CN102153970A - Adhesive applied to preparing copper clad laminate copper foils and substrates - Google Patents
Adhesive applied to preparing copper clad laminate copper foils and substrates Download PDFInfo
- Publication number
- CN102153970A CN102153970A CN 201110066245 CN201110066245A CN102153970A CN 102153970 A CN102153970 A CN 102153970A CN 201110066245 CN201110066245 CN 201110066245 CN 201110066245 A CN201110066245 A CN 201110066245A CN 102153970 A CN102153970 A CN 102153970A
- Authority
- CN
- China
- Prior art keywords
- clad laminate
- copper
- copper clad
- paper
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to an adhesive applied to preparing copper clad laminate copper foils and substrates. The adhesive consists of the following raw materials by mass percent: 55-65% of polyvinyl butyral and 35-45% of phenolic resin. The adhesive is mainly applied to paper-base copper clad foil laminates and can be used for improving the bonding strength and dip soldering endurance of paper-base copper clad foil laminates and paper bases. In a normal state, the peel strength can reach over 1.3N/mm, and the dip soldering endurance can reach the extent of no layering or bubbling for 20s in a tin infusion vat at 260 DEG C.
Description
Technical field
The present invention relates to a kind of tackiness agent, especially relate to a kind of tackiness agent that is applied to prepare copper-clad laminate Copper Foil and substrate.
Background technology
Before the present invention makes, generally adopted polyvinyl alcohol butyral, resol (doing catalyst), silicon rubber as the tackiness agent for preparing copper-clad laminate with ammoniacal liquor in the past.Copper Foil and the cohesive strength of paper substrate and the poor-performing of anti-immersed solder behind the employing tackiness agent.Can only reach 8 ~ 10N/mm under the stripping strength normality.Anti-immersed solder reaches only and keeps 5 ~ 10 to bubble with regard to layering in 260 ℃ molten tin cylinder.(this Copper Foil binding agent and be difficult to deposit in summer because after this Copper Foil binding agent uses silicon rubber, when summer such as condition of storage temperature are higher, just stick together easily, is given and is produced and storage brings certain difficulty.）。
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, a kind of Copper Foil and the cohesive strength of paper substrate and tackiness agent that is applied to prepare copper-clad laminate Copper Foil and substrate of anti-immersed solder performance that can improve the paper substrate copper-clad laminate is provided.
The object of the present invention is achieved like this: a kind of tackiness agent that is applied to prepare copper-clad laminate Copper Foil and substrate, described tackiness agent are that the raw material of following mass percent is formed:
Polyvinyl butyral acetal 55% ~ 65%
Ba phenolic resin 35% ~ 45%.
Tackiness agent of the present invention is mainly used in the paper substrate copper-clad laminate, adopts the present invention can improve the cohesive strength and the anti-immersed solder performance of paper substrate copper-clad laminate Copper Foil and paper substrate.Can reach more than the 1.3N/mm under the stripping strength normality.Anti-immersed solder can reach in 260 ℃ molten tin cylinder keep 20 seconds not stratified non-foaming.
Polyvinyl butyral resin, nontoxic, odorless, non-corrosiveness, have the good transparency, good insulation performance, shock resistance and tensile property, the anti-intensity height that rises, cementability is good, good springiness, can act on fat by inorganic acid resistance, also have excellent comprehensive performances such as fast light, cold-resistant, ageing-resistant.
Hydroxyl in the polyvinyl butyral acetal, vinyl acetate base and butyraldehyde base, has very high adhesiveproperties, in polyvinyl butyral acetal, add resol, make tackiness agent, to metal, timber, leather, glass, fiber, pottery, very strong cementability is arranged, the used affine performance of tung oil modified phenolic resin of water-soluble ba phenolic resin and paper-based copper-coated board is good, and has very high thermotolerance, with formed good binding agent after two kinds of material mixing of polyvinyl butyral acetal become binding agent, make the advantage of two kinds of materials obtain giving full play to, thereby this binding agent use as the binding agent of Copper Foil, is greatly improved the stripping strength of paper-based copper-coated board and anti-immersed solder performance in the phenolic aldehyde paper-based copper-coated board.
Embodiment
The present invention is applied to prepare the tackiness agent of copper-clad laminate Copper Foil and substrate, and described tackiness agent is that the raw material of following mass percent is formed: polyvinyl butyral acetal 60%, ba phenolic resin 40%.
Claims (1)
1. tackiness agent that is applied to prepare copper-clad laminate Copper Foil and substrate is characterized in that described tackiness agent is that the raw material of following mass percent is formed:
Polyvinyl butyral acetal 55% ~ 65%
Ba phenolic resin 35% ~ 45%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110066245 CN102153970A (en) | 2011-03-18 | 2011-03-18 | Adhesive applied to preparing copper clad laminate copper foils and substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110066245 CN102153970A (en) | 2011-03-18 | 2011-03-18 | Adhesive applied to preparing copper clad laminate copper foils and substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102153970A true CN102153970A (en) | 2011-08-17 |
Family
ID=44435654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110066245 Pending CN102153970A (en) | 2011-03-18 | 2011-03-18 | Adhesive applied to preparing copper clad laminate copper foils and substrates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102153970A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109082252A (en) * | 2015-12-17 | 2018-12-25 | 福建利豪电子科技股份有限公司 | A kind of high-peeling strength paper-based copper-coated board copper foil glue |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86100670A (en) * | 1986-01-21 | 1987-01-31 | 湖州绝缘材料厂 | Copper foil adhesion agent for copper-foil-covering laminated paper plate |
| JPS62132986A (en) * | 1985-12-04 | 1987-06-16 | Matsushita Electric Works Ltd | Adhesive for metal-clad laminated sheet |
| JPS62241983A (en) * | 1986-04-14 | 1987-10-22 | Toshiba Chem Corp | Adhesive for copper foil |
-
2011
- 2011-03-18 CN CN 201110066245 patent/CN102153970A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62132986A (en) * | 1985-12-04 | 1987-06-16 | Matsushita Electric Works Ltd | Adhesive for metal-clad laminated sheet |
| CN86100670A (en) * | 1986-01-21 | 1987-01-31 | 湖州绝缘材料厂 | Copper foil adhesion agent for copper-foil-covering laminated paper plate |
| JPS62241983A (en) * | 1986-04-14 | 1987-10-22 | Toshiba Chem Corp | Adhesive for copper foil |
Non-Patent Citations (2)
| Title |
|---|
| 《中国胶粘剂》 19930302 刘立柱等 覆铜箔层压板用新型铜箔胶粘剂配方的研究 16-19,58,62 1 第2卷, 第1期 * |
| 《木材胶黏剂》 20090131 李和平 酚醛树脂胶黏剂 化学工业出版社 第299-300页 1 , * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109082252A (en) * | 2015-12-17 | 2018-12-25 | 福建利豪电子科技股份有限公司 | A kind of high-peeling strength paper-based copper-coated board copper foil glue |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103722807B (en) | High pressure aluminum-based copper-clad plate of a kind of high heat conduction and preparation method thereof | |
| CN102408672B (en) | Production method for cardanol modified phenolic resin | |
| CN102977818A (en) | Water-based aluminium foil adhesive for cigarette packing and preparation method thereof | |
| CN104175702A (en) | Special base board for drilling thick copper foil board and preparation method of special base board for drilling thick copper foil board | |
| CN103213356B (en) | Preparation method of bisphenol A modified paper-base glass cloth copper-clad foil single-sided copper-clad plate | |
| CN103666307B (en) | A kind of Acid-resistant protection film rubber belt | |
| CN104629597B (en) | Coated aluminum sheet cover plate for PCB drilling and manufacturing method thereof | |
| CN102153970A (en) | Adhesive applied to preparing copper clad laminate copper foils and substrates | |
| CN104452482A (en) | Preparation method of high-intensity waterproof-type corrugated paper board | |
| CN102775734A (en) | Halogen-free resin composition and prepreg prepared by using same | |
| CN106893241A (en) | A kind of polyvinyl acetal resin composition and resin coated copper foil | |
| CN205800386U (en) | A kind of high stability paper-based copper-coated board | |
| CN103129090B (en) | The preparation method of a kind of glass-film base copper-clad plate and prepared copper-clad plate thereof | |
| CN103820060A (en) | Water-based OPP (o-phenylphenol) composite adhesive for tobacco bale and its preparation method | |
| TW200930759A (en) | Resin composition and the application thereof | |
| CN102199264A (en) | Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive | |
| CN103978768A (en) | Preparation method for bisphenol A modified phenolic paper-based single-side copper-clad plate | |
| CN102040801B (en) | Epoxy resin composition as well as film and substrate | |
| CN101597466B (en) | Bonding sheet of rigid-flex combined board and method for manufacturing same | |
| CN203368904U (en) | Multi-layer PCB plate structure | |
| KR102522754B1 (en) | Printed circuit board and its manufacturing method | |
| CN203267351U (en) | Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate | |
| CN204109101U (en) | A kind of plank pierces through the glued board that fiber is chopped in mouthful hole off | |
| CN203901854U (en) | 3D metal-based copper clad laminate | |
| WO2021007814A1 (en) | Adhesive piece, preparation method thereof, and copper-clad laminate using the adhesive piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110817 |