CN201373344Y - Light emitting diode frame structure and light emitting diode packaging module - Google Patents
Light emitting diode frame structure and light emitting diode packaging module Download PDFInfo
- Publication number
- CN201373344Y CN201373344Y CN200920007160U CN200920007160U CN201373344Y CN 201373344 Y CN201373344 Y CN 201373344Y CN 200920007160 U CN200920007160 U CN 200920007160U CN 200920007160 U CN200920007160 U CN 200920007160U CN 201373344 Y CN201373344 Y CN 201373344Y
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- Prior art keywords
- emitting diode
- light emitting
- light
- cup
- cooling base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a light emitting diode packaging module and a light emitting diode frame structure used in the light emitting diode packaging module, wherein the light emitting diode frame structure is used for bearing a plurality of light emitting diodes; the light emitting diode frame structure comprises a radiating base and a plurality of cup base structures; the cup seat structures are arranged on the surface of the radiating base; each cup base structure is used for correspondingly installing one light emitting diode; and the radiating base and the cup base structures adopt metal for direct integrated molding in non-forging manner, such as powder metallurgy manner, powder injection molding manner or pressure casting manner, so that minute cup base structures are efficiently formed on the radiating base.
Description
[technical field]
The utility model is about a kind of light-emitting diode support structure and LED package module, particularly about a kind of LED package module and be used in light-emitting diode support structure in the LED package module.
[background technology]
The advantage of light emitting diode power saving, overcome the defective of its illumination life-span and heat radiation gradually in modern science and technology after, become the main product of illumination gradually; On the practice, can install the light emitting diode of many arrangements,, realize the effect of throwing light on to strengthen luminosity.
The particle of a plurality of light emitting diodes generally is to be installed in jointly on the LED package module, with convenience goods transportation, installation, the base configuration of LED package module is a light-emitting diode support structure, and the light-emitting diode support structure main body is the cooling base of a metal; In the past, can on cooling base, make a big cup structure, accommodate a plurality of light emitting diodes jointly, and with the inclination of cup structure tiltedly with the bottom surface wall of cup as reflective surface, to strengthen the luminosity that throws light on.
Yet a plurality of light emitting diodes place a cup structure jointly, and the light of adjacent light emitting diode is before the wall of cup that does not reach the cup structure, and the light that is produced with other light emitting diode is interfered mutually, thereby has weakened light intensity.
So development is preferable processing mode with the technology of a ccontaining light emitting diode of cup structure; But, on making, but face a problem, most of light-emitting diodes tube particles are little, single cup structure of accommodating is also less, for saving the space if when wanting a plurality of cup structures closely to arrange, then can't forge with tradition, the mode of punching press, form integrated cooling base and a plurality of cup structure, can realize single cup structure of accommodating light emitting diode so must overcome manufacture.
Cooling base about light-emitting diode support structure is made, existing have a several methods, for example copper or aluminium can be combined with the base material of resin or pottery, and this kind method program is loaded down with trivial details, only can make square-folded cooling base, and not go out the structure of cup structure.In addition, also have alundum (Al or aluminium nitride sintering technology in copper or gold surface, but the structure that this method also can't moulding cup structure.Or technology is arranged is directly with copper cold forging or hot-forging forming, but because external impacts is made the destruction that principle comes down to belong to metal structure, more is unfavorable for the shaping structures of cup structure.
[utility model content]
Main purpose of the present utility model is to provide a kind of LED package module and is used in light-emitting diode support structure in the LED package module, to improve the problems referred to above.
The purpose of this utility model is to provide a kind of LED package module and is used in light-emitting diode support structure in the LED package module, the cup structure of the one-body molded cooling base of energy and a plurality of ccontaining single light emitting diodes, not only promote luminous intensity, improve radiating effect, also improve the yield of making, and significantly reduce manufacturing cost.
The utility model is about a kind of LED package module and is used in light-emitting diode support structure in the LED package module, in order to carry several light emitting diodes.This light-emitting diode support structure is to comprise a cooling base and several cup structures.
These several cup structures are the surfaces that are arranged at this cooling base, and each cup structure is in order to correspondence a light emitting diode to be set.
Wherein, this cooling base and these cup structures are to come directly one-body molded for metal in non-forging mode.Supplementary notes, described non-forging mode is come directly one-body molded, be can be the powder metallurgy mode come directly one-body molded, the metal dust injection molding method comes directly one-body molded or come directly one-body molded in the die casting mode.
Further, by one-body molded manufacturing just, differ from the surface of this cup structure in this cooling base, an also one-body molded radiating fin group is to promote radiating effect.
LED package module of the present utility model is to utilize to carry several light emitting diodes, and this LED package module comprises:
One light-emitting diode support structure comprises a cooling base, and several cup structures are arranged at the surface of this cooling base, and each cup structure is in order to correspondence a light emitting diode to be set;
Several terminals is fixed in this cooling base lateral margin, is the light emitting diode that is electrically connected at respectively in these cup structures;
Wherein, this cooling base and these cup structures are that metal comes directly one-body molded in non-forging mode.
By LED package module of the present utility model and be used in light-emitting diode support structure in the LED package module, utilize and make as non-forging modes such as powder metallurgy mode, metal dust injection molding method or die casting modes, the cup structure of the one-body molded cooling base of energy and a plurality of ccontaining single light emitting diodes, not only promote luminous intensity, after the one-body molded radiating fin group, more can improve radiating effect, further also improve the yield of making, and significantly reduced manufacturing cost.
[description of drawings]
Figure 1A is the first routine schematic top plan view of the utility model light-emitting diode support structure;
Figure 1B is that the first routine side of the utility model light-emitting diode support structure is cutd open schematic diagram;
Fig. 2 A is the second routine schematic top plan view of the utility model light-emitting diode support structure;
Fig. 2 B is that the second routine side of the utility model light-emitting diode support structure is cutd open schematic diagram;
Fig. 3 is first illustration intention of the utility model radiating fin group;
Fig. 4 is second illustration intention of the utility model radiating fin group;
Fig. 5 is the first routine enforcement figure of the utility model LED package module;
Fig. 6 is the second routine enforcement figure of the utility model LED package module;
Fig. 7 is the applied better enforcement view of the utility model radiating fin group; And
Fig. 8 is the schematic diagram of the utility model relaying conductor embodiment.
30: light-emitting diode support structure 32: cooling base
34: cup structure 3402: prominent wall part
3404: recess 36: the radiating fin group
10: light emitting diode 20: the LED package module
40: terminal 42: megohmite insulant
50: substrate 54: opening
52: relaying conductor 42: lead
Can describe in detail and appended graphic being further understood by following utility model about advantage of the present utility model and spirit.
[specific embodiment]
See also Figure 1A and Figure 1B, Figure 1A is the first routine schematic top plan view of the utility model light-emitting diode support structure 30.Figure 1B is that the first routine side of the utility model light-emitting diode support structure 30 is cutd open schematic diagram.
The invention relates to a kind of light-emitting diode support structure 30, is to be used in the LED package module, to carry several light emitting diodes.Light-emitting diode support structure 30 is to comprise a cooling base 32 and several cup structures 34.
The material of light-emitting diode support structure 30 can adopt metal materials such as aluminium, copper or aluminium nitride based on the good metal of thermal conductivity.
These cup structures 34 are the surfaces that are arranged at cooling base 32, and the wall of cup of cup structure 34 is further electrosilvering or nickel.Each cup structure 34 is in order to correspondence a light emitting diode to be set, and the light that light emitting diode produced can make illumination penetrate intensity and become big via the concentrated reflection of silver or nickel reflective surface.In addition, the heat that light emitting diode produced can be passed to cooling base 32 by cup structure 34, because it is the type thing of one, so the conduction efficiency spy is good.
Further specifying, is example with Figure 1A and Figure 1B, and cup structure 34 is the prominent wall parts 3402 that further comprise ring-type, and prominent wall part 3402 is to stand on cooling base 32 surfaces; 3402 of each prominent wall parts around intermediate recess place 3404, be in order to a light emitting diode to be set.
Importantly, cooling base 32 and these cup structures 34 are come directly one-body molded for metal in non-forging mode.Described in non-forging mode, be meant with the powder metallurgy mode or with the die casting mode or come with the metal dust injection molding method directly one-body molded, and can not be to forge or the mode moulding of punching press.So, cup structure 34 that can one-body molded micro-structure is in the surface of cooling base 32.
In the powder metallurgy mode, and though be adopt metals such as aluminium, copper or aluminium nitride all can, process is earlier with its metal dust pressurization, follow-up sintering more again behind cold forging, carries out densification afterwards again, at last, the good metal of class reflecting power of electrosilvering or nickel gets final product in the surface.
With metal dust injection molding method and die casting mode, process is to need earlier its metal dust and binding agent to be mixed, and utilizes mould that the blended stock ejection formation is formed a living embryo, continues and again this is given birth to embryo degreasing and sintering; The densification again of some processing procedure, perhaps no longer densification also can, required integrated light-emitting diode support structure 30.
See also Fig. 2 A and Fig. 2 B, Fig. 2 A is the second routine schematic top plan view of the utility model light-emitting diode support structure 30.Fig. 2 B is that the second routine side of the utility model light-emitting diode support structure 30 is cutd open schematic diagram.Cup structure 34 also can directly cave in to form cup structure 34 on the surface of cooling base 32 except the outstanding shaped structures of precedent, and the recess 3404 in each cup structure 34 is also in order to be provided with a light emitting diode 10.Compare the difference of two examples, the heat radiation of precedent is preferable, but the moulding dose rate is poor slightly; Back example is then easy to manufacture, but radiating effect is poor slightly.
See also Fig. 3, Fig. 3 is first illustration intention of the utility model radiating fin group 36.Because light-emitting diode support structure 30 is to utilize non-forging mode one-body molded, as powder metallurgy mode, die casting mode or metal dust injection molding method etc., so that form fine structure; And the mode of Xing Chenging once also can be complicated because of structure, will slow down the speed of manufacturing.
So, also can on cooling base 32, differ from the surface of cup structure 34 in the integrated while, one-body moldedly go out a radiating fin group 36, just as the bottom of graphic cooling base 32, the one-body molded radiating fin group 36 that goes out a group.The light-emitting diode support structure 30 heat conduction of one material are good, and radiating fin group 36 more can increase area of dissipation, and gets desirable radiating effect.
See also Fig. 4, Fig. 4 is second illustration intention of the utility model radiating fin group 36.Fig. 4 is the example of another radiating fin group 36, and principle is with Fig. 3 example, but is implemented on Fig. 2 A and the described light-emitting diode support structure 30 of Fig. 2 B, and is same, also can significantly improve radiating effect.
See also Fig. 5, Fig. 5 is the first routine enforcement figure of the utility model LED package module 20.The utility model also is a kind of LED package module 20, utilizes to carry several light emitting diodes 10 equally.LED package module 20 is to comprise a light-emitting diode support structure 30 and several terminals 40.
Light-emitting diode support structure 30 is to comprise a cooling base 32 and several cup structures 34 as described above, and its material also based on the good metal of thermal conductivity, can adopt materials such as aluminium, copper or aluminium nitride.
These cup structures 34 are the surfaces that are arranged at cooling base 32, and each cup structure 34 is in order to correspondence a light emitting diode 10 to be set.The cup structure 34 of legend is the prominent wall part 3402 that further comprises ring-type, and prominent wall part 3402 is to stand on cooling base 32 surfaces, 3402 of prominent wall parts around intermediate recess place 3404 be in order to a light emitting diode 10 to be set.
Continue, can utilize megohmite insulant 42, as plastic cement, the periphery of aforementioned light-emitting diode support structure 30 and the top of terminal 40 are encapsulated, be a module element of conveniently installing and using so not only with LED package module 20 firm coatings, and also absolute terminal 40 and light-emitting diode support structure 30 insulation are isolated.
At last, can will be welded in as the lead 42 of gold thread between light emitting diode 10 and the light emitting diode 10, or be welded between light emitting diode 10 and the terminal 40, so that on the LED package module 20 in parallel the or series connection of 10 one-tenth of all light emitting diodes with electrically connect, the effect of collaborative performance illumination.
What remark additionally is that cooling base 32 and these cup structures 34 are come directly one-body molded for metal in non-forging mode.Described in non-forging mode, be meant in the powder metallurgy mode or in the die casting mode or come directly one-body molded with the metal dust injection molding method.
See also Fig. 6, Fig. 6 is the second routine enforcement figure of the utility model LED package module 20.Cup structure 34 also can directly cave in to form cup structure 34 on the surface of cooling base 32 except the described outstanding shaped structures of Fig. 5 example; Cooling base 32 is that depression is to form cup structure 34 as seen from Figure 6, recess 3404 in the cup structure 34 is in order to a light emitting diode 10 to be set, so to form light-emitting diode support structure 30 as Fig. 2 A and Fig. 2 B example, with megohmite insulant 42 periphery of light-emitting diode support structure 30 and the top of terminal 40 are encapsulated again, to become another LED package module 20 that is different from Fig. 5 example.
See also Fig. 7, Fig. 7 is the utility model radiating fin group 36 applied better enforcement view.When cooling base 32 differs from the also one-body molded radiating fin group 36 in the surface of cup structure 34, when just cooling base 32 bottoms have radiating fin group 36, with general assembling, be to be installed on as on the substrates such as epoxy resin base plate or copper clad laminate 50, but can whole height be heightened because of the height of radiating fin group 36, unfavorable slimming design, and radiating fin group 36 stopped by substrate 50, is unfavorable for the loss of heat.
Therefore, the LED package module 20 of tool radiating fin group 36 can be installed on the substrate 50 with an opening 54, opening 54 is corresponding radiating fin groups 36, so as to making after LED package module 20 is installed on the substrate 50, radiating fin group 36 can be extended to see through opening 54 from cooling base 32.So, whole height is reduced, more can make air be easy to convection current and the radiating effect lifting.
See also Fig. 8, Fig. 8 is the schematic diagram of the utility model relaying conductor 52 embodiment.In general as shown in Figure 5, a plurality of light emitting diodes 10 and terminal are 40 in the LED package module 20, be directly to be electrical connected with lead 42, but when making, be difficult on the practice precisely be welded in identical solder joint, so that resistance value is different and make the brightness of these light emitting diodes 10 inconsistent.
Fig. 8 example further is a kind of mode of ameliorating, and it is in 34 on two adjacent cup structures, and is electrically isolated and a relaying conductor 52 is set with cooling base 32.Afterwards, it is the lead 42 of light emitting diode 10 drawings in one of them cup structure 34, and another lead 42 of light emitting diode 10 drawings in another cup structure 34, lead 42 all is electrically connected on the relaying conductor 52 with two extending ends of another lead 42.So, not only because of the big welding easily of relaying conductor 52 areas, even and pad tolerance is arranged, can not make the luminosity of these light emitting diodes 10 inconsistent too greatly because of resistance value difference yet.
Therefore, by LED package module 20 of the present utility model and be used in light-emitting diode support structure 30 in the LED package module 20, utilize and make as non-forging modes such as powder metallurgy mode or die casting modes, the cup structure 34 of the one-body molded cooling base 32 of energy and a plurality of ccontaining single light emitting diodes 10, not only promote luminous intensity, after the one-body molded radiating fin group 36, more can improve radiating effect, further also improve the yield of making, and significantly reduced manufacturing cost.
By the above detailed description of preferred embodiments, be to wish to know more to describe feature of the present utility model and spirit, and be not to come category of the present utility model is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain being arranged in the claim of the present utility model of various changes and tool equality.
Claims (18)
1, a kind of light-emitting diode support structure is to be used in the LED package module, and to carry several light emitting diodes, this light-emitting diode support structure is characterized in that: comprise:
One cooling base; And
Several cup structures are arranged at the surface of this cooling base, and each cup structure is in order to correspondence a light emitting diode to be set;
Wherein, this cooling base and these cup structures are that metal comes directly one-body molded in non-forging mode.
2, light-emitting diode support structure as claimed in claim 1, it is characterized in that: this cup structure further comprises the prominent wall part of ring-type, should prominent wall part be to stand on this cooling base surface, this prominent wall part around the intermediate recess place be in order to a light emitting diode to be set.
3, light-emitting diode support structure as claimed in claim 1 is characterized in that: this cooling base is to cave in to form this cup structure, and the recess in this cup structure is in order to a light emitting diode to be set.
4, light-emitting diode support structure as claimed in claim 1 is characterized in that: described non-forging mode is come directly one-body molded, be come in the powder metallurgy mode directly one-body molded.
5, light-emitting diode support structure as claimed in claim 1 is characterized in that: described non-forging mode is come directly one-body molded, be come in the die casting mode directly one-body molded.
6, light-emitting diode support structure as claimed in claim 1 is characterized in that: described non-forging mode is come directly one-body molded, be come with the metal dust injection molding method directly one-body molded.
7, light-emitting diode support structure as claimed in claim 1 is characterized in that: the material of this light-emitting diode support structure is to be selected from by aluminium, copper, aluminium nitride to be formed the material in the group.
8, light-emitting diode support structure as claimed in claim 1 is characterized in that: this cooling base differs from the surface of this cup structure, also is an one-body molded radiating fin group.
9, a kind of LED package module is to utilize to carry several light emitting diodes, and this LED package module is characterized in that: comprise:
One light-emitting diode support structure comprises
One cooling base,
Several cup structures are arranged at the surface of this cooling base, and each cup structure is in order to correspondence a light emitting diode to be set;
Several terminals is fixed in this cooling base lateral margin, is the light emitting diode that is electrically connected at respectively in these cup structures;
Wherein, this cooling base and these cup structures are that metal comes directly one-body molded in non-forging mode.
10, LED package module as claimed in claim 9, it is characterized in that: this cup structure further comprises the prominent wall part of ring-type, should prominent wall part be to stand on this cooling base surface, this prominent wall part around the intermediate recess place be in order to a light emitting diode to be set.
11, LED package module as claimed in claim 9 is characterized in that: this cooling base is to cave in to form this cup structure, and the recess in this cup structure is in order to a light emitting diode to be set.
12, LED package module as claimed in claim 9 is characterized in that: described non-forging mode is come directly one-body molded, be come in the powder metallurgy mode directly one-body molded.
13, LED package module as claimed in claim 9 is characterized in that: described non-forging mode is come directly one-body molded, be come in the die casting mode directly one-body molded.
14, LED package module as claimed in claim 9 is characterized in that: described non-forging mode is come directly one-body molded, be come with the metal dust injection molding method directly one-body molded.
15, LED package module as claimed in claim 9 is characterized in that: the material of this light-emitting diode support structure is to be selected from by aluminium, copper, aluminium nitride to be formed the material in the group.
16, LED package module as claimed in claim 9, it is characterized in that: this cooling base differs from the surface of this cup structure, also is an one-body molded radiating fin group.
17, LED package module as claimed in claim 16, it is characterized in that: this LED package module is to be installed on the substrate, this substrate is to should the radiating fin group having an opening, and this radiating fin group is to extend to see through this opening from this cooling base.
18, LED package module as claimed in claim 9, it is characterized in that: between two adjacent cup structures, electrically isolated and a relaying conductor is set with this cooling base, it is light emitting diode drawing one lead in one of them cup structure, and another lead of light emitting diode drawing in another cup structure, two extending ends of this lead and this another lead all are electrically connected on this relaying conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920007160U CN201373344Y (en) | 2009-02-27 | 2009-02-27 | Light emitting diode frame structure and light emitting diode packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920007160U CN201373344Y (en) | 2009-02-27 | 2009-02-27 | Light emitting diode frame structure and light emitting diode packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201373344Y true CN201373344Y (en) | 2009-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920007160U Expired - Fee Related CN201373344Y (en) | 2009-02-27 | 2009-02-27 | Light emitting diode frame structure and light emitting diode packaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201373344Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545426A (en) * | 2013-10-31 | 2014-01-29 | 桂林福冈新材料有限公司 | LED support |
-
2009
- 2009-02-27 CN CN200920007160U patent/CN201373344Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545426A (en) * | 2013-10-31 | 2014-01-29 | 桂林福冈新材料有限公司 | LED support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091230 Termination date: 20100227 |