1334637 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種'表面黏著型二極體支架之製 w方法及其構造，尤指一種以定位銷及成型銷頂抵金 屬接腳之方法所成型之表面黏著型二極體支架構造。 【先前技術】 知發光一極體（Light Emiiting Diode，LED) 的體積小、耐震性高、省電、反應速度快且壽命長等優 點，應用的層面也越來越廣。近年來，由於發光二極體 之效率越來越咼，更已被廣泛使用於一般照明裝置及各 種產品的背光源。 .習知之表面黏著型發光二極體（Surface M〇unt Device，SMD)，一般來說，乃係將發光二極體晶片固 接於^面黏著型之二極體支架内，再經打線及封膠等 之後續製程作業，從而構成一表面黏著型發光二極 胆其中，s玄一極體支架係具有一膠座，其一端面具 有内凹的功能區，以及二間隔設置的金屬接腳，其分 別與膠座固接’且係由功能區中向外延伸至膠座外部。 上述習知的二極體支架之成型方式，可如第一圖 所示，乃係先將一金屬基板（圖略）沖壓成型有金屬接 腳1 1 ’，之後置入一模具2 〇，之中，並把沖壓成型 之金屬接腳1 1 ’置於模具2 〇’所具有之模穴中，再 以一成型銷2 1，頂抵金屬接腳丄丄，，而再注入高分. 子原料3’，使其凝固以成型膠座3 〇，，而上述之功 5 1334637 迠區乃係藉由成型銷2 1，，所成型。惟，因金屬接腳1 1，未被適當地夾持靣定，再加上高分子原料3，於模 具2 0’内流動的影響，將造成金屬接腳工丄，產生位 移，而使得向分子原料3，於成型銷2工，與金屬接腳 1，1 ’相頂抵處產生溢料之情形，不但使藉由成型銷2 1所形成的功能區尺寸產生偏差，更使得後續製程作 業的良率下降，產品的品質不穩定且相對地使製造成 本提高。 緣疋，本發明人有感上述缺失之可改善，乃特潛 心研究並配合學理之運用，終於提出—種設計合理且 有效改善上述缺失之本發明。 【發明内容】 搞驶ίί明之主要目的，在於提供—種表面黏著型二 著却广之製造方法及其構造’其可免除傳統表面黏 極體支架因為成型勝座時，高分子原料之流動 對支罙產生位移而溢料，使功能區 :程的良率增加並有效降低製造成本=: 著型=本：：係提供—種表面黏 且沖壓該金屬基板以成型有複數個間隔設 形狀之金屬接腳；提供一模具，其係具有預定 複數個及該模穴中具有相對設置的-成型鎖及 複數個&位銷；將該金屬基板定位於該模具， 之金屬接聊位於該模穴♦， 銷相對地分別頂权於.所、f夕▲ ΐ成型銷和該等定位 择祖一〜、頁抵所逑之金屬接腳相對的兩端面； Ϊ仏了刀子原'料，將該高分子原料注入至該模穴 丄以包覆該成型銷、該等定位銷及該等金屬接腳. 化成型，固化定型之高分子原料固接所述之 從該模具中取出該金屬基板，經由 该成型勒以使該膠座的一端面成型 該等定位銷以使該膠座相對的 = •通至所述之金屬接㈣端面。 ‘預留孔係連 括：士:1 月另ΐ!:種表面黏著二極體支架構造，包 功处f : 〃一端面具有一内凹的功能區’及與該 及另""端面具有複數個内凹之預留孔；以 接f五屬接腳’係分別間隔相鄰的與該膠座固 且2係由該膠座之功能區中向外延伸 外部，該等預留孔係分別連通至該等金屬接腳。 位雜有以下有益效果：本發明之成型銷及定 、十、之：屬1頂抵所述之金屬接腳相對的兩端面，使所 :寸定t該模穴中，可使成型之功能區 、"，美南後績製程的良率並降低製造成本。 進—步了解本發明之特徵及技術内容， 心閱以下有關於本發明之詳細說明與附圖，然而所 1334637 =式僅供參考與說明用’並非用來對本發明加以限 【實施方式】- :先參閱第—圖至第五圖所示，本發明係提供— ^面黏著型二極體支架之製造方法及其構造」，其 中忒製造方法係包括有下列之步驟： 、 可^S1=)提供—金屬基板1Q，該金屬基板1 〇 尊板件，其可使用連續進料之方式以金屬沖 ^成里’可得複數個支架區域中具有間隔設置且不連. 腳11 ’而該等金屬接腳11之數量可依 =之#永設置，在本發明之圖式中係以二個為例， 虽，、、、'也可沖壓成型有三個或四個等之數量。 (S101)提供一模具2 〇，其可係為二相互對人 之，模及母模，而模具2 0的内部係具有對應於上述 ，支架區域數量的模穴2 1，該模穴2 1係預先加工 ^斤預定之形狀，所述之加工方式可為如放電加工法 ^加工方法’並於所成型之該模穴2工中相對地設 可上τ移動地一成型銷22及複數個定位銷2 ，’該成型銷2 2可為-圓形、方形、長方形或多邊 形，在本發明中係以一長橢圓形為例。 、（si〇2)將該金屬基板1 〇定位於該模具2 〇中， 並使所述之金屬接腳i i相對應地位於該模穴2工 中’而二金屬接腳1 !係分別間隔相鄰的設置，且相 對地上、下兩端面係分別被該成型銷2 2和該等定位 1334637 銷2 3相對地頂抵，藉以可穩固地夾持固定住該等金 屬接腳1 1，使其免;^因後續製程之作業而發生位移。 (S'103)提供一高分子原料3，並可使用如射出 成生（Molding)或澆鑄成型（casting)等之技術方 式，熔融該高分子原料3而注入至該模穴2丄之中， 以包覆該成型銷2 2、該等定位銷2 3及該等金屬接 腳11並填滿該模穴2i;其中，該高分子原料3之 材質可係為如聚鄰苯二T醯胺（p〇lyphthaiamide， PPA)，或其它任何已知之熱塑性樹脂。 (S104)接著，待高分子原料3冷卻固化成型， 固化定型之該高分子原料3，可將所述之金屬接腳工 1固接’並因模穴2 1之預定形狀而成財具絕緣性 (S1G5)最後，移除該成型銷2 2及該等定位銷 2 3，並從該模具2 〇中取出該金屬基板1 〇 ;其中，1334637 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a surface-adhesive diode holder and a structure thereof, and more particularly to a locating pin and a forming pin against a metal pin. The method of forming a surface-adhesive diode support structure. [Prior Art] Knowing that Light Emiiting Diode (LED) is small in size, high in shock resistance, power saving, fast in response, and long in life, the application level is also wider. In recent years, the efficiency of light-emitting diodes has become more and more rampant, and has been widely used in general lighting devices and backlights for various products. Surface M〇unt Device (SMD), in general, is a method in which a light-emitting diode chip is fixed in a two-electrode holder of a surface-adhesive type, and then is threaded and Subsequent processing operations such as encapsulation, thereby forming a surface-adhesive light-emitting diode. Among them, the s-monopole support has a plastic seat, and one end surface has a concave functional area, and two spaced metal contacts. , which are respectively fixed to the rubber seat and extend outward from the functional area to the outside of the rubber seat. The above-mentioned conventional diode holder can be formed by forming a metal substrate (not shown) with a metal pin 1 1 ', and then placing a mold 2 〇, as shown in the first figure. In the middle, and the stamped metal pin 1 1 ' is placed in the cavity of the mold 2 〇 ', and then a molded pin 2 1 is placed against the metal pin, and then the high score is injected. The raw material 3' is solidified to form a plastic seat 3, and the above-mentioned work 5 1334637 is formed by molding the pin 2 1, . However, because the metal pin 1 1 is not properly clamped, and the polymer material 3 is added, the influence of the flow in the mold 20 will cause the metal pin to work and cause displacement. The molecular material 3, in the case of the forming pin 2, is in contact with the metal pin 1, 1 ', causing a flash, which not only causes a deviation in the size of the functional zone formed by the forming pin 21, but also makes subsequent process operations The yield is lowered, the quality of the product is unstable, and the manufacturing cost is relatively increased. In the meantime, the present inventors have felt that the above-mentioned deficiency can be improved, and the research and the use of the theory are intensively researched, and finally the present invention which is designed to be reasonable and effective in improving the above-mentioned defects is finally proposed. [Summary of the Invention] The main purpose of driving ί ί 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 在于 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面The support is displaced and overflows, so that the functional area: the yield of the process is increased and the manufacturing cost is effectively reduced. =: Type = this:: The surface is provided with a surface adhesive and the metal substrate is stamped to form a plurality of spaced shapes. a metal pin; providing a mold having a predetermined plurality of and a plurality of shaped locks in the cavity and a plurality of & position pins; positioning the metal substrate in the mold, the metal chat is located in the mold The hole ♦, the pin is relatively top right in the right, the eve ▲ ΐ molding pin and the positioning of the ancestors ~ ~, the page is opposite the metal pin opposite the opposite end faces; The polymer raw material is injected into the mold cavity to cover the molding pin, the positioning pins and the metal pins. The molding and curing of the shaped polymer raw material are fixed, and the metal substrate is taken out from the mold. Through this Le so that the end surface of a molded plastic holder such positioning pin so that the plastic holder opposite = • to pass said metal contact (iv) of the end face. 'Reserved holes are included: Shi: January is another!!: The surface is attached to the diode support structure, and the work is f: The one end of the mask has a concave functional area' and the other "" The end face has a plurality of recessed reserved holes; the connecting five f-pins are respectively spaced apart from the glue seat and the two are extended outward from the functional area of the rubber seat, the reservation The holes are connected to the metal pins, respectively. The utility model has the following beneficial effects: the molding pin of the invention and the fixed, ten, and the other end faces of the metal pin which are opposite to the metal pin, so that the function of the molding can be formed in the cavity. District, ", the yield of the South American production process and reduce manufacturing costs. The features and technical contents of the present invention are described in detail below. The following is a detailed description of the present invention and the accompanying drawings. However, the referenced FIG. 1334637 is for reference only and is not intended to limit the invention. Referring to the first to fifth figures, the present invention provides a method for manufacturing a surface-mounting diode holder and a structure thereof, wherein the method for manufacturing the crucible includes the following steps: Provided - a metal substrate 1Q, which can be used in a continuous feeding manner to form a metal in a plurality of bracket regions having a spacing and not connecting the foot 11' The number of the metal pins 11 can be set according to the number of the first embodiment. In the drawings of the present invention, two are used as an example, and the number of the three or four can be formed by stamping. (S101) providing a mold 2 〇 which can be two mutually facing, a mold and a female mold, and the inner portion of the mold 20 has a cavity 2 1 corresponding to the number of the bracket regions described above, and the cavity 2 1 The predetermined shape is processed in advance, and the processing method may be, for example, an electric discharge machining method and a processing method, and a molding pin 22 and a plurality of the plurality of τ movements are relatively disposed in the mold cavity 2 formed. The positioning pin 2, 'the forming pin 2 2 may be a circle, a square, a rectangle or a polygon. In the present invention, a long ellipse is taken as an example. (si〇2) positioning the metal substrate 1 于 in the mold 2 ,, and the metal pins ii are correspondingly located in the cavity 2, and the two metal pins 1 are spaced apart Adjacently disposed, and the upper and lower end faces are oppositely abutted by the forming pin 2 2 and the positioning 1334637 pin 2 3 respectively, so that the metal pins 1 1 can be firmly clamped and fixed. It is exempted; ^ is displaced due to the subsequent process of the process. (S'103) providing a polymer raw material 3, and melting the polymer raw material 3 into the cavity 2 by using a technique such as injection molding or casting molding. The molding pin 2 2, the positioning pins 23 and the metal pins 11 are filled to fill the cavity 2i; wherein the material of the polymer material 3 can be, for example, poly(phthalamide) (p〇lyphthaiamide, PPA), or any other known thermoplastic resin. (S104) Next, the polymer raw material 3 is cooled and solidified, and the polymer raw material 3 which is solidified and shaped can be fixed to the metal pin 1 and insulated by the predetermined shape of the cavity 2 1 . (S1G5) Finally, the forming pin 2 2 and the positioning pins 2 3 are removed, and the metal substrate 1 is removed from the mold 2 〇;
取出金屬基板1 〇之方式’係可藉由如頂出等之技術 方式，即可將金屬基板i ◦取出；同時 第六圖及第七圖所示，藉由該成型銷22之外；：： 该膠座3 0的-端面係向内斜向地成型有一内凹的功 能區3 1，其外型乃係相對應於該成型銷 型▲’並f ^該等^位銷2 3以使該膠座3 Q相對於成 型§亥功能區3 1的另—端面成型有複數個内凹之預留 孔3 2，其係連通至所述之金屬㈣i i 所述之金屬接分難由該功能區31中向外延 1334637 伸至該膠座3 0之外部。， 然，為使所述之金屬接腳i i具有更好的光反射 率，'亦可於上述步驟（sioo)中將所-述之金屬基板丄 0沖壓步驟之前，或沖壓步驟之後更進一步電鍍沉積 形成有一金屬反射層，即該金屬基板丄〇及所述之金 屬接腳1 1端面（表面）各具有金屬反射層（未圖示）， 而所述之金屬反射層可為如銀等之高反射率金屬。The metal substrate 1 can be taken out by a technical method such as ejection, and the metal substrate i can be taken out; and the sixth and seventh figures are shown by the molding pin 22; : The end face of the rubber seat 30 is formed with a concave functional area 3 1 obliquely inwardly, and the outer shape is corresponding to the molded pin type ▲' and f ^ the same position pin 2 3 Forming a plurality of recessed reserved holes 3 2 with respect to the other end face of the molding 412 functional zone 31, which is connected to the metal (4) i i The functional area 31 extends to the outside of the plastic seat 30 to the extension 1334637. In order to make the metal pin ii have better light reflectivity, the metal substrate may be further plated before the stamping step or after the stamping step in the above step (sioo). Depositing a metal reflective layer, that is, the metal substrate and the metal pin 11 end surface (surface) each have a metal reflective layer (not shown), and the metal reflective layer may be, for example, silver. High reflectivity metal.
再進一步地說，藉由上述之步驟可構成本發明之 表面黏著型二極體支架構造，以成型有一膠座3 〇， 及複數個金屬接腳1 i，在膠座3 〇的一端面内凹成 型上述之功能區31，相對的另一端面則成型上述之 預留孔3 2，每一金屬接腳1 1分別由功能區3 1中 向外延伸至膠座3 〇外部。然而，每一預留孔3 2係 經由上述之模具20内所設置之每一定位銷23所成 型，且相間隔的成型於該膠座3 〇之一端面上。Furthermore, the surface-adhesive diode support structure of the present invention can be formed by the above steps to form a plastic seat 3 〇 and a plurality of metal pins 1 i in one end of the plastic seat 3 〇 The functional area 31 is concavely formed, and the opposite end surface is formed with the above-mentioned reserved holes 3 2 , and each of the metal pins 11 extends outward from the functional area 31 to the outside of the plastic seat 3 . However, each of the reserved holes 3 2 is formed via each of the positioning pins 23 provided in the above-described mold 20, and is formed to be spaced apart on one end face of the plastic seat 3 .
另外，上述之每一金屬接腳丄丄係各具有一基部 ^ ί 1及—接腳部1 1 2。基部1 1 1係位於該功能 =31中，接腳部⑴係由基部⑴一端一體延 至膠座3 0外部’以做為後續之焊接點。其中，节 =接：部，1 2可分別位於該膠座3 0相對的二側： ’、'可彎折至該膠座3 〇之預留孔3 2.端第 1( P向發光）”戈者，該等接聊部1 1 2可位於琴 ’座3 0的同一側緣面(未圖示）’藉以可構成一側： 10 型（Side View)二極體支架（即側向發光）。 二由上述之說明，使得本發明可製作出更精蜂尺 第圖所示、，之後，即可於膠座 3 0内進仃固晶、打線及封膠等之後續製程作 而構成一表面黏著型發光二極體。1 作 係，膠座30的一金屬接腳η;基部工：進 二極體晶片40之安裝附著，可使用如黏著J 術方式，將該發光二極體晶片4 〇固接，接 =行打線作業，係將該發光二極體晶片4 0與功能 :)Λ内：互腳11之基部111 ’以導線(如金 3)41相互地連結以達成電性連接，最後，進行封膠 、業’其係在膠座3 ◦的功能區31内覆蓋—層 J性的封膠層（未圖示），如環氧樹脂或熱塑性樹脂 ^ ’以封發光二極體晶片4 〇及導線4工，而構成 一表面黏著型發光二極體，俾以在金屬㈣i丄之 腳。卩1 1 2 (可提供焊接於電路板上）施以電流，進而 使發光一極體晶片4 〇釋放其光線。 如後因此，藉由本發明所能產生的特點及功能經签理 v 一、本發明之該成型銷22及該等定位銷23可 仝別有效的頂抵固定所述之金屬接腳丄丄之相對兩端 ，，使所述之金屬接腳i 2於該模穴2丄+，不會受 局分子原料3之流動而位移.。 & 二、本發明之膠座3 〇具有較精確的尺寸，且可 1334637 有效提升後續製程的良率 量生產。 · ’使生產成本降低且適合大 bbT以上所述’僅為本發明之具體實施例之· 限制本發明及本發明之= 精神二=二:==者’沿依本發明之 利範时 以化6應包含於本發明之專 【圖式簡單說明】 意圖 第一圖··係習知表面黏著型二極體支架之製作 第二圖：係本發明之製造方法流程圖。 _ 固係本發明金屬基板成型金屬接腳之立辦 不意圖。 瑕 第四圖：係本發明金屬接腳之固定示意圖。 第五圖：係本發明成型膠座之示意圖。 第六圖：係本發明膠座成型功能區之立體圖。 第七圖：係本發明膠座成型預留孔之立體圖。 第八圖：係本發明金屬接腳成型接腳部之立體圖。 第九圖：係本發明經固晶及打線之立體圖。 【主要元件符號說明】 [習知] 金屬接腳 11， 模具 2 0， 12 1334637 成型銷 2 1’ 高分子原料 3 ’膠座 3 0’ [本發明] 金屬基板 10 金屬接腳 11 接腳部 112 模具 2 0 模穴 2 1 定位銷 2 3 面分子原料 3 膠座 3 0 功能區3 1 發光二極體晶片 40 導線 4 1 基部 111 成型銷 2 2 預留孔 32 13In addition, each of the metal pin systems described above has a base portion 及 1 and a pin portion 1 1 2 . The base 1 1 1 is located in the function = 31, and the pin portion (1) is integrally extended from the one end of the base portion (1) to the outer portion of the rubber seat 30 as a subsequent solder joint. Wherein, the node=connection: part, 1 2 can be respectively located on opposite sides of the rubber seat 30: ', ' can be bent to the reserved hole of the rubber seat 3 2. 3. End 1 (P-direction illumination) "Go, these 1⁄2 can be located on the same side of the piano's 30 (not shown)' to form one side: Type 10 (Side View) diode bracket (ie lateral According to the above description, the present invention can produce a finer bee ruler as shown in the figure, and then, in the subsequent process of the solidification, wire bonding and sealing of the rubber seat 30, Forming a surface-adhesive light-emitting diode. 1 as a system, a metal pin η of the plastic seat 30; base work: mounting and attaching the diode chip 40, which can be used, for example, by adhesive J, The body wafer 4 is fixedly connected, and the wire bonding operation is performed by connecting the light-emitting diode wafer 40 with the function:): the base portion 111' of the leg 11 is connected to each other by a wire (such as gold 3) 41 to achieve Electrical connection, and finally, the sealing, the industry is covered in the functional area 31 of the plastic seat 3 - a layer of J-type sealing layer (not shown), such as epoxy resin or thermoplastic tree ^ 'Bake the LED array 4 and the wire 4 to form a surface-adhesive LED, which is used in the metal (4) 丄 卩 1 1 1 2 (can be soldered on the circuit board) The current is used to cause the light-emitting monopole wafer 4 to release its light. As will be described later, the features and functions that can be produced by the present invention are signed. The molded pin 22 of the present invention and the positioning pins 23 can be The opposite ends of the metal pin are fixed to the opposite ends, so that the metal pin i 2 is at the cavity 2丄, and is not displaced by the flow of the local material 3 . 2. The rubber seat 3 本 of the present invention has a relatively accurate size, and can effectively increase the yield of subsequent processes by 1334637. · 'Reducing production cost and suitable for large bbT above' is only the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention and the present invention are limited to the following: FIG. 1 is a second embodiment of the present invention. ·The production of conventional surface-adhesive diode holders The flow chart of the manufacturing method of the invention is not intended. The fourth figure is a schematic diagram of the fixing of the metal pins of the present invention. The fifth figure is a schematic diagram of the molding rubber seat of the present invention. Fig. 6 is a perspective view of a molding function area of the rubber seat of the present invention. Fig. 7 is a perspective view of a reserved hole for forming a rubber seat of the present invention. Fig. 8 is a perspective view of a metal pin forming pin portion of the present invention. Nine diagrams: A perspective view of the solid crystal and wire bonding of the present invention. [Main component symbol description] [Practical] Metal pin 11, mold 2 0, 12 1334637 Molding pin 2 1' Polymer material 3 'Glue seat 3 0' [Invention] Metal substrate 10 Metal pin 11 Pin portion 112 Mold 2 0 Mold hole 2 1 Locating pin 2 3 Face molecular material 3 Glue seat 3 0 Function area 3 1 Light-emitting diode wafer 40 Wire 4 1 Base 111 Molding Pin 2 2 reserved hole 32 13