CN2155126Y - Printed board - Google Patents
Printed board Download PDFInfo
- Publication number
- CN2155126Y CN2155126Y CN 93205356 CN93205356U CN2155126Y CN 2155126 Y CN2155126 Y CN 2155126Y CN 93205356 CN93205356 CN 93205356 CN 93205356 U CN93205356 U CN 93205356U CN 2155126 Y CN2155126 Y CN 2155126Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- utility
- model
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a novel printed circuit board which is characterized in that an electric conduction line of the printed circuit board is provided with a nickel coating layer, and a welding disc of a single sided printed circuit board or a welding disc of a metalization printed circuit board with double side holes and the inner surface of a metalization hole are coated with terne alloy layers. The utility model has the advantages of simple manufacture process, no environment pollution and low cost. The bright and flat nickel coating layer is favorable for direct detection. Compared with SMOBC boards, the oxidation resistance and the corrosion resistance of the utility model are enhanced. The utility model has good weldability and is suitable for the technology of surface mounting and wave soldering for electronic products.
Description
The utility model relates to a kind of novel printed circuit board, and it is particularly suitable for wave-soldering and surface mounting technology.
At present, SMOBC printed circuit board the most popular with users, its production technology more complicated in process of production, needs terne plating on the printed board conductive line earlier, and then deleading ashbury metal layer.This production technology not only needs expensive hot air levelling machine, and easily produces environmental pollution.The major defect of this printed circuit board is the cost height, complex manufacturing and wayward, and its bus surface is the copper layer, so easily oxidation, corrosion resistance is relatively poor.
The purpose of this utility model is at above-mentioned shortcoming of the prior art, and provides a kind of solderability good, and production technology is simple, and cost is low, is fit to the mounted on surface of electronic product and the printed circuit board of wave-soldering packing technique.
The purpose of this utility model is achieved in that it by insulated substrate 1, Copper Foil conductive line 4, and hole 2 and pad 3 are formed, and are provided with nickel coating 6 on the Copper Foil conductive line, and pad 3 surfaces are pb-sn alloy plating 5.
It is by insulated substrate 1, Copper Foil conductive line 4, plated-through hole 9, and pad 3 is formed, and is provided with nickel coating 6 above the conductive line after hole metallization is handled, and pad 3 surfaces and plated-through hole inner surface are pb-sn alloy plating 5.
Below in conjunction with drawings and Examples the utility model is further described.
Fig. 1 is the single-clad board structural representation.
Fig. 2 is the two sided pcb structural representation.
As shown in Figure 1, single-clad board is by insulated substrate 1, Copper Foil conductive line 4, and hole 2, pad 3, and the nickel coating on the Copper Foil conductive line 6 is formed.The surface of pad 3 is a pb-sn alloy plating 5.Wherein, the layer of lead-tin alloy 5 of nickel coating 6 and bond pad surface is finished by graphic plating.
As shown in Figure 2, two-sided hole metallization printed circuit board is made up of insulated substrate 1, Copper Foil conductive line 4, plated-through hole 9, pad 3 and the nickel coating 6 above the conductive line after hole metallization is handled.The surface of pad 3 and the inner surface of plated-through hole are terne metal gold plate 5.Among the figure, 8 is the electroless copper plating layer, and 7 is copper plate.
The utility model has the advantages that manufacturing process is simple, do not produce environmental pollution, cost is low, nickel coating light, the smooth visual inspection that is beneficial to, and its non-oxidizability is compared with the SMOBC plate with corrosion resistance and is improved, its solderability is good, and install and the wave-soldering packing technique on the surface that is fit to electronic product, and it is a kind of printed board with the value of pushing away.
Claims (2)
1, a kind of novel single-clad board, it is by insulated substrate 1, Copper Foil conductive line 4, hole 2 and pad 3 are formed, and it is characterized in that being provided with on the Copper Foil conductive line nickel coating 6, and pad 3 surfaces are pb-sn alloy plating 5.
2, a kind of novel two-sided hole metallization printed circuit board, it is by insulated substrate 1, Copper Foil conductive line 4, plated-through hole 9, and pad 3 is formed, it is characterized in that being provided with nickel coating 6 above the conductive line after hole metallization is handled, pad 3 surfaces and plated-through hole inner surface are pb-sn alloy plating 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93205356 CN2155126Y (en) | 1993-03-13 | 1993-03-13 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93205356 CN2155126Y (en) | 1993-03-13 | 1993-03-13 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2155126Y true CN2155126Y (en) | 1994-02-02 |
Family
ID=33788650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 93205356 Expired - Fee Related CN2155126Y (en) | 1993-03-13 | 1993-03-13 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2155126Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469689A (en) * | 2010-11-15 | 2012-05-23 | 深南电路有限公司 | Manufacturing process for PCB (Printed Circuit Board) step board |
| CN101715494B (en) * | 2007-07-10 | 2012-10-17 | 安美特德国有限公司 | Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
| CN102638931B (en) * | 2004-09-17 | 2014-09-24 | 泰拉丁公司 | Electronic assembly, method for minimizing parasitic capacitance, and method for manufacturing circuit board structure |
-
1993
- 1993-03-13 CN CN 93205356 patent/CN2155126Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638931B (en) * | 2004-09-17 | 2014-09-24 | 泰拉丁公司 | Electronic assembly, method for minimizing parasitic capacitance, and method for manufacturing circuit board structure |
| CN101715494B (en) * | 2007-07-10 | 2012-10-17 | 安美特德国有限公司 | Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
| CN102469689A (en) * | 2010-11-15 | 2012-05-23 | 深南电路有限公司 | Manufacturing process for PCB (Printed Circuit Board) step board |
| CN102469689B (en) * | 2010-11-15 | 2013-05-08 | 深南电路有限公司 | Manufacturing process for PCB (Printed Circuit Board) step board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |