CN205900585U - Flip -chip LED structure - Google Patents
Flip -chip LED structure Download PDFInfo
- Publication number
- CN205900585U CN205900585U CN201620769082.0U CN201620769082U CN205900585U CN 205900585 U CN205900585 U CN 205900585U CN 201620769082 U CN201620769082 U CN 201620769082U CN 205900585 U CN205900585 U CN 205900585U
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- China
- Prior art keywords
- led
- anisotropic conductive
- flip
- led structure
- pad
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Abstract
The utility model discloses a flip -chip LED structure. Wherein, flip -chip LED structure includes: the base plate, be provided with predetermined circuit layout and pad on the base plate, predetermined circuit layout includes the independent parallelly connected and/or current circuit of a plurality of groups, the anisotropic conductive silver adhesive layer, the anisotropic conductive silver adhesive layer cover in the pad surface, the flip chip, the flip chip bonds on the anisotropic conductive silver adhesive layer. It can effectual promotion LED luminous efficiency, and the weld layer does not exist residual and empty problem, leads to secondary pollution. Such flip -chip LED compares with general formal dress LED, heat conduction is more high -efficient, effectual problem of having prevented LED wafer short circuit electric leakage, the setting of independent circuit moreover, improvement reliability of an item that can be fine.
Description
Technical field
The utility model is related to led encapsulation technology field, more particularly, to a kind of upside-down mounting led structure.
Background technology
Led lighting engineering, through the development of decades, has been widely used at present, but the heat dispersion one of led
It is directly the bottleneck of puzzlement led development, particularly on powerful led product, performance is especially apparent.And study and show, impact
The most critical factor of led heat dispersion is the capacity of heat transmission of led.In order to solve led Heat Conduction Problems, improve the heat dispersion of led,
Led wafer technique is just gradually by the packing forms of formal dress structural transition to inverted structure.
And the die bond material of reverse installation process mainly has two kinds at present: tin cream and golden tin solder.When being encapsulated using tin cream, its
Based on SAC, thermal conductivity factor is about 50w/m k although having the advantage of low cost to composition.But the led of encapsulation
Light extraction efficiency is also low, and has the congenital shortcoming of residue and cavity, and product is led to larger potential safety hazard.In order to reduce
The content of residue (scaling powder) and cavity etc., need the structure to pad to carry out certain change, to ensure exhaust effect, this
Sample needs to pad, and the making of nonstandardized technique made by substrate, is not easy to make and assembles.
And gold-tin alloy encapsulation, it has the advantages that heatproof may be up to more than 280 degree so that led can be with secondary back.But
Golden tin-welding process cost is high, and its led light extraction efficiency is also low.
Therefore, prior art is also to be developed.
Content of the invention
In view of in place of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of upside-down mounting led structure, purport
In solving the problems, such as prior art, upside-down mounting led cannot take into account cost and product quality balance.
In order to achieve the above object, the utility model takes technical scheme below:
A kind of upside-down mounting led structure, wherein, comprising:
Substrate, described substrate is provided with predetermined circuit layout and pad；Described predetermined circuit layout includes some
Organize independent parallel connection and/or series circuit；
Anisotropic conductive elargol layer, described anisotropic conductive elargol layer is covered in described bond pad surface；
Flip chip, described flip chip is bonded on described anisotropic conductive elargol layer.
Described upside-down mounting led structure, wherein, positive terminal that described flip chip includes and negative pole end respectively with described substrate
Corresponding pad pass through anisotropic conductive elargol layer connect.
Described upside-down mounting led structure, wherein, the surface of described pad is smooth surface.
Described upside-down mounting led structure, wherein, described substrate is aluminium base, copper base or ceramic substrate.
Beneficial effect: a kind of upside-down mounting led structure that the utility model provides, can effectively lift led light extraction efficiency, weldering
Connect layer and there is not residue and empty problem, lead to secondary pollution., compared with general formal dress led, heat conduction is more for such upside-down mounting led
For efficient, effectively prevent the problem of led chip short circuit electric leakage, and the setting of independent circuits, can be very good to improve and produce
The reliability of product.
Brief description
Fig. 1 is the structural representation of the upside-down mounting led structure of the utility model specific embodiment.
Specific embodiment
The utility model provides a kind of upside-down mounting led structure.For making the purpose of this utility model, technical scheme and effect more
Clear, clear and definite, the present invention is described in more detail for the embodiment that develops simultaneously referring to the drawings.It should be appreciated that it is described herein
Specific embodiment only in order to explain the utility model, is not used to limit the utility model.
As shown in figure 1, a kind of upside-down mounting led structure for the utility model specific embodiment.Comprising: substrate 100, respectively to
Different in nature conductive silver glue-line 200 and flip chip 300.
Predetermined circuit layout and pad 101 are provided with described substrate.Described predetermined circuit layout includes some groups
Independent parallel connection and/or series circuit.Using independent circuits setting, the reliability of led encapsulating products can be lifted.
Described anisotropic conductive elargol layer 200 is covered in described pad 101 surface, and described flip chip 300 is bonded in
On described anisotropic conductive elargol layer 200.Preferably, the surface of described pad is smooth surface, can with using each to different
Property conductive silver glue match as die bond material, it is possible to use standardization flow process making pad.Pad is led with anisotropy
It is completely embedded between electric elargol layer, prevented the problem of cavity and residue.
In actual encapsulation process, can be by anisotropic conductive elargol even print on the pad of substrate, then
After flip chip is accurately placed into suitable position, cross Reflow Soldering, final curing completes to encapsulate.
Specifically, as shown in figure 1, described flip chip 300 positive terminal 301 and negative pole end 302. that include its respectively with institute
The corresponding pad stating substrate passes through the connection of anisotropic conductive elargol layer.
More specifically, described substrate 100 can be aluminium base, copper base or ceramic substrate.Specifically used substrate can
To select to use according to actual Production requirement.
It is understood that for those of ordinary skills, can according to the technical solution of the utility model and
The utility model design in addition equivalent or change, and all these change or replace all should belong to appended by the utility model
Scope of the claims.
Claims (4)
1. a kind of upside-down mounting led structure is it is characterised in that include:
Substrate, described substrate is provided with predetermined circuit layout and pad；Described predetermined circuit layout include some groups only
Vertical parallel connection and/or series circuit；
Anisotropic conductive elargol layer, described anisotropic conductive elargol layer is covered in described bond pad surface；
Flip chip, described flip chip is bonded on described anisotropic conductive elargol layer.
2. upside-down mounting led structure according to claim 1 it is characterised in that the positive terminal that includes of described flip chip with negative
Extremely pass through anisotropic conductive elargol layer with the corresponding pad of described substrate respectively to connect.
3. upside-down mounting led structure according to claim 1 is it is characterised in that the surface of described pad is smooth surface.
4. upside-down mounting led structure according to claim 1 is it is characterised in that described substrate is aluminium base, copper base or pottery
Porcelain substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620769082.0U CN205900585U (en) | 2016-07-19 | 2016-07-19 | Flip -chip LED structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620769082.0U CN205900585U (en) | 2016-07-19 | 2016-07-19 | Flip -chip LED structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205900585U true CN205900585U (en) | 2017-01-18 |
Family
ID=57773330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620769082.0U Expired - Fee Related CN205900585U (en) | 2016-07-19 | 2016-07-19 | Flip -chip LED structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205900585U (en) |
-
2016
- 2016-07-19 CN CN201620769082.0U patent/CN205900585U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |