JP3159654U - LED heat dissipation structure - Google Patents

Abstract

The present invention provides an LED heat dissipation structure that can reduce the generation of waste materials and lower the cost of a base material, and easily discharges heat of a light emitting chip that contributes to environmental protection. A package body includes a concave groove and an outer surface. The heat dissipating frame 12 is coupled to the package body, a part of the heat dissipating frame is disposed in the concave groove, and at least one end of the heat dissipating frame penetrates from at least one side of the concave groove to at least one side of the outer surface, One end is refracted and stretched along the outer surface of the package body. The light emitting chip 13 is positioned in the concave groove and attached to the heat dissipation frame. The conductive pin 14 has a first conductive pin and a second conductive pin, and the first conductive pin and the second conductive pin are located in the concave groove and penetrate from one side of the concave groove to the outer surface side. The plurality of lead wires 15 have a first lead wire and a second lead wire. The first lead wire connects the light emitting chip and the first conductive pin in the concave groove, and the second lead wire. The line connects the light emitting chip and the second conductive pin in the groove. [Selection] Figure 3

Description

  The present invention relates to an LED heat dissipation structure, and more particularly, to an LED heat dissipation structure that includes a heat dissipation frame in a package body and extends through the heat dissipation frame to the heat dissipation area of the LED outside the package body.

  Since an LED generates a large amount of heat during the light emission process, an appropriate heat dissipation device must be installed to avoid damaging the life of the light emitting chip itself.

  A conventional LED heat dissipation structure 1a (as shown in FIGS. 1 and 2) includes a first conductive pin 141a and a second conductive pin 142a facing each other in the package body 11a. The light emitting chip 13a is mounted on the first conductive pin 141a, the first conductive pin 141a is extended from the inside of the concave groove 111a to the outside of the package body 11a, and the first conductive pin 141a outside the package body 11a is connected to the circuit board 2a. By connecting to the upper surface, heat is radiated by the heat radiating element 3a (for example, an aluminum substrate) in contact with the bottom surface of the circuit board. The heat radiating element 3a may discharge heat from the light emitting chip 13a using a structure such as an auxiliary heat radiating fin, a heat radiating conductive tube, a cooling chip, a heat equalizing plate, or a heat radiating fan.

  However, since the first conductive pin 141a and the second conductive pin 142a are connected to the circuit board 2a and are limited to a narrow circuit in the circuit board 2a, the first conductive pin 141a and the second conductive pin 142a have a pin area. Since the heat dissipation area of the conventional light-emitting diode (LED) becomes worse, the heat dissipation speed is slow, the volume of the auxiliary heat dissipation device is too large, etc. It becomes the fault of.

  Further, when an aluminum substrate heat dissipation element is purchased, the cost is high, and further, if the aluminum substrate is processed and connected to the bottom side of the circuit board, the cost of the LED heat dissipation structure is significantly improved.

  An object of the present invention is to radiate heat from a light emitting chip by coupling a heat dissipating frame on which a light emitting chip generating a heat source is mounted to the package body and extending at least one end of the heat dissipating frame to the outside of the package main body. An object of the present invention is to provide an LED heat dissipation structure capable of solving difficult problems.

  Another object of the present invention is that the conductive pins and the heat dissipating frame are formed by pressing once with the same base material, so that both materials and thicknesses are the same, and in various existing press devices (for example, presses). It can be manufactured by pressing at the same time, and there is no need to process and manufacture two parts in two parts, so the production of waste materials is reduced, the cost of the base material is reduced, and it is suitable for environmental protection philosophy. An object of the present invention is to provide an LED heat dissipation structure that can reduce the number of steps.

  In order to achieve the above object, an LED heat dissipation structure according to the present invention includes a package body, a heat dissipation frame, at least one light emitting chip, a plurality of conductive pins, and a plurality of lead wires. The package body includes a recessed groove and an outer surface. A heat dissipating frame is coupled to the package body, a part of the heat dissipating frame is disposed in the concave groove, and at least one end of the heat dissipating frame penetrates from at least one side of the concave groove to at least one side of the outer surface, and one end of the heat dissipating frame on the outer surface side Is refracted and stretched along the outer surface of the package body. At least one light emitting chip is positioned in the concave groove and attached to the heat dissipation frame. The plurality of conductive pins have at least one first conductive pin and at least one second conductive pin, and the first conductive pin and the second conductive pin are located in the concave groove and are arranged on the outer surface from one side of the concave groove. It penetrates to the side. The plurality of lead wires have at least one first lead wire and at least one second lead wire, and the first lead wire connects the light emitting chip and the first conductive pin in the concave groove. The second lead wire connects the light emitting chip and the second conductive pin in the concave groove.

  The LED heat dissipation structure 1 further includes a light-transmitting body that is formed in a concave groove and packages a heat dissipation frame, a light emitting chip, a conductive pin, and a lead wire in the concave groove.

  In order to understand the features and technical contents of the present invention in a deep and specific manner, reference will be made to the following detailed description and attached drawings related to the present invention. It goes without saying that the scope is not strictly limited.

FIG. 1 is a plan view showing a conventional LED heat dissipation structure. FIG. 2 is a sectional side view showing a conventional LED heat dissipation structure. FIG. 3 is a perspective view showing the heat dissipation structure of the LED according to the first embodiment of the present invention. FIG. 4 is a plan view showing a heat dissipation structure for an LED according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view taken along the line A-A 'of FIG. 4 of the LED heat dissipation structure according to the first embodiment of the present invention. FIG. 6 is a right side view showing the heat dissipation structure of the LED according to the first embodiment of the present invention. FIG. 7 is a front view illustrating a heat dissipation structure for an LED according to the first embodiment of the present invention. FIG. 8 is a plan view illustrating a heat dissipation structure for an LED according to a second embodiment of the present invention.

3 to 7 are a perspective view, a plan view, a cross-sectional view taken along line AA ′, a right side view, and a front view, respectively, illustrating the LED heat dissipation structure according to the first embodiment of the present invention.
In the drawing, an LED heat dissipation structure 1 includes a package body 11, a heat dissipation frame 12, at least one light emitting chip 13, and a plurality of conductive pins 14 (that is, at least one first conductive pin 141 and at least one one. The second conductive pin 142) and a plurality of lead wires 15 are included. The package body 11 includes a concave groove 111 and an outer surface 112 (as shown in FIGS. 3 and 4).

  The heat dissipating frame 12 is coupled to the package body 11, a part of the heat dissipating frame 11 is disposed in the concave groove 111, and is interposed between the first conductive pin 141 and the second conductive pin 142, The material is a metal or a metal alloy. One end of the heat dissipating frame 12 penetrates from one side of the concave groove 111 to the outer surface 112 side of the package body 11, and further refracts along the outer surface 112 and extends to the circuit board 2. Finally, one end of the heat dissipating frame 12 penetrating the circuit board 2 is connected to the heat dissipating element 3 (as shown in FIG. 7), and for example, the heat dissipating frame 12 is connected to the base of the heat dissipating fin.

  Further, the other end of the heat dissipating frame 12 penetrates from the other side of the concave groove 111 to the other side of the outer surface 112, and further refracts along the other side of the outer surface 112 and extends to the circuit board 2. Finally, the other end of the heat dissipating frame 12 penetrating the circuit board 2 is connected to the heat dissipating element 3 (as shown in FIG. 7). For example, the heat dissipating frame 12 is connected to the base of the heat dissipating fin.

  The penetrated circuit board 2 is a flexible printed circuit (FPC) or a rigid printed circuit (RPC). At least one light emitting chip 13 is attached to the heat dissipation frame 12 in the concave groove 111. In the present embodiment, three light emitting chips 13 are shown. However, the present invention is not limited thereto, and the light emitting chips 13 may be provided in the heat dissipating frame 12 in one, two, or four or more.

  The plurality of conductive pins 14 include at least one first conductive pin 141 and at least one second conductive pin 142. The outer shapes of the first conductive pin 141 and the second conductive pin 142 are not restricted, and the first conductive pin 141 and the second conductive pin 142 are easy to arrange in the narrow groove 111. The external shapes may be the same or different. A part of the first conductive pin 141 is positioned in the concave groove 111, and one end of the first conductive pin 141 is penetrated from the inside of the concave groove 111 to one side of the outer surface 112 of the package body 11, and It refracts down along the outer surface 112 and extends to the boundary between one side and the bottom side of the outer surface 112 (as shown in FIGS. 5 and 6). Finally, one end of the first conductive pin 141 is refracted and extended to the bottom side of the outer surface 112 (that is, the bottom surface of the package body 11). In the present embodiment, the three refracted first conductive pins 141 and the three refracted second conductive pins 142 have been described. However, the present invention is not limited thereto, and the first conductive pin 141 and the second conductive pin are not limited thereto. 142 may be one, two, or four or more, respectively.

  A part of the second conductive pin 142 is positioned in the concave groove 111 and opposed to the first conductive pin 141, and one end of the second conductive pin 142 is connected to the package body 11 from the inside of the concave groove 111. It penetrates to one side of the outer surface 112, and further refracts downward along the outer surface 112 and extends to the boundary between one side and the bottom side of the outer surface 112 (as shown in FIGS. 5 and 6). Finally, one end of the second conductive pin 142 is refracted and extended to the bottom side of the outer surface 112 of the package body 11 (that is, the bottom surface of the package body 11). One end of the first conductive pin 141 and one end of the second conductive pin 142 extended to the bottom surface of the package body 11 may be connected to the circuit board 2 by a soldering method.

  The first conductive pin 141, the second conductive pin 142, and the heat dissipation frame 12 are simultaneously carved into the concavo-convex mold, and the first conductive pin 141, the second conductive pin 142 are made from the metal substrate in the process of pressing once. Since the three members of the heat dissipating frame 12 can be manufactured, the material and thickness thereof are also the same.

  The plurality of lead wires 15 include a first lead wire 151 and a second lead wire 152, and the first lead wire 151 connects the light emitting chip 13 and the first conductive pin 141 in the concave groove 111. The first lead wire 151 transmits the electric negative electrode from the first conductive pin 141 to the light emitting chip 13. The second lead wire 152 connects the light emitting chip 13 and the second conductive pin 142 in the concave groove 111, and the second lead wire 152 connects the electric positive electrode from the second conductive pin 142 to the light emitting chip 13. To transmit.

FIG. 8 is a plan view illustrating a heat dissipation structure for an LED according to a second embodiment of the present invention.
The LED heat dissipation structure 1 further includes a translucent body 16 formed in the concave groove 111. The translucent body 16 is formed by injecting molten translucent colloid into the concave groove 111 and solidifying it. The heat radiating frame 12, the light emitting chip 13, the conductive pins 14 and the lead wires 15 in the concave groove 111 are packaged. To do. Moreover, the light from the light emitting chip 13 that may contain a fluorescent powder component in the light transmitting body 16 is converted to a different wavelength by the fluorescent action of the fluorescent powder, and light of different colors can be emitted.

  As described above, the heat dissipation structure of the LED can solve the problem that the heat of the light emitting chip is not easily discharged by extending at least one end of the heat dissipation frame having a large area to the outside of the package body through the circuit board. It is in. At least one end of the heat dissipating frame is connected to the heat dissipating element 3 (for example, a heat dissipating fin, a heat dissipating conductive tube, a cooling chip, a heat equalizing plate, or a heat dissipating fan) to assist the heat dissipating of the heat dissipating frame, thereby greatly improving the heat dissipation effect It can be improved.

  Another feature of the heat dissipation structure of the LED is that the heat dissipation frame, the first conductive pin, and the second conductive pin are a convex shape in which the heat dissipation frame, the first conductive pin, and the second conductive pin are carved in the press device. Then, the metal substrate is pressed into a heat sink frame, a concave part in which the first conductive pin and the second conductive pin are carved, and the three members of the heat dissipation frame, the first conductive pin and the second conductive pin are simultaneously combined. Can be manufactured once. For this reason, it is not necessary to manufacture conductive pins and heat dissipation frames of the same material and thickness at the same time, and process and manufacture them in two parts, reducing the generation of waste materials, reducing the cost of metal substrates, and reducing the manufacturing process. And will fit the current environmental protection philosophy.

  However, the configuration disclosed above is merely a preferred embodiment of the present invention, and does not limit the characteristics of the present invention. Any expert having ordinary knowledge in the field of the present invention may In particular, conversions and modifications can be appropriately performed, but it goes without saying that those implementations should be delivered within the scope of the claimed invention.

1 ... LED heat dissipation structure 11 ... Package body 111 ... Dove groove 112 ... Exterior surface 12 ... Heat dissipation frame 13 ... Light emitting chip 14. ······························································································ Lead wire 151... 2 lead wires 16... Translucent body 2... Circuit board 3.

Claims (4)

A package body comprising a recessed groove and an outer surface;
It is coupled to the package body, a part thereof is disposed in the groove, at least one end thereof is penetrated from at least one side of the groove to at least one side of the outer surface, and one end on the outer surface side is an outer surface of the package body A heat dissipation frame that is refracted and stretched along
At least one light emitting chip located in the concave groove and attached to the heat dissipation frame;
And having at least one first conductive pin and at least one second conductive pin, wherein the first conductive pin and the second conductive pin are located in the concave groove and from one side of the concave groove to the outer surface side. A plurality of conductive pins penetrating to
Having at least one first lead wire and at least one second lead wire, the first lead wire connecting the light emitting chip and the first conductive pin in the concave groove, and The second lead wire is an LED heat dissipation structure including a plurality of lead wires connecting the light emitting chip and the second conductive pin in the concave groove.   The LED heat dissipation structure according to claim 1, further comprising a translucent body formed in the concave groove.   2. The LED heat dissipation structure according to claim 1, wherein one end of the extended heat dissipation frame is further connected to a heat dissipation element through the circuit board.   The LED heat dissipation structure according to claim 1, wherein the heat dissipation frame and the plurality of conductive pins are formed by pressing once and have the same thickness.

Images