CN86100670A - Copper foil adhesion agent for copper-foil-covering laminated paper plate - Google Patents
Copper foil adhesion agent for copper-foil-covering laminated paper plate Download PDFInfo
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- CN86100670A CN86100670A CN 86100670 CN86100670A CN86100670A CN 86100670 A CN86100670 A CN 86100670A CN 86100670 CN86100670 CN 86100670 CN 86100670 A CN86100670 A CN 86100670A CN 86100670 A CN86100670 A CN 86100670A
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- copper
- polyvinyl acetal
- copper foil
- acetal resin
- phenolic resin
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Abstract
A kind ofly be specially adapted to not have cloth papery copper-clad laminate, also be applicable to the cloth copper foil adhesion agent for copper-foil-covering laminated paper plate, it contains polyvinyl acetal resin and phenolic resin composition, it is characterized in that: wherein gone back admixture through the active silicon powder of handling of compound silane coupling agent.It is 100 that polyvinyl acetal resin and phenolic resin composition are converted to solids by weight, and the admixture mean particle size is 10～300 greater than 300 purpose active micro silicon powders.
The Copper Foil tackiness agent that utilizes proportioning components of the present invention to make makes the anti-immersed solder of no cloth papery copper-clad laminate that makes, stripping strength, and electrical property and resistance to chemical corrosion all are improved or improve and be easy to and use, and also can reduce cost.
Description
The invention belongs to technical field of adhesive, specific description is the modification of copper foil adhesion agent for copper-foil-covering laminated paper plate proportioning components.
In prior art, be used to make the Copper Foil tackiness agent that no cloth papery copper-clad laminate is used, adopt the formulated by a certain percentage constituent of polyvinyl acetal resin and resol mostly, its trade mark has Б Φ-4, JSF-4, X98-1 etc.In this resin composition tackiness agent, adopted polyvinyl butyral resin morely, so comparatively suitable to the manufacturing that the cloth copper-clad laminate is arranged, the anti-immersed solder of the product of making, stripping strength, electrical properties etc. are all comparatively excellent.But when being applied to not have cloth papery copper-clad laminate, the anti-immersed solder performance that will produce product reduces, and can glue the shortcomings such as paper fiber on the hypocoxa when peeling off Copper Foil.Present some patent documentation of approach that overcomes these shortcomings mentions it being admixture additive in the polyvinyl acetal resin phenolic resin composition.These patents are: the clear 55-49640 of Japan special permission, this patent is to mix mean particle size less than the aluminium hydroxide of 3u and Resins, epoxy etc. in resin combination.Behind the admixture, though the performance of tackiness agent is made moderate progress, cause staging life short, shortcomings such as cost height also bring inconvenience to use.
Japan clear 56-51191 of special permission and 57-57508, this binomial patent is to mix antimonous oxide or titanium dioxide in resin combination, though help the improvement of binder performance behind the admixture, can produce copper-clad laminate after etching, substrate covers the shortcoming that " turning white " appears in copper-clad surface.Very thin antimonous oxide and the titanium dioxide of granularity does not have special commercially available prod simultaneously, need be equipped with apparatus processing in addition and become fine particle, and this has brought inconvenience to use, and cost is also higher.
The above-mentioned shortcoming that exists at no cloth papery copper foil adhesion agent for copper-foil-covering laminated paper plate, and the approach that overcomes these shortcomings is to mix additive in polyvinyl acetal resin and phenolic resin composition.Purpose of the present invention, be to select a kind of ideal additive, be spiked in polyvinyl acetal resin and the phenolic resin composition, it is progressive to make no cloth papery copper foil adhesion agent for copper-foil-covering laminated paper plate produce essence, promptly adopt this tackiness agent can not influence the electrical property of product, and the immersed solder of the product that makes.Stripping strength all obviously improves, can etching not take place after, substrate covers the shortcoming that copper-clad surface " turns white ", and the Copper Foil long preservative period after the gluing.This additive should have the commercially available prod simultaneously, does not need to process separately levigate.Cheap.This Copper Foil tackiness agent also can be made the Copper Foil tackiness agent of cloth copper-clad laminate except that being specially adapted to not have the cloth papery copper-clad laminate in addition.
Copper foil adhesion agent for copper-foil-covering laminated paper plate provided by the present invention contains polyvinyl acetal resin and phenolic resin composition, also contains admixture in resin combination and through the active active micro silicon powder of handling of compound silane coupling agent.There is one deck compound silane coupling agent film on this active micro silicon powder surface, can play the interlinkage reaction with the active group of resin combination under certain condition.The composition of this copper foil adhesion agent for copper-foil-covering laminated paper plate and proportioning are by weight:
It is 100 that polyvinyl acetal resin and phenolic resin composition are converted to solid.
Active micro silicon powder 10～300.
The granularity of the active micro silicon powder of institute's admixture should be greater than 300 orders in the Copper Foil tackiness agent of the present invention.
The composition of contained polyvinyl acetal resin and phenolic resin composition and proportioning are converted to solids by weight and are in the Copper Foil tackiness agent of the present invention:
Polyvinyl acetal resin 1
Resol 0.5～4
Contained polyvinyl acetal resin is polyvinyl butyral resin or methylal resin in the Copper Foil tackiness agent of the present invention, can also use paracril replacing for polyvinyl alcohol Derlin, but the most handy polyvinyl acetal resin.
In addition, in the contained polyvinyl acetal resin and phenolic resin composition, also can suitably add Resins, epoxy in the Copper Foil tackiness agent of the present invention.
The best proportioning of contained each composition is by weight in the Copper Foil tackiness agent of the present invention:
It is 10 that polyvinyl acetal resin and phenolic resin composition are converted to solid.
600 order active micro silicon powders 6.5
Wherein, the proportioning of polyvinyl acetal resin and phenolic resin composition is converted to solids by weight and is:
Polyvinyl butyral resin 1
Heat-reactive phenolic resin 1.4
By most preferred embodiment of the present invention, can prepare copper foil adhesion agent for copper-foil-covering laminated paper plate with following routine method.
Take by weighing polyethylene powder butyral resin 45 gram, put into there-necked flask, add content greater than 95% ethanol 405 grams, and under 60～70 ℃ temperature, heating in water bath mixes to transparent fully 10% butyral ethanolic soln.
Take by weighing this solution 120 grams, take by weighing and liquid is converted to solid heat-reactive phenolic resin 16.8 gram by content pours in the there-necked flask together and mix, take by weighing 600 order active micro silicon powders, 18.72 grams again, join in the there-necked flask, under 20～40 ℃ of temperature, mix and promptly made copper foil adhesion agent for copper-foil-covering laminated paper plate in 30 minutes.
At the 305g/m that handles through surface coarsening
2The prepared Copper Foil tackiness agent of coating one deck on the Copper Foil, spread is 15～25g/m
2, put into 104～106 ℃ constant temperature convection oven 25 minutes then, just make the gluing Copper Foil.Get 2 on epoxy anti-flaming gumming paper, make gluing copper-clad surface gummed paper for one, another makes the bottom surface gummed paper.Between gluing copper-clad surface and bottom surface two gummed papers, 6 of overlapping placement flame-proof phenolic gum dipped papers are 100～110KGf/cm with the thermocompressor hot pressing pressure then
2, 160～170 ℃ of temperature, promptly can be made into nominal thickness and are 1.5 millimeters fire-retardant no cloth papery copper-clad laminate at 90 minutes heat-insulation pressure keeping time.This veneer sheet and be the no cloth papery copper-clad laminate that the Copper Foil tackiness agent is made with " JSF-4 " tackiness agent, as shown in the table by the determination of test method result of the SJ200-78 of Ministry of Electronics Industry standard code.
Except that the listed result of last table, the substrate surface quality of most preferred embodiment and electrical property are also all comparatively excellent, and after the etching, substrate covers copper-clad surface " turning white " phenomenon can not occur, and the staging life of gluing Copper Foil is also longer, and it is also comparatively convenient to use.Simultaneously, active micro silicon powder has the commercially available prod of professional plant produced, low price, can reduce the cost of copper foil adhesion agent for copper-foil-covering laminated paper plate and the cost of prepared copper-clad plate product, the copper foil adhesion agent for copper-foil-covering laminated paper plate that the present invention makes, be specially adapted to not have cloth papery copper-clad laminate, also be applicable to that the cloth copper-clad laminate is bonding as Copper Foil.
Claims (6)
1, a kind ofly is specially adapted to not have cloth papery copper-clad laminate, also is applicable to what the cloth copper-clad laminate was used, copper foil adhesion agent for copper-foil-covering laminated paper plate.It contains polyvinyl acetal resin and phenolic resin composition, the invention is characterized in: the active micro silicon powder of wherein having gone back admixture.The composition of this tackiness agent and proportioning are by weight:
It is 100 that polyvinyl acetal resin and phenolic resin composition are converted to solid.
Active micro silicon powder 10～300.
2, according to the described Copper Foil tackiness agent of claim 1, it is characterized in that: active micro silicon powder wherein is that its mean particle size is greater than 300 orders through the active silicon powder of handling of compound silane coupling agent.
3, according to claim 1 and 2 described Copper Foil tackiness agents, it is characterized in that: the polyvinyl acetal resin wherein and the composition of phenolic resin composition and proportioning are converted to solids by weight and are:
Polyvinyl acetal resin 1.
Resol 0.5～4.
4, according to the described Copper Foil tackiness agent of claim 3, it is characterized in that: polyvinyl acetal resin wherein is polyvinyl butyral resin or vinyl-formal resin.Can also use paracril replacing for polyvinyl alcohol Derlin, and the most handy polyvinyl acetal resin.
5, according to the described Copper Foil tackiness agent of claim 1, it is characterized in that: in therein the polyvinyl acetal resin and phenolic resin composition, also can add Resins, epoxy.
6,, it is characterized in that the best proportioning of above-mentioned each composition is by weight according to claim 1 and 4 described Copper Foil tackiness agents:
It is 10 that polyvinyl acetal resin and phenolic resin composition are converted to solid.
600 order active micro silicon powders 6.5.
Wherein, polyvinyl acetal resin and phenolic resin composition are converted to the solid proportioning and are by weight:
Polyvinyl butyral resin 1.
Heat-reactive phenolic resin 1.4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN198686100670A CN86100670B (en) | 1986-01-21 | 1986-01-21 | Copper foil adhesion agent for copper-foil-covering laminated paper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN198686100670A CN86100670B (en) | 1986-01-21 | 1986-01-21 | Copper foil adhesion agent for copper-foil-covering laminated paper plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN86100670A true CN86100670A (en) | 1987-01-31 |
| CN86100670B CN86100670B (en) | 1988-07-27 |
Family
ID=4801149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN198686100670A Expired CN86100670B (en) | 1986-01-21 | 1986-01-21 | Copper foil adhesion agent for copper-foil-covering laminated paper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN86100670B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102153970A (en) * | 2011-03-18 | 2011-08-17 | 江阴市明康绝缘玻纤有限公司 | Adhesive applied to preparing copper clad laminate copper foils and substrates |
| CN102732197A (en) * | 2011-04-12 | 2012-10-17 | 佛冈建滔实业有限公司 | Preparation process of adhesive suitable for adhesive coated copper foil |
| CN103756606A (en) * | 2013-12-24 | 2014-04-30 | 上海邦中高分子材料有限公司 | Water-resistant insulated adhesive resin and preparation method thereof |
| CN105400466A (en) * | 2015-12-01 | 2016-03-16 | 烟台柳鑫新材料科技有限公司 | Adhesive for cover plate and preparation method |
| CN106752979A (en) * | 2016-12-02 | 2017-05-31 | 陈佩珊 | A kind of adhesive with HXNBR rubber |
| CN108977144A (en) * | 2015-12-17 | 2018-12-11 | 福建利豪电子科技股份有限公司 | A kind of copper foil glue manufacturing method for slim paper-based copper-coated board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100897079B1 (en) * | 2001-09-21 | 2009-05-14 | 세키스이가가쿠 고교가부시키가이샤 | Modified Polyvinyl Acetal Resin |
-
1986
- 1986-01-21 CN CN198686100670A patent/CN86100670B/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102153970A (en) * | 2011-03-18 | 2011-08-17 | 江阴市明康绝缘玻纤有限公司 | Adhesive applied to preparing copper clad laminate copper foils and substrates |
| CN102732197A (en) * | 2011-04-12 | 2012-10-17 | 佛冈建滔实业有限公司 | Preparation process of adhesive suitable for adhesive coated copper foil |
| CN103756606A (en) * | 2013-12-24 | 2014-04-30 | 上海邦中高分子材料有限公司 | Water-resistant insulated adhesive resin and preparation method thereof |
| CN105400466A (en) * | 2015-12-01 | 2016-03-16 | 烟台柳鑫新材料科技有限公司 | Adhesive for cover plate and preparation method |
| CN105400466B (en) * | 2015-12-01 | 2018-07-24 | 烟台柳鑫新材料科技有限公司 | A kind of cover board adhesive and preparation method |
| CN108977144A (en) * | 2015-12-17 | 2018-12-11 | 福建利豪电子科技股份有限公司 | A kind of copper foil glue manufacturing method for slim paper-based copper-coated board |
| CN109082252A (en) * | 2015-12-17 | 2018-12-25 | 福建利豪电子科技股份有限公司 | A kind of high-peeling strength paper-based copper-coated board copper foil glue |
| CN108977144B (en) * | 2015-12-17 | 2021-01-08 | 福建利豪电子科技股份有限公司 | Method for manufacturing copper foil adhesive for thin paper-based copper-clad plate |
| CN106752979A (en) * | 2016-12-02 | 2017-05-31 | 陈佩珊 | A kind of adhesive with HXNBR rubber |
Also Published As
| Publication number | Publication date |
|---|---|
| CN86100670B (en) | 1988-07-27 |
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