CN104175702A - Special base board for drilling thick copper foil board and preparation method of special base board for drilling thick copper foil board - Google Patents
Special base board for drilling thick copper foil board and preparation method of special base board for drilling thick copper foil board Download PDFInfo
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- CN104175702A CN104175702A CN201410416732.9A CN201410416732A CN104175702A CN 104175702 A CN104175702 A CN 104175702A CN 201410416732 A CN201410416732 A CN 201410416732A CN 104175702 A CN104175702 A CN 104175702A
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- copper foil
- thick copper
- backing plate
- board
- resin
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Abstract
The invention discloses a special base board for drilling a thick copper foil board and a preparation method of the special base board for drilling the thick copper foil board. Binding resin and an adjuvant of which the mass fraction is 0-5% are stirred evenly, and a reinforcing material is coated with the mixed binding resin and adjuvant in a roller painting manner, so as to prepare the special base board for drilling the thick copper foil board, wherein the surface layer of the base board is a binding resin layer, and the bottom layer of the base board is a reinforcing material layer. The special base board for drilling the thick copper foil board, disclosed by the invention, can be tightly combined with the thick copper foil board to be drilled, so that the thick copper foil board is prevented from generating burrs, and the problem that plenty of burrs are generated when a conventional base board is drilled is avoided. The later tinning and copper plating process of the prepared thick copper foil board is prevented from being affected by the burrs, a prepared circuit board is high in circuit signal transmission speed, small in energy loss and good in conductivity, and the special base board has the good industrial production value and application prospect.
Description
Technical field
The present invention relates to PCB processing preparation field, relate in particular to a kind of thick copper foil plate boring special backing plate and preparation method thereof.
Background technology
Thick copper foil plate is as the baseplate material in printed circuit board manufacture, be widely used in electron trade, it mainly plays interconnection, insulation and support to printed circuit board, the transmission speed of signal in circuit, energy loss and characteristic impedance etc. are had a great impact, therefore, the processability in the performance of printed circuit board, quality, manufacture, manufacture level, manufacturing cost and long-term reliability and stability depend on zinc-plated, copper facing technology to a great extent.And easily there is buckling deformation in thick copper foil plate itself, during boring because traditional phenolic aldehyde, epoxy backing plate rigidity are large, can not combine closely with it, this just very easily causes between thick copper foil plate and backing plate local gapped, thereby a large amount of burrs appear in bottom while causing the boring of thick copper foil plate, have a strong impact on the quality of the PROCESS FOR TREATMENT such as zinc-plated, copper facing of its later stage.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of thick copper foil plate boring special backing plate and preparation method thereof and using method, while being intended to solve current thick copper foil plate boring, there is burr, affect the problem of post-production quality.
Technical scheme of the present invention is as follows:
A preparation method for thick copper foil plate boring special backing plate, wherein, described preparation method comprises the following steps:
After the auxiliary agent of binding resin and 0-5% mass fraction is stirred, its roller is applied on reinforcing material, making top layer is binding resin layer, the thick copper foil plate boring special backing plate that bottom is layers of reinforcement.
The preparation method of described thick copper foil plate boring special backing plate, wherein, described binding resin is phenoxy resin, ketone resin, polyvinyl alcohol resin or acroleic acid resin.
The preparation method of described thick copper foil plate boring special backing plate, wherein, described reinforcing material is fibrous paper or aluminium foil.
The preparation method of described thick copper foil plate boring special backing plate, wherein, when described binding resin is phenoxy resin, described auxiliary agent is amines catalyst, its consumption accounts for the 0.5--5% mass fraction of phenoxy resin; When described binding resin is ketone resin, described auxiliary agent is sodium sulfonate; When described binding resin is polyvinyl alcohol resin, described auxiliary agent is triethylamine, and its consumption accounts for the 0.1--2% mass fraction of polyvinyl alcohol resin; When described binding resin is acrylic resin, described auxiliary agent is tackifier.
In addition, the present invention also provides a kind of thick copper foil plate boring special backing plate of being made by above-mentioned preparation method.
Described thick copper foil plate boring special backing plate, wherein, the binding resin layer thickness of described backing plate is 5-10um, preferably, the binding resin layer thickness of described backing plate is 8 um.
Described thick copper foil plate boring special backing plate, wherein, the reinforcing material layer thickness of described backing plate is 0.15mm-0.25mm, preferably, the reinforcing material layer thickness of described backing plate is 0.20mm.
The using method that the present invention also provides described thick copper foil plate to hole special backing plate, wherein, described method is:
A, thick copper foil plate boring special backing plate is affixed on PCB substrate, with rubber roll roll-in 3-5 time, compacting;
B, the PCB substrate that posts thick copper foil plate boring special backing plate is positioned in baking box, under the condition of 100-140 ℃, toasts 10-30min.
Beneficial effect: the invention provides a kind of thick Copper Foil boring special backing plate and preparation method thereof, the thick Copper Foil boring special backing plate of preparing can with wait that boring thick copper foil plate combines closely, thereby the burr that should appear at the thick copper foil plate back side during by boring has been transferred to the back side of backing plate, stop the generation of thick copper foil plate burr, while having avoided conventional backing plate to hole, produced a large amount of problems that produce burrs.Make prepared thick zinc-plated copper-plating technique of copper foil plate later stage not affected by burr, produce the circuit board that circuit signal transmission speed is fast, energy loss is little, electric conductivity is good, there is good industrial production and be worth and application prospect.
Accompanying drawing explanation
Fig. 1 is the structural representation of thick Copper Foil boring special backing plate in specific embodiment in the present invention.
The specific embodiment
The invention provides a kind of thick Copper Foil boring special backing plate and preparation method thereof, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
A kind of preparation method of thick copper foil plate boring special backing plate, wherein, described preparation method comprises the following steps: after the auxiliary agent of binding resin and 0-5% mass fraction is stirred, its roller is applied on reinforcing material, making top layer is binding resin layer, the thick copper foil plate boring special backing plate that bottom is layers of reinforcement.
Further, the preparation method of described thick copper foil plate boring special backing plate, wherein, described binding resin is phenoxy resin, ketone resin, polyvinyl alcohol resin or acroleic acid resin.
The auxiliary agent of the binding resin described in the present invention and 0-5% mass fraction can form the binding resin layer with certain caking property and flexibility after stirring combination, in the time of holing to thick copper foil plate, impulse force has certain resiliency, reduces the phenomenon that causes burr to produce because rigidity is excessive.
Further, the preparation method of described thick copper foil plate boring special backing plate, wherein, described reinforcing material is fibrous paper or aluminium foil.
Reinforcing material described in the present invention is the material of strengthening made backing plate mechanical property or other performance, and the enhancement effect of reinforcing material depends on itself and the compatibility that is enhanced material.In the present invention, adopt fibrous paper or aluminium foil as reinforcing material, can combine closely with binding resin layer of the present invention, compatibility is good, make the resistance to punching press of prepared thick copper foil plate boring special backing plate, be difficult for deformation, energy and thick copper foil plate fit tightly, thus the generation of back side burr while effectively suppressing thick copper foil plate machine drilling.
The preparation method of described thick copper foil plate boring special backing plate, wherein, when described binding resin is phenoxy resin, described auxiliary agent is amines catalyst, its consumption accounts for the 0.5--5% mass fraction of phenoxy resin; When described binding resin is ketone resin, described auxiliary agent is sodium sulfonate; When described binding resin is polyvinyl alcohol resin, described auxiliary agent is triethylamine, and its consumption accounts for the 0.1--2% mass fraction of polyvinyl alcohol resin; When described binding resin is acrylic resin, described auxiliary agent is tackifier.
In the present invention, phenoxy resin has good caking property and flexibility with the amines catalyst that accounts for its 0.5--5% mass fraction in conjunction with the binding resin layer forming, can combine closely with layers of reinforcement of the present invention, formation can effectively suppress the thick copper foil plate boring special backing plate that burr produces.
Further, described amines catalyst is ethylenediamine or the triethanolamine that accounts for phenoxy resin 2.5% mass fraction.
In preferred embodiment, described binding resin layer also can be combined into by ketone resin and sodium sulfonate.
Further, described sodium sulfonate accounts for ketone resin 0.5% mass fraction.
Further, described ketone resin is cyclohexanone-furfural resin.
In preferred embodiment, described binding resin layer also can be combined into by polyvinyl alcohol resin and the triethylamine that accounts for its 0.1--2% mass fraction.
Further, described triethylamine accounts for the mass fraction of polyvinyl alcohol resin 1%.
In preferred embodiment, described binding resin layer also can be combined into by acrylic resin and binding agent.
Further, described binding agent accounts for acrylic resin 2% mass fraction.
Further, described acrylic resin is methyl methacrylate, and described binding agent is poly-amino resin.
Preferably, in the present invention, binding agent used is polyurethane formic acid esters, adopts polyurethane formic acid esters as the binding agent in the present invention, has height adhesion, mar proof and chemical resistance.
In addition, as shown in Figure 1, the present invention also provides a kind of thick copper foil plate boring special backing plate of being made by above-mentioned preparation method.Wherein, described backing plate comprises layers of reinforcement 20 and the binding resin layer 10 for contacting with PCB substrate surface that is arranged on described layers of reinforcement 20 surfaces.
The binding resin layer on thick Copper Foil boring of the present invention special backing plate top layer has certain flexibility, and backing plate can be fitted tightly with the thick copper foil plate of distortion or warpage, thus the generation of back side burr while effectively suppressing thick copper foil plate machine drilling.And increase material layer, there is certain strength structure, can effectively support binding resin layer, make prepared thick Copper Foil boring special backing plate there is certain intensity.
In preferred embodiment, described layers of reinforcement is wooden pricker ply of paper or aluminium foil layer, and described binding resin layer is thermoset resin layer or pressure-sensitive resin bed.Specifically thermosetting resin or pressure-sensitive resin roll are applied on layers of reinforcement wood pricker paper or aluminium foil and form; During boring, utilize the cohesive force of top layer binding resin layer and the strength structure of layers of reinforcement that backing plate and thick copper foil plate are combined closely, thereby play the effect that prevents that burr from producing.
Described thick copper foil plate boring special backing plate, wherein, the binding resin layer thickness of described backing plate is 5-10um.
Described thick copper foil plate boring special backing plate, wherein, the reinforcing material layer thickness of described backing plate is 0.15mm-0.25mm.
Preferably, described layers of reinforcement is 0.2mm, and the layers of reinforcement of this thickness can guarantee to have again suitable flexibility when backing plate has suitable intensity, meets the requirement on the thick copper foil plate surface of fitting completely.
Preferably, described binding resin layer thickness is preferably 8 μ m, and the too thick meeting of binding resin layer causes the undercapacity of backing plate, produces burr and creep in resin bed during boring, cannot effectively reduce the generation of burr; The too thin meeting of binding resin layer causes the pliability of backing plate not enough, and impulse force during boring easily makes thick copper foil plate generation separated with backing plate space, causes burr to produce.And the cohesive force that the binding resin layer that thickness is 8 μ m provides can guarantee fitting tightly of thick copper foil plate and backing plate.
When actual use procedure, backing plate is attached to the back side of thick copper foil plate with the one side of binding resin layer, with roll shaft roll-in 3-5 time, upper machine drill hole after placement 5min, after boring finishes tears backing plate.
Further, the using method that the present invention also provides described thick copper foil plate to hole special backing plate, wherein, described method is:
First thick copper foil plate boring special backing plate is affixed on PCB substrate, with rubber roll roll-in 3-5 time, compacting;
Again the PCB substrate that posts thick copper foil plate boring special backing plate is positioned in baking box, under the condition of 100-140 ℃, toasts 10-30min, can be used for boring.
Thick copper foil plate boring special backing plate of the present invention can with wait that boring thick copper foil plate combines closely, thereby the burr that should appear at the thick copper foil plate back side during by boring has been transferred to the back side of backing plate, stop the generation of thick copper foil plate burr, while having avoided conventional backing plate to hole, produced a large amount of problems that produce burrs.Make prepared thick zinc-plated copper-plating technique of copper foil plate later stage not affected by burr, produce the circuit board that circuit signal transmission speed is fast, energy loss is little, electric conductivity is good.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection domain of claims of the present invention.
Claims (7)
1. a preparation method for thick copper foil plate boring special backing plate, is characterized in that, described preparation method comprises the following steps:
After the auxiliary agent of binding resin and 0-5% mass fraction is stirred, its roller is applied on reinforcing material, making top layer is binding resin layer, the thick copper foil plate boring special backing plate that bottom is layers of reinforcement.
2. the preparation method of thick copper foil plate boring special backing plate according to claim 1, is characterized in that, described binding resin is phenoxy resin, ketone resin, polyvinyl alcohol resin or acroleic acid resin.
3. the preparation method of thick copper foil plate boring special backing plate according to claim 1, is characterized in that, described reinforcing material is fibrous paper or aluminium foil.
4. the preparation method of thick copper foil plate boring special backing plate according to claim 2, is characterized in that, when described binding resin is phenoxy resin, described auxiliary agent is amines catalyst, and its consumption accounts for the 0.5--5% mass fraction of phenoxy resin; When described binding resin is ketone resin, described auxiliary agent is sodium sulfonate; When described binding resin is polyvinyl alcohol resin, described auxiliary agent is triethylamine, and its consumption accounts for the 0.1--2% mass fraction of polyvinyl alcohol resin; When described binding resin is acrylic resin, described auxiliary agent is tackifier.
5. a thick copper foil plate boring special backing plate, is characterized in that, described backing plate adopts the method as described in claim 1-4 any one to prepare.
6. according to the thick copper foil plate boring special backing plate described in claim 5, it is characterized in that, the binding resin layer thickness of described backing plate is 5-10um.
7. according to the thick copper foil plate boring special backing plate described in claim 6, it is characterized in that, the reinforcing material layer thickness of described backing plate is 0.15mm-0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410416732.9A CN104175702B (en) | 2014-08-22 | 2014-08-22 | A kind of thick copper foil plate boring special backing plate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410416732.9A CN104175702B (en) | 2014-08-22 | 2014-08-22 | A kind of thick copper foil plate boring special backing plate and preparation method thereof |
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| CN104175702A true CN104175702A (en) | 2014-12-03 |
| CN104175702B CN104175702B (en) | 2016-08-17 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357884A (en) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | Method for forming slot in PCB (Printed Circuit Board) and manufacturing method of PCB |
| CN105538387A (en) * | 2016-01-21 | 2016-05-04 | 烟台柳鑫新材料科技有限公司 | Cover plate for PCB drilling |
| CN105729557A (en) * | 2016-03-14 | 2016-07-06 | 深圳市柳鑫实业股份有限公司 | Method for improving PCB drilling burrs |
| CN106879177A (en) * | 2017-03-01 | 2017-06-20 | 深圳市柳鑫实业股份有限公司 | A kind of method of suppression PCB drillings burr |
| CN107309941A (en) * | 2017-07-13 | 2017-11-03 | 深圳市志凌伟业技术股份有限公司 | The hole slot processing method of plastic casing |
| CN112261792A (en) * | 2020-11-03 | 2021-01-22 | 生益电子股份有限公司 | PCB manufacturing method for improving drilling burrs and PCB |
| CN114773980A (en) * | 2022-04-28 | 2022-07-22 | 扬宣电子(清远)有限公司 | PCB (printed circuit board) coated aluminum substrate and preparation method thereof |
| CN115339205A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Deformation base plate and preparation method thereof |
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| CN201768939U (en) * | 2009-11-11 | 2011-03-23 | 深圳市柳鑫实业有限公司 | Resin-coated fiberboard used in drilling process of printed circuit board |
| CN103008729A (en) * | 2011-09-27 | 2013-04-03 | 合正科技股份有限公司 | Drilling auxiliary board for printed circuit board |
| CN103935079A (en) * | 2014-04-22 | 2014-07-23 | 烟台柳鑫新材料科技有限公司 | Coated aluminum substrate for drilling PCB (Printed Circuit Board) and preparation method of coated aluminum substrate |
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| CN201768939U (en) * | 2009-11-11 | 2011-03-23 | 深圳市柳鑫实业有限公司 | Resin-coated fiberboard used in drilling process of printed circuit board |
| CN103008729A (en) * | 2011-09-27 | 2013-04-03 | 合正科技股份有限公司 | Drilling auxiliary board for printed circuit board |
| CN103935079A (en) * | 2014-04-22 | 2014-07-23 | 烟台柳鑫新材料科技有限公司 | Coated aluminum substrate for drilling PCB (Printed Circuit Board) and preparation method of coated aluminum substrate |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357884A (en) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | Method for forming slot in PCB (Printed Circuit Board) and manufacturing method of PCB |
| CN105538387A (en) * | 2016-01-21 | 2016-05-04 | 烟台柳鑫新材料科技有限公司 | Cover plate for PCB drilling |
| CN105729557A (en) * | 2016-03-14 | 2016-07-06 | 深圳市柳鑫实业股份有限公司 | Method for improving PCB drilling burrs |
| CN105729557B (en) * | 2016-03-14 | 2018-08-24 | 深圳市柳鑫实业股份有限公司 | A method of improving PCB drilling burrs |
| CN106879177A (en) * | 2017-03-01 | 2017-06-20 | 深圳市柳鑫实业股份有限公司 | A kind of method of suppression PCB drillings burr |
| CN107309941A (en) * | 2017-07-13 | 2017-11-03 | 深圳市志凌伟业技术股份有限公司 | The hole slot processing method of plastic casing |
| CN112261792A (en) * | 2020-11-03 | 2021-01-22 | 生益电子股份有限公司 | PCB manufacturing method for improving drilling burrs and PCB |
| CN112261792B (en) * | 2020-11-03 | 2022-02-08 | 生益电子股份有限公司 | PCB manufacturing method for improving drilling burrs and PCB |
| CN115339205A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Deformation base plate and preparation method thereof |
| CN115339205B (en) * | 2021-12-06 | 2024-03-15 | 深圳市柳鑫实业股份有限公司 | Deformation backing plate and preparation method thereof |
| CN114773980A (en) * | 2022-04-28 | 2022-07-22 | 扬宣电子(清远)有限公司 | PCB (printed circuit board) coated aluminum substrate and preparation method thereof |
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| CN104175702B (en) | 2016-08-17 |
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Address after: 265300 Economic Development Zone, Fushan District, Yantai City, Shandong Province Patentee after: Yantai Liuxin New Material Technology Co.,Ltd. Address before: 265300 Zhongqiao Economic Development Zone, Qixia City, Yantai City, Shandong Province Patentee before: Yantai Liuxin New Material Technology Co.,Ltd. |