CN205800386U - A kind of high stability paper-based copper-coated board - Google Patents
A kind of high stability paper-based copper-coated board Download PDFInfo
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- CN205800386U CN205800386U CN201620736225.8U CN201620736225U CN205800386U CN 205800386 U CN205800386 U CN 205800386U CN 201620736225 U CN201620736225 U CN 201620736225U CN 205800386 U CN205800386 U CN 205800386U
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- paper
- prepreg
- varnish
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Abstract
This utility model relates to copper-clad plate technology, particularly to a kind of high stability paper-based copper-coated board.This kind of high stability paper-based copper-coated board, strengthen prepreg including internal layer varnish(ed) paper, outer layer varnish(ed) paper strengthens prepreg and adhesive coated foil, described adhesive coated foil is laminating to be strengthened on prepreg and adhesive coated foil is symmetrical with the stress that outer layer varnish(ed) paper strengthens prepreg in outer layer varnish(ed) paper, and described internal layer varnish(ed) paper strengthens the stress of prepreg and strengthens the stress of prepreg less than outer layer varnish(ed) paper.Above-mentioned high stability paper-based copper-coated board, the ability resisting extraneous humiture change can be strengthened, copper-clad plate surface stress is symmetrical simultaneously, after internal layer varnish(ed) paper strengthens prepreg pressing and forming, resin state of cure is shallow, can be more easy to discharge internal stress, it is difficult to warpage and distortion, improves processability and the reliability of copper-clad plate, more adapt to the development need of modern electronic technology.
Description
Technical field
This utility model relates to copper-clad plate technology, particularly to a kind of high stability paper-based copper-coated board.
Background technology
Copper-clad plate has another name called base material.Being to soak supporting material with resin, one or both sides are coated with Copper Foil, through the one of hot pressing
Plant board-like material, referred to as copper-clad laminate.Paper base plate, half glass fiber plate and full glass can be divided into according to using raw sheet assortment class
Sheet material.
In traditional paper-based copper-coated board, the grammes per square metre of varnish(ed) paper surface layer is generally 130-140 gram/m2, varnish(ed) paper
Strengthening prepreg resin content and be generally less than 47%, it is low that copper-clad plate outer layer varnish(ed) paper strengthens prepreg resin content
Easily cause copper-clad plate water absorption rate to increase, and copper-clad plate produces warpage or twisted phenomena with extraneous humiture change, thus impact is covered
Copper coin processing characteristics, even scraps, and the most existing paper-based copper-coated board is further improved.
Utility model content
For overcoming deficiency of the prior art, this utility model provides a kind of high stability paper-based copper-coated board.
For achieving the above object, the technical solution adopted in the utility model is as follows: a kind of high stability paper-based copper-coated board, its
It is characterised by: include that internal layer varnish(ed) paper strengthens prepreg, outer layer varnish(ed) paper strengthens prepreg and adhesive coated foil,
Described adhesive coated foil is laminating to be strengthened on prepreg and adhesive coated foil strengthens with outer layer varnish(ed) paper in outer layer varnish(ed) paper
The stress of prepreg is symmetrical, and described internal layer varnish(ed) paper strengthens the stress of prepreg and strengthens less than outer layer varnish(ed) paper
The stress of prepreg.
Further, internal layer, outer layer varnish(ed) paper are strengthened prepreg and include varnish(ed) paper and be dried by gluing
Postadhesion resin thereon.
Further, the grammes per square metre of the varnish(ed) paper enhancing prepreg varnish(ed) paper of internal layer is exhausted more than the dipping of outer layer
Edge paper strengthens the grammes per square metre of prepreg varnish(ed) paper.
Further, internal layer varnish(ed) paper strengthens prepreg due to multi-disc superposition composition.
Further, internal layer varnish(ed) paper enhancing prepreg is provided with four.
From above-mentioned to description of the present utility model, compared with prior art, the high stability that this utility model provides
Paper-based copper-coated board, it is asymmetric with outer layer varnish(ed) paper enhancing prepreg structure that internal layer varnish(ed) paper strengthens prepreg,
Pressing and forming rear surface molecular resin chain is finer and close, can strengthen the ability resisting extraneous humiture change, make outer layer varnished insulation
The stress that paper strengthens after prepreg pressing and forming is consistent with the stress after adhesive coated foil pressing and forming, thus covers copper described in being formed
Plate surface stress is symmetrical, and after internal layer varnish(ed) paper strengthens prepreg pressing and forming, resin state of cure is shallow, can be more easy to release
Internal stress, is difficult to warpage and distortion, improves processability and the reliability of copper-clad plate, more adapts to the development of modern electronic technology
Need.
Accompanying drawing explanation
Fig. 1 is the structural representation of high stability paper-based copper-coated board.
Fig. 2 is the process for pressing schematic diagram of high stability paper-based copper-coated board.
Detailed description of the invention
Below by way of detailed description of the invention, the utility model will be further described.
Shown in reference Fig. 1, a kind of high stability paper-based copper-coated board, including internal layer varnish(ed) paper enhancing prepreg 1, outward
Layer varnish(ed) paper strengthens prepreg 2 and adhesive coated foil 3；
Internal layer varnish(ed) paper is strengthened prepreg 1 and includes varnish(ed) paper 11 and adhered to after drying on it by gluing
Resin 12, varnish(ed) paper strengthen prepreg 1 include that four layers are overlapped mutually, internal layer varnish(ed) paper strengthen prepreg 1
Stress less than outer layer varnish(ed) paper strengthen prepreg 2 stress；
Outer layer varnish(ed) paper is strengthened prepreg 2 and includes varnish(ed) paper 21 and adhered to after drying on it by gluing
Resin 22, outer layer varnish(ed) paper 11 is less than the grammes per square metre of internal layer varnish(ed) paper 11；
Adhesive coated foil 3 is laminating strengthens on prepreg 2 in outer layer varnish(ed) paper, including Copper Foil 31 and resin 32, gluing
The stress that Copper Foil 3 and outer layer varnish(ed) paper strengthen prepreg is symmetrical.
With reference to shown in Fig. 1, Fig. 2, prepare above-mentioned high stability paper-based copper-coated board, specifically comprise the following steps that
Step 1, prepares outer layer varnish(ed) paper and strengthens prepreg 2, and outer layer varnish(ed) paper strengthens prepreg dipping
The grammes per square metre of insulating paper is 120-126 gram/m2, resin content is 49-51%, resin flow is 5-7%；
Step 2, prepares internal layer varnish(ed) paper and strengthens prepreg 1, and internal layer varnish(ed) paper strengthens prepreg dipping
The grammes per square metre of insulating paper is 130-140 gram/m2, resin content is 43.5-46.5%, resin flow is 9-11%；
Step 3, prepares adhesive coated foil 3, uses Copper Foil 31 and resin 32 coated drying machine single spreading post-treatment system
?；
Step 4, outer layer varnish(ed) paper step 1, step 2, step 3 prepared strengthens prepreg 2, internal layer dipping absolutely
Edge paper strengthens prepreg 1 and the most neatly overlaps, and strengthens on prepreg coated with step 3 adhesive coated foil at outer layer varnish(ed) paper
2, then put it into and hot-forming in vacuum hot pressing formation machine obtain high stability paper-based copper-coated board, this vacuum hot pressing formation machine
High temperature constant temperature temperature is 150-165 DEG C, high-pressure controls at 6.5-7.5MPa, and the High Temperature High Pressure retention time is that 80-100 divides
Clock, optimization, in the present embodiment, temperature was warming up to 160 DEG C by 155 DEG C through 20 minutes, and keep 160 DEG C of high temperature constant temperatures 90 minutes,
High-pressure was promoted most 5.5Mpa by 2Mpa through 20 minutes, and now temperature rises to 160 DEG C, continues to lift up pressure and to 7MPa and protects
Hold 7Mpa high pressure to terminate to high temperature constant temperature.
Make high stability paper-based copper-coated board obtained in aforementioned manners, angularity≤14mm after testing, for just sticking up, distort
Degree≤5mm；
Internal layer varnish(ed) paper strengthens prepreg 1 and outer layer varnish(ed) paper strengthens table after prepreg 2 pressing and forming
Face molecular resin chain is finer and close, can strengthen the ability resisting the change of extraneous humiture, makes copper-clad plate be difficult to moisture absorption and warpage, torsion
Song, this kind of insulating paper and resin content design and through specific process for pressing simultaneously, make outer layer varnish(ed) paper strengthen half solid
Change the stress after sheet 2 pressing and forming consistent with the stress after adhesive coated foil 3 pressing and forming, thus form described copper-clad plate surface and answer
Power is symmetrical, and after internal layer varnish(ed) paper strengthens prepreg 1 pressing and forming, resin state of cure is shallow, can be more easy to discharge internal stress,
It is difficult to warpage and distortion, improves processability and the reliability of copper-clad plate, more adapt to the development need of modern electronic technology.
Above are only some detailed description of the invention of the present utility model, but design concept of the present utility model is not limited to
This, all changes utilizing this design that this utility model carries out unsubstantiality, infringement this utility model protection domain all should be belonged to
Behavior.
Claims (5)
1. a high stability paper-based copper-coated board, it is characterised in that: include that internal layer varnish(ed) paper strengthens prepreg, outer layer leaching
Bakelite paper strengthens prepreg and adhesive coated foil, and described adhesive coated foil is laminating strengthens prepreg in outer layer varnish(ed) paper
Upper and adhesive coated foil strengthens the stress symmetry of prepreg with outer layer varnish(ed) paper, and described internal layer varnish(ed) paper strengthens half
The stress of cured sheets strengthens the stress of prepreg less than outer layer varnish(ed) paper.
High stability paper-based copper-coated board the most according to claim 1, it is characterised in that: described internal layer, outer layer varnished insulation
Paper strengthens prepreg and includes varnish(ed) paper and adhere to resin thereon after drying by gluing.
High stability paper-based copper-coated board the most according to claim 2, it is characterised in that: the varnish(ed) paper of described internal layer increases
The grammes per square metre of more than half cured sheets varnish(ed) paper strengthens the grammes per square metre of prepreg varnish(ed) paper more than the varnish(ed) paper of outer layer.
4. according to the high stability paper-based copper-coated board described in claim 1 or 3, it is characterised in that: described internal layer varnish(ed) paper
Strengthen prepreg due to multi-disc superposition composition.
High stability paper-based copper-coated board the most according to claim 4, it is characterised in that: described internal layer varnish(ed) paper strengthens
Prepreg is provided with four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620736225.8U CN205800386U (en) | 2016-07-13 | 2016-07-13 | A kind of high stability paper-based copper-coated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620736225.8U CN205800386U (en) | 2016-07-13 | 2016-07-13 | A kind of high stability paper-based copper-coated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205800386U true CN205800386U (en) | 2016-12-14 |
Family
ID=57510972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620736225.8U Expired - Fee Related CN205800386U (en) | 2016-07-13 | 2016-07-13 | A kind of high stability paper-based copper-coated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205800386U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111002651A (en) * | 2019-12-13 | 2020-04-14 | 陕西卫宁电子材料有限公司 | High-frequency copper-clad plate and preparation method thereof |
| CN114103307A (en) * | 2021-12-06 | 2022-03-01 | 中国电子科技集团公司第四十六研究所 | Low-warpage thermosetting resin copper-clad plate and preparation method thereof |
-
2016
- 2016-07-13 CN CN201620736225.8U patent/CN205800386U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111002651A (en) * | 2019-12-13 | 2020-04-14 | 陕西卫宁电子材料有限公司 | High-frequency copper-clad plate and preparation method thereof |
| CN114103307A (en) * | 2021-12-06 | 2022-03-01 | 中国电子科技集团公司第四十六研究所 | Low-warpage thermosetting resin copper-clad plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20180713 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |