CN219087398U - Double-sided flexible circuit board with special conducting structure - Google Patents
Double-sided flexible circuit board with special conducting structure Download PDFInfo
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- CN219087398U CN219087398U CN202222828118.6U CN202222828118U CN219087398U CN 219087398 U CN219087398 U CN 219087398U CN 202222828118 U CN202222828118 U CN 202222828118U CN 219087398 U CN219087398 U CN 219087398U
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- sided flexible
- clad plate
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- copper
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
A double-sided flexible circuit board of a special conductive structure, comprising: the double-sided flexible copper-clad plate comprises a double-sided flexible copper-clad plate, a bottom protection film, a thermosetting adhesive, a metal reinforcing plate, a top protection film, a laser engraving area and a top conduction bonding pad, wherein the bottom of the double-sided flexible copper-clad plate is provided with the bottom protection film, the bottom protection film is connected with the metal reinforcing plate through the thermosetting adhesive, the top of the double-sided flexible copper-clad plate is provided with the top protection film, the laser engraving area is arranged in the double-sided flexible copper-clad plate, the top conduction bonding pad is semicircular, and the top conduction bonding pad is arranged between the double-sided flexible copper-clad plate and the top protection film. The double-sided flexible copper-clad plate comprises: top copper foil, adhesive glue, PI board and bottom copper foil. Compared with the prior art, the double-layer circuit conducting function of the double-sided flexible circuit board is realized by etching the conducting ring of the upper copper foil.
Description
Technical Field
The utility model relates to the field of metal circuit boards for LED car lamps, in particular to a double-sided flexible circuit board with a special conducting structure.
Background
In the current production, if the production of double-sided flexible wiring boards is required, the most common way is to implement with two single-sided wiring boards, but this requires more consumable costs and additional processing steps. Therefore, in addition to the method, the other scheme is realized by directly adopting the material of the double-sided flexible copper-clad plate.
In a double-sided flexible circuit board for a car lamp, general double-sided circuit conduction is often realized by adopting an electroplating process, the process is complex, and the double-layer circuit conduction of the double-sided flexible circuit board can be completed only by drilling, removing glue in holes, plating copper (PTH) -plating copper on hole walls and the like, and the lighting of the car lamp is realized after electronic components are mounted and attached.
The electroplating process is complex and time-consuming, and has the discharge of waste water and waste gas, which has a certain influence on environmental pollution.
To solve the above problems, we have made a series of improvements.
Disclosure of Invention
The utility model aims to provide a double-sided flexible circuit board with a special conducting structure, which overcomes the defects and the shortcomings in the prior art.
A double-sided flexible circuit board of a special conductive structure, comprising: the double-sided flexible copper-clad plate comprises a double-sided flexible copper-clad plate, a bottom protective film, a thermosetting adhesive, a metal reinforcing plate, a top protective film, a laser engraving area and a top conduction bonding pad, wherein the bottom protective film is arranged at the bottom of the double-sided flexible copper-clad plate and is connected with the metal reinforcing plate through the thermosetting adhesive;
the double-sided flexible copper-clad plate comprises: the top copper foil, the adhesive glue, the PI plate and the bottom copper foil, the top copper foil is connected with the PI plate through the adhesive glue, the PI plate is connected with the bottom copper foil through the adhesive glue, the top copper foil, the adhesive glue and the PI plate are penetrated to form a laser engraving area, and the contact position between the bottom copper foil and the laser engraving area is a bottom conduction disc.
The utility model has the beneficial effects that:
compared with the prior art, the double-layer circuit conducting function of the double-sided flexible circuit board is realized by etching the conducting ring of the upper copper foil.
Description of the drawings:
fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic process diagram of surface mounting.
Fig. 3 is a schematic structural diagram of a bottom conductive pad and a top conductive pad.
Reference numerals:
the double-sided flexible copper-clad laminate 100, the top copper foil 110, the adhesive 120, the PI board 130, the bottom copper foil 140 and the bottom conductive plate 141.
The protective film comprises a bottom protective film 200, a thermosetting adhesive 300, a metal reinforcing plate 400, a top protective film 500, a laser engraving area 600 and a top conducting bonding pad 700.
Detailed Description
The utility model will now be further described with reference to specific examples. It should be understood that the following examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model.
Fig. 1 is a schematic structural view of the present utility model. Fig. 2 is a schematic process diagram of surface mounting. Fig. 3 is a schematic structural diagram of a bottom conductive pad and a top conductive pad.
Example 1
As shown in fig. 1-3, a double-sided flexible circuit board with a special conductive structure includes: the double-sided flexible copper-clad plate 100, the bottom protection film 200, the thermosetting adhesive 300, the metal reinforcing plate 400, the top protection film 500, the laser engraving area 600 and the top-layer conduction bonding pad 700 are arranged at the bottom of the double-sided flexible copper-clad plate 100, the bottom protection film 200 is connected with the metal reinforcing plate 400 through the thermosetting adhesive 300, the top of the double-sided flexible copper-clad plate 100 is provided with the top-layer protection film 500, the laser engraving area 600 is arranged in the double-sided flexible copper-clad plate 100, the top-layer conduction bonding pad 700 is in a semicircular shape, and the top-layer conduction bonding pad 700 is arranged between the double-sided flexible copper-clad plate 100 and the top-layer protection film 500.
The double-sided flexible copper clad laminate 100 includes: the top copper foil 110, the adhesive glue 120, the PI plate 130 and the bottom copper foil 140, the top copper foil 110 is connected with the PI plate 130 through the adhesive glue 120, the PI plate 130 is connected with the bottom copper foil 140 through the adhesive glue 120, the top copper foil 110, the adhesive glue 120 and the PI plate 130 are penetrated to form a laser engraving area 600, and the contact position between the bottom copper foil 140 and the laser engraving area 600 is a bottom conductive disc 141.
As described in the background art, the double-sided flexible copper-clad plate needs electroplating technology to realize the double-sided flexible circuit board for the car lamp. The present utility model as a whole is changed as follows compared to the electroplating process.
The traditional electroplating process adopts drilling processing to open the upper layer and the lower layer of the double-sided flexible copper-clad plate, so that the double-sided flexible copper-clad plate is of a through structure, and the upper layer and the lower layer of the double-sided flexible copper-clad plate are of a complete conducting plate structure. The present utility model adopts the laser engraving technique to engrave the surface of the double-sided flexible copper clad laminate 100 to form a laser engraved area 600 that resembles a hole but does not penetrate the underlying copper foil 140. Although the bottom via pad 141 is similar to plating, the top via pad 700 is a semicircular structure in the top design.
And the utility model can also realize the conduction of the double-sided flexible copper-clad plate 100 and the final effect of the electroplating process. Thus, the method can save a large number of steps and is environment-friendly. The implementation principle is as follows: the upper copper foil layer conduction bonding pad 700 is etched, the bottom copper foil 140 of the double-sided board is exposed by adopting a laser engraving process, a connection conduction disc of the double-sided board is formed, the upper copper foil layer and the lower copper foil layer are directly connected and conducted by solder through the process processing of surface mounting SMT, and the double-layer circuit conduction function of the double-sided flexible circuit board is realized. I.e. the utility model is practicable.
The top-layer conductive bonding pad 700 of the top-layer copper foil 110 is finished by adopting an etching process, is designed into a semicircular shape, enhances the reliability of copper foil connection of upper and lower layers, is beneficial to the flow of soldering tin in the subsequent surface mounting process, and prevents the occurrence of void and poor cold joint of the soldering flux in the reflow soldering process.
Compared with the prior art, the double-layer circuit conducting function of the double-sided flexible circuit board is realized by etching the conducting ring of the upper copper foil.
The present utility model has been described in detail with reference to the embodiments, but the present utility model is not limited thereto, and various modifications may be made without departing from the spirit of the present utility model.
Claims (1)
1. The utility model provides a two-sided flexible wiring board of special conduction structure which characterized in that includes: the double-sided flexible copper-clad plate (100), a bottom layer protection film (200), thermosetting glue (300), a metal reinforcing plate (400), a top layer protection film (500), a laser engraving area (600) and a top layer conduction bonding pad (700), wherein the bottom layer protection film (200) is arranged at the bottom of the double-sided flexible copper-clad plate (100), the bottom layer protection film (200) is connected with the metal reinforcing plate (400) through the thermosetting glue (300), the top of the double-sided flexible copper-clad plate (100) is provided with the top layer protection film (500), the laser engraving area (600) is arranged in the double-sided flexible copper-clad plate (100), the top layer conduction bonding pad (700) is in a semicircular shape, and the top layer conduction bonding pad (700) is arranged between the double-sided flexible copper-clad plate (100) and the top layer protection film (500);
the double-sided flexible copper-clad plate (100) comprises: top layer copper foil (110), bonding adhesive (120), PI board (130) and bottom copper foil (140), top layer copper foil (110) are connected with PI board (130) through bonding adhesive (120), PI board (130) are connected with bottom copper foil (140) through bonding adhesive (120), top layer copper foil (110), bonding adhesive (120) and PI board (130) are formed laser sculpture district (600) after being penetrated, bottom copper foil (140) and the contact position of laser sculpture district (600) are bottom layer switch-on dish (141).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222828118.6U CN219087398U (en) | 2022-10-26 | 2022-10-26 | Double-sided flexible circuit board with special conducting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222828118.6U CN219087398U (en) | 2022-10-26 | 2022-10-26 | Double-sided flexible circuit board with special conducting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219087398U true CN219087398U (en) | 2023-05-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222828118.6U Active CN219087398U (en) | 2022-10-26 | 2022-10-26 | Double-sided flexible circuit board with special conducting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219087398U (en) |
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2022
- 2022-10-26 CN CN202222828118.6U patent/CN219087398U/en active Active
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