CN103528033A - Integrally formed radiator of semiconductor light source lamp and manufacturing method thereof - Google Patents
Integrally formed radiator of semiconductor light source lamp and manufacturing method thereof Download PDFInfo
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- CN103528033A CN103528033A CN201310467030.9A CN201310467030A CN103528033A CN 103528033 A CN103528033 A CN 103528033A CN 201310467030 A CN201310467030 A CN 201310467030A CN 103528033 A CN103528033 A CN 103528033A
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Abstract
The invention discloses an integrally formed radiator of a semiconductor light source lamp. The radiator comprises a substrate and a cup body, wherein the substrate and the cup body are integrally formed, a plurality of sheet strips are punched on the substrate, tail ends of the sheet strips are not disengaged from the substrate, strip-shaped holes are formed between the substrate and the sheet strips, and a light source is fixed to the substrate. The strip-shaped holes form circulation air holes or air discharge grooves of the radiator. A manufacturing method of the integrally formed radiator of the semiconductor light source lamp comprises the four steps of blanking, stretching, edge cutting and sheet strip punching. The radiator is simple in manufacturing process, easy to form and process at one time, little in amount of waste materials in the twisting process, high in material utilization rate and low in production cost; the radiator has a high heat conductivity coefficient and a good radiating effect and achieves radiating of the high-power LED lamp; the radiator is of a disc shape, the radiating sheet strips formed through punching and twisting are not disengaged from the substrate, and heat conduction is facilitated.
Description
Technical field
The present invention relates to the Radiator and its preparation method of field of illuminating lamps.In particular, the present invention relates to a kind of one-body molded Radiator and its preparation method of semiconductor light sources light fixture.
Background technology
Current semiconductor light sources lamp radiator different modeling on the market, the manufacture craft of radiator is mostly to adopt aluminium die-casting moulding process and the manufacture of extrudate cutting technique, thermal conductivity factor is low, heatsink weight is larger, and consumptive material is many, rear processed complex, production efficiency is low, and production cost is high.
Current radiator base plate and cup are all fastening again after processing respectively, and the mode of this stack, makes its heat conductivility unstable, and heat-conducting effect is bad, and in production process, needing has the operation that two parts are fixed together.
The shortcoming of prior art is: radiator manufacturing process is complicated, finned radiator manufacture method for example, comprise the following steps: that the rapid ﹑ contraposition of standby material step walks that rapid ﹑ punching press walks that rapid ﹑ presses down that the rapid ﹑ of bending step cuts off and riveted walks rapid ﹑ and revolves and go to step ﹑ and repeat disconnected and riveted step with rotation step and take out step, continuous punching one metal material belt and form radiating fin on a machining tool in particular, and sequentially radiating fin is cut off on metal material belt, and sequentially plug to the slot of a metal substrate, and utilize two-way riveted mode sequentially radiating fin to be fixed on metal substrate, and then acquisition radiator.This radiator manufacturing process is complicated, and single product are consuming time larger, because it is thermal contact conductance, make its radiating effect general.
Summary of the invention
In view of above-mentioned condition, be necessary to provide a kind of simple in structure, convenient for production, manufacture fast, radiating effect is excellent, reduce the one-body molded Radiator and its preparation method that unnecessary finished product assembling procedure makes the semiconductor light sources light fixture that production capacity can significantly improve, cost is low.
For solving the problems of the technologies described above, a kind of one-body molded radiator of semiconductor light sources light fixture is provided, it comprises substrate and cup, described substrate and described cup are one-body molded, on described substrate, go out some sheet bars, described sheet bar end is not separated with described substrate, between described substrate and described sheet bar, has bar hole, and light source is fixed on described substrate.Described bar hole has formed passage or the air discharge duct of radiator.
Preferably, on described substrate, have at least and enclose the rounded sheet bar of arranging and arranging.
Further, described sheet bar divides first to enclose with second and enclose rounded arranging and be arranged on described substrate.
Further, described first encloses and is equipped with 14 described sheet bars, and described second encloses and be equipped with 36 described sheet bars.
Preferably, on described substrate, has a screening shape bar at least.
Preferably, described sheet bar pulls open any one or the multiple combination in the radiator shutter, arc radiator shutter, triangle radiator shutter of sheet, vertical radiator shutter, inclination radiator shutter, trapezoidal radiator shutter, wave radiator shutter or I-shaped shape radiator shutter for band.
An one-body molded manufacturing method of heat radiator for light fixture, comprises the following steps:
A, according to heat sink size, determine material size, and material is fixed on lathe;
B, from radiator base plate stretched radiator cup;
C, cup redundance is wiped out;
D, on substrate, stamp out sheet bar.
Preferably, described B step adopts the stretched radiator cup of mode of punching press.
Preferably, described B step adopts the stretched radiator cup of mode of spinning.
Described radiator is that a kind of spinning is made in conjunction with hardware stamping distortion technique.
The invention has the beneficial effects as follows, described radiator manufacturing process is simple, easily one-shot forming processing, and in distort process, compared with less waste material, stock utilization is high, and production cost is low; Described radiator thermal conductivity factor is high, and good heat dissipation effect meets the heat radiation of high-power LED lamp; Described radiator is disc-shape, and the heat radiation sheet bar of punching press distortion moulding is not separated with substrate, is convenient to heat conduction.
Than traditional die cast metal or aluminium extruded pressure type fin slices radiator, in punching press distortion radiator of the present invention, heat radiation sheet strip adoption punching press distortion moulding, can be made into the thin slice that thickness is less, reduce the weight of radiator, and in the situation that pedestal is identical, can greatly increase the quantity of sheet bar, the radiating efficiency of heat radiation device; In the situation that guaranteeing that radiating efficiency is identical, make material that the making of radiator needs still less, saved the cost of material, more environmental protection and energy saving.Heat radiation sheet bar bending angle on radiator of the present invention and size can be carried out corresponding adjustment as required, owing to can forming cross-ventilation between heat radiation sheet bar, so compare obvious its radiating effect that improved than the structure of the radiating fin of common radiator, there is Fan Wei Guang ﹑ Chong Liang Qing ﹑ good heat dissipation effect for Ying, low cost and other advantages simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention 1;
Fig. 2 is the partial enlarged drawing at the A place of Fig. 1;
Fig. 3 is the structural representation of the embodiment of the present invention 2;
Fig. 4 is the partial enlarged drawing at the B place of Fig. 3;
Fig. 5 is the structural representation of the embodiment of the present invention 3;
Fig. 6 is the partial enlarged drawing at the C place of Fig. 5;
Fig. 7 is the structural representation of the embodiment of the present invention 4;
Fig. 8 is the partial enlarged drawing at the D place of Fig. 7;
Fig. 9 is the structural representation of the embodiment of the present invention 5;
Figure 10 is the partial enlarged drawing at the E place of Fig. 9;
Figure 11 is the structural representation of the embodiment of the present invention 6;
Figure 12 is the partial enlarged drawing at the F place of Figure 11;
Figure 13 is the structural representation of the embodiment of the present invention 7;
Figure 14 is the partial enlarged drawing at the G place of Figure 13;
Figure 15 is the structural representation of the embodiment of the present invention 8;
Figure 16 is the partial enlarged drawing at the H place of Figure 15;
Figure 17 is the structural representation of the embodiment of the present invention 9;
Figure 18 is the partial enlarged drawing at the J place of Figure 17.
The specific embodiment
Below in conjunction with drawings and Examples, the one-body molded Radiator and its preparation method of semiconductor light sources light fixture of the present invention is described in further detail.
Shown in Fig. 1 and Fig. 2, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms the radiator shutter 3 that band pulls open sheet 4, and described radiator shutter 3 upwards forms passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the radiator shutter 3 of the outside punching press distortion of radiator, describedly pull open the contact area that sheet 4 has increased described substrate 1 and described radiator shutter 3, described radiator shutter 3 and described substrate 1 are vertical distribution, combine the characteristic that heat upwards distributes, thereby quickening radiating rate, improves overall performance.
Patented product of the present invention is as shown in the table with the implementation benefit contrast that product brings on the market:
Shown in Fig. 3 and Fig. 4, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms arc radiator shutter 6, and described arc radiator shutter 6 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the arc radiator shutter 6 of the outside punching press distortion of radiator.
Shown in Fig. 5 and Fig. 6, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 forms passage 5 through hardware stamping, and on described substrate 1, first encloses circular arrangement and be provided with 14, second and enclose circular arrangement and be provided with 36 passages 5.
Shown in Fig. 7 and Fig. 8, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms triangle radiator shutter 7, and described triangle radiator shutter 7 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the triangle radiator shutter 7 of the outside punching press distortion of radiator.
Shown in Fig. 9 and Figure 10, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms vertical radiator shutter 8, and described vertical radiator shutter 8 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the vertical radiator shutter 8 of the outside punching press distortion of radiator.
Shown in Figure 11 and Figure 12, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms inclination radiator shutter 9, and described inclination radiator shutter 9 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to 9 of the outside punching press distortion of radiator.
Shown in Figure 13 and Figure 14, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms trapezoidal radiator shutter 10, and described trapezoidal radiator shutter 10 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the trapezoidal radiator shutter 10 of the outside punching press distortion of radiator.
Shown in Figure 15 and Figure 16, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms wave radiator shutter 11, and described wave radiator shutter 11 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the wave radiator shutter 11 of the outside punching press distortion of radiator.
Shown in Figure 17 and Figure 18, the one-body molded radiator of the semiconductor light sources light fixture of the embodiment of the present invention, comprise substrate 1 and cup 2, described substrate 1 is through the stretched described cup 2 of spinning process, again redundance on described cup 2 is wiped out and made 2 one-tenth of described cups barrel-shaped, described substrate 1 local upwards protuberance after hardware stamping distortion forms I-shaped shape radiator shutter 12, and described I-shaped shape radiator shutter 12 upwards forms described passage 5 after protuberance.On described substrate 1, first encloses circular arrangement and is provided with 14, second and encloses circular arrangement and be provided with 36 to the I-shaped shape radiator shutter 12 of the outside punching press distortion of radiator.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (9)
1. the one-body molded radiator of a semiconductor light sources light fixture, it comprises substrate and cup, it is characterized in that: described substrate and described cup are one-body molded, on described substrate, go out some sheet bars, described sheet bar end is not separated with described substrate, between described substrate and described sheet bar, have bar hole, light source is fixed on described substrate.
2. the one-body molded radiator of semiconductor light sources light fixture as claimed in claim 1, is characterized in that: on described substrate, have at least and enclose the rounded sheet bar of arranging and arranging.
3. the one-body molded radiator of semiconductor light sources light fixture as claimed in claim 2, is characterized in that: described sheet bar divides first to enclose with second and enclose rounded arranging and be arranged on described substrate.
4. the one-body molded radiator of semiconductor light sources light fixture as claimed in claim 3, is characterized in that: described first encloses and be equipped with 14 described sheet bars, and described second encloses and be equipped with 36 described sheet bars.
5. the one-body molded radiator of semiconductor light sources light fixture as claimed in claim 1, is characterized in that: on described substrate, have a screening shape bar at least.
6. the one-body molded radiator of the semiconductor light sources light fixture as described in claim 1 or 2 or 3 or 4 or 5, is characterized in that: described sheet bar pulls open any one or the multiple combination in radiator shutter, arc radiator shutter, triangle radiator shutter, vertical radiator shutter, inclination radiator shutter, trapezoidal radiator shutter, wave radiator shutter or the I-shaped shape radiator shutter of sheet for band.
7. an one-body molded manufacturing method of heat radiator for semiconductor light sources light fixture, is characterized in that, comprises the following steps:
A, according to heat sink size, determine material size, and material is fixed on lathe;
B, from radiator base plate stretched radiator cup;
C, cup redundance is wiped out;
D, on substrate, stamp out sheet bar.
8. the one-body molded manufacturing method of heat radiator of semiconductor light sources light fixture as claimed in claim 7, is characterized in that: described B step adopts the stretched radiator cup of mode of punching press.
9. the one-body molded manufacturing method of heat radiator of semiconductor light sources light fixture as claimed in claim 7, is characterized in that: described B step adopts the stretched radiator cup of mode of spinning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310467030.9A CN103528033A (en) | 2013-10-01 | 2013-10-01 | Integrally formed radiator of semiconductor light source lamp and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310467030.9A CN103528033A (en) | 2013-10-01 | 2013-10-01 | Integrally formed radiator of semiconductor light source lamp and manufacturing method thereof |
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| CN103528033A true CN103528033A (en) | 2014-01-22 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105987318A (en) * | 2015-01-29 | 2016-10-05 | 全亿大科技（佛山）有限公司 | Led lamp |
| CN106801832A (en) * | 2016-12-14 | 2017-06-06 | 安徽银盾斯金铝业有限公司 | A kind of car coat type LED street lamp radiator aluminium section bar |
| CN107477544A (en) * | 2017-08-26 | 2017-12-15 | 中山火炬职业技术学院 | Intelligent control's UV-LED photocuring device's cooling system |
| EP3502545A4 (en) * | 2016-08-22 | 2020-03-25 | Ichikoh Industries, Ltd. | Vehicle lamp |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2227259Y (en) * | 1995-05-26 | 1996-05-15 | 林振堂 | Improved lamps and lanterns |
| CN201043737Y (en) * | 2007-05-29 | 2008-04-02 | 金松山 | High power semiconductor lighting lamp |
| CN201892081U (en) * | 2010-11-09 | 2011-07-06 | 深圳市皓泰光电有限公司 | Light-emitting diode (LED) lamp with heat radiating structure |
| CN102278729A (en) * | 2011-08-26 | 2011-12-14 | 惠州伟业精密部件厂 | Heat dissipation body for light emitting diode (LED) lamp and manufacturing method of heat dissipation body |
| CN202203907U (en) * | 2011-09-02 | 2012-04-25 | 李润清 | Sheet metal radiator for lamp |
| CN102900979A (en) * | 2012-09-25 | 2013-01-30 | 刘世全 | Wholly stamping LED (light-emitting diode) lamp |
| CN202915201U (en) * | 2012-11-28 | 2013-05-01 | 天马微电子股份有限公司 | Backlight module and liquid crystal display device |
| CN203517718U (en) * | 2013-10-01 | 2014-04-02 | 许富昌 | Integrally-formed radiator of semiconductor light source lamp |
-
2013
- 2013-10-01 CN CN201310467030.9A patent/CN103528033A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2227259Y (en) * | 1995-05-26 | 1996-05-15 | 林振堂 | Improved lamps and lanterns |
| CN201043737Y (en) * | 2007-05-29 | 2008-04-02 | 金松山 | High power semiconductor lighting lamp |
| CN201892081U (en) * | 2010-11-09 | 2011-07-06 | 深圳市皓泰光电有限公司 | Light-emitting diode (LED) lamp with heat radiating structure |
| CN102278729A (en) * | 2011-08-26 | 2011-12-14 | 惠州伟业精密部件厂 | Heat dissipation body for light emitting diode (LED) lamp and manufacturing method of heat dissipation body |
| CN202203907U (en) * | 2011-09-02 | 2012-04-25 | 李润清 | Sheet metal radiator for lamp |
| CN102900979A (en) * | 2012-09-25 | 2013-01-30 | 刘世全 | Wholly stamping LED (light-emitting diode) lamp |
| CN202915201U (en) * | 2012-11-28 | 2013-05-01 | 天马微电子股份有限公司 | Backlight module and liquid crystal display device |
| CN203517718U (en) * | 2013-10-01 | 2014-04-02 | 许富昌 | Integrally-formed radiator of semiconductor light source lamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105987318A (en) * | 2015-01-29 | 2016-10-05 | 全亿大科技（佛山）有限公司 | Led lamp |
| EP3502545A4 (en) * | 2016-08-22 | 2020-03-25 | Ichikoh Industries, Ltd. | Vehicle lamp |
| CN106801832A (en) * | 2016-12-14 | 2017-06-06 | 安徽银盾斯金铝业有限公司 | A kind of car coat type LED street lamp radiator aluminium section bar |
| CN107477544A (en) * | 2017-08-26 | 2017-12-15 | 中山火炬职业技术学院 | Intelligent control's UV-LED photocuring device's cooling system |
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Application publication date: 20140122 |