heating device (2), also has by fixed plate (4), pressure sensor mounting (5), digital display pressure module (6) and passes the fine setting pressure device that depression bar 7 is constituteed, wherein, has array internal thread hole on fixed plate (4), pressure sensor mounting (5) are the cavitys of an outband screw thread, and the array suit is in the corresponding screw hole of fixed plate (4), digital display pressure module (6) suit again pass depression bar (7) and install the lower part in pressure sensor mounting (5) on pressure sensor mounting (5) upper portion. The utility model discloses an eutectic bonding anchor clamps can accurately provide the eutectic pressure that microelectronic product chip eutectic bondd, and adjust pressure is convenient, and are especially bigger to the effect of batch simultaneous processing. Use extensively specially adapted microelectronics encapsulation field in the semiconductor device manufacture process.
Description
Technical field
The utility model relates to the equipment manufacturing semiconductor device, specifically, relates to the fixture of assembly location in manufacture process.
Background technology
Along with the fast development of integrated antenna package technology, microelectronic product encapsulation chips bonding adopts eutectic Welding more and more extensive in highly reliable quality requirement field, and for little chip because self gravitation is light, eutectic fixture seems particularly important.
At present, the eutectic fixture structure that known batch is processed simultaneously is placed plate two parts by heater and processed product and is formed, before eutectic, microelectronic product to be processed is neatly lain in and places on plate, then heater is driven to carry out eutectic weldering according to predetermined heating schedule, when solder reaches fusing point, the chip of microelectronic product to be processed is pressed on solder by deadweight, thus chip bottom to be partially submerged into solder and to weld with the abundant eutectic of solder.But along with integrated circuit subminaturization, high density future development, a lot of chip size is tiny at present, deadweight is very light, when being not enough to meet eutectic, chip bottom embeds the pressure needed for solder, and this easily causes segment chip eutectic die attach rosin joint, causes chip can not bond with shell.Therefore, existing eutectic fixture can not provide the pressure needed for microelectronic product chip eutectic.
Through retrieval, the Chinese patent application part relating to chip eutectic welding/bonding has No. CN1292463C " eutectic welding pasting method on semiconductor chip back side ", No. CN102832320B " a kind of LED chip eutectic coheres technique ", No. CN103066001B " the Universal leveling suction nozzle of eutectic welding machine pick-up chip ", No. CN102522481A " a kind of LED chip support for eutectic solid welding crystalline substance ", No. CN104934336A " a kind of chip eutectic welding method " etc., these technical schemes all have nothing to do with fixture, what relate to chip eutectic die attach fixture only has No. CN104900575A " the chip positioning fixture of Vacuum Eutectic weldering, manufacture method and chip conveyer method ", system's suction nozzle holds chip positioning fixture, its effect it be unclear that.
Summary of the invention
The purpose of this utility model is to provide a kind of chip light eutectic die attach fixture, to solve the problem that existing eutectic fixture can not provide the pressure needed for microelectronic product chip eutectic.
The chip light eutectic die attach fixture that designer provides, is transform on original eutectic fixture, increases accurate adjustable pressure device, and being formed can independently to the novel co-crystal fixture of finely tuning eutectic pressure during each microelectronic product eutectic to be processed.This fixture still has placement plate and the heater of original eutectic fixture; Designer adds at placement plate the fine setting pressure apparatus be made up of fixed head, pressure sensor fixture, digital display modular pressure and pressure transmission bar, wherein, fixed head has array internal thread hole; Pressure sensor fixture is an externally threaded cavity of band, is sleeved in the respective screw hole of fixed head; Digital display modular pressure is sleeved on again pressure sensor fixture top, and pressure transmission bar is arranged on the bottom of pressure sensor fixture.
Above-mentioned digital display modular pressure is the digital display modular pressure product of commercially available shown force value size.
Above-mentioned pressure sensor fixture is the screw rod of attached cavity, and the pitch of screw rod is below 0.1mm; The cavity of pressure sensor fixture mates with digital display modular pressure.
Above-mentioned pressure transmission bar is an elongate cylinder bar, its upper end be sleeved on pressure sensor fixture cavity bottom, contact with digital display modular pressure, the other end use time contact chip.
Above-mentioned fine setting pressure apparatus is that in device, each modular pressure of array can be exerted pressure size by individual fine tuning by the support vertical of a band screw above product to be processed; Screw thread on the screw of support and fixed head is supporting, and fixed head bolt penetrates support and is fixed on and places on plate.
The principle of chip light eutectic die attach fixture is: fixture passes through rotation pressure sensor fixture, lifting pressure module, thus is transmitted chip increase and decrease eutectic pressure by pressure transmission bar.Using method is: when turn clockwise pressure sensor fixture time, modular pressure declines along with pressure sensor fixture simultaneously, start to extrude pressure transmission bar and decline, and the position of chip immobilizes when modular pressure drops to certain position; Therefore, pressure transmission pole pair chip produces a pressure, and this pressure increases with pressure transmission bar decline degree and increases; When being rotated counterclockwise pressure sensor fixture, modular pressure rises along with pressure sensor fixture simultaneously, rise when modular pressure thus the extruding force of pressure transmission bar is diminished, make it to reduce the eutectic pressure of chip, along with modular pressure rising degree is larger less to pressure transmission bar extruding force, until pressure transmission bar is unsettled when rising to certain position, be zero to the pressure of chip.
Eutectic die attach fixture of the present utility model accurately can provide the eutectic pressure of microelectronic product chip eutectic die attach, regulates pressure convenient, and particularly to batch, elaboration is larger simultaneously.The pressure transmission bar initial condition of this eutectic die attach fixture is unsettled, can not directly contact processed product chip and destroy product when making it sectional fixture.Therefore, it can provide required pressure for various micro-electronic machining, can process the product that multiple microelectronic product chip size is less than 2.0mm × 2.0mm simultaneously.The force value of each microelectronic product chip acquisition to be processed needed for eutectic can be made, there is practical value, can carry out transforming, increasing this device on existing eutectic fixture.Be widely used in fabrication of semiconductor device, be specially adapted to microelectronics Packaging field.
Accompanying drawing explanation
Fig. 1 is eutectic die attach fixture unit cross-sectional view of the present utility model; Fig. 2 is the vertical view of eutectic die attach fixture; Fig. 3 is the structure side view of eutectic die attach fixture.
In figure: 1 for placing plate, and 2 is heater, and 3 is the shell of processed product, and 4 is fixed head, and 5 is pressure sensor fixture, and 6 is digital display modular pressure, 7 is pressure transmission bar, and 8 is chip, and 9 is bolt, and 10 is support.
Embodiment
Below in conjunction with accompanying drawing, the utility model content is further described, but is not to restriction of the present utility model.
Embodiment:
Chip light eutectic die attach fixture as Figure 1-3, this fixture still has placement plate 1 and the heater 2 of original eutectic fixture, add the fine setting pressure apparatus be made up of fixed head 4, pressure sensor fixture 5, digital display modular pressure 6 and pressure transmission bar 7, wherein, fixed head 4 has array internal thread hole; Pressure sensor fixture 5 is the externally threaded cavitys of band, and array nest is in the corresponding screwed hole of fixed head 4; Digital display modular pressure 6 is set in again pressure sensor fixture 5 top, and pressure transmission bar 7 is arranged on the bottom of pressure sensor fixture 5.
After whole fine-tuning pressure apparatus assembles, being fixed on by support 10 places on plate 1, measure each pressure transmission bar 7 upright projection places plate 1 position at processed product, and carry out mark in relevant position, take off fine-tuning pressure apparatus, then be that the corresponding each identified array of microelectronic product to be processed of 1.5mm × 1.5mm lies in and places on plate 1 by chip area, again whole fine setting pressure apparatus is fixed on placement plate 1 with bolt 9 again: whole fine setting pressure apparatus is placed in above each chip 8, micro-spinning force transducer fixture 5 respectively, digital display modular pressure 6 is elevated, when to show force value be desired value to digital display modular pressure 6, stop the rotation, the force value that each chip 8 obtains is constant, heating schedule is driven to carry out eutectic die attach.Therefore, the force value needed for the acquisition of chip 8 eutectic die attach of each microelectronic product to be processed.
Claims (5)
1. a chip light eutectic die attach fixture, eutectic fixture is had to place plate (1) and heater (2), it is characterized in that the fine setting pressure apparatus that it is made up of fixed head (4), pressure sensor fixture (5), digital display modular pressure (6) and pressure transmission bar (7) in addition, wherein, fixed head (4) there is the internal thread hole of array; Pressure sensor fixture (5) is an externally threaded cavity of band, and multiple pressure sensor fixture (5) is sleeved in the corresponding screwed hole of fixed head (4); Digital display modular pressure (6) is sleeved on again pressure sensor fixture (5) top, and pressure transmission bar (7) is arranged on the bottom of pressure sensor fixture (5).
2., according to eutectic die attach fixture according to claim 1, it is characterized in that the digital display modular pressure product that described digital display modular pressure (6) is commercially available shown force value size.
3. according to eutectic die attach fixture according to claim 1, it is characterized in that the screw rod that described pressure sensor fixture (5) is attached cavity, the pitch of screw rod is below 0.1mm; The cavity of pressure sensor fixture (5) mates with digital display modular pressure (6).
4. according to eutectic die attach fixture according to claim 1, it is characterized in that described pressure transmission bar (7) is an elongate cylinder bar, its upper end is sleeved on the cavity bottom suspension of pressure sensor fixture (5), during use, upper end contacts with digital display modular pressure (6), other end contact chip.
5., according to eutectic die attach fixture according to claim 1, it is characterized in that support (10) orthogonal array of described fine setting pressure apparatus by a band screw is above product to be processed; Positioning threads on screw thread on support (10) and fixed head (4) is supporting, and fixed head (4) bolt (9) is fixed on support (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520993175.7U CN205159289U (en) | 2015-12-04 | 2015-12-04 | Light -duty chip eutectic bonding anchor clamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520993175.7U CN205159289U (en) | 2015-12-04 | 2015-12-04 | Light -duty chip eutectic bonding anchor clamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205159289U true CN205159289U (en) | 2016-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520993175.7U Active CN205159289U (en) | 2015-12-04 | 2015-12-04 | Light -duty chip eutectic bonding anchor clamps |
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| Country | Link |
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| CN (1) | CN205159289U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115223902A (en) * | 2022-09-21 | 2022-10-21 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Pressurization of high accuracy eutectic chip mounter is got and is put structure |
-
2015
- 2015-12-04 CN CN201520993175.7U patent/CN205159289U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115223902A (en) * | 2022-09-21 | 2022-10-21 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Pressurization of high accuracy eutectic chip mounter is got and is put structure |
| CN115223902B (en) * | 2022-09-21 | 2022-11-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Pressure of high accuracy eutectic chip mounter is got and is put structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 550018 Guizhou Province, Guiyang city new North Avenue No. 238 Patentee after: Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd. Address before: 550018 Guizhou Province, Guiyang city new North Avenue No. 238 Patentee before: GUIZHOU ZHENHUA FENGGUANG SEMICONDUCTOR Co.,Ltd. |