CN205351258U - A high -efficient heat abstractor for LED lamps and lanterns - Google Patents

Abstract

The utility model discloses a high-efficiency heat dissipation device for LED lamps, which comprises: a bottom plate, one side of which is used for installing LED lamps; a plurality of cooling fins extending from the bottom plate in a direction away from the LED lamp; a fastening device, which has a limiting portion arranged at intervals between the plurality of cooling fins, and the fastening device is connected in a detachable manner on the heat sink; an elastic member elastically connects the fastening device and the bottom plate. The utility model can flexibly change the shape of the heat sink according to different shapes of LED lamps and heat dissipation requirements of high-power integrated chips, and the heat sink is light in weight and large in heat dissipation area, effectively ensuring heat dissipation requirements and steady-state work of LED integrated chips.

Description

A high-efficiency heat dissipation device for LED lamps

technical field

The utility model relates to the field of heat dissipation of LED lamps. More specifically, the utility model relates to a high-efficiency heat dissipation device for LED lamps.

Background technique

As a solid light source, LED has been widely used in the field of lighting because of its energy saving, long life and no pollution. However, compared with traditional high-pressure sodium lamps and halogen lamps, LED lamps have poor heat resistance, and the working temperature cannot exceed 60°C, otherwise it will cause serious light decay and affect the service life of LED lamps. Therefore, the current theoretical life of LED lamps can reach more than 100,000 hours. Due to the problems of materials, manufacturing technology, and especially heat dissipation, the life of LED devices on the existing market generally can only reach 10,000 to 20,000 hours.

In addition, the currently commonly used high-power LED chips with relatively stable performance are still 1W or 3W. In order to obtain higher luminous flux and improve the application range of LED lamps, it is a development trend to integrate ultra-high-power LED chips with a hundred watts. Integrated chips and single Compared with the bead chip, it has many advantages such as high brightness, low cost, small size, and easy installation, but its temperature rise is also more concentrated and higher, and the problem of heat dissipation is also more prominent.

The best way to increase the heat dissipation area per unit mass of the heat sink is to reduce the thickness of the heat sink to increase the number of fins. If it is less than 1.5mm, if the height of thinner fins is further increased, not only the die-casting process is difficult to process but also the cost is high, so micro-spray cooling systems, fan-assisted air cooling, thermoelectric cooling, copper tube water cooling, etc. Auxiliary cooling means not only have a limited cooling effect, but also increase the volume, weight and energy consumption of the lamps, especially for high pole lighting lamps that are difficult to maintain, the additional maintenance of cooling components will greatly increase the cost .

Utility model content

An object of the present invention is to solve at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described hereinafter.

Another purpose of this utility model is to provide a high-efficiency heat dissipation device for LED lamps, which can flexibly change the shape of the radiator according to the different shapes of LED lamps and the heat dissipation requirements of high-power integrated chips, and the radiator is light in weight, The heat dissipation area is large, effectively ensuring the heat dissipation requirements and steady-state work of the LED integrated chip.

In order to achieve these objects and other advantages according to the utility model, a high-efficiency heat dissipation device for LED lamps is provided, which includes:

Base plate, one side of which is used to install LED lights;

A heat sink, which is connected to the other side of the bottom plate, the heat sink has a plurality of heat sinks extending from the bottom plate to a direction away from the LED lamp;

A fastening device, which has a limiting portion arranged at intervals between the plurality of cooling fins, the fastening device is detachably connected to the heat sink;

A resilient member elastically connects the fastening means and the base plate.

Preferably, wherein, the fastening device further includes a threaded screw at both ends, the heat sink and the limiting part are provided with corresponding through holes, and the detachable connection between the fastening device and the radiator It is realized by screwing a nut at both ends of the screw rod through the through hole sequentially.

Preferably, wherein, the plurality of cooling fins are arranged at the same height or in steps along the extending direction thereof.

Preferably, the plurality of cooling fins are arranged at the same height or in steps along at least one side of the direction perpendicular to their extension.

Preferably, a layer of thermal paste is filled between the bottom of the heat sink and the bottom plate.

Preferably, the bottom of the heat sink is provided with a 90° bent portion, and the bent portion is in contact with the bottom plate.

Preferably, wherein, the heat sink is an aluminum sheet or a copper sheet, the thermal conductivity of aluminum can reach 209W/m·k, the processing performance is good, and the cost is low; the thermal conductivity of copper is 390W/m·k, which is higher than that of aluminum , but it is about three times heavier than aluminum, and it is not as easy to process as aluminum sheet, so in general, aluminum sheet can be preferred for heat sink, and copper sheet is usually used when the application of heat sink is limited by the conduction characteristics.

Preferably, the distance between the plurality of cooling fins is 7-12mm, so as to facilitate the smooth convection between the heat dissipated by the cooling fins and the external ambient air.

Preferably, the heat sink has a thickness of 0.3-2 mm, which can be flexibly designed according to the heat dissipation capability required by the LED integrated chip and the weight and volume of the LED lamp.

Preferably, the height of the heat sink is 60-500mm, and the height of the heat sink is flexibly adjusted according to the heat dissipation requirements of the LED lamps and the components are produced in a standardized manner.

The utility model at least includes the following beneficial effects:

(1) The radiator of the utility model can ensure that the heat dissipation area per watt of the LED lamp is more than 150cm ² , and it can well meet the heat dissipation demand of the 200W high-power LED lamp under the condition of natural convection and stabilize at a lower level for a long time. Temperature, the life of LED lamps can be increased by 2 to 3 times;

(2) The radiator of this utility model does not need die-casting molding, and can be processed by using thin aluminum sheets or copper sheets, which greatly reduces the design and manufacturing costs of hundreds of thousands or even tens of millions of molds, and shortens the product development cycle. significantly shortened;

(3) According to the different shapes of lamps and the actual heat dissipation needs of integrated chips, the utility model can flexibly design heat sinks and standardize the production of components, and significantly reduce the weight of the heat sink while effectively ensuring the heat dissipation capacity of the heat sink. It is convenient for the application of LED lamps in the lighting of high pole venues.

Other advantages, objectives and features of the utility model will partly be embodied through the following description, and partly will be understood by those skilled in the art through the research and practice of the utility model.

Description of drawings

Fig. 1 is a side view of a high-efficiency heat dissipation device for LED lamps with cooling fins arranged at the same height in an embodiment of the present invention;

Fig. 2 is a front view of a high-efficiency heat dissipation device for LED lamps with heat sinks arranged at the same height in an embodiment of the present invention;

Fig. 3 is a side view of a high-efficiency heat dissipation device for LED lamps in which the top of the heat sink is arranged in a stepped shape in another embodiment of the present invention;

Fig. 4 is a front view of a high-efficiency heat dissipation device for LED lamps in which the top of the heat sink is arranged in a stepped shape in an embodiment of the present invention;

Fig. 5 is a side view of a high-efficiency heat dissipation device for LED lamps with one side of the heat sink arranged in a stepped shape in another embodiment of the present invention;

Fig. 6 is a front view of a high-efficiency heat dissipation device for LED lamps with one side of the heat sink arranged in a stepped shape in another embodiment of the present invention;

Fig. 7 is a schematic diagram of two sets of cooling devices arranged in a stepped shape on one side in an embodiment of the present invention and used together in an LED lamp.

In the figure: 1. LED lamp, 2. Base plate, 3. Heat sink, 4. Limiting part, 5. Elastic member, 6. Screw rod, 7. Nut, 8. Bending part.

detailed description

The utility model will be described in further detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it by referring to the description.

It should be understood that terms such as "having", "comprising" and "including" as used herein do not entail the presence or addition of one or more other elements or combinations thereof.

Fig. 1～Fig. 7 shows a kind of implementation form according to the present utility model, comprises:

A bottom plate 2, one side of which is used to install the LED lamp 1;

A heat sink, which is connected to the other side of the bottom plate 2, the heat sink has a plurality of heat sinks 3 extending from the bottom plate to a direction away from the LED lamp;

A fastening device, which has stoppers 4 arranged at intervals between the plurality of cooling fins 3, the fastening device is detachably connected to the radiator, which is convenient for the later maintenance of the cooling fins and the cooling of the cooling fins. Adjustment of spacing;

The elastic member 5 elastically connects the fastening device and the bottom plate 2 for fixing the radiator on the floor.

In this technical solution, a thin metal sheet with high thermal conductivity is cut and processed according to the actual shape of the LED lamp housing, and after the radiator is fastened and connected in a detachable manner, it is arranged on the bottom plate through an elastic member. It is used to dissipate the heat generated by the LED lamps on the other side of the bottom plate during operation. Generally, the shell of LED lamps is equipped with convection vents with the outside air. The heat generated by the LED when it emits light is transferred from the bottom plate to the radiator and dissipated into the external environment through the vent holes on the lamp shell. No auxiliary parts for forced convection are needed. The effect of high heat dissipation can be achieved.

In the above solution, one way of detachably connecting the fastening device to the radiator is as follows: the fastening device also includes a threaded screw 6 at both ends, and the heat sink 3 and the position-limiting The part 4 is provided with a corresponding through hole, and the detachable connection between the fastening device and the radiator is realized by screwing a nut 7 at both ends of the screw rod through the through hole in turn.

In the above solution, a layer of heat conduction paste is filled between the bottom of the heat sink 3 and the bottom plate 2 to improve the heat conduction effect from the bottom plate to the heat sink.

In the above solution, a 90° bent portion 8 is provided at the bottom of the heat sink, and the bent portion is in contact with the bottom plate to increase the heat conduction contact area between the heat sink and the bottom plate.

In the above scheme, the heat sink is an aluminum sheet or a copper sheet, and the thermal conductivity of aluminum can reach 209W/m·k, which has good processability and low cost; the thermal conductivity of copper is 390W/m·k, which is higher than that of aluminum, but But it is about three times heavier than aluminum, and it is not as easy to process as aluminum sheet, so in general, aluminum sheet can be preferred for heat sink, and copper sheet is usually used when the application of heat sink is limited by the conduction characteristics.

In the above scheme, according to the different shapes of LED lamps:

Referring to Figure 1 and Figure 2, one implementation of the plurality of cooling fins 3 is as follows:

The heat sinks are arranged at the same height along the extending direction, the heat sinks are parallel to each other, and the adjacent heat sinks are kept at an appropriate distance to form a ventilation slot for convection and loss of heat and the external environment, which can be increased by increasing the number of heat sinks or increasing the height The heat dissipation area is conducive to the dissipation of heat from the integrated chip.

Among them, the heat sink is aluminum, the height of the heat sink is 80mm, the distance between the heat sinks is 7mm, the thickness of the heat sink is 1.8mm, and the LED is a single integrated chip of 100W. In order to consider the overall heat dissipation performance of the LED, the The lamp is placed in an air-conditioned airtight room at 25°C. Under the working conditions of the LED, the junction temperature is measured every 6 hours. After 90 hours, the average junction temperature of the system rises to 15°C.

Referring to Figure 3 and Figure 4, another implementation of the plurality of cooling fins 3 is:

The heat sink is arranged in a stepped shape along its extension direction, and the overall side of the top of the heat sink forms a peak-shaped or arc-shaped structure that can match the lamp housing, so that the cross-section of the lamp housing is gradually reduced along the extension direction of the heat sink. LED lamps;

Among them, the heat sink is a copper sheet, the height of the heat sink is 200-500mm, the distance between the heat sinks is 10mm, the thickness of the heat sink is 0.5mm, and the LED is a single integrated chip of 200W. In order to consider the overall heat dissipation performance of the LED, Place the lamp in an air-conditioned airtight room at 30°C, and measure its junction temperature every 6 hours under the working conditions of the LED. After 90 hours, the average junction temperature of the system rises to 14°C.

Another implementation of the plurality of cooling fins 3 described in FIGS. 5 to 7 is as follows:

The plurality of cooling fins are arranged in steps along the extending direction, and at least one side along the extending direction perpendicular to the extending direction is arranged in the same height or step shape, so as to meet the heat dissipation requirements of the elongated LED lamps. Referring to Fig. 7, two sets of heat sinks composed of multiple heat sinks are arranged on the bottom plate of a relatively slender lamp. In the longitudinal direction of the lamp, the sides of the top of the two heat sinks are approximately peak-shaped or arc-shaped. In the lateral direction of the lamp housing, the adjacent inner sides of the two heat sinks are set at equal lengths to avoid interference during installation of the two heat sinks. The outer sides of the two heat sinks are generally peak-shaped or arc-shaped.

Among them, the heat sink is made of aluminum sheet, the height of the heat sink is 100-160mm, the distance between the heat sinks is 11mm, the thickness of the heat sink is 1.2mm, and the two LED lamps are 100W integrated chips. For heat dissipation performance, the lamp is placed in an air-conditioned airtight room at 35°C, and the junction temperature is measured every 6 hours under the LED working condition. After 90 hours, the average junction temperature of the system rises to 16°C.

Moreover, the implementation form of the plurality of heat sinks is not limited thereto, and it can be bent and cut according to different shapes of LED lamps, and can be produced in a standardized manner to meet the heat dissipation requirements of LED lamps to the greatest extent.

The number of devices and the scale of processing described here are used to simplify the description of the present invention. The application, modification and change of the high-efficiency heat dissipation device for LED lamps of the present invention will be obvious to those skilled in the art.

As mentioned above, according to the utility model, the radiator can ensure that the heat dissipation area per watt of the LED lamp is more than 150 cm ² , which can well meet the heat dissipation demand of the 200W high-power LED lamp under the condition of natural convection and stabilize at a relatively high temperature for a long time. Low temperature, the life of LED lamps can be increased by 2 to 3 times;

In addition, the radiator of the utility model does not need mold die-casting, and can be processed by using thin aluminum or copper sheets, which greatly reduces the design and manufacturing costs of hundreds of thousands or even tens of millions of molds, and the product development cycle is also obvious. shorten;

In addition, the utility model can meet the different shapes of lamps and the actual heat dissipation needs of integrated chips, flexibly design heat sinks and standardize the production of components, and significantly reduce the weight of the heat sink while effectively ensuring the heat dissipation capacity of the heat sink, which is convenient The application of LED lamps in the lighting of high pole venues.

Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and implementation. It can be applied to various fields suitable for the utility model. Additional modifications can readily be made by those skilled in the art. Therefore, the invention should not be limited to the specific details and examples shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims (10)

1. the efficient radiating apparatus for LED lamp, it is characterised in that including:

Base plate, its side is used for mounted LED lamp；

Radiator, it is connected to the opposite side of described base plate, and described radiator has multiple from described base plate to the multiple fin extended away from LED direction；

Clamp device, it has the limiting section being arranged at intervals between the plurality of fin, and described clamp device is detachably connected to described radiator；

Elastic component, it flexibly connects described clamp device and base plate.

2. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterized in that, described clamp device also includes two ends and is provided with the screw mandrel of screw thread, described fin and limiting section are provided with corresponding through hole, and after the removably connecting of described clamp device and radiator sequentially passes through described through hole by screw mandrel, its two ends nut that is spirally connected respectively realizes.

3. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that it is contour or stepped setting that the plurality of fin extends along direction.

4. the efficient radiating apparatus for LED lamp as claimed in claim 3, it is characterised in that it is contour or stepped setting that the plurality of fin edge is perpendicular at least side, direction of its extension.

5. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that be filled with one layer of heat-conducting cream between bottom and the described base plate of described fin.

6. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that being provided with one 90 ° of kinks bottom described fin, described kink contacts with described base plate.

7. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that described fin is aluminium flake or copper sheet.

8. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that the spacing between the plurality of fin is 7～12mm.

9. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that the thickness of described fin is 0.3～2mm.

10. the efficient radiating apparatus for LED lamp as claimed in claim 1, it is characterised in that the height of described fin is 60～500mm.