CN202308034U - Improved structure for LED (Light Emitting Diode) bracket - Google Patents
Improved structure for LED (Light Emitting Diode) bracket Download PDFInfo
- Publication number
- CN202308034U CN202308034U CN2011203627882U CN201120362788U CN202308034U CN 202308034 U CN202308034 U CN 202308034U CN 2011203627882 U CN2011203627882 U CN 2011203627882U CN 201120362788 U CN201120362788 U CN 201120362788U CN 202308034 U CN202308034 U CN 202308034U
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- China
- Prior art keywords
- insulating base
- contact site
- metal cooling
- conductive feet
- cooling seat
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Abstract
The utility model discloses an improved structure for an LED (Light Emitting Diode) bracket. The improved structure comprises an insulating base and a metal bracket, wherein the metal bracket is formed by being embedded into the insulating base; a chip accommodating chamber is arranged on the insulating base; the metal bracket comprises a metal radiating base and at least two conductive pins; the metal radiating base is provided with a bearing surface exposed on an inner bottom surface of the chip accommodating chamber; each of the conductive pins comprises a contact part and a soldering tin part which are integrally connected with each other; the soldering tin part extends out of the insulating base; end faces of all contact parts are kept at intervals; each contact part is provided with a connecting surface which is exposed on the inner bottom surface of the chip accommodating chamber; and the bearing surface of the metal radiating base is lower than the connecting surface of each contact part. Thus, a concave chamber is formed in the chip accommodating chamber to form a cup-in-cup structure; when an LED chip is mounted in the chip accommodating chamber, the dosage of fluorescent powder in the concave chamber is saved and the light evenness of the fluorescent powder is efficiently increased; and the convenience in adding the fluorescent powder is supplied by the concave chamber.
Description
Technical field
The utility model relates to the led support art, refers in particular to a kind of improvement structure of led support.
Background technology
Led support is the bottom susceptor of a kind of led chip before encapsulation, on the basis of led support, chip fixedly entered, and the positive and negative electrode of burn-oning, once in package shape with packaging plastic again.Led support generally is (iron material, aluminium and pottery etc. are also arranged at present) that copper is done, because the conductivity of copper is fine; Its inside can be leaded; Connect the inner electrode of led chip, after led chip was in package shape, led chip can take off from support; The copper pin at led chip two promptly becomes the both positive and negative polarity of led chip, is used to be welded to LED light fixture or other LED finished product.
At present common led support generally comprise an insulating base and with the metallic support of this insulating base produced by insert molding, the conductive feet of metallic support has two on anodal pin and negative pole pin, this conductive feet comprises integrated contact site and solder sections.Insulating base be provided with one led chip is installed the chip containing cavity, utilize conductive feet and insulating base produced by insert molding that two conductive feet are embedded in the both sides of insulating base, and the contact site of conductive feet exposes the inner surface at the chip containing cavity, be used for electrically contacting with led chip.
Yet this led support is because the restriction of its structure is difficult to exist following shortcoming with avoiding:
The first, because the plastic cement surface between the contact site of two conductive feet flushes with chip containing cavity inner surface, make this part plastic cement and two contacts site on same plane; When led chip is fit into the chip containing cavity; Need add fluorescent material in the bottom of led chip,, therefore need the fluorescent material amount of increase a lot of because the area of chip containing cavity is bigger; Be difficult to save material, production cost is high.
The second, when this metallic support and insulating base produced by insert molding, this metallic support can not be bitten insulating base well, makes the geometry location of metallic support not fix well, and metallic support all around freely spurs easily, influences the serviceability of product.
The utility model content
In view of this, the utility model is to the disappearance of prior art existence, and its main purpose provides a kind of improvement structure of led support, and it can practice thrift the consumption of fluorescent material, effectively promotes the equal photosensitiveness of fluorescent material, and for adding fluorescent material convenience is provided.
For realizing above-mentioned purpose, the utility model adopts following technical scheme:
A kind of improvement structure of led support; Comprise that insulating base reaches and the metallic support of this insulating base produced by insert molding; This insulating base is provided with the chip containing cavity; This metallic support includes metal cooling seat and at least two conductive feet, and this metal cooling seat has the loading end that exposes at chip containing cavity inner bottom surface; Each conductive feet includes one-body molded interconnective contact site and solder sections; This solder sections is stretched out outside the insulating base; The end face of each contact site maintains spacing; And each contact site has the joint face that exposes bottom surface within this chip containing cavity, and the loading end of this metal cooling seat is lower than the joint face of contact site.
As a kind of preferred version, the loading end of said this metal cooling seat is than the low 0.2mm of joint face of contact site.
As a kind of preferred version, the bottom surface at insulating base is exposed at the back side of said metal cooling seat, and the plastic cement between the loading end of metal cooling seat and the joint face of contact site is a transitional slope.
As a kind of preferred version, the relative solder sections of said contact site is higher, and the two is step-like.
As a kind of preferred version, the surface of said conductive feet is provided with capillary groove through thinning moulding, the junction of this capillary groove between contact site and solder sections, and capillary groove runs through the two sides of conductive feet simultaneously.
As a kind of preferred version, the end face top of the contact site of said each conductive feet has outwards protruded out hanging platform, this hanging platform imbed in the insulating base with the insulating base produced by insert molding together.
The utility model compared with prior art has tangible advantage and beneficial effect, particularly, can be known by technique scheme:
At first, through designing metal cooling seat lower, make and form cup structure in the cavity composition cup in the chip containing cavity again than contact site; When led chip is installed in the chip containing cavity; Fluorescent material directly drops in this cavity, can practice thrift the consumption of fluorescent material, effectively promotes the equal photosensitiveness of fluorescent material; And this cavity also provides convenience for adding fluorescent material.
Moreover; Through contact site being designed to such an extent that relatively solder sections is higher, thereby contact site and solder sections formation roughly are the structure of step, so that conductive feet is stung plastic cement tightly when being embedded in insulating base; Reduce the back stamping-out to insulating base pulling function, retain strength is effectively strengthened.
Also have, all be provided with capillary groove on the surface of each conductive feet, when metallic support and insulating base produced by insert molding through thinning moulding; The part plastic cement of insulating base is filled in the capillary groove, makes capillary groove imbed in the insulating base and the insulating base produced by insert molding, further blocks insulating base with this; Reduce the back stamping-out to insulating base pulling function; Retain strength is effectively strengthened, and effectively prevents red ink test infiltration, and sealing is good.
In addition,, increase the contact area of conductive feet and insulating base, increase solid brilliant scolding tin line position through six conductive feet are set.
Be architectural feature and the effect of more clearly setting forth the utility model, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment.
Description of drawings
Fig. 1 is the assembling schematic perspective view of the preferred embodiment of the utility model;
Fig. 2 is the rear view of Fig. 1;
Fig. 3 is the enlarged diagram of metallic support in the preferable enforcement of the utility model;
Fig. 4 is the rear view of Fig. 3;
Fig. 5 is an integrally-built profile in the preferable enforcement of the utility model.
The accompanying drawing identifier declaration:
10, insulating base 11, chip containing cavity
20, metallic support 21, conductive feet
211, contact site 212, solder sections
213, hanging platform 214, capillary groove
215, joint face 22, metal cooling seat
221, hanging platform 222, loading end
223, transitional slope.
Embodiment
Please referring to figs. 1 through shown in Figure 5, the concrete structure that it has demonstrated the preferred embodiment of the utility model, include insulating base 10 and with the metallic support 20 of these insulating base 10 produced by insert molding.
At first, as depicted in figs. 1 and 2, this insulating base 10 probably is the square shape, and insulating base 10 is provided with a chip containing cavity 11, is used to take in led chip.This chip containing cavity 11 is the tetragonal cup body structure of fillet, and the width at the top of chip containing cavity 11 is wideer than the bottom, so that form certain gradient between the top and bottom, is beneficial to the light reflection of led chip.Having, is fillet structure between adjacent two walls of this chip containing cavity 11 again, is beneficial to the molded of plastic cement.
In conjunction with Fig. 3 and Fig. 4, this metallic support 20 comprises at least two conductive feet 21, and it is processed by the good copper product of conductivity, and each conductive feet 21 produced by insert molding is on insulating base 10.In the present embodiment, the number of said conductive feet 21 has six, with three be one group, be arranged on to spacing arrangement the both sides, bottom surface of insulating base 10, yet the number of conductive feet 21 is not a limitation with six.
Each conductive feet 21 includes the contact site 211 and solder sections 212 of one-body molded connection, the end face of the contact site 211 of each conductive feet 21 each other over against, and maintain spacing between the end face of the contact site 211 of two adjacent conductive pin 21.And the end face top of each contact site 211 has all extended outward hanging platform 213; This hanging platform 213 is imbedded in the insulating base 10 and insulating base 10 produced by insert molding; To bite insulating base 10 better the geometric position of metallic support 20 is fixed, prevented that metallic support 20 from freely spurring and cause a series of problems.The contact site 211 of each conductive feet 21 all exposes the inner bottom surface of aforementioned chip containing cavity 11, and the surface that this contact site 211 exposes in chip containing cavity 11 is a joint face 215.And the solder sections 212 of each conductive feet 21 is extended outside the insulating base 10 each other dorsad.
As shown in Figure 5; Said contact site 211 relative solder sections 212 are higher; Be one thereby be connected smoothly through the inclined-plane between contact site 211 and the solder sections 212, this contact site 211 forms the structure that roughly is step with solder sections 212, so that conductive feet 21 is stung plastic cement tightly when being embedded in insulating base 10; Reduce the back stamping-out to insulating base 10 pulling functions, retain strength is effectively strengthened.
And the junction on the surface of said two conductive feet 21 between contact site 211 and solder sections 212 is provided with capillary groove 214 through thinning moulding, and this capillary groove 214 runs through the two sides of conductive feet 21 simultaneously; When metallic support 20 and insulating base 10 produced by insert molding; The part plastic cement of insulating base 10 is filled in the capillary groove 214, makes capillary groove 214 imbed in the insulating base 10 and insulating base 10 produced by insert molding, further blocks insulating base 10; Reduce the back stamping-out to insulating base 10 pulling functions; Retain strength is effectively strengthened, and effectively prevents red ink test infiltration, and sealing is good.
Hold, this metallic support 20 also includes a metal cooling seat 22, and this metal cooling seat 22 is embedded on the plastic cement between the end face of each contact site 211, and this metal cooling seat has the loading end 222 that exposes at chip containing cavity inner bottom surface; This loading end 222 is lower than the joint face 215 of aforementioned contact site 211, forms cup structure in the cavity composition cup in the chip containing cavity 11 again thereby make.The upper surface of this metal cooling seat 22 exposes in chip containing cavity 11; The bottom surface at insulating base 10 is exposed at the back side of metal cooling seat 22; Plastic cement between the loading end 222 of metal cooling seat 22 and the joint face 215 of contact site 211 is a transitional slope 223; And the end face top of metal cooling seat 22 outwards protruded out hanging platform 221, this hanging platform 221 imbed in the insulating base 10 with insulating base 10 produced by insert molding together.In the present embodiment, the degree of depth of chip containing cavity 11 is 0.8mm, and the degree of depth of this cavity is 0.2mm.Thereby when LED was installed in chip containing cavity 11, fluorescent material dropped in this cavity, can practice thrift the consumption of fluorescent material.
The manufacturing process that present embodiment is detailed is following: at first; On same block of metal material, mold several strips and a plurality of aforementioned metal support 20 simultaneously through punching press or other modes; The both ends of each bar strip are provided with circular location hole; Mold position and plating add plating tool location in man-hour when being used for punch forming, and the product size precision is improved greatly, more can effectively improve the rate of coming into force.Then, the contact site 211 of each conductive feet 21 in each metallic support 20 and the junction between the solder sections 212 are thinned mold two capillary grooves 214 side by side.Then, strip and a plurality of metallic support 20 are put into mould, make each metallic support 20 and corresponding insulating base 10 produced by insert molding, aforementioned hanging platform 213 is all imbedded in the insulating base 10 with capillary groove 214.When needs take out each led support from strip, adopt cutting implement that it is separated to cut and get final product.
The design focal point of the utility model is:
At first, through designing metal cooling seat lower, make and form cup structure in the cavity composition cup in the chip containing cavity again than contact site; When led chip is installed in the chip containing cavity; Fluorescent material directly drops in this cavity, can practice thrift the consumption of fluorescent material, effectively promotes the equal photosensitiveness of fluorescent material; And this cavity also provides convenience for adding fluorescent material.
Moreover; Through contact site being designed to such an extent that relatively solder sections is higher, thereby contact site and solder sections formation roughly are the structure of step, so that conductive feet is stung plastic cement tightly when being embedded in insulating base; Reduce the back stamping-out to insulating base pulling function, retain strength is effectively strengthened.
Also have, all be provided with capillary groove on the surface of each conductive feet, when metallic support and insulating base produced by insert molding through thinning moulding; The part plastic cement of insulating base is filled in the capillary groove, makes capillary groove imbed in the insulating base and the insulating base produced by insert molding, further blocks insulating base with this; Reduce the back stamping-out to insulating base pulling function; Retain strength is effectively strengthened, and effectively prevents red ink test infiltration, and sealing is good.
In addition,, increase the contact area of conductive feet and insulating base, increase solid brilliant scolding tin line position through six conductive feet are set.
The above; It only is the preferred embodiment of the utility model; Be not that the technical scope of the utility model is done any restriction; So every technical spirit according to the utility model all still belongs in the scope of the utility model technical scheme any trickle modification, equivalent variations and modification that above embodiment did.
Claims (7)
1. the improvement structure of a led support; Comprise that insulating base reaches and the metallic support of this insulating base produced by insert molding; This insulating base is provided with the chip containing cavity; This metallic support includes metal cooling seat and at least two conductive feet, and this metal cooling seat has the loading end that exposes at chip containing cavity inner bottom surface; Each conductive feet includes one-body molded interconnective contact site and solder sections; This solder sections is stretched out outside the insulating base; The end face of each contact site maintains spacing; And each contact site has the joint face that exposes bottom surface within this chip containing cavity, it is characterized in that: the loading end of this metal cooling seat is lower than the joint face of contact site.
2. the improvement structure of led support according to claim 1 is characterized in that: the loading end of said this metal cooling seat is than the low 0.2mm of joint face of contact site.
3. the improvement structure of led support according to claim 1, it is characterized in that: the bottom surface at insulating base is exposed at the back side of said metal cooling seat, and the plastic cement between the loading end of metal cooling seat and the joint face of contact site is a transitional slope.
4. the improvement structure of led support according to claim 1, it is characterized in that: the end face top of said metal cooling seat has outwards protruded out hanging platform, this hanging platform imbed in the insulating base with the insulating base produced by insert molding together.
5. the improvement structure of led support according to claim 1, it is characterized in that: the relative solder sections of said contact site is higher, and the two is step-like.
6. the improvement structure of led support according to claim 1; It is characterized in that: the surface of said conductive feet is provided with capillary groove through thinning moulding; The junction of this capillary groove between contact site and solder sections, and capillary groove runs through the two sides of conductive feet simultaneously.
7. the improvement structure of led support according to claim 1, it is characterized in that: the end face top of the contact site of said each conductive feet has outwards protruded out hanging platform, this hanging platform imbed in the insulating base with the insulating base produced by insert molding together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203627882U CN202308034U (en) | 2011-09-26 | 2011-09-26 | Improved structure for LED (Light Emitting Diode) bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203627882U CN202308034U (en) | 2011-09-26 | 2011-09-26 | Improved structure for LED (Light Emitting Diode) bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202308034U true CN202308034U (en) | 2012-07-04 |
Family
ID=46376868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203627882U Expired - Fee Related CN202308034U (en) | 2011-09-26 | 2011-09-26 | Improved structure for LED (Light Emitting Diode) bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202308034U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107256922A (en) * | 2017-07-14 | 2017-10-17 | 湖南粤港模科实业有限公司 | A kind of aluminum foil type radiator and chip package integrated optical source structure |
| CN110875408A (en) * | 2018-08-30 | 2020-03-10 | 深圳市聚飞光电股份有限公司 | High-strength LED support, LED and light-emitting device |
| CN111816748A (en) * | 2020-07-15 | 2020-10-23 | 深圳锐思曼光电有限公司 | LED light-emitting device with high weather resistance |
-
2011
- 2011-09-26 CN CN2011203627882U patent/CN202308034U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107256922A (en) * | 2017-07-14 | 2017-10-17 | 湖南粤港模科实业有限公司 | A kind of aluminum foil type radiator and chip package integrated optical source structure |
| CN107256922B (en) * | 2017-07-14 | 2023-05-26 | 湖南粤港模科实业有限公司 | Aluminum foil type radiator and chip packaging integrated light source structure |
| CN110875408A (en) * | 2018-08-30 | 2020-03-10 | 深圳市聚飞光电股份有限公司 | High-strength LED support, LED and light-emitting device |
| CN111816748A (en) * | 2020-07-15 | 2020-10-23 | 深圳锐思曼光电有限公司 | LED light-emitting device with high weather resistance |
| CN111816748B (en) * | 2020-07-15 | 2021-09-21 | 深圳锐思曼光电有限公司 | LED light-emitting device with high weather resistance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20150926 |
|
| EXPY | Termination of patent right or utility model |