CN115223902B - Pressure of high accuracy eutectic chip mounter is got and is put structure - Google Patents
Pressure of high accuracy eutectic chip mounter is got and is put structure Download PDFInfo
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- CN115223902B CN115223902B CN202211146678.1A CN202211146678A CN115223902B CN 115223902 B CN115223902 B CN 115223902B CN 202211146678 A CN202211146678 A CN 202211146678A CN 115223902 B CN115223902 B CN 115223902B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention relates to the field of micro-assembly chip mounting equipment, in particular to a pressurizing and taking structure of a high-precision eutectic chip mounter, which comprises a servo motor, wherein the servo motor is connected with a harmonic reducer, the harmonic reducer is connected with an eutectic rotating shaft, the eutectic rotating shaft is connected with an eutectic pressure control assembly, a guide rail mounting piece on the eutectic pressure control assembly is connected with a semi-cylindrical structure, a crossed roller guide rail assembly is mounted in the semi-cylindrical structure, a welding head connecting block is fixed on the crossed roller guide rail assembly, the welding head connecting block is connected with a suction nozzle positioning piece, a welding head pressurizing piece is fixed on the welding head connecting block, a spring fixing screw and a ball plunger are fixed on the welding head pressurizing piece, the upper end of a pre-pressing spring is fixed on a spring fixing screw, and the lower end of the pre-pressing spring is connected with a spring fixing steel sheet; and a pressure sensor mounting block is arranged on the semi-cylindrical structure, and the pressure sensor mounting block is fixed with the pressure sensor. The invention can be applied to high-precision paster occasions with paster precision of +/-1 mu m, and the precision of eutectic pressure is controlled within 0.02N.
Description
Technical Field
The invention relates to the field of micro-assembly chip mounting equipment, in particular to a pressurizing, taking and placing structure of a high-precision eutectic chip mounter, which is used for realizing the functions of high-precision pressure control, high-precision and high-resolution chip angle adjustment and the like in the chip mounting equipment.
Background
In the field of micro-assembly process, a high-precision eutectic chip process is one of key processes, and with the development of micro-packaging process technology, the improvement of chip precision and chip quality becomes a continuously pursued target. The precise adjustment and alignment of the chip and the precise pressurization control in the eutectic chip mounting process are two important links of equipment. The pressurizing taking and placing structure of the traditional eutectic chip device mainly has the following problems: and (1) the angle adjustment precision of the alignment adjustment mechanism is poor. When the chip is aligned, the high-precision alignment of the chip is limited by the rotation angle adjustment precision of the chip, and the requirement of high-precision chip mounting with the chip mounting precision of +/-1 micron level is difficult to meet; and (2) the pressurizing control precision is low. The low precision of pressurization control can cause poor consistency of eutectic quality, so that the product performance is unstable, and the production requirement of high-performance devices cannot be met.
Disclosure of Invention
In order to solve the problems of poor angle alignment precision, insufficient pressure control capability of an eutectic chip and the like of the traditional eutectic chip mounting equipment, the invention provides a pressurizing, taking and placing structure of a high-precision eutectic chip mounter, which can be applied to high-precision chip mounting occasions with chip mounting precision of +/-1 micron level, and the precision of eutectic pressure can be controlled within 0.02N.
The invention is realized by the following technical scheme: the utility model provides a structure is put in pressurization of high accuracy eutectic chip mounter, includes servo motor, and servo motor is connected with the harmonic speed reducer machine, and the harmonic speed reducer machine is fixed on welding axle mounting, and the output of harmonic speed reducer machine and the one end of speed reducer switching shaft are connected, and the other end and the eutectic pivot of speed reducer switching shaft are connected.
The eutectic pressure control assembly is connected below the eutectic rotating shaft and comprises a guide rail mounting part, the eutectic pressure control assembly is connected with the eutectic rotating shaft through the guide rail mounting part, a semi-cylindrical structure is connected below the guide rail mounting part, a crossed roller guide rail assembly is installed in the semi-cylindrical structure, a welding head connecting block is fixed on a movable part of the crossed roller guide rail assembly, the welding head connecting block is connected with a suction nozzle positioning piece below, two paths of pore passages are formed inside the suction nozzle positioning piece, a suction nozzle negative pressure connector and a workpiece negative pressure suction nozzle connector which are configured on the welding head connecting block are respectively used for introducing two paths of negative pressure into the suction nozzle positioning piece, the two paths of negative pressure are respectively communicated with the two paths of pore passages inside the suction nozzle positioning piece, one path of negative pressure is used for adsorbing and fixing a ceramic suction nozzle, and the other path of negative pressure is used for adsorbing a processed chip through the ceramic suction nozzle.
A welding head pressurizing piece is further fixed on the welding head connecting block, two spring fixing screws are respectively fixed on two sides of the top of the welding head pressurizing piece, a ball plunger is further fixed at the bottom of the welding head pressurizing piece, the upper ends of two pre-pressing springs are respectively fixed on one spring fixing screw, the lower ends of the two pre-pressing springs are both connected with a spring fixing steel sheet, and the spring fixing steel sheet is fixed on a semi-cylindrical structure below the guide rail mounting piece; the semi-cylindrical structure below the guide rail installation part is also provided with a pressure sensor installation block, the lower part of the pressure sensor installation block is fixed with a pressure sensor, the top surface of the pressure sensor is contacted with the lower part of the ball plunger after the pressure sensor is fixed, the pressure sensor has a jacking pressure on the ball plunger, the pre-pressing spring is stretched at the moment, the ball plunger acts on the pressure sensor with a certain force under the combined action of the restoring force of the two pre-pressing springs and the gravity of relevant parts (a welding head connecting block, a welding head pressurizing piece and parts connected with the welding head pressurizing piece and the welding head pressurizing piece), and the force is the pre-pressing force applied to the pressure sensor.
The harmonic speed reducer in the structure has 100-time speed reduction capacity, so that the rotation resolution of the structure is greatly improved, the rotation control precision of the structure is greatly improved, and the eutectic pressure control assembly plays a role in downwards transmitting the angle rotation on one hand and is used for realizing the precise control of the eutectic pressure on the other hand. When the patch device does not work, the pressure sensor is always under the action of the pre-pressure force. When the chip is pasted with the eutectic pressure, the ceramic suction nozzle applies downward eutectic pressure to the chip, the eutectic pressure reacts on the ceramic suction nozzle and is transmitted upwards all the time, the eutectic pressure counteracts a part of prepressing force of the ball plunger on the pressure sensor, the reduced prepressing force after the pressure sensor is counteracted is the eutectic pressure, and therefore the pressure sensor can measure an accurate value of the eutectic pressure and is matched with equipment eutectic pressure to rotate and drive, and high-precision closed-loop control of the eutectic pressure is achieved together.
Foretell structure is got in pressurization of high accuracy eutectic chip mounter, pressure sensor installation piece passes through the polyurethane pad and is connected with pressure sensor one side, and pressure sensor's opposite side and the stiff end of sensor driving plate are fixed, and the downside all disposes the polyurethane pad on the stiff end of sensor driving plate, and the non-fixed end upper surface of sensor driving plate contacts with the below of bulb plunger, and pressure sensor gives bulb plunger top pressure through the fixed sensor driving plate of its one side. After the polyurethane pads are arranged on the upper side and the lower side of the fixed end of the sensor transmission plate, the sensor transmission plate becomes a cantilever structure, the top pressure of the sensor transmission plate on the ball plunger is flexible, if the pressure sensor directly presses the ball plunger, the top pressure is rigid, and the flexible top pressure is favorable for accurately measuring the eutectic pressure.
The pressurizing taking and placing structure of the high-precision eutectic chip mounter is characterized in that three photoelectric switch sensors are further mounted on the welding shaft fixing piece, the middle photoelectric switch sensor is used as a 0-position origin sensor, the other two photoelectric switch sensors are respectively used as a left limit sensor and a right limit sensor of the mechanism to rotate, and a sensor induction sheet which can be matched with the photoelectric switch sensors for use is fixed on the speed reducer transfer shaft. The sensor induction sheet rotates along with the speed reducer adapter shaft and is matched with the photoelectric switch sensors at three positions to position the three rotating positions.
Foretell structure is got in pressurization of high accuracy eutectic chip mounter, the other end of speed reducer switching shaft is connected with the one end of shaft coupling, and the other end of shaft coupling is connected with the eutectic pivot, and the lead screw fixing base is fixed on welding axle mounting, and the eutectic pivot rotates to be fixed on the lead screw fixing base, and speed reducer switching shaft passes through the coupling joint eutectic pivot.
According to the pressurization taking and placing structure of the high-precision eutectic chip mounter, the upper portion of the guide rail mounting part is of the flange structure and is connected with the eutectic rotating shaft, the middle portion of the flange is provided with the circular positioning hole and is matched with the eutectic rotating shaft to be mounted, and the center of the eutectic pressure control assembly is guaranteed to be coaxial with the rotation axis of the eutectic rotating shaft.
The pressurizing taking and placing structure provided by the invention is used for high-precision eutectic chip mounting equipment. The beneficial effects are mainly as follows: (1) Because the servo motor, the harmonic speed reducer with the speed reduction ratio of 100 times and the like are adopted, the angular rotation adjustment precision is greatly improved, and the angular alignment precision of the equipment is ensured; (2) According to the invention, the sensitive feedback of the eutectic pressure is realized in a preloading mode of the pressure sensor, and a basic condition is established for realizing the high-precision closed-loop control of the eutectic pressure; (3) The ceramic suction nozzle is fixed in a negative pressure mode, so that the ceramic suction nozzle has the characteristics of convenience in replacement and the like, and the compatibility of equipment to various products is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic view of the overall mechanism of the present invention.
Fig. 2 is a partial sectional view of the mechanism of the present invention.
Fig. 3 is a schematic structural view of a eutectic pressure control assembly according to the present invention.
FIG. 4 is a schematic diagram of a eutectic pressure control assembly with some parts hidden.
Fig. 5 is a schematic diagram of the cross roller guide assembly.
In the figure: 1-servo motor, 2-harmonic reducer, 3-welding shaft fixing piece, 4-reducer transfer shaft, 5-coupler, 6-lead screw fixing piece, 7-eutectic rotating shaft, 8-eutectic pressure control assembly, 9-suction nozzle positioning piece, 10-ceramic suction nozzle, 11-sensor fixing piece, 12-photoelectric switch sensor, 13-sensor sensing piece, 14-guide rail mounting piece, 15-crossed roller guide rail assembly, 16-welding head connecting piece, 17-suction nozzle negative pressure joint, 18-workpiece negative pressure suction nozzle joint, 19-welding head pressurizing piece, 20-spring fixing screw, 21-prepressing spring, 22-cushion block, 23-pressure sensor mounting block, 24-pressure sensor, 25-polyurethane pad, 26-sensor driving plate, 27-ball plunger, 28-spring fixing steel piece, 29-movable part, 30-guide rail and 31-base.
Detailed Description
The utility model provides a structure is put in pressurization of high accuracy eutectic chip mounter, carries out the servo motor 1 that rotates the adjustment including drive chip, and servo motor 1 is connected with harmonic speed reducer machine 2, and harmonic speed reducer machine 2 is fixed on welding axle mounting 3, and harmonic speed reducer machine 2 possesses 100 times speed reduction ability, and this will make mechanism's rotational resolution improve by a wide margin, has greatly promoted the rotation control precision of mechanism. The output of harmonic speed reducer machine 2 is fixed with the one end of speed reducer machine switching shaft 4, and the other end of speed reducer machine switching shaft 4 is connected with the one end of high rigid shaft coupling 5, and the other end of high rigid shaft coupling 5 is connected with eutectic pivot 7, and lead screw fixing base 6 is fixed on welding axle mounting 3, and eutectic pivot 7 rotates to be fixed in lead screw fixing base 6.
In order to control the rotation range of the mechanism and determine the 0 position of the rotation part, a sensor fixing piece 11 is also arranged on the welding shaft fixing piece 3, three photoelectric switch sensors 12 are arranged on the sensor fixing piece 11, one of the three photoelectric switch sensors is used as a 0 position origin sensor, the other two photoelectric switch sensors are respectively used as a left limit sensor and a right limit sensor of the mechanism rotation, and a sensor induction piece 13 is fixed on the speed reducer switching shaft 4 and can synchronously rotate along with the output end of the harmonic speed reducer 2.
Eutectic pressure control assembly 8 is connected with to the below of eutectic pivot 7, and eutectic pressure control assembly 8 plays the effect of rotating the angle and passing down on the one hand, and on the other hand is used for realizing the accurate control of eutectic pressure. A suction nozzle positioning piece 9 is fixed below the eutectic pressure control assembly 8, and a ceramic suction nozzle 10 can be adsorbed and fixed at the bottom of the suction nozzle positioning piece 9 in a negative pressure mode. Two negative pressures are introduced into the eutectic pressure control assembly 8 and are respectively communicated with two channels inside the suction nozzle positioning piece 9, one negative pressure is used for adsorbing and fixing the ceramic suction nozzle 10, and the other negative pressure is used for adsorbing a processed chip through the ceramic suction nozzle 10.
The eutectic pressure control assembly 8 comprises a guide rail mounting part 14, the upper part of the guide rail mounting part 14 is of a flange structure and can be connected with the eutectic rotating shaft 7, and a circular positioning hole is formed in the middle of the flange and is matched with the eutectic rotating shaft 7 for mounting, so that the center of the eutectic pressure control assembly 8 is coaxial with the rotation axis of the eutectic rotating shaft 7. The lower portion of the guide rail installation part 14 is of a semi-cylindrical structure, a rectangular groove is formed in the semi-cylindrical structure, a crossed roller guide rail assembly 15 is installed in the rectangular groove, a welding head connecting block 16 is fixed to a movable portion of the crossed roller guide rail assembly 15, the welding head connecting block 16 can move up and down under the guiding effect of the crossed roller guide rail assembly 15, the lower portion of the welding head connecting block 16 is connected with a suction nozzle positioning part 9, and a suction nozzle negative pressure connector 17 and a workpiece negative pressure suction nozzle connector 18 which are arranged on the welding head connecting block 16 are respectively used for introducing two paths of negative pressure to the suction nozzle positioning part 9. The welding head pressurizing piece 19 is fixed on the welding head connecting block 16, two spring fixing screws 20 are respectively fixed on two sides of the top of the welding head pressurizing piece 19, the upper ends of two pre-pressing springs 21 are fixed on the spring fixing screws 20, the lower ends of the two pre-pressing springs are connected with a spring fixing steel sheet 28, the spring fixing steel sheet 28 is fixed on a semi-cylindrical structure below the guide rail mounting piece 14, and a cushion block 22 is arranged between the two. A pressure sensor mounting block 23 is mounted on the semi-cylindrical structure below the guide rail mounting piece 14, the pressure sensor mounting block 23 is connected with the pressure sensor 24 through a polyurethane pad 25, a sensor transmission plate 26 is fixed on the other side of the pressure sensor 24, the polyurethane pad 25 is arranged on the upper side and the lower side of the fixed end of the sensor transmission plate 26, the upper surface of the non-fixed end of the sensor transmission plate 26 is in contact with a ball plunger 27 fixed on the welding head pressurizing piece 19, the non-fixed end of the sensor transmission plate 26 has a jacking pressure on the ball plunger 27, at the moment, a pre-pressing spring is stretched, and under the combined action of the restoring force of the two pre-pressing springs and the gravity of related parts (a connecting block 16, a welding head pressurizing piece 19 and parts connected with the connecting block 16 and the welding head pressurizing piece 19), the ball plunger 27 acts on the sensor transmission plate 26 with a certain force, and the force is transmitted to the pressure sensor 24, and the pre-pressing force on the pressure sensor 24 is obtained. The pressure sensor 24 is constantly subjected to the above-mentioned pre-pressure when the patch device is not in operation. When the chip is mounted, the ceramic suction nozzle 10 applies downward eutectic pressure to the chip, the eutectic pressure reacts on the ceramic suction nozzle 10 and is transmitted upward all the time, a part of force of the ball plunger 27 on the sensor transmission plate 26, namely a part of pre-pressure of the pressure sensor 24, is counteracted, the counteracted reduced pre-pressure is the eutectic pressure, and the pressure sensor 24 can measure an accurate value of the eutectic pressure.
The cross roller guide assembly 15 is composed of a movable part 29 (specifically, a slider), rollers, a roller holder, a guide rail 30, and a base 31. The base 31 is fixed in a rectangular groove of a semi-cylindrical structure below the guide rail mounting part 14, the two guide rails 30 are arranged on two sides of the inside of the base, the movable part 29 is arranged in the middle of the base 31, and the rollers and the roller retainers are arranged between the guide rails 30 and the movable part 29, so that the movable part 29 can flexibly move up and down along the guide rails on two sides.
Claims (5)
1. The utility model provides a structure is got in pressurization of high accuracy eutectic chip mounter which characterized in that: the device comprises a servo motor (1), wherein the servo motor (1) is connected with a harmonic speed reducer (2), the harmonic speed reducer (2) is fixed on a welding shaft fixing part (3), the output end of the harmonic speed reducer (2) is connected with one end of a speed reducer transfer shaft (4), the other end of the speed reducer transfer shaft (4) is connected with an eutectic rotating shaft (7), an eutectic pressure control assembly (8) is connected below the eutectic rotating shaft (7), the eutectic pressure control assembly (8) comprises a guide rail mounting part (14), the eutectic pressure control assembly (8) is connected with the eutectic rotating shaft (7) through the guide rail mounting part (14), a semi-cylindrical structure is connected below the guide rail mounting part (14), a crossed roller guide rail assembly (15) is installed in the semi-cylindrical structure, a welding head connecting block (16) is fixed on a movable part of the crossed roller guide rail assembly (15), the lower part of the connecting block (16) is connected with a suction nozzle (9), two channels are arranged in the suction nozzle positioning part (9), a negative pressure connector (17) and a workpiece negative pressure connector (18) is respectively used for connecting the suction nozzle (9), and two channels are respectively used for sucking and connected with a ceramic chip positioning part (10) through two channels; a welding head pressurizing piece (19) is further fixed on the welding head connecting block (16), two spring fixing screws (20) are respectively fixed on two sides of the top of the welding head pressurizing piece (19), a ball plunger (27) is further fixed at the bottom of the welding head pressurizing piece (19), the upper ends of two pre-pressing springs (21) are respectively fixed on one spring fixing screw (20), the lower ends of the two pre-pressing springs (21) are connected with a spring fixing steel sheet (28), and the spring fixing steel sheet (28) is fixed on a semi-cylindrical structure below the guide rail mounting piece (14); and a pressure sensor mounting block (23) is further mounted on the semi-cylindrical structure below the guide rail mounting piece (14), the lower part of the pressure sensor mounting block (23) is fixed with a pressure sensor (24), the top surface of the fixed pressure sensor (24) is contacted with the lower part of the ball plunger (27), and the pressure sensor (24) has a jacking pressure on the ball plunger (27).
2. The pressing, picking and placing structure of the high-precision eutectic chip mounter according to claim 1, wherein: the pressure sensor mounting block (23) is connected with one side of the pressure sensor (24) through a polyurethane pad (25), the other side of the pressure sensor (24) is fixed with the fixed end of a sensor transmission plate (26), the polyurethane pad (25) is arranged on the upper side and the lower side of the fixed end of the sensor transmission plate (26), the upper surface of the non-fixed end of the sensor transmission plate (26) is in contact with the lower portion of the ball plunger (27), and the pressure sensor (24) applies jacking force to the ball plunger (27) through the sensor transmission plate (26) fixed on one side of the pressure sensor.
3. The pressing, picking and placing structure of the high-precision eutectic chip mounter according to claim 1 or 2, wherein: three photoelectric switch sensors (12) are further mounted on the welding shaft fixing piece (3), the photoelectric switch sensor (12) in the middle is used as a 0-position origin sensor, the other two photoelectric switch sensors (12) are respectively used as left and right limit sensors for mechanism rotation, and a sensor induction sheet (13) which can be matched with the photoelectric switch sensors (12) for use is fixed on the speed reducer transfer shaft (4).
4. The pressing, picking and placing structure of the high-precision eutectic chip mounter according to claim 1 or 2, wherein: the other end of speed reducer switching shaft (4) is connected with the one end of shaft coupling (5), and the other end of shaft coupling (5) is connected with eutectic pivot (7), and lead screw fixing base (6) are fixed on welding axle mounting (3), and eutectic pivot (7) rotate to be fixed in lead screw fixing base (6), and speed reducer switching shaft (4) passes through shaft coupling (5) and connects eutectic pivot (7).
5. The pressing, taking and placing structure of the high-precision eutectic chip mounter according to claim 1 or 2, wherein: the upper part of the guide rail mounting part (14) is of a flange structure and is connected with the eutectic rotating shaft (7), the middle part of the flange is provided with a circular positioning hole which is matched and mounted with the eutectic rotating shaft (7), and the center of the eutectic pressure control assembly (8) is ensured to be coaxial with the rotation axis of the eutectic rotating shaft (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211146678.1A CN115223902B (en) | 2022-09-21 | 2022-09-21 | Pressure of high accuracy eutectic chip mounter is got and is put structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211146678.1A CN115223902B (en) | 2022-09-21 | 2022-09-21 | Pressure of high accuracy eutectic chip mounter is got and is put structure |
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| CN115223902A CN115223902A (en) | 2022-10-21 |
| CN115223902B true CN115223902B (en) | 2022-11-25 |
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| CN117182841B (en) * | 2023-09-08 | 2024-05-10 | 深圳市镭恩特自动化技术有限公司 | Pressurizing mechanical device for pasting piezoelectric ceramic plate |
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| CN113410128A (en) * | 2014-12-23 | 2021-09-17 | Ev 集团 E·索尔纳有限责任公司 | Method and device for pre-fixing a substrate |
| CN205159289U (en) * | 2015-12-04 | 2016-04-13 | 贵州振华风光半导体有限公司 | Light -duty chip eutectic bonding anchor clamps |
| CN106128979A (en) * | 2016-08-05 | 2016-11-16 | 深圳清华大学研究院 | A kind of chip mounter and pasting method |
| CN111863676A (en) * | 2020-08-28 | 2020-10-30 | 恩纳基智能科技无锡有限公司 | High-precision intelligent eutectic crystal mounting equipment and processing method thereof |
| CN213340331U (en) * | 2020-10-19 | 2021-06-01 | 广东瑞谷光网通信股份有限公司 | Chip suction structure |
| CN114883223A (en) * | 2022-05-23 | 2022-08-09 | 江苏新智达新能源设备有限公司 | Packaging device for semiconductor eutectic soldering |
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