CN106356435B - A kind of packaging method of flip-chip pressing machine and inverted light-emitting diode (LED) - Google Patents
A kind of packaging method of flip-chip pressing machine and inverted light-emitting diode (LED) Download PDFInfo
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- CN106356435B CN106356435B CN201510405294.0A CN201510405294A CN106356435B CN 106356435 B CN106356435 B CN 106356435B CN 201510405294 A CN201510405294 A CN 201510405294A CN 106356435 B CN106356435 B CN 106356435B
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- 238000003825 pressing Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000001514 detection method Methods 0.000 claims abstract description 34
- 238000007731 hot pressing Methods 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 15
- 230000008569 process Effects 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000011897 real-time detection Methods 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 239000011236 particulate material Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 230000005496 eutectics Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H01L33/48—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H01L33/62—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/8302—Applying permanent coating to the layer connector in the bonding apparatus, e.g. in-situ coating
-
- H01L2933/0033—
-
- H01L2933/0066—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Wire Bonding (AREA)
Abstract
The present invention provides a kind of packaging methods of inverted light-emitting diode (LED), electrically conductive particles are evenly spread in the good insulative glue of thermal conductivity first and form pressing conducting resinl, then inverted light-emitting diode (LED) is fixed on substrate with the pressing conducting resinl, a kind of flip-chip pressing machine, including display control component, moving assembly, image recognition component, weld assembly, hot pressing head assembly, height detection component, electrical detection component and temperature-controlling component are additionally provided simultaneously.The packaging method of inverted light-emitting diode (LED) provided by the present invention, it is different from the method for traditional eutectic weldering, conductive and die bond effect is realized with pressing conducting resinl, switching performance is higher, simple process and low cost, and it is very environmentally friendly, so as to form a set of flip-chip die bond completely new equipment, method and technique, full-automatic, quick die bond, significant increase upside-down mounting die bond yield can be carried out.
Description
Technical field
The present invention relates to the technical field of LED flip chip, especially a kind of flip-chip pressing machine and flipped light emitting two
The packaging method of pole pipe.
Background technique
LED (LightEmittingDiode), light emitting diode, abbreviation LED, it is visible to be that one kind can convert electrical energy into
The solid-state semiconductor device of light.As new and effective solid light source, semiconductor lighting has service life length, energy-saving and environmental protection, safety etc.
Remarkable advantage is widely applied and illumination, display, signal lamp field.
Flip-chip is because having excellent electric conductivity and good thermal diffusivity to seal as electronic chip in existing technology
The main trend of dress, it is also more and more prosperous in illuminating industry.Flip-chip need to be welded the salient point of chip surface by welding system
It connects on substrate, welding system directly influences the welding quality of chip to the control of chip height, and excessive welding and assembling height is easy
Lead to rosin joint, too low welding and assembling height easily leads to short circuit, and chip level degree difference easily leads to missing solder.Current LED face-down bonding system
System there is a problem of can not detection chip welding quality it is fine or not, yield is low, and welding equipment is at high cost.
Summary of the invention
The present invention provides a kind of flip-chip pressing machine, and current collection, machine, light, image are integrated, integrated use image procossing skill
The multinomial technology such as art, movement control technology, precision machinery technology, temperature control technology, feedback control is formed a set of completely new
Flip-chip die-bonding method and technique can carry out full-automatic, quick die bond, significant increase upside-down mounting die bond yield.
In order to achieve the above objects and other related objects, the encapsulation side of a kind of inverted light-emitting diode (LED) provided by the invention
Method includes the following steps:
1) electrically conductive particles are evenly spread in the good insulative glue of thermal conductivity and forms pressing conducting resinl；
2) on the package substrate by pressing conducting resinl drop, then the upside-down mounting LED chip is aligned
Electrode position, which is placed on drop, to be had on the package substrate of the pressing conducting resinl；
3) upside-down mounting LED chip is pressed using the pressing machine, applied in the package substrate positive and negative electrode
Voltage makes the upside-down mounting when reaching certain distance between the inverted light-emitting diode (LED) electrode and the package substrate electrode
Light-emitting diode chip for backlight unit conducting, when a probing needle detects a certain specified current flow, the pressing machine stops pressing；
4) be heating and curing the pressing conducting resinl, is formed between the upside-down mounting LED chip and the package substrate and is led to
Cross the upside-down mounting LED lighting device of countless micro- contact vertical conductions.
One preferred embodiment of the packaging method as inverted light-emitting diode (LED) of the invention is pressed using the pressing machine
The upside-down mounting LED chip, for this time away between 2~30um, the pressing machine application voltage is described between 2~100V
Specified current flow when upside-down mounting LED chip is connected is between 0.1uA~1A.
One preferred embodiment of the packaging method as inverted light-emitting diode (LED) of the invention, the substrate are with circuit
Heat sink, such as bracket, pcb board, COB plate.
As the pressing conducting resinl that the present invention is applicable in, by the good megohmite insulant of thermal conductivity and it is coated in megohmite insulant
Conductive particle composition, the megohmite insulant volume accounting are 50-98.8%, and conductive particle volume accounting is 0.2-50%, institute
It is non-conductive to state pressing conducting resinl itself, includes conductive particle, includes megohmite insulant outside the conductive particle, it is sufficiently large in pressure
Under conditions of, megohmite insulant is destroyed, and electric conductivity is highlighted.
As a preferred embodiment of the pressing conducting resinl that the present invention is applicable in, the megohmite insulant is thermoplastic resin
Rouge, the conductive particulate materials that the pressing conducting resinl includes can be one of gold, silver, copper, nickel, palladium, molybdenum, zirconium, cobalt, tin or more
Kind.
As a preferred embodiment of the pressing conducting resinl that the present invention is applicable in, megohmite insulant is epoxy resin, polyamides Asia
One or more, 2~50um of the conductive particle diameter of amine and phenolic resin.
As a kind of flip-chip pressing machine applied by the present invention, it is characterised in that: the pressing machine includes display control
Component processed, moving assembly, image recognition component, weld assembly, hot pressing head assembly, height detection component, electrical detection component, control
Warm component, the display control component are made of display and control system, display display machinery and system mode, control
System control moving assembly, image recognition component, weld assembly, hot pressing head assembly, height detection component, electrical detection component,
The operation of temperature-controlling component, the hot pressing head assembly have pressurization, heating and automatic regulating function.
Wherein, the height of the height detection component energy real-time measurement hot pressing head assembly, is converted into telecommunications for altitude signal
Number, output voltage values are transferred to display control component, and the electrical property detection components apply voltage and real to welding chip both ends
When sensed current signal, when current signal reaches standard by electrical property detection components feedback signal to control assembly, control group
Part controls hot pressing head assembly and stablizes in final height.
Wherein, the moving assembly includes workbench, lifting rotation mould group, vacuum system, plays control dispensing workbench
Function of the accurate dispensing in substrate designated position, mobile flip-chip to substrate designated position and adjustment chip and substrate spacing
Energy.
Wherein, described image recognizer component includes microscope, ccd image processing unit, and picture processing speed may be up to
In 10ms, chip coordinate can be accurately identified, the positioning of chip and workbench is controlled with moving assembly, and accurately identifies substrate seat
Mark, with the positioning of moving assembly control weld assembly.
Wherein, the weld assembly realizes the process that flip-chip is fixed on to substrate, and weld assembly has heating function
And by temperature-controlling component temperature control, substrate quickly can be increased to assigned temperature by the temperature-controlling component, and real-time measurement substrate temperature will be warm
Degree signal is converted into voltage signal, and is modified and output voltage values are transferred to display control component, while controlling temperature perseverance
The fixed and stopping heating after reaching specified time.
As described above, a kind of packaging method of inverted light-emitting diode (LED) provided by the present invention, the method with the weldering of traditional eutectic
Difference realizes conductive and die bond effect with pressing conducting resinl, and switching performance is higher, simple process and low cost, and very environmentally friendly,
A kind of flip-chip pressing machine applied by the present invention, current collection, machine, light, image are integrated simultaneously, integrated use image procossing skill
The multinomial technology such as art, movement control technology, precision machinery technology, temperature control technology, feedback control is formed a set of completely new
Flip-chip die-bonding method and technique can carry out full-automatic, quick die bond, significant increase upside-down mounting die bond yield, to adapt to China
The needs of flip-chip extensive development, equipment have domestically leading level.
Detailed description of the invention
Fig. 1 is shown as flip-chip pressing machine composition and system control and transmission structure figure in the present invention.
Fig. 2 is shown as flow diagram when each step of flipped light emitting diode packaging method in the present invention carries out.
Include in fig. 1 and 2:
11- display control component, 12- moving assembly, 13- image recognition component, 14- weld assembly, 15- thermal head group
Part, 16- height detection component, 17- electrical detection component, 18- temperature-controlling component, 21- inverted light-emitting diode (LED), 22- symmetry electrode,
23- presses conducting resinl, 24- conductive particle, the megohmite insulant outside 25- conductive particle, 26- substrate, 27- point probing needle.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples, it is noted that in the present embodiment
The provided diagram basic conception that only the invention is illustrated in a schematic way, only shows component related to the present invention in diagram then
Rather than drawn according to the component count, shape and size of actual implementation, when actual implementation each component form, quantity and ratio
Can arbitrarily it change for one kind, and its assembly layout form may also be increasingly complex.
Embodiment: as shown in FIG. 1 to FIG. 2, a kind of flip-chip pressing machine applied by the present embodiment, including following knot
Structure: display control component 11, moving assembly 12, image recognition component 13, weld assembly 14, hot pressing head assembly 15, height detection
Component 16, electrical detection component 17, temperature-controlling component 18, wherein the thermal head component 15 has pressurization, heating and adjust automatically
Function, hot pressing head assembly 15 has the function of adsorbing chip and adjusts chip level, and the height of thermal head is by height detection component
16 carry out preliminary control function, by the final height of 17 feedback control of electrical detection component.
Display control component 11 is made of display and control system, and display machinery and system mode control moving assembly
12, image recognition component 13, weld assembly 14, hot pressing head assembly 15, height detection component 16, electrical detection component 17, temperature control
The operation such as component 18.
Moving assembly 12 includes workbench, lifting rotation mould group, vacuum system, plays the control accurate dispensing of dispensing workbench
In substrate designated position, mobile flip-chip to substrate designated position adjusts the functions such as chip and substrate spacing.
Image recognition component 13 includes microscope, ccd image processing unit, and picture processing speed may be up in 10ms, essence
True identification chip coordinate, with the positioning of moving assembly control chip and workbench；Substrate coordinate is accurately identified, with moving assembly control
The positioning of weld assembly processed.
Weld assembly 14 realizes the process that flip-chip is fixed on to substrate, and weld assembly 14 has heating function and by controlling
Warm 18 temperature control of component.
Altitude signal is converted into electric signal by height detection component 16, the height of real-time measurement hot pressing head assembly 15, output
Voltage value is transferred to display control component 11.
Electrical property detection components 17 apply voltage, real-time detection current signal, when current signal reaches to welding chip both ends
When to standard, feedback signal controls hot pressing head assembly 15 and stablizes height herein to control assembly 11.
Substrate quickly can be increased to assigned temperature by temperature-controlling component 18, and real-time measurement substrate temperature converts temperature signal
It at voltage signal, and is modified and output voltage values are transferred to display control component 11, control temperature is constant and refers to reaching
Stop heating after fixing time.
A kind of packaging method of inverted light-emitting diode (LED) provided by the present embodiment, comprising the following steps:
Preparation pressing conducting resinl 23: step S1 conductive particle 24 is evenly spread in the good insulative glue of thermal conductivity
Form pressing conducting resinl 23；
Step S2 is dripped the pressing conducting resinl 23 on the package substrate 26 using dispensing workbench, then by institute
Stating upside-down mounting LED chip 21 and being aligned 22 position of electrode and be placed on to drip has the package substrate for pressing conducting resinl 23
On 26；
Step S3 presses the upside-down mounting LED chip 21 using the pressing compressing head 16, in the encapsulation base
26 positive and negative electrode of plate applies voltage, when reaching one between 26 electrode of the inverted light-emitting diode (LED) electrode 22 and the package substrate
Set a distance (1-100um), the megohmite insulant 25 outside the conductive particle rupture, and the flipped light emitting is connected in the conductive particle 24
Diode chip for backlight unit 2, when this time point probing needle 27 detects a certain specified current flow within the scope of 0.1uA-200mA, the pressing machine
Pressure head 16 stablizes height herein；
Step S4 is heating and curing the pressing conducting resinl 23 with weld assembly 14, forms the inverted light-emitting diode (LED) core
Pass through the upside-down mounting LED lighting device of countless micro- contact vertical conductions between piece 21 and the package substrate 26.
Compared with prior art, operation of the present invention is simple by the present invention, there is certain requirement to equipment precision, can high-volume
It uses, overall cost is low, and production yield significantly improves.
The above embodiments and description only illustrate the principle of the present invention and most preferred embodiment, is not departing from this
Under the premise of spirit and range, various changes and improvements may be made to the invention, these changes and improvements both fall within requirement and protect
In the scope of the invention of shield.
Claims (8)
1. a kind of packaging method of inverted light-emitting diode (LED), it is characterised in that: the following steps are included:
1) electrically conductive particles are evenly spread in the good insulative glue of thermal conductivity and forms pressing conducting resinl；
2) then the upside-down mounting LED chip is aligned electrode position on package substrate by pressing conducting resinl drop
Being placed on drop has on the package substrate of the pressing conducting resinl；
3) upside-down mounting LED chip is pressed using pressing machine, applies voltage in the package substrate positive and negative electrode, when
When reaching certain distance between the inverted light-emitting diode (LED) electrode and the package substrate electrode, make two pole of flipped light emitting
Tube chip conducting, when a probing needle detects a certain specified current flow, the pressing machine stops pressing；
4) be heating and curing the pressing conducting resinl, is formed between upside-down mounting LED chip and the package substrate by countless micro-
Contact the upside-down mounting LED lighting device of vertical conduction；
The pressing machine includes display control component, moving assembly, image recognition component, weld assembly, hot pressing head assembly, height
Detection components, electrical detection component, temperature-controlling component, the display control component are made of display and control system, display
Device display is mechanical and system mode, control system control moving assembly, image recognition component, weld assembly, hot pressing head assembly, height
The operation of detection components, electrical detection component, temperature-controlling component is spent, the hot pressing head assembly has pressurization, heating and adjust automatically
Function；
Altitude signal is converted into electric signal, output electricity by the height of the height detection component energy real-time measurement hot pressing head assembly
Pressure value is transferred to display control component, and the electrical property detection components apply voltage and real-time detection electric current to welding chip both ends
Signal, when current signal reaches standard by electrical property detection components feedback signal to control assembly, control assembly controls hot pressing
Head assembly is stablized in final height.
2. the packaging method of inverted light-emitting diode (LED) according to claim 1, it is characterised in that: the pressing conducting resinl by
The good megohmite insulant of thermal conductivity and the conductive particle being coated in megohmite insulant form, and the megohmite insulant volume accounting is
50-98.8%, conductive particle volume accounting are 0.2-50%.
3. the packaging method of inverted light-emitting diode (LED) according to claim 2, it is characterised in that: the megohmite insulant is
Thermoplastic resin, it is described to press the conductive particulate materials that conducting resinl includes as one in gold, silver, copper, nickel, palladium, molybdenum, zirconium, cobalt, tin
Kind is a variety of.
4. the packaging method of inverted light-emitting diode (LED) according to claim 2, it is characterised in that: the megohmite insulant is
Epoxy resin, polyimides and phenolic resin it is one or more.
5. a kind of flip-chip pressing machine, it is characterised in that: the pressing machine includes display control component, moving assembly, image
Recognizer component, weld assembly, hot pressing head assembly, height detection component, electrical detection component, temperature-controlling component, the display control
Component processed is made of display and control system, and display display is mechanical and system mode, control system control moving assembly, figure
It is described as the operation of recognizer component, weld assembly, hot pressing head assembly, height detection component, electrical detection component, temperature-controlling component
Hot pressing head assembly has pressurization, heating and automatic regulating function, the height detection component energy real-time measurement hot pressing head assembly
Highly, altitude signal is converted into electric signal, output voltage values are transferred to display control component, the electrical property detection components pair
Welding chip both ends apply voltage and real-time detection current signal, anti-by electrical property detection components when current signal reaches standard
To control assembly, control assembly controls hot pressing head assembly and stablizes in final height feedback signal.
6. flip-chip pressing machine according to claim 5, it is characterised in that: the moving assembly includes workbench, rises
Rotating module, vacuum system are dropped, plays the control accurate dispensing of dispensing workbench in substrate designated position, mobile flip-chip to base
Piece designated position and the function of adjusting chip and substrate spacing.
7. flip-chip pressing machine according to claim 5, it is characterised in that: described image recognizer component includes micro-
Mirror, ccd image processing unit, can accurately identify chip coordinate, with the positioning of moving assembly control chip and workbench, Yi Jijing
Really identification substrate coordinate, with the positioning of moving assembly control weld assembly.
8. flip-chip pressing machine according to claim 5, it is characterised in that: the weld assembly is realized flip-chip
It is fixed on the process of substrate, weld assembly has heating function and by temperature-controlling component temperature control, and the temperature-controlling component can be quickly by base
Piece is increased to assigned temperature, and temperature signal is converted into voltage signal, and is modified and exports electricity by real-time measurement substrate temperature
Pressure value is transferred to display control component, at the same control temperature it is constant and after reaching specified time stop heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510405294.0A CN106356435B (en) | 2015-07-13 | 2015-07-13 | A kind of packaging method of flip-chip pressing machine and inverted light-emitting diode (LED) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510405294.0A CN106356435B (en) | 2015-07-13 | 2015-07-13 | A kind of packaging method of flip-chip pressing machine and inverted light-emitting diode (LED) |
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| Publication Number | Publication Date |
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| CN106356435A CN106356435A (en) | 2017-01-25 |
| CN106356435B true CN106356435B (en) | 2019-07-09 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10741482B2 (en) | 2017-12-29 | 2020-08-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
| CN108253921B (en) * | 2018-03-26 | 2023-09-19 | 东莞高伟光学电子有限公司 | System and method for detecting welding levelness of chip and ceramic substrate on line |
| CN112186088A (en) * | 2020-09-30 | 2021-01-05 | 深圳Tcl新技术有限公司 | Laminating equipment and LED packaging process |
| CN114420717A (en) * | 2022-01-13 | 2022-04-29 | Tcl华星光电技术有限公司 | Die bonding method of LED chip and LED panel |
| CN117110842B (en) * | 2023-09-14 | 2024-05-17 | 苏州微飞半导体有限公司 | Conductive particle vertical conductive adhesive PCR test equipment and use method thereof |
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| CN1551320A (en) * | 2003-05-12 | 2004-12-01 | ������������ʽ���� | Anisotropic conductive adhesive, assembling method,electrooptical device module and electronic device |
| CN202480522U (en) * | 2012-02-27 | 2012-10-10 | 苏州市嘉科精密机械有限公司 | Pressing machine |
| CN102650676A (en) * | 2012-05-02 | 2012-08-29 | 威力盟电子(苏州)有限公司 | LED testing device and LED testing method |
| CN104821369A (en) * | 2015-05-25 | 2015-08-05 | 叶志伟 | Flip LED packaging method |
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| CN106356435A (en) | 2017-01-25 |
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