JPS5783535A - Preparation of laminate - Google Patents
Preparation of laminateInfo
- Publication number
- JPS5783535A JPS5783535A JP15975380A JP15975380A JPS5783535A JP S5783535 A JPS5783535 A JP S5783535A JP 15975380 A JP15975380 A JP 15975380A JP 15975380 A JP15975380 A JP 15975380A JP S5783535 A JPS5783535 A JP S5783535A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resultant
- base material
- amount
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: To obtain a laminate useful for a copper-clad laminate used as a printed wiring without using a solvent, by impregnating or coating a base material material with a solventless varnish composition consisting of a polyhydric alcohol, epoxy resin, curing agent, etc., and heating and pressing the resultant impregnated or coated material.
CONSTITUTION: An epoxy resin containing two or more epoxy groups in one molecule and a polyhydric phenol having two or more phenolic hydroxyl groups in one molecule are dissolved at a temperature of insufficient reaction under heating, and a curing agent in an amount corresponding to the difference in equivalents of the epoxy resin and the polyhydric phenol, a catalyst for the etherifying reaction of the phenolic hydroxyl groups with the epoxy groups in an amount of 0.001W1wt% based on the epoxy resin and a curing accelerator preferably in an amount of 0.01W5wt% based on the total amount of the epoxy resin and the polyhydric phenol are dissolved in the resultant solution under heating to form a solventless varnish composition. A base material is then impregnated with the resultant varnish composition and heated to give a preperg of the stage B. Plural sheets of the resultant prepregs are then placed on top of each other and hot-pressed, or the composition is applied to the base material and hot- pressed to give the aimed laminate.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15975380A JPS6039288B2 (en) | 1980-11-12 | 1980-11-12 | Method of manufacturing laminates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15975380A JPS6039288B2 (en) | 1980-11-12 | 1980-11-12 | Method of manufacturing laminates |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5783535A true JPS5783535A (en) | 1982-05-25 |
JPS6039288B2 JPS6039288B2 (en) | 1985-09-05 |
Family
ID=15700502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15975380A Expired JPS6039288B2 (en) | 1980-11-12 | 1980-11-12 | Method of manufacturing laminates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6039288B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61501212A (en) * | 1984-07-17 | 1986-06-19 | ザ ダウ ケミカル カンパニ− | Manufacturing method of partially advanced epoxy resin |
WO1992017532A1 (en) * | 1991-03-28 | 1992-10-15 | Hüls Troisdorf Aktiengesellschaft | Process for manufacturing prepregs containing solvent-free epoxy resin |
JPH1036639A (en) * | 1996-07-29 | 1998-02-10 | Matsushita Electric Works Ltd | Epoxy resin composition for laminate |
-
1980
- 1980-11-12 JP JP15975380A patent/JPS6039288B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61501212A (en) * | 1984-07-17 | 1986-06-19 | ザ ダウ ケミカル カンパニ− | Manufacturing method of partially advanced epoxy resin |
JPS632967B2 (en) * | 1984-07-17 | 1988-01-21 | Dow Chemical Co | |
WO1992017532A1 (en) * | 1991-03-28 | 1992-10-15 | Hüls Troisdorf Aktiengesellschaft | Process for manufacturing prepregs containing solvent-free epoxy resin |
JPH1036639A (en) * | 1996-07-29 | 1998-02-10 | Matsushita Electric Works Ltd | Epoxy resin composition for laminate |
Also Published As
Publication number | Publication date |
---|---|
JPS6039288B2 (en) | 1985-09-05 |
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