CN2216318Y - Flexible polyester film coated copper foil plate and film-coated circuit board - Google Patents
Flexible polyester film coated copper foil plate and film-coated circuit board Download PDFInfo
- Publication number
- CN2216318Y CN2216318Y CN 94245505 CN94245505U CN2216318Y CN 2216318 Y CN2216318 Y CN 2216318Y CN 94245505 CN94245505 CN 94245505 CN 94245505 U CN94245505 U CN 94245505U CN 2216318 Y CN2216318 Y CN 2216318Y
- Authority
- CN
- China
- Prior art keywords
- polyester film
- film
- circuit board
- flexible
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laminated Bodies (AREA)
Abstract
The invention relates to a flexible board and a film coated circuit board, particularly a flexible polyester film coated copper foil board and a film coated circuit board. A polyester film is coated with EEA material on one surface or double surfaces, and then is combined with specially treated copper foil in the heat composite method to compose the flexible board. A polyester film is recombined with a flexible circuit board to compose the film coated circuit board. The invention has the advantages of light weight, bend ease, good dielectric property, heat resistance, solvent resistance, strong adhesive capacity, good transparency and low cost. The products of the inventive are suitable for being used as printed wiring boards for automobile instruments, etc.
Description
The utility model relates to flexible board and overlay film wiring board, relates to polyester film flexible copper clad foil plate and mylar overlay film wiring board in more detail.
At present employed printed wiring board such as domestic automobile instrument adopts imines flexible board and hard copper coated foil plate, on its wiring board all is to be coated with the green solder resist of last layer or zinc-platedly to come protection circuit in case oxidation of principal vertical line road surfaces or scuffing.Its shortcoming of these flexible boards and wiring board is: volume is big, heavy, the shortage flexibility, crooked easy fracture, and the life-span is short, the manufacturing process complexity, transparency is relatively poor, and dimensional discrepancy is big.Cost is also high in addition.
The purpose of this utility model provides a kind of polyester film flexible copper clad foil plate and polyester film overlay film wiring board that has improved.
The purpose of this utility model is that the polyester film flexible copper clad foil plate realized in the following manner is to adopt the special-purpose PET film (polyester film) of electrician, is composited with Copper Foil heat through special processing after single or double is handled again.Its formation of polyester film overlay film wiring board is that polyester film flexible copper clad foil plate is printed to circuit, and the PET film is covered formation polyester film overlay film wiring board on the flexible circuit board.
The advantage of the utility model polyester film flexible copper clad foil plate is: volume is little, and is in light weight, and transparency is good, the bending strength height, and heat-resisting anti-solvent is good, dependable performance, cost is low.The wiring board bonding force that polyester film flexible copper clad foil plate is made is strong, can prevent that circuit from coming off, and prolong useful life greatly.
Below in conjunction with description of drawings preferred forms of the present utility model.
Fig. 1 is the utility model polyester film flexible copper clad foil plate structure schematic diagram.
Fig. 2 is the utility model polyester film overlay film circuit board structure schematic diagram.
Referring to Fig. 1: 10-polyester film flexible copper clad foil plate, wherein: the 11-polyester film; The 12-EEA material; 13-alligatoring Copper Foil.
Referring to Fig. 2: 10-polyester film flexible copper clad foil plate; The 14-DET/EEA film.
Introduce embodiment of the present utility model below.
Flexible polyester thin film flexible copper coated foil plate adopts polyester film (0.05mm-0.20mm) to be coated with the material with EEA at the single or double of film, through temperature 5 meters baking boxs of 100 ℃-130 ℃, and make the PET/EEA film with per minute 2m-4m speed baking, and then with the alligatoring Copper Foil or the gluing Copper Foil (0.018mm-0.20mm) of electrician's special use be 110 ℃-150 ℃ in temperature, unit pressure is 20kgf/cm
2-50kgf/cm
2Hydraulic press on hot pressing compound 30 minutes-90 minutes, promptly make polyester film flexible copper clad plate.
Polyester film overlay film wiring board is to adopt polyester film flexible copper clad foil plate, becomes wiring board through corrosion processing, and to be 100 ℃-140 ℃ with the PET/EEA film in temperature be 10kgf/cm in unit pressure
2-30kgf/cm
2Hydraulic press on hot pressing promptly made this wiring board in 10 minutes-30 minutes.
Claims (2)
1, a kind of polyester film flexible copper clad foil plate is characterized in that constituting by being coated with outer compound alligatoring Copper Foil of the polyester film (PET) of EEA material or gluing Copper Foil.
2, a kind of polyester film overlay film wiring board is characterized in that being made of polyester film flexible copper clad foil plate both sides hot pressing PET/EEA film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94245505 CN2216318Y (en) | 1994-11-24 | 1994-11-24 | Flexible polyester film coated copper foil plate and film-coated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94245505 CN2216318Y (en) | 1994-11-24 | 1994-11-24 | Flexible polyester film coated copper foil plate and film-coated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2216318Y true CN2216318Y (en) | 1995-12-27 |
Family
ID=33851272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 94245505 Expired - Fee Related CN2216318Y (en) | 1994-11-24 | 1994-11-24 | Flexible polyester film coated copper foil plate and film-coated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2216318Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100391730C (en) * | 1999-03-17 | 2008-06-04 | 日矿材料美国有限公司 | Copper surface treatment for preventing microcrack in soft circuit |
| CN100521866C (en) * | 2004-03-30 | 2009-07-29 | 新日铁化学株式会社 | Flexible copper-coated laminated board and mfg. method |
| CN101151946B (en) * | 2005-03-31 | 2010-10-27 | 新日铁化学株式会社 | Multi-layer laminate and flexible copper-clad laminated substrate production method |
| CN102543899A (en) * | 2011-12-28 | 2012-07-04 | 广东生益科技股份有限公司 | Flexible encapsulating substrate and manufacturing method thereof |
| CN103009713A (en) * | 2012-11-28 | 2013-04-03 | 梅州市志浩电子科技有限公司 | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof |
| CN103917042A (en) * | 2012-12-28 | 2014-07-09 | 新日铁住金化学株式会社 | Flexible copper-coated laminated plate |
| CN105799148A (en) * | 2014-12-31 | 2016-07-27 | 佛山市顺德区莱尔电子材料有限公司 | Preparation method and application of high temperature resistant PET film |
-
1994
- 1994-11-24 CN CN 94245505 patent/CN2216318Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100391730C (en) * | 1999-03-17 | 2008-06-04 | 日矿材料美国有限公司 | Copper surface treatment for preventing microcrack in soft circuit |
| CN100521866C (en) * | 2004-03-30 | 2009-07-29 | 新日铁化学株式会社 | Flexible copper-coated laminated board and mfg. method |
| CN101151946B (en) * | 2005-03-31 | 2010-10-27 | 新日铁化学株式会社 | Multi-layer laminate and flexible copper-clad laminated substrate production method |
| CN102543899A (en) * | 2011-12-28 | 2012-07-04 | 广东生益科技股份有限公司 | Flexible encapsulating substrate and manufacturing method thereof |
| CN102543899B (en) * | 2011-12-28 | 2016-04-06 | 广东生益科技股份有限公司 | Flexible encapsulating substrate and preparation method thereof |
| CN103009713A (en) * | 2012-11-28 | 2013-04-03 | 梅州市志浩电子科技有限公司 | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof |
| CN103917042A (en) * | 2012-12-28 | 2014-07-09 | 新日铁住金化学株式会社 | Flexible copper-coated laminated plate |
| CN103917042B (en) * | 2012-12-28 | 2018-03-30 | 新日铁住金化学株式会社 | Flexible copper-clad laminate |
| CN105799148A (en) * | 2014-12-31 | 2016-07-27 | 佛山市顺德区莱尔电子材料有限公司 | Preparation method and application of high temperature resistant PET film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |