JP3767847B2 - Method and apparatus for attaching adhesive tape to ring frame - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention, for example using a TAB (Tape Automated Bonding) tape type semiconductor package, mounting a tape-type semiconductor package that is particularly formed in a strip shape such as BGA using tape (Ball Grid Array) and CSP (Chip Size Package) The present invention relates to a method and an apparatus for attaching an adhesive tape to a ring frame.
[0002]
[Prior art]
With the recent spread of mobile terminal tools, high-density mounting technology for semiconductor devices is becoming more and more compact in order to reduce the size and weight of products. There is a demand for finer mounting pitch.
[0003]
Recently, instead of lead frames, printed wiring boards and polyimide tape have been used, and BGA using solder balls for external connection (connection between package and external substrate) has appeared. It has been developed into a CSP in which the package size is reduced to a size very close to a chip. (Futurely, “wafer level CSP technology”, which performs the packaging process at the silicon wafer stage, is drawing attention.)
At present, tape-type semiconductor packages using TAB tape have become mainstream, and are widely put into practical use.
[0004]
Generally, a manufacturing process of a tape-type semiconductor package is performed by mounting a plurality of bare chips (semiconductor chips) on a TAB tape having a metal wiring pattern formed and cut into a predetermined length and die-bonding. The chip sealing is performed through steps such as resin sealing of the chip and formation of external terminals (solder balls).
[0005]
1A to 1D show a strip-shaped TAB tape on which a plurality of bare chips are mounted. In these figures, reference numeral 10 denotes a strip-shaped TAB tape, the surface of which is coated with a resin seal 12 of a plurality of units of bare chips 11 (see FIG. 1 (D)), and the back is a solder ball serving as an external terminal. A plurality of 13 are mounted for each chip unit.
[0006]
1D is a cross-sectional view taken along the line XX of FIG. 1A. A copper wiring pattern 14 is formed on the tape substrate 10a of the TAB tape 10, and the bare chip 11 is mounted and bonded via an insulating layer 15. FIG. ing. Further, the copper wiring pattern 14 on the tape substrate 10a and the surface electrode of the bare chip 11 are connected by die bonding using a gold wire 16, and a resin seal 12 is applied so as to cover the whole. On the other hand, solder balls 13 connected to a desired copper wiring pattern 14 are formed in a protruding state on the back surface of the tape substrate 10a.
[0007]
The TAB tape 10 having the above structure is taken out as an individual semiconductor package (CSP) by being cut along the cutting line 17 shown in FIGS. 1C and 1D by a dicing apparatus, for example.
[0008]
In order to dice the TAB tape into individual semiconductor packages (CSP), before the dicing step, there is a step of mounting the TAB tape 10 on the ring frame via the adhesive tape in order to prevent the package from scattering during dicing. Necessary.
[0009]
Therefore, conventionally, the mounting process of the TAB tape is performed manually by the operator, or the mounting process of the TAB tape is performed by using, for example, a wafer mounting device disclosed in Japanese Patent Laid-Open No. 2-142156. Was.
[0010]
[Problems to be solved by the invention]
By the way, the former manual work is inefficient and the work is not accelerated. Furthermore, since the mounting position on the adhesive tape surface varies due to manual work, the cut line of the package obtained by dicing also varies, and there is a problem that it is not uniform.
[0011]
Further, since the latter apparatus disclosed in Japanese Patent Laid-Open No. 2-142156 uses a ring frame having a circular inner peripheral hole, the adhesive tape attached to the ring frame is cut out into a circular shape and its width and length. Since it is pasted so as to leave a throw-off in the direction, the amount of adhesive tape used per ring frame increases only by the amount of loss, which is uneconomical.
[0012]
Further, since the adhesive tape is cut into a circular shape, the structure of the tape cutting mechanism is complicated, which increases the cost of the apparatus.
[0013]
Accordingly, the present invention challenge is to solve the conventional problems described above, and minimize the amount of tape in the none hand upon the adhesive tape applying to the ring frame, the discarded Shi filtration of the tape, the economic effects It improved Hakare, moreover tape cut so as to cut with a single location of a straight line, to provide an adhesive tape applying method and apparatus to-ring frame so it is possible to simplify and speed up the cutter mechanism There is.
[0014]
[Means for Solving the Problems]
In order to solve the above-described problems, the invention of claim 1 is to pull out the adhesive tape whose end is clamped by the chuck unit directly above the ring frame positioned and supplied on the lifting table, and then lower the chuck unit by lowering the chuck unit. After the end of the adhesive tape is crimped to one end on the ring frame, the adhesive tape is crimped onto the ring frame by pressing the movement of the affixing roller, and the adhesive tape is positioned in the width direction at the other end of the ring frame. a by cutting linearly, in which the adhering of the adhesive tape to the ring frame employing a row of cormorants configuration.
[0015]
The invention of claim 2 is arranged so as to reciprocate along the moving direction of the adhesive tape during the movement of the adhesive tape pulled out toward the lifting table on which the ring frame is placed in a positioned state, Tape pulling and tensioning mechanism that pulls out a predetermined length by sandwiching the middle, and arranged to reciprocate back and forth on the lifting table, pulling out the adhesive tape, sticking the adhesive tape on the ring frame, and It consists of a tape chuck unit that performs cutting, and this tape chuck unit moves back and forth horizontally with a fixed stroke, and reciprocates vertically and horizontally with a fixed stroke. Hold the end of the adhesive tape and pull it out, suck and hold the end of the adhesive tape at the advanced position, and lower tape chuck An upper tape chuck that presses the end of the adhesive tape onto the ring frame after returning, and a horizontal stroke reciprocated horizontally in front of the lower tape chuck, and pressing the adhesive tape on the ring frame when returning And an affixing roller that adheres to the ring frame, and is arranged on the front surface of the upper tape chuck so as to move integrally with the upper tape chuck, and in a lateral direction perpendicular to the longitudinal movement of the upper tape chuck. The upper tape chuck is formed with a cutter that linearly cuts the adhesive tape in the width direction at the retreating original position of the upper tape chuck, and the suction port for adsorbing and holding the adhesive tape on the upper tape chuck opens at the lower surface. The configuration provided in is adopted.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0017]
FIG. 2 is a plan view showing the entire structure of the tape-type semiconductor package mounting device, which includes a ring frame supply unit (I), a ring frame positioning / tape attaching unit (II), and a TAB tape. It comprises a supply part (III), a TAB tape mount part (IV), a ring frame inversion part (V), and a cassette storage part (VI). The ring frame 21 used in the present invention has a rectangular inner peripheral hole 22 and has a structure in which a positioning notch 23 is provided on the outer peripheral portion, and an adhesive that is attached to the ring frame 21. The tape A is slightly wider than the inner peripheral hole 22 and is in a roll-wrapped form.
[0018]
As shown in FIGS. 3 and 4, the mounting device is disposed on the base 24. A pair of side walls 25, 25 are erected on the upper surface of the base table 24, and the ring frame supply part (I) is located between the side walls 25, 25 on the base table 24, and is an elevator type storage box. In this structure, a large number of ring frames 21 are stacked and accommodated in the interior 26.
[0019]
The suction conveyance member 27 for conveying the ring frame 21 of the ring frame supply unit (I) to the next ring frame positioning / tape adhering unit (II) is a horizontal guide rail provided on the opposing inner surfaces of the side walls 25, 25. 28 is formed by providing suction members 30 that move up and down on both sides of a moving member 29 that reciprocally moves with a drive source as appropriate, and the ring frame 21 in the storage box 26 is positioned immediately above the ring frame supply unit (I). The suction member 30 sucks and removes only one sheet from its upper surface, and supplies it to a predetermined position on the lifting table 31 of the next ring frame positioning / tape adhering portion (II) located in front.
[0020]
As shown in FIGS. 3 to 10, the ring frame positioning / tape attaching portion (II) is disposed between the side walls 25, 25 on the upper surface of the base base 24, and is supplied by the suction conveyance member 27. Is formed by a circular lifting table 31 on which the tape is placed and an adhesive tape sticking device 32 provided between the side walls 25, 25. The lifting table 31 is engaged with a pin 33 provided on the upper surface and a notch 23 of the ring frame 21. Thus, the ring frame 21 is positioned.
[0021]
The adhesive tape sticking device 32 includes a mounting portion 34 of the roll-wrapped adhesive tape A located at the upper part between the side walls 25 and 25, and a pair of guide rollers 35 for guiding the adhesive tape A drawn from the mounting portion 34 downward. And an upper guide roller 36 for peeling the release paper B from the adhesive tape A, a release paper take-up portion 37 for winding the peeled release paper B, and a lower part between the side walls 25 and 25. Is located in front of the lower guide roller 38 and the lower guide roller 38, and the lower guide roller 38 is inclined in parallel with the adhesive tape A moving between the upper guide roller 36 and the lower guide roller 38. A tape chuck unit 40 that reciprocates back and forth on the table 31 is formed.
[0022]
The tape pulling / tensioning mechanism 39 is provided with a moving member 42 that reciprocally moves with an appropriate driving source along an inclined guide rail 41 provided on the inner surfaces of the side walls 25, 25 facing each other. A roller 43 that receives the lower surface of the adhesive tape A, and a chuck 44 that can move forward and backward with respect to the roller 43 with respect to the roller 43 from the adhesive tape A and that clamps the adhesive tape A with the roller 43 is provided. By moving from the upper original position shown by the solid line of 4 to the lower advance position of the two-dot chain line in the same figure, the adhesive tape A will be pulled out by the moving stroke, and at the time of attaching the adhesive tape A described later, By clamping the adhesive tape A, tension is applied to the adhesive tape A.
[0023]
The tape chuck unit 40 includes a lower tape chuck 46 that reciprocally moves a predetermined stroke horizontally with a suitable driving source between horizontal guide rails 45 provided on the inner surfaces of the side walls 25, 25, and a lower tape chuck 46. Affixing roller 47 positioned forward and reciprocating a fixed stroke horizontally with an appropriate driving source, and moving up and down by a cylinder or the like and moving a fixed stroke horizontally with an appropriate driving source, An upper tape chuck 48 that sandwiches the adhesive tape A, and is arranged on the front surface of the upper tape chuck 48 so as to move integrally with the upper tape chuck 48, and in a lateral direction perpendicular to the longitudinal movement of the upper tape chuck 48. The upper tape chuck 48 is formed with a movable cutter 49 and a suction port 50 for adsorbing the adhesive tape A. Provided so as to open at the lower surface, the running groove 51 is provided for releasing the cutting edge of the cutter 49 to the upper surface of the front end portion of the lower tape chuck 46.
[0024]
The TAB tape supply section (III) is located on the side of the TAB tape mount section (IV) on the base 24, and stores the TAB tape 10 stacked and stored in the elevator storage box 52 from its upper surface. It is taken out through an appropriate suction conveyance means (not shown) and supplied to a predetermined position on the mounting table 54 in the vacuum chamber 53 of the TAB tape mount (IV).
[0025]
The TAB tape mount part (IV) is positioned in front of the ring frame positioning / tape attaching part (II) on 24 bases, and the adhesive tape A is attached to the ring frame positioning / tape attaching part (II). The attached ring frame 21 is sucked and transported from the ring frame positioning / tape attaching (II) to the TAB tape mount (IV) by the suction transporting member 55 and placed on the placing table 54 in the vacuum chamber 53. TAB tape 10 is supplied. Thereafter, the upper lid of the vacuum chamber 53 is closed to make the inside of the chamber 53 vacuum (reduced pressure), and the TAB tape 10 is attached to the tape bonding surface of the ring frame 21 by a sticking roller (not shown) built in the upper lid. Adhere (mount). The suction conveyance member 55 is provided with an arm 58 on a moving member 57 that reciprocally moves with a drive source along a horizontal guide rail 56 provided on the base 24, and suction members 59 are provided on both sides of the lower part of the arm 58. Is formed.
[0026]
The ring frame reversing part (V) is positioned in front of the TAB tape mounting part (IV) on the base 24, and the ring frame 21 mounted with the TAB tape 10 is appropriately transported (not shown) having a reversing mechanism. The TAB tape mount part (IV) is reversely transferred from the TAB tape mount part (IV) to the ring frame reverse part (V).
[0027]
The cassette housing part (VI) is located on the side of the ring frame reversing part (V), and the ring frame 21 conveyed from the ring frame reversing part (V) (not shown in the conveying means) is set in the elevator mechanism. The cassette 60 is accommodated in the cassette 60.
[0028]
Next, a method of attaching the adhesive tape A to the ring frame 21 will be described using mainly the process diagrams of FIGS.
[0029]
FIG. 5 shows an initial state in which the lower tape chuck 46 and the affixing roller 47, the upper tape chuck 48, and the cutter 49 are in the original positions close to the lower guide roller 38, and the lower tape chuck 46 is lowered. The upper tape chuck 48 clamps one end of the adhesive tape A, and the ring frame positioning / tape adhering portion (II) is supplied from the ring frame supply portion (I) to the upper surface of the lifting table 31 in the lowered position. The single ring frame 21 thus positioned is placed, and the tape pulling / tensioning mechanism 39 releases the adhesive tape A while the chuck 44 is separated from the roller 43 and waits at the upper original position.
[0030]
FIG. 6 shows a drawing process of the adhesive tape A. The tape drawing / tension mechanism 39 chucks the middle of the adhesive tape A by the chuck 44 moving closer to the roller 43. The tape drawing / tension mechanism 39 and the tape The chuck unit 40 moves synchronously, and the tape pulling / tensioning mechanism 39 and the tape chuck unit 40 move to their forward positions as shown by the solid lines in the figure, and the adhesive tape A is pulled out to the front of the lower guide roller 38 by a predetermined length. To face directly above the lifting table 31. As shown in FIG. 3, the width of the adhesive tape A is slightly wider than the width of the opening hole 22 of the ring frame 21, and the center line of the ring frame 21 on the lifting table 31 and the width direction of the adhesive tape A are The center lines are coincident with each other in a plane.
[0031]
As shown in FIG. 7, when the tape chuck unit 40 stops at the advanced position, the tape chuck unit 40 rises with the upper tape chuck 48 adsorbing the tip of the adhesive tape A, and the lower side where the adhesive tape A is separated. The tape chuck 46 moves backward to return to a desired position on the rear end of the ring frame 21 slightly before the original position, and the ring frame positioning / tape attaching part (II) is moved forward by the lifting table 31. One side of the ring frame 21 comes into contact with the affixing roller 47 located at the center.
[0032]
Next, as shown in FIG. 8, the upper tape chuck 48 of the tape chuck unit 40 moves downward, and one end of the adhesive tape A is pressed against one side of the ring frame 21 on the lifting table 31 to be bonded. After this bonding, the upper tape chuck 48 is lifted after stopping the suction of the adhesive tape A, retreats at the raised position, returns to a position slightly before the original position, and immediately above the lower tape chuck 46 that has returned to the previous position. Stop after a while.
[0033]
From the above state, as shown in FIG. 9, the sticking roller 47 moves backward and rolls while pressing the adhesive tape A on the ring frame 21, thereby sticking the adhesive tape A to the peripheral edge on the ring frame 21. The When the affixing roller 47 returns slightly before the original position located just before the lower tape chuck 46, the upper tape chuck 48 moves downward and chucks the middle of the adhesive tape A with the lower tape chuck 46. Then, in this state, the cutter 49 reciprocates in a direction across the adhesive tape A, and the adhesive tape A is cut linearly along the front surface of the upper tape chuck 48.
The backward movement of the upper tape chuck 48 and the backward movement of the sticking roller 47 may be performed simultaneously.
[0034]
When the cutter 49 cuts the adhesive tape A, as shown in FIG. 10, the tape drawer / tension mechanism 39 releases the adhesive tape A by moving the chuck 44 away from the roller 43, and the chuck 44 and the roller 43 are inclined rearward. The upper tape chuck 48, the lower tape chuck 46, and the attaching roller 47 of the tape chuck unit 40 are slightly moved backward to return to the original position. Thereby, the sticking roller 47 completely sticks to the ring frame 21 up to the other end side of the adhesive tape A.
[0035]
When the tape chuck unit 40 moves backward and returns to the original position, the lifting table 31 returns to the lowered position, and each part returns to the initial state of FIG.
[0036]
In addition, the adhesive tape sticking apparatus to the ring frame of this invention can be utilized for the conventional wafer mounting apparatus.
[0037]
In this way, when the attachment of the adhesive tape A to the ring frame 21 is completed in the ring frame positioning / tape attaching part (II), the adhesive ring frame 21 of the adhesive tape A is adsorbed thereafter as described above. The transport member 55 sends the TAB tape 10 to the TAB tape mount section (IV). The mount section (IV) mounts the TAB tape 10 on the adhesive tape A. The ring frame 21 on which the TAB tape 10 is mounted is a ring frame reversal section. After being reversed and transferred to (V), it is stored in the cassette 60 of the cassette storage section (VI).
[0038]
【The invention's effect】
As described above, according to the first aspect of the present invention, the adhesive tape whose end is clamped by the chuck unit is pulled out directly above the ring frame positioned and supplied on the lifting table, and the adhesive tape is pressed by the pressing roller. with crimped on the frame, by cutting in a straight line the adhesive tape in the width direction. Thus if rows of adhering the adhesive tape to the ring frame, mounting operations of the ring frame of a tape-type semiconductor package There performed with high efficiency, it is possible to minimize the amount of tape in the eradicate discarded Shi filtrate tangent adhesive tape.
[0039]
According to the second aspect of the present invention, the tape pulling / tensioning mechanism and the lifting table are reciprocated back and forth during the movement of the adhesive tape pulled out toward the lifting table on which the ring frame is placed in a positioned state. A tape chuck unit that pulls out and attaches the adhesive tape onto the ring frame and cuts the adhesive tape is provided. The adhesive tape is pressed onto the ring frame by pressing the application roller, and the adhesive tape is linear in the width direction. Since the adhesive tape is attached to the ring frame by cutting the tape into a ring frame, the amount of tape used can be minimized when the tape is attached to the ring frame. The effect is improved, and the tape cutting is done at a single straight line. It is possible to achieve the simplification and speed-up.
[Brief description of the drawings]
1A is a front view of a TAB tape, FIG. 1B is a side view of FIG. 1A, FIG. 1C is a rear view of the TAB tape, and FIG. 1D is an enlarged view of an arrow XX portion in FIG. Sectional view [Fig. 2] Simplified plan view showing the entire tape semiconductor package mounting device [Fig. 3] Plan view showing details of the adhesive tape sticking device to the ring frame [Fig. 4] Sticking adhesive tape to the ring frame Front view showing details of the attaching device [FIG. 5] Explanatory drawing of the initial state showing the adhesive tape attaching step [FIG. 6] Explanatory drawing of the adhesive tape drawing state showing the adhesive tape attaching step [FIG. 7] Adhesive tape attaching Explanatory drawing of the state where the adhesive tape is raised and the lifting table is raised. FIG. 8 is an explanatory diagram of the state where the end of the adhesive tape is adhered to one side of the ring frame. FIG. Adhesive tape crimping with an adhesive roller indicating the attachment process Illustration of state [10] illustration of sticking completed state after the adhesive tape cut showing the adhesive tape attaching step EXPLANATION OF REFERENCE NUMERALS
DESCRIPTION OF SYMBOLS 10 TAB tape 21 Ring frame 27 Adsorption conveyance member 31 Lifting table 32 Adhesive tape sticking apparatus 36 Upper guide roller 38 Lower guide roller 39 Tape drawer and tension mechanism 40 Tape chuck unit 46 Lower tape chuck 47 Adhesion roller 48 Upper tape chuck 49 Cutter 50 Suction port 55 Adsorption conveyance member A Adhesive tape (I) Ring frame supply part (II) Ring frame positioning / tape attaching part (III) TAB tape supply part (IV) TAB tape mount part (V) Ring frame reversing part (VI) Cassette compartment

Claims (2)

After the adhesive tape clamped at the end by the chuck unit is pulled out directly above the ring frame positioned and supplied on the lifting table, the end of the adhesive tape is crimped to one end on the ring frame by lowering the chuck unit. The adhesive tape is pressed onto the ring frame by pressing the moving roller, and the adhesive tape is applied to the ring frame by cutting it linearly in the width direction at the other end of the ring frame. adhesive tape applying method to the ring frame, characterized in the wearing rows of TURMERIC.   It is arranged to reciprocate along the moving direction of the adhesive tape during the movement of the adhesive tape pulled out to the lifting table on which the ring frame is placed in a positioned state. A tape pulling and tensioning mechanism for pulling out the thickness, and a tape chuck unit arranged to reciprocate back and forth on the lifting table, for pulling out the adhesive tape, sticking the adhesive tape on the ring frame, and cutting the adhesive tape This tape chuck unit holds the end of the adhesive tape between the lower tape chuck that moves back and forth horizontally for a fixed stroke, and the fixed tape that moves up and down and moves horizontally for a fixed stroke. Then pull out and hold the end of the adhesive tape by suction at the advanced position. An upper tape chuck that presses the end of the ring frame onto the ring frame, and moves in a reciprocating manner at a fixed stroke horizontally in front of the lower tape chuck, and presses the adhesive tape on the ring frame when returning. It is placed on the front surface of the upper tape chuck so as to move integrally with the upper tape chuck, and can be moved in the lateral direction perpendicular to the longitudinal movement of the upper tape chuck. It is formed with a cutter that linearly cuts the adhesive tape in the width direction at the receding original position of the tape chuck, and an adsorption port for adsorbing and holding the adhesive tape to the upper tape chuck is provided so as to open on the lower surface. A device for attaching an adhesive tape to a ring frame.

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