CN210225864U - Multilayer braided wire flexible circuit board - Google Patents
Multilayer braided wire flexible circuit board Download PDFInfo
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- CN210225864U CN210225864U CN201920020705.8U CN201920020705U CN210225864U CN 210225864 U CN210225864 U CN 210225864U CN 201920020705 U CN201920020705 U CN 201920020705U CN 210225864 U CN210225864 U CN 210225864U
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Abstract
The utility model discloses a multilayer braided wire flexible line board, including positive and negative protective film subassembly, double sided board circuit board and the infinitely long metallic conduction layer in the back, first installation side and second installation side have on the double sided board circuit board, positive and negative protective film subassembly set up in the double sided board circuit board on the first installation side, the infinitely long metallic conduction layer in the back set up in the double sided board circuit board on the second installation side. The utility model relates to a multilayer braided wire flexible line way board, through setting up anti-oxidation plating layer, can avoid flexible line way board to be oxidized easily in the brazing point surface of pad under the high temperature lamination, avoid appearing the electronic components contact failure's behind the paster the condition, and then improve the conductive ability on positive circuit layer of double sided board and double sided board reverse side circuit layer, and then improve the electric conductive property of circuit board, improve flexible line way board's stability.
Description
Technical Field
The utility model relates to a flexible line way board field especially relates to a multilayer braided wire flexible line way board.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The flexible printed circuit board or FPC for short has the characteristics of high wiring density, light weight and thin thickness. A complete and reasonable production process is required for manufacturing a good-quality FPC board, and each process must be strictly executed from pre-production pretreatment to final shipment. In the production process, in order to prevent the problems of FPC scrapping and material supplementing caused by too low yield rate due to too many open/short circuits or reduced process problems such as drilling, rolling, cutting and the like, and to evaluate how to select materials to achieve the flexible circuit board with the best effect for customers to use. Prenatal pretreatment is especially important.
However, copper on a conventional flexible circuit board is mainly red copper, and the surface of a brazing point of a bonding pad is easily oxidized under high-temperature lamination, so that the oxidized copper is not conductive any more or an electronic component after being pasted is poor in contact, the conductive capability of the circuit board is reduced, and the stability of the flexible circuit board is also reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, provide one kind and avoid appearing the pad by the oxidation, improve flexible circuit board conducting capacity, avoid appearing contact failure and improve the multilayer braided wire flexible line way board of stability.
The purpose of the utility model is realized through the following technical scheme:
a multilayer braided wire flexible wiring board comprising: the double-sided circuit board comprises a front-back side protective film assembly, a double-sided circuit board and a back infinite-length metal conducting layer, wherein the double-sided circuit board is provided with a first mounting side face and a second mounting side face;
the front and back protective film assembly comprises a front cover film windowing layer, an anti-oxidation electroplated layer and a multi-layer board back cover film protective layer, wherein the front cover film windowing layer is attached to the first installation side face, the multi-layer board back cover film protective layer is attached to the other side face, away from the second installation side face, of the back infinite metal conductive layer, a plurality of patch windows are formed in the front cover film windowing layer, intervals are formed among the patch windows respectively, the anti-oxidation electroplated layer is arranged on the front cover film windowing layer, and the anti-oxidation electroplated layer is attached to the edge position of each patch window;
the double sided board circuit board comprises a double sided board front line layer, an electric shielding layer, a double sided board reverse line layer and a back double sided pure glue layer which are sequentially stacked, the double sided board front line layer is further attached to the front side covering film windowing layer, the back double sided pure glue layer is further attached to the back side infinite metal conducting layer is far away from the other side of the multilayer board back covering film protecting layer.
In one embodiment, the oxidation-preventing plating layer is a gold-depositing layer, a silver-depositing layer or a tin-depositing layer.
In one embodiment, the back infinite metal conductive layer is a wire braid or a die-cut copper foil layer.
In one embodiment, the metal conductive layer includes a plurality of metal wires, each metal wire is attached to the back double-sided pure glue layer, a space is arranged between each metal wire, and each metal wire is in a filament strip shape.
In one embodiment, the back infinite metal conductive layer comprises a plurality of die-cut copper foil strips, each die-cut copper foil strip is attached to the back double-sided pure glue layer, a gap is formed between each die-cut copper foil strip, and each die-cut copper foil layer is in a long strip shape.
In one embodiment, the electrical shielding layer has a plurality of via holes, and each via hole is in one-to-one correspondence with each of the patch windows, so that the front circuit layer of the double-sided board is electrically connected to the back circuit layer of the double-sided board.
In one embodiment, a plurality of through holes are formed in the back double-sided pure glue layer, and the through holes are communicated with the through holes in a one-to-one correspondence manner, so that the back infinite metal conductive layer is electrically connected with the circuit layer on the back side of the double-sided board.
In one embodiment, the plurality of patch windows include a plurality of LED welding holes and a plurality of capacitance and resistance welding holes, wherein a space is respectively disposed between the LED welding holes, and a space is respectively disposed between the capacitance and resistance welding holes.
In one embodiment, the backside clear adhesive layer is a solid adhesive.
In one embodiment, the multilayer braided wire flexible circuit board further comprises a front character layer, and the front character layer is arranged on the front cover film windowing layer.
The utility model discloses compare in prior art's advantage and beneficial effect as follows:
the utility model relates to a multilayer braided wire flexible line way board, through setting up anti-oxidation plating layer, can avoid flexible line way board to be oxidized easily in the brazing point surface of pad under the high temperature lamination, avoid appearing the electronic components contact failure's behind the paster the condition, and then improve the conductive ability on positive circuit layer of double sided board and double sided board reverse side circuit layer, and then improve the electric conductive property of circuit board, improve flexible line way board's stability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a multilayer braided wire flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the front and back side protective film assemblies of the multilayer braided wire flexible circuit board shown in FIG. 1;
FIG. 3 is a schematic structural diagram of a double-sided circuit board of the multi-layer braided wire flexible circuit board shown in FIG. 1;
fig. 4 is a schematic structural diagram of the back infinite metal conductive layer shown in fig. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a multilayer braided wire flexible circuit board includes: the double-sided circuit board comprises a front-back protective film assembly 100, a double-sided circuit board 200 and a back infinitely long metal conducting layer 300, wherein the double-sided circuit board 200 is provided with a first installation side surface and a second installation side surface, the front-back protective film assembly 100 is arranged on the first installation side surface of the double-sided circuit board 200, and the back infinitely long metal conducting layer 300 is arranged on the second installation side surface of the double-sided circuit board 200. It should be noted that the front and back side protective film assembly 100 is used for protecting the double-sided circuit board 200 and the back side infinite metal conductive layer 300 from being damaged, thereby improving the stability and the service life of the flexible circuit board; the double-sided board circuit board 200 is used for realizing a conducting circuit of the LED flexible circuit board; the back infinite metal conductive layer 300 is used to realize electrical connection of the double-sided board 200, and can realize low voltage infinite length. It should be further noted that the back-side infinite-length metal conductive layer 300 is a metal conductive layer, and can achieve the effect of low-voltage infinite-length and no-voltage drop, that is, theoretically, the effect of no-voltage drop or low-voltage drop can be achieved, so that the circuit board can be designed infinitely long or very long according to actual needs, but the circuit board is often designed according to the length of a required product in actual needs.
Referring to fig. 2, the front-back side protective film assembly 100 includes a front side cover film windowing layer 110, an oxidation-resistant plating layer 120, and a multi-layer board back side cover film protective layer 130, the front side cover film windowing layer 110 is attached to the first mounting side, the multi-layer board back side cover film protective layer 130 is attached to the other side of the back infinite metal conductive layer 300 away from the second mounting side, the front side cover film windowing layer 110 is provided with a plurality of patch windows 111, spaces are respectively provided between the patch windows 111, the oxidation-resistant plating layer 120 is disposed on the front side cover film windowing layer 110, and the oxidation-resistant plating layer 120 is attached to the edge position of each patch window 111. It should be noted that the front cover film windowing layer 110 is used for protecting the front side of the circuit board from being damaged; the anti-oxidation electroplated layer 120 is used for protecting the bonding pad from being oxidized, and through the anti-oxidation electroplated layer, the problem that the surface of a brazing point of the bonding pad of the flexible circuit board is easily oxidized under high-temperature lamination can be avoided, the condition of poor contact of an electronic component after being pasted is avoided, the conductive capacity of the front circuit layer of the double-sided board and the back circuit layer of the double-sided board is improved, the conductive performance of the circuit board is improved, and the stability of the flexible circuit board is improved. The multilayer board back cover film protective layer 130 is used for protecting the back of the circuit board from being damaged, so that the stability of the circuit board is further improved, and the service life of the circuit board is further prolonged.
Referring to fig. 3, the double-sided circuit board 200 includes a double-sided front circuit layer 210, an electrical shielding layer 220, a double-sided back circuit layer 230, and a back double-sided pure glue layer 240 stacked in sequence, the double-sided front circuit layer is further attached to the front cover film windowing layer, and the back double-sided pure glue layer is further attached to the other side of the back infinite metal conductive layer away from the multi-layer board back cover film protection layer. It should be noted that the double-sided board front-side circuit layer 210 is used to electrically connect electronic components of a front-side circuit, the electrical shielding layer 220 is used to avoid electrical connection between the double-sided board front-side circuit layer 210 and the double-sided board back-side circuit layer 230, the double-sided board back-side circuit layer 230 is used to electrically connect the double-sided board front-side circuit layer 210 and the back infinite-length metal conductive layer 300, and the back double-sided pure glue layer 240 is used to bond the double-sided board circuit board 200 to the back infinite-length metal conductive layer 300, so that the pressing is more convenient and the electrical connection stability is higher.
Specifically, the anti-oxidation electroplated layer is a gold-deposited layer, a silver-deposited layer or a tin-deposited layer. Thus, the surface is treated by gold immersion or silver immersion or tin immersion, which can effectively prevent the surface of the bonding pad from being oxidized under high-temperature lamination
Referring to fig. 4, the back infinite metal conductive layer is a metal wire braid or a die-cut copper foil layer. The metal conductive layer includes a plurality of metal wires 310, and each metal wire 310 is respectively attached to the back double-sided pure glue layer 240. In this embodiment, a space is respectively disposed between the metal wires, and each metal wire is in the shape of a long strip. Specifically, the scrap is drawn into a plurality of fine metal wires 310 by means of copper rod drawing; the flat metal wire is woven by a plurality of metal wires, and the flat metal wire is widened and thickened according to the requirements of customers to form a whole roll of infinite-length flat metal wire braid layer, so that the electrical performance required by the customers is achieved.
It should be further noted that the back infinite metal conductive layer includes a plurality of die-cut copper foil strips, each die-cut copper foil strip is attached to the back double-sided pure glue layer, a space is arranged between each die-cut copper foil strip, and each die-cut copper foil layer is in a long strip shape. Therefore, the characteristics of infinite length and no pressure drop can be ensured.
Referring to fig. 3 again, a plurality of via holes 221 are formed in the electrically shielding layer 220, and each via hole is in one-to-one correspondence with each of the patch windows so as to electrically connect the front circuit layer of the double-sided board and the back circuit layer of the double-sided board. A plurality of current-conducting holes 241 are formed in the back double-sided pure adhesive layer 240, and each current-conducting hole is communicated with each conducting hole in a one-to-one correspondence manner, so that the back infinite metal conducting layer is electrically connected with the back circuit layer of the double-sided board. The diameter of the through hole 241 is larger than the diameter of the via hole 221. Therefore, the metal wires on the back infinite metal conducting layer 300 can be exposed, and the electronic component can be attached to the top. Preferably, the through hole 221 is elliptical, and the current passing hole 241 is elliptical. Therefore, the reliability of the electrical connection can be ensured.
It should be further noted that the plurality of patch windows include a plurality of LED welding holes and a plurality of capacitance resistance welding holes, a space is respectively provided between each LED welding hole, and a space is respectively provided between each capacitance resistance welding hole. Therefore, the multilayer braided wire flexible circuit board further comprises a plurality of LED lamp groups and a plurality of capacitance resistors, wherein the LED lamp groups are pasted in the LED welding holes in a one-to-one correspondence mode, and the capacitance resistors are pasted in the capacitance resistor welding holes in a one-to-one correspondence mode. Thus, a finished product of the LED flexible lamp strip can be formed.
The back double-sided pure glue layer is a solid adhesive. So, through setting up solid adhesive, can conveniently paste and paste the unlimited long metal conducting layer in back for production efficiency and shipment efficiency.
Referring to fig. 2 again, the multilayer braided wire flexible circuit board further includes a front character layer 400, and the front character layer 400 is disposed on the front cover film windowing layer. Therefore, the user can conveniently identify and clearly see the anode and the cathode of each line.
It is understood that the front side is a double-layer or multi-layer wiring board, which is a conductive wiring board formed by a copper deposition plating process; the double-layer or multilayer circuit board that will sink gold or sink silver or sink tin is well combined with the pure glue of opening the circular telegram hole, specifically, the pure glue is including the two-sided pure glue of carrier, the trompil mode: drilling, die cutting, etc. Then combining the double-layer or multi-layer circuit board pasted with pure glue with the flat metal wire braid layer, then rolling, heating and shaping the whole roll, and conducting the whole roll in a high-temperature laminating mode; meanwhile, fixing holes are added on the double-layer or multi-layer circuit board, so that the stability of the flat metal wire braided wire layer and the double-layer or multi-layer circuit board is better. And the back main line is connected to the flat metal wire braided layer to form a whole roll of infinitely extending back main line, and the back main line is a finished product of the LED flexible circuit board which is braided by the flat metal wire and is formed by multiple layers of infinitely long metal braided wires.
Specifically, the production process comprises the following steps:
s1, drawing the scrap copper rod into a plurality of thin wire-shaped metal wires in a wire drawing mode;
s2, weaving a plurality of metal wires into flat wires, widening and thickening the flat wires according to the requirements of customers to form a metal braid layer with the back being a whole roll of infinite-length flat wires, so as to achieve the electrical performance required by the customers;
s3, adhering the single windowed first insulating layer to the front surface of the single double-layer or multi-layer circuit board;
s4, performing gold immersion, silver immersion or tin immersion treatment on the surface of the single double-layer or multi-layer circuit layer;
s5, combining the double-layer or multi-layer circuit board with the gold or silver or tin plated and the pure glue with the open energizing holes;
s6, attaching the double-layer or multi-layer circuit board with the pure glue (the pure glue comprises double-sided pure glue with a carrier) to the whole roll of the infinite-length flat metal braid layer on the reverse side;
s7, rolling, heating and shaping the whole roll;
s8, conducting the double-layer or multi-layer circuit board and the back surface infinite length flat metal braid layer in a high-temperature laminating mode, and baking and curing at high temperature to form a complete multi-layer infinite length back surface which is a whole roll of flat metal braid flexible LED circuit board;
s9, welding electronic components on the double-sided or multilayer circuit layers to form a multilayer flexible luminous belt body with an infinite-length flat metal wire weaving main line on the back side of the whole body;
and S10, if the electronic component is not welded on the double-sided or multilayer circuit layers, forming a finished product of the LED flexible circuit board with the integral reverse main line being a metal wire braided multilayer infinite-length metal braided wire.
Therefore, the whole roll of the infinitely-extending multilayer infinitely-long metal braided wire LED flexible circuit board with the back main wire braided by flat metal wires can be cut into low-voltage whole-roll multilayer infinitely-long metal braided wire LED flexible circuit boards with the length of 0.5 meter, 1.0 meter, 1.5 meter or infinitely-long, the low-voltage infinite length is realized, and the width and the thickness of the metal wire braided layer can be increased randomly so that the electrical performance of the product can achieve no voltage drop; the surface of the flexible LED circuit board is processed by gold immersion, silver immersion or tin immersion, and then the reliability of welding electronic components is higher; the interconnection of the electrical performance of the multilayer circuit is realized, the blank that the electrical performance of the low-voltage circuit board in the field of the LED lamp strip is transmitted in a long distance without voltage drop is filled, and the industrial standard is updated.
It should be further noted that the finished product of the multilayer infinite-length metal braided wire LED flexible circuit board, in which the main wire on the back side is a flat metal wire braided with metal wires, may be cut in the length direction. The width of the metal wire braided layer is 1 mm-30 mm, and the thickness is more than 0.05 mm. Meanwhile, the characteristic of infinite extension of the whole roll can be realized; the multilayer infinite-length metal braided wire LED flexible circuit board has smaller voltage drop when in circuit connection, improves the electrical performance of long-distance transmission of the low-voltage circuit board, reduces the installation cost and improves the production efficiency.
The utility model relates to a multilayer braided wire flexible line way board, through setting up anti-oxidation plating layer, can avoid flexible line way board to be oxidized easily in the brazing point surface of pad under the high temperature lamination, avoid appearing the electronic components contact failure's behind the paster the condition, and then improve the conductive ability on positive circuit layer of double sided board and double sided board reverse side circuit layer, and then improve the electric conductive property of circuit board, improve flexible line way board's stability. Through the double-layer or multilayer circuit board and the reverse side for flat metal braid layer with pure glue lamination closes, can be so that infinitely long metal wire braid layer and double-layer or multilayer circuit board stability is better, and the surface adopts heavy gold or heavy silver or heavy tin to handle the back welding electronic components reliability higher, improves the production quality of the infinitely long metal braided wire LED flexible line way board of multilayer.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A multilayer braided wire flexible wiring board, comprising: the double-sided circuit board comprises a front-back side protective film assembly, a double-sided circuit board and a back infinite-length metal conducting layer, wherein the double-sided circuit board is provided with a first mounting side face and a second mounting side face;
the front and back protective film assembly comprises a front cover film windowing layer, an anti-oxidation electroplated layer and a multi-layer board back cover film protective layer, wherein the front cover film windowing layer is attached to the first installation side face, the multi-layer board back cover film protective layer is attached to the other side face, away from the second installation side face, of the back infinite metal conductive layer, a plurality of patch windows are formed in the front cover film windowing layer, intervals are formed among the patch windows respectively, the anti-oxidation electroplated layer is arranged on the front cover film windowing layer, and the anti-oxidation electroplated layer is attached to the edge position of each patch window;
the double sided board circuit board comprises a double sided board front line layer, an electric shielding layer, a double sided board reverse line layer and a back double sided pure glue layer which are sequentially stacked, the double sided board front line layer is further attached to the front side covering film windowing layer, the back double sided pure glue layer is further attached to the back side infinite metal conducting layer is far away from the other side of the multilayer board back covering film protecting layer.
2. The flexible printed circuit board of claim 1, wherein the oxidation-resistant plating layer is a gold, silver or tin plating layer.
3. The multilayer braided wire flexible circuit board of claim 1, wherein said back infinite metal conductive layer is a wire braid or die cut copper foil layer.
4. The multilayer braided wire flexible circuit board of claim 3, wherein the metal conductive layer comprises a plurality of metal wires, each metal wire is respectively attached to the back double-sided adhesive tape layer, a space is respectively arranged between each metal wire, and each metal wire is in a filament strip shape.
5. The flexible printed circuit board of claim 3, wherein the infinitely long back metal conductive layer comprises a plurality of die-cut copper foil strips, each die-cut copper foil strip is attached to the back double-sided adhesive layer, a space is disposed between each die-cut copper foil strip, and each die-cut copper foil layer is in the shape of a strip.
6. The flexible printed circuit board of claim 1, wherein the electrically shielding layer has a plurality of vias formed therein, and each of the vias is in one-to-one correspondence with each of the patch windows to electrically connect the front side circuit layer of the double-sided board and the back side circuit layer of the double-sided board.
7. The flexible printed circuit board of claim 6, wherein the back double-sided clear adhesive layer has a plurality of through holes, and each through hole is in one-to-one correspondence with each through hole, so that the back infinitely long metal conductive layer is electrically connected to the back circuit layer of the double-sided board.
8. The flexible printed circuit board of claim 1, wherein the plurality of patch windows comprises a plurality of LED bonding holes and a plurality of capacitive and resistive bonding holes, wherein a space is provided between each of the LED bonding holes and a space is provided between each of the capacitive and resistive bonding holes.
9. The multilayer braided wire flexible circuit board of claim 1, wherein said back double-sided clear adhesive layer is a solid adhesive.
10. The multilayer braided wire flexible circuit board of claim 1, further comprising a face-character layer disposed on the face cover film fenestration layer.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111694401A (en) * | 2020-04-24 | 2020-09-22 | 上海浩创亘永科技有限公司 | Flexible line way board and have wearing formula smart machine of this flexible line way board |
| CN111931459A (en) * | 2020-10-09 | 2020-11-13 | 三维通信股份有限公司 | Power amplifier module manufacturing method and device, storage medium and electronic equipment |
| CN112770544A (en) * | 2020-12-16 | 2021-05-07 | 中山市立体光电科技有限公司 | Manufacturing method of composite flexible circuit board |
-
2019
- 2019-01-07 CN CN201920020705.8U patent/CN210225864U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111694401A (en) * | 2020-04-24 | 2020-09-22 | 上海浩创亘永科技有限公司 | Flexible line way board and have wearing formula smart machine of this flexible line way board |
| CN111694401B (en) * | 2020-04-24 | 2021-02-23 | 上海浩创亘永科技有限公司 | Flexible line way board and have wearing formula smart machine of this flexible line way board |
| CN111931459A (en) * | 2020-10-09 | 2020-11-13 | 三维通信股份有限公司 | Power amplifier module manufacturing method and device, storage medium and electronic equipment |
| CN112770544A (en) * | 2020-12-16 | 2021-05-07 | 中山市立体光电科技有限公司 | Manufacturing method of composite flexible circuit board |
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