CN105799148A - Preparation method and application of high temperature resistant PET film - Google Patents
Preparation method and application of high temperature resistant PET film Download PDFInfo
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- CN105799148A CN105799148A CN201410845020.9A CN201410845020A CN105799148A CN 105799148 A CN105799148 A CN 105799148A CN 201410845020 A CN201410845020 A CN 201410845020A CN 105799148 A CN105799148 A CN 105799148A
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- high temperature
- pet film
- temperature resistant
- resistant pet
- copper foil
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Abstract
The invention discloses a preparation method and application of a high temperature resistant PET film. The method consists of: subjecting PET raw materials to drying, melt extrusion and sheet casting, then conducting two-way stretching in vertical and horizontal direction, and finally conducting rolling and cutting to obtain a finished product, with the transverse/longitudinal stretching ratio being 2.5-2.8. The invention also discloses application of the high temperature resistant PET film prepared by the method in flexible printed circuit boards.
Description
Technical field
The present invention relates to PET film, particularly relate to preparation method and the application thereof of a kind of high temperature resistant PET film.
Background technology
Flexible PCB (FlexiblePrintedCircuitBoard) is called for short " soft board ", FPC it is commonly called as in industry, the printed circuit board (PCB) made with flexible insulating substrate (mainly polyimides or mylar), has the advantage that many rigid printed circuit boards do not possess.Such as it can free bend, winding, folding.Utilize FPC can be substantially reduced the volume of electronic product, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
Flexible PCB divides according to the number of plies of copper-foil conducting electricity, is divided into lamina, doubling plate, multi-layer sheet, dual platen etc..Existing doubling plate is be respectively equipped with PI film at the tow sides of metal forming, is combined by Wear Characteristics of Epoxy Adhesive, then at PI film last layer ink, namely has 7 Rotating fields between PI film and metal forming, and cost is higher.And due to the character of PI film and epoxy glue, the conventional flex LED-baseplate being prepared from can only store under cryogenic, and the life-span is short.Additionally, flexible PCB mostly is employing etching technique, more or less circuit has irregular edge.In order to overcome this defect, it is badly in need of a kind of new material to replace PI film and epoxy glue.
PET film has another name called high temperature resistance polyester thin film.The good mechanical performance of PET film, its obdurability is best in all thermoplastics, and tensile strength and impact strength are more much higher than general thin film；And very power is good, dimensionally stable, be suitable to the secondary operations such as printing, paper bag.PET film also has excellent heat-resisting, tolerance to cold and good chemical proofing and oil resistivity.But owing to heat resistance is not good, under 220 DEG C of conditions, easily shrink tilting, and the preparation of flexible PCB it is generally required to carry out hot-press solidifying under middle hot conditions, therefore PET is hardly for the preparation of substrate of flexible circuit board.
Application number be 200710103415.1 Chinese patent " mylar for flexible printing plate " disclose a kind of mylar for flexible printing plate, its separable adhesive layer (A) comprising base copolyester (B), using polyester resin and acrylic resin to be formed on a surface of described base copolyester；And on another surface of described base copolyester formed antistatic layer (C).This patent in order to improve the adhesive force of mylar and photosensitive resin, the separable adhesive layer formed on a surface of base copolyester, but not mylar is processed, described mylar still can shrink tilting under middle hot conditions.
Above-mentioned patent adopts base copolyester and adhesive layer to replace PI film and epoxy glue, although can solve PI film and epoxy glue can only cryopreservation and life-span short defect, but self there is also the problem shrinking tilting under middle hot conditions, accordingly, the present invention except having done the defect being correspondingly improved to overcome above-mentioned patent on composition material.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, it is provided that the preparation method of the simple high temperature resistant PET film of a kind of technique.
It is a further object to provide flexible circuit board prepared by described high temperature resistant PET film.
The above-mentioned purpose of the present invention is achieved by following technical solution:
A kind of preparation method of high temperature resistant PET film, PET raw material through super-dry, melt extrude, carry out biaxial tension in length and breadth after slab, control thickness, last rolling cuts into finished product, and described horizontal stroke/vertical draw ratio is 2.5 ~ 2.8.Common PET biaxial tension multiple is all 3 at horizontal stroke/longitudinal direction, and PET biaxial tension multiple of the present invention all less than normal at horizontal stroke/longitudinal direction be 2.5 ~ 2.8, less draw ratio decreases the PET film ratio at later stage heat shrinkable.
High temperature resistant PET film prepared by described preparation method is for the preparation of flexible circuit board.
Flexible circuit board prepared by described high temperature resistant PET film, the Copper Foil positive and negative at die-cut good circuit is arranged with high temperature resistant PET film, is provided with thermosetting glue-line between described high temperature resistant PET film and Copper Foil, and described high temperature resistant PET film is by thermosetting glue-line and Copper Foil bonding.The present invention is structure symmetrical above and below, and thermosetting glue-line viscosity clings greatly high temperature resistant PET film under middle hot conditions on the one hand, reduces the trend of high temperature resistant PET film heat shrinkable, thus reducing high temperature resistant PET film to shrink the possibility tilted；On the one hand, thermosetting glue-line is polyester glue-line, and owing to polyester glue-line and PET film character are close, approximate one, thus reducing the high temperature resistant PET film ratio at later stage heat shrinkable；On the other hand, the symmetrical above and below of the present invention is provided with high temperature resistant PET film, during high temperature resistant PET film heat shrinkable, the high temperature resistant PET film heat shrinkable in front has pulling force upwards, the high temperature resistant PET film heat shrinkable of reverse side has downward pulling force, upper lower pulling force is cancelled out each other, thus reducing the probability that upper and lower high temperature resistant PET film bends in later stage thermal histories to certain one end.Additionally, this is anti-without this layer of ink, saves cost, and the present invention has been by one-step punching, therefore para-position is neat.
Described thermosetting glue-line is polyester glue-line.Described hot-setting adhesive layer thickness is 20 ~ 30 μm.Conventionally employed is PI film and epoxy glue, and due to the character of PI film and epoxy glue, the conventional flex circuits plate being prepared from can only store under cryogenic, and the life-span is short.And replace just overcoming this problem with high temperature resistant PET film and polyester glue-line.Preserve at normal temperatures.
The high temperature resistant PET film that a kind of scheme is described Copper Foil front is provided with the die-cut mouth corresponding with the circuit on Copper Foil.The program is single-sided flexible circuit board.
The high temperature resistant PET film that another kind of scheme is described Copper Foil reverse side is provided with the die-cut mouth corresponding with the circuit on Copper Foil.The program is single-sided flexible circuit board.
Another kind of scheme is be equipped with the die-cut mouth corresponding with the circuit on Copper Foil in the high temperature resistant PET film of described Copper Foil positive and negative.The program is double-faced flexible wiring board.
Compared with prior art, beneficial effects of the present invention is as follows:
(1) present invention process is simple；
(2) structure symmetrical above and below is adopted to reduce the probability that upper and lower high temperature resistant PET film bends in later stage thermal histories to certain one end；
(3) simple in construction, it is not necessary to this layer of ink, has saved cost, and the present invention is by one-step punching, therefore para-position is neat；
(4) replacing traditional PI film and epoxy glue with high temperature resistant PET film and polyester glue-line, described flexible circuit board can store at normal temperatures, and the life-span is long.
Accompanying drawing explanation
Fig. 1 is the structural representation of flexible circuit board；Wherein, 1, Copper Foil；2, thermosetting glue-line；3, high temperature resistant PET film；
Fig. 2 is the preparation flow figure of flexible circuit board.
Detailed description of the invention
Below in conjunction with Figure of description and specific embodiment the present invention made and elaborating further, but the present invention is not limited in any form by embodiment.
Embodiment 1
A kind of preparation method of high temperature resistant PET film, PET raw material through super-dry, melt extrude, carry out biaxial tension in length and breadth after slab, control thickness, last rolling cuts into finished product, and described horizontal stroke/vertical draw ratio is 2.5.
Flexible circuit board prepared by described high temperature resistant PET film, Copper Foil 1 positive and negative at die-cut good circuit is arranged with high temperature resistant PET film 3, is provided with thermosetting glue-line 2 between described high temperature resistant PET film 3 and Copper Foil 1, and described high temperature resistant PET film 3 is bonded by thermosetting glue-line 2 and Copper Foil 1.
Described thermosetting glue-line 2 is polyester glue-line.Described hot-setting adhesive layer thickness is 20 μm.
The high temperature resistant PET film 3 in described Copper Foil 1 front is provided with the die-cut mouth corresponding with the circuit on Copper Foil 1.
Embodiment 2
A kind of preparation method of high temperature resistant PET film, PET raw material through super-dry, melt extrude, carry out biaxial tension in length and breadth after slab, control thickness, last rolling cuts into finished product, and described horizontal stroke/vertical draw ratio is 2.6.
Flexible circuit board prepared by described high temperature resistant PET film, Copper Foil 1 positive and negative at die-cut good circuit is arranged with high temperature resistant PET film 3, is provided with thermosetting glue-line 2 between described high temperature resistant PET film 3 and Copper Foil 1, and described high temperature resistant PET film 3 is bonded by thermosetting glue-line 2 and Copper Foil 1.
Described thermosetting glue-line 2 is polyester glue-line.Described hot-setting adhesive layer thickness is 25 μm.
The high temperature resistant PET film 3 of described Copper Foil 1 reverse side is provided with the die-cut mouth corresponding with the circuit on Copper Foil 1.
Embodiment 3
A kind of preparation method of high temperature resistant PET film, PET raw material through super-dry, melt extrude, carry out biaxial tension in length and breadth after slab, control thickness, last rolling cuts into finished product, and described horizontal stroke/vertical draw ratio is 2.7.
Flexible circuit board prepared by described high temperature resistant PET film, Copper Foil 1 positive and negative at die-cut good circuit is arranged with high temperature resistant PET film 3, is provided with thermosetting glue-line 2 between described high temperature resistant PET film 3 and Copper Foil 1, and described high temperature resistant PET film 3 is bonded by thermosetting glue-line 2 and Copper Foil 1.
Described thermosetting glue-line 2 is polyester glue-line.Described hot-setting adhesive layer thickness is 28 μm.
The high temperature resistant PET film 3 of described Copper Foil 1 positive and negative is equipped with the die-cut mouth corresponding with the circuit on Copper Foil 1.
Embodiment 4
A kind of preparation method of high temperature resistant PET film, PET raw material through super-dry, melt extrude, carry out biaxial tension in length and breadth after slab, control thickness, last rolling cuts into finished product, and described horizontal stroke/vertical draw ratio is 2.8.
Flexible circuit board prepared by described high temperature resistant PET film, Copper Foil 1 positive and negative at die-cut good circuit is arranged with high temperature resistant PET film 3, is provided with thermosetting glue-line 2 between described high temperature resistant PET film 3 and Copper Foil 1, and described high temperature resistant PET film 3 is bonded by thermosetting glue-line 2 and Copper Foil 1.
Described thermosetting glue-line 2 is polyester glue-line.Described hot-setting adhesive layer thickness is 30 μm.
The high temperature resistant PET film 3 of described Copper Foil 1 positive and negative is equipped with the die-cut mouth corresponding with the circuit on Copper Foil 1.
The preparation method of flexible circuit board prepared by described high temperature resistant PET film, as in figure 2 it is shown, first prepare the high temperature resistant PET film in bottom, then glues thermosetting glue-line on a pet film, pastes thermosetting glue-line at the Copper Foil back side, then Copper Foil is cut, remove useless portion；Prepare the high temperature resistant PET film in top again, hold the excision mouth corresponding with Copper Foil successfully, then high temperature resistant for top PET film is pasted with thermosetting glue-line, by thermosetting glue-line copper foil front.
Claims (8)
1. a preparation method for high temperature resistant PET film, PET raw material through super-dry, melt extrude, carry out biaxial tension in length and breadth after slab, control thickness, last rolling cuts into finished product, it is characterised in that described horizontal stroke/vertical draw ratio is 2.5 ~ 2.8.
2. the high temperature resistant PET film that according to claim 1 prepared by preparation method is for the preparation of flexible circuit board.
3. the flexible circuit board that according to claim 2 prepared by high temperature resistant PET film, it is characterized in that, Copper Foil positive and negative at die-cut good circuit is arranged with high temperature resistant PET film, is provided with thermosetting glue-line between described high temperature resistant PET film and Copper Foil, and described high temperature resistant PET film is by thermosetting glue-line and Copper Foil bonding.
4. flexible circuit board according to claim 3, it is characterised in that described thermosetting glue-line is polyester glue-line.
5. flexible circuit board according to claim 3, it is characterised in that the high temperature resistant PET film in described Copper Foil front is provided with the die-cut mouth corresponding with the circuit on Copper Foil.
6. flexible circuit board according to claim 3, it is characterised in that the high temperature resistant PET film of described Copper Foil reverse side is provided with the die-cut mouth corresponding with the circuit on Copper Foil.
7. flexible circuit board according to claim 5, it is characterised in that also be provided with the die-cut mouth corresponding with the circuit on Copper Foil in the high temperature resistant PET film of described Copper Foil reverse side.
8. flexible circuit board according to claim 3, it is characterised in that described hot-setting adhesive layer thickness is 20 ~ 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410845020.9A CN105799148A (en) | 2014-12-31 | 2014-12-31 | Preparation method and application of high temperature resistant PET film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410845020.9A CN105799148A (en) | 2014-12-31 | 2014-12-31 | Preparation method and application of high temperature resistant PET film |
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| CN105799148A true CN105799148A (en) | 2016-07-27 |
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| CN201410845020.9A Pending CN105799148A (en) | 2014-12-31 | 2014-12-31 | Preparation method and application of high temperature resistant PET film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113492440A (en) * | 2021-06-28 | 2021-10-12 | 深圳市领滔科技有限公司 | Die cutting process for copper foil assembly and die cutting product production line |
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|---|---|---|---|---|
| CN2216318Y (en) * | 1994-11-24 | 1995-12-27 | 刘宝申 | Flexible polyester film coated copper foil plate and film-coated circuit board |
| CN101733925A (en) * | 2009-10-26 | 2010-06-16 | 申达集团有限公司 | Method for preparing polyester film for photovoltaic cell backplane |
| CN201629907U (en) * | 2010-01-27 | 2010-11-10 | 上海海优威电子技术有限公司 | Substrate of flexible circuit board |
| CN202121867U (en) * | 2011-06-17 | 2012-01-18 | 湖北友邦电子材料有限公司 | Double-sided copper clad laminate |
| CN202262031U (en) * | 2011-08-10 | 2012-05-30 | 田茂福 | Heat dissipation type led flexible circuit board |
| CN203340410U (en) * | 2013-07-11 | 2013-12-11 | 常州宇宙星电子制造有限公司 | Flexible circuit board |
| CN103978516A (en) * | 2014-05-05 | 2014-08-13 | 厦门弘信电子科技股份有限公司 | Through hole punching technology for rolled flexible circuit board |
-
2014
- 2014-12-31 CN CN201410845020.9A patent/CN105799148A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2216318Y (en) * | 1994-11-24 | 1995-12-27 | 刘宝申 | Flexible polyester film coated copper foil plate and film-coated circuit board |
| CN101733925A (en) * | 2009-10-26 | 2010-06-16 | 申达集团有限公司 | Method for preparing polyester film for photovoltaic cell backplane |
| CN201629907U (en) * | 2010-01-27 | 2010-11-10 | 上海海优威电子技术有限公司 | Substrate of flexible circuit board |
| CN202121867U (en) * | 2011-06-17 | 2012-01-18 | 湖北友邦电子材料有限公司 | Double-sided copper clad laminate |
| CN202262031U (en) * | 2011-08-10 | 2012-05-30 | 田茂福 | Heat dissipation type led flexible circuit board |
| CN203340410U (en) * | 2013-07-11 | 2013-12-11 | 常州宇宙星电子制造有限公司 | Flexible circuit board |
| CN103978516A (en) * | 2014-05-05 | 2014-08-13 | 厦门弘信电子科技股份有限公司 | Through hole punching technology for rolled flexible circuit board |
Non-Patent Citations (4)
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| 于丁: "聚酯薄膜", 《塑料》 * |
| 王文俊: "《实用塑料成型工艺》", 31 August 1999, 国防工业出版社 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113492440A (en) * | 2021-06-28 | 2021-10-12 | 深圳市领滔科技有限公司 | Die cutting process for copper foil assembly and die cutting product production line |
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Address after: 528325, Foshan Town, Shunde District, Guangdong Province Applicant after: Guangdong Lyle new materials Polytron Technologies Inc Address before: 528325, Foshan Town, Shunde District, Guangdong Province Applicant before: Leary Electrical Equipment Co., Ltd. |
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Application publication date: 20160727 |