CN102199264A - Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive - Google Patents
Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive Download PDFInfo
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- CN102199264A CN102199264A CN 201110065564 CN201110065564A CN102199264A CN 102199264 A CN102199264 A CN 102199264A CN 201110065564 CN201110065564 CN 201110065564 CN 201110065564 A CN201110065564 A CN 201110065564A CN 102199264 A CN102199264 A CN 102199264A
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Abstract
The invention relates to a preparation method of a water-soluble phenolic resin applied to preparation of a copper-clad foil laminated board adhesive. The preparation method is characterized in that phenol and formaldehyde are used as main raw materials, barium hydroxide is used as a catalyst, and the water-soluble phenolic resin is generated through synthesis reaction, wherein the reaction temperature is 90 DEG C-98 DEG C, the reaction time is 45-70 minutes, and normal pressure is maintained when in reaction. The feeding mass parts of various components of the water-soluble phenolic resin are as follows: 100 parts of the phenol, 100 parts of the formaldehyde and 2-4 parts of the barium hydroxide. By using the preparation method, the adhesive property and heat-resistant property between a copper foil and a papery substrate can be improved.
Description
Technical field
The present invention relates to a kind of resin, especially relate to a kind of method for making that is applied to prepare the water soluble phenol resin of copper-clad laminate tackiness agent.
Background technology
Before the present invention makes, generally adopted ammoniacal liquor to do the resin of the resol of catalyst as preparation copper-clad laminate tackiness agent in the past.Use by the tackiness agent of this resins after the adhesive property and the resistance toheat of Copper Foil and paper substrate relatively poor, can only reach 9 ~ 10N/mm under the stripping strength normality.Anti-immersed solder degree warm in nature can only reach 5 ~ 10 seconds in 260 ℃ tin cylinder.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, provide a kind of and can improve the adhesive property of Copper Foil and paper substrate and the water soluble phenol resin that is applied to prepare the copper-clad laminate tackiness agent of resistance toheat.
The object of the present invention is achieved like this: a kind of method for making that is applied to prepare the water soluble phenol resin of copper-clad laminate tackiness agent, it is characterized in that described method for making is that employing phenol and formaldehyde are main raw material, with hydrated barta is catalyzer, building-up reactions generates water soluble phenol resin, described temperature of reaction is 90 ℃～98 ℃, times 45～70 clock keeps synthesis under normal pressure during reaction; The mass parts that feeds intake of described each component is:
100 parts of phenol
100 parts in formaldehyde
2 ~ 4 parts of hydrated bartas.
The ba phenolic resin that the present invention adopts is a water soluble phenolic resin, after itself and polyvinyl butyral acetal are used, can improve the adhesive property of Copper Foil and paper substrate, improves resistance toheat simultaneously.
It is not stratified more than 20 seconds, non-foaming that anti-immersed solder performance keeps in 260 ℃ molten molten tin cylinder.Because traditional to do worm angle matchmaker's synthetic resol molecular weight with ammoniacal liquor big, the tung oil-modified resin affinity used with the paper-based copper-coated board paper substrate is general, and be evenly distributed with the high, medium and low three kinds of molecular structures of resol that hydrated barta is worm angle matchmaker, and avidity is good between the molecule of tung oil modified phenolic resin, cooperates Copper Foil binding agent after synthetic to improve the anti-immersed solder performance of paper-based copper-coated board greatly with the polyvinyl alcohol butyral so do catalyst synthetic water soluble phenol resin with hydrated barta.
Embodiment
A kind of method for making that is applied to prepare the water soluble phenol resin of copper-clad laminate tackiness agent that the present invention relates to, be that employing phenol and formaldehyde are main raw material, with hydrated barta is catalyzer, building-up reactions generates water soluble phenol resin, described temperature of reaction is 90 ℃～98 ℃, times 45～70 clock, keep synthesis under normal pressure during reaction, reaction drillstem test gelation time, when gel time reaches needed numerical value, in to the reaction, carry out vacuum hydro-extraction, moisture in the resin is taken off to the greatest extent, however add solvent cut finished product.The mass parts that feeds intake of described each component is: 100 parts of phenol, 100 parts in formaldehyde, 2 ~ 4 parts of hydrated bartas.
Claims (1)
1. method for making that is applied to prepare the water soluble phenol resin of copper-clad laminate tackiness agent, it is characterized in that described method for making is that employing phenol and formaldehyde are main raw material, with hydrated barta is catalyzer, building-up reactions generates water soluble phenol resin, described temperature of reaction is 90 ℃～98 ℃, times 45～70 clock keeps synthesis under normal pressure during reaction; The mass parts that feeds intake of described each component is:
100 parts of phenol
100 parts in formaldehyde
2 ~ 4 parts of hydrated bartas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110065564 CN102199264A (en) | 2011-03-18 | 2011-03-18 | Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110065564 CN102199264A (en) | 2011-03-18 | 2011-03-18 | Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102199264A true CN102199264A (en) | 2011-09-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110065564 Pending CN102199264A (en) | 2011-03-18 | 2011-03-18 | Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive |
Country Status (1)
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| CN (1) | CN102199264A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105623186A (en) * | 2015-12-30 | 2016-06-01 | 陕西生益科技有限公司 | Method for improving moisture-resistant and heat-resistant performance of CEM-1 copper foil-clad laminate |
| CN105949711A (en) * | 2016-05-27 | 2016-09-21 | 烟台柳鑫新材料科技有限公司 | Resin for cover plate and preparation method of resin |
| CN108977144A (en) * | 2015-12-17 | 2018-12-11 | 福建利豪电子科技股份有限公司 | A kind of copper foil glue manufacturing method for slim paper-based copper-coated board |
| CN113388349A (en) * | 2021-05-13 | 2021-09-14 | 福建利豪电子科技股份有限公司 | Preparation process of copper foil adhesive special for high CTI (comparative tracking index) and application of copper foil adhesive to paper-based copper-clad plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377916A (en) * | 2001-03-29 | 2002-11-06 | 中国科学院化学研究所 | Water soluble phenolic resin/nano clay composition and its preparing method |
-
2011
- 2011-03-18 CN CN 201110065564 patent/CN102199264A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377916A (en) * | 2001-03-29 | 2002-11-06 | 中国科学院化学研究所 | Water soluble phenolic resin/nano clay composition and its preparing method |
Non-Patent Citations (1)
| Title |
|---|
| 《热固性树脂》 19980815 李瑞珍 覆铜板聚乙烯醇缩醛铜箔粘合剂的研究 第22-26页 1 , 第3期 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108977144A (en) * | 2015-12-17 | 2018-12-11 | 福建利豪电子科技股份有限公司 | A kind of copper foil glue manufacturing method for slim paper-based copper-coated board |
| CN109082252A (en) * | 2015-12-17 | 2018-12-25 | 福建利豪电子科技股份有限公司 | A kind of high-peeling strength paper-based copper-coated board copper foil glue |
| CN108977144B (en) * | 2015-12-17 | 2021-01-08 | 福建利豪电子科技股份有限公司 | Method for manufacturing copper foil adhesive for thin paper-based copper-clad plate |
| CN105623186A (en) * | 2015-12-30 | 2016-06-01 | 陕西生益科技有限公司 | Method for improving moisture-resistant and heat-resistant performance of CEM-1 copper foil-clad laminate |
| CN105623186B (en) * | 2015-12-30 | 2018-12-21 | 陕西生益科技有限公司 | A method of it is moisture resistance hot to improve CEM-1 copper-clad laminate |
| CN105949711A (en) * | 2016-05-27 | 2016-09-21 | 烟台柳鑫新材料科技有限公司 | Resin for cover plate and preparation method of resin |
| CN105949711B (en) * | 2016-05-27 | 2018-04-20 | 烟台柳鑫新材料科技有限公司 | A kind of cover board resin and preparation method thereof |
| CN113388349A (en) * | 2021-05-13 | 2021-09-14 | 福建利豪电子科技股份有限公司 | Preparation process of copper foil adhesive special for high CTI (comparative tracking index) and application of copper foil adhesive to paper-based copper-clad plate |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20110928 |