CN210225865U - Multilayer infinite-length LED flexible circuit board - Google Patents

Abstract

The utility model discloses an infinitely long LED flexible circuit board of multilayer, including the attached subassembly in front, circuit board, electrically conductive bonding subassembly and the attached subassembly in the back, electrically conductive bonding subassembly sets up on back circuit layer, and electrically conductive bonding subassembly includes electrically conductive adhesive linkage and pure glue film, and the attached side of keeping away from the double sided board conduction layer in back circuit layer of the first bonding face of electrically conductive adhesive linkage, and the second bonding face of electrically conductive adhesive linkage is attached on pure glue film, has seted up a plurality of conduction points on the electrically conductive adhesive linkage, has seted up a plurality of electrically conductive holes on the pure glue film, each conduction point one-to-one set up in each conduction point in the electrically conductive hole. The utility model discloses a set up electrically conductive adhesive linkage and pure glue film, can be so that circuit board and back metal level pressfitting in the time, the unreliable condition of flexible line way board can not appear in the problem that becomes flexible or shift to can also avoid the unstable problem of electronic components welding, improved flexible line way board's stability and reliability.

Description

Multilayer infinite-length LED flexible circuit board

Technical Field

The utility model relates to a flexible line way board field especially relates to a multilayer infinitely long LED flexible circuit board.

Background

Prenatal pretreatment requires three aspects of treatment, all of which are performed by engineers. Firstly, evaluating the FPC board engineering, wherein whether the FPC board of a client can be produced and whether the production capacity of a company can meet the board making requirement of the client and the unit cost are mainly evaluated; if the engineering evaluation is passed, then the material is required to be prepared immediately to meet the raw material supply of each production link, finally, an engineer processes engineering files such as a CAD structure chart, gerber line information and the like of a client to be suitable for the production environment and the production specification of production equipment, and then the production drawing, MI (engineering process card) and other information are transferred to a production department and various departments such as a control department, a purchase department and the like to enter a conventional production process.

In traditional flexible circuit board, can set up the tin cream pad between the back of double-deck circuit board and the wire layer of weaving to make double-deck circuit board and wire layer of weaving realize the electricity and connect. However, the solder paste pad is easy to fall off, and the solder paste also increases the impedance of the metal wire braided wire layer, increases the voltage drop of the flexible circuit board, and generates larger unnecessary loss in the use process; meanwhile, when the electronic components are welded on the flexible circuit board, the situation that the electronic components are unstable in electric connection may occur, and the stability and reliability of the flexible circuit board are reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, provide a multilayer infinitely long LED flexible circuit board that reduces the impedance, reduces the pressure drop, improves the stability and the reliability of connecting.

The purpose of the utility model is realized through the following technical scheme:

a multilayer infinite length LED flexible circuit board comprising:

the front side attaching assembly comprises a character attaching layer and a first solder mask layer, and the character attaching layer is attached to a first side surface of the first solder mask layer;

the circuit board is provided with a second side face, far away from the character attaching layer, of the first solder mask layer, and comprises a front circuit layer, a double-sided board conduction layer and a back circuit layer which are sequentially arranged, the front circuit layer is also arranged on the first solder mask layer, a plurality of conducting holes are formed in the double-sided board conduction layer, and the conducting holes are used for enabling the front circuit layer and the back circuit layer to be electrically connected;

the conductive bonding assembly is arranged on the back circuit layer and comprises a conductive bonding layer and a pure glue layer, a first bonding surface of the conductive bonding layer is attached to one side surface, away from the double-sided board conduction layer, of the back circuit layer, a second bonding surface of the conductive bonding layer is attached to the pure glue layer, a plurality of conduction points are arranged on the conductive bonding layer, a plurality of conductive holes are arranged on the pure glue layer, and the conduction points are arranged in the conductive holes in a one-to-one correspondence manner; and

the attached subassembly in back, the attached subassembly in back includes back metal level and second solder mask, back metal level laminate fit the pure glue film is kept away from on the side of conductive bonding layer, the back metal level still set up in on the second solder mask.

In one embodiment, the back metal layer comprises a braided wire layer or a pure copper foil layer.

In one embodiment, the pure copper foil layer is divided into a plurality of copper foil strips by a whole roll of pure copper foil, a space is respectively arranged between the copper foil strips, the copper foil strips are respectively laminated on one side surface of the pure adhesive layer away from the conductive adhesive layer, and the copper foil strips are respectively arranged on the second solder mask layer.

In one embodiment, the width of the back metal layer is 1mm to 20 mm.

In one embodiment, the thickness of the copper foil strip is 0.025 mm-10 mm.

In one embodiment, the conductive adhesive layer is a conductive adhesive layer or a conductive solvent layer.

In one embodiment, the thickness of the conductive adhesive layer is 15um to 100 um.

In one embodiment, the thickness of the pure glue layer is 20um to 100 um.

In one embodiment, a plurality of welding windows are formed in the first solder mask layer, and a space is respectively arranged between each welding window.

In one embodiment, the LED flexible circuit board further includes a plurality of electronic components, and the electronic components are respectively soldered in the solder windows in a one-to-one correspondence.

The utility model discloses compare in prior art's advantage and beneficial effect as follows:

the utility model relates to a multilayer infinite length LED flexible circuit board through setting up electrically conductive adhesive linkage and pure glue film, can replace traditional tin cream pad to switch on to when making circuit board and back metal level pressfitting, the insecure condition of flexible circuit board can not appear becoming flexible or the problem of aversion, and can also avoid the unstable problem of electronic components welding, improved flexible circuit board's stability and reliability. Meanwhile, the conductive bonding layer is arranged, so that the conductive impedance of the flexible circuit board can be reduced, the voltage drop of the conductive copper foil layer is further reduced, and the loss generated in the using process is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a multilayer infinite LED flexible circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a front surface attachment assembly of the LED flexible circuit board shown in FIG. 1;

FIG. 3 is a schematic structural diagram of a circuit board of the LED flexible circuit board shown in FIG. 1;

FIG. 4 is a schematic structural diagram of a conductive adhesive assembly of the LED flexible circuit board shown in FIG. 1;

fig. 5 is a schematic structural diagram of a back surface attachment assembly of the LED flexible circuit board shown in fig. 1.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, a multilayer infinite LED flexible circuit board includes: the flexible printed circuit board comprises a front surface attaching assembly 100, a circuit board 200, a conductive bonding assembly 300 and a back surface attaching assembly 400, wherein the front surface attaching assembly 100 is used for protecting the front surface of the flexible printed circuit board; the circuit board 200 is used for realizing the circuit of the circuit and realizing the conductive function of the circuit board; the conductive bonding assembly 300 is used for bonding the circuit board 200 and the back surface attachment assembly 400, and compared with the traditional solder paste welding, the conductive bonding assembly can reduce the voltage drop and improve the stability of the flexible circuit board; the back attachment assembly 400 is used to protect the reverse side of the flexible circuit board. It should be noted that the multilayer infinite-length LED flexible circuit board means that, theoretically, an effect of no voltage drop or low voltage drop can be achieved, and then the circuit board can be designed infinitely or very long according to actual needs, but often in actual needs, the circuit board is designed according to the length of a required product.

Referring to fig. 2, the front surface attachment assembly 100 includes a character attachment layer 110 and a first solder resist layer 120, wherein the character attachment layer 110 is attached to a first side surface of the first solder resist layer 120; it should be noted that the character attaching layer 110 is composed of a plurality of characters, so that the flexible circuit board has a certain mark; the first solder mask layer 120 is a cover film for protecting the front surface circuit of the circuit board from being damaged and for insulating the circuit board.

Referring to fig. 3, the circuit board 200 is disposed on a second side surface of the first solder resist layer 120 away from the character attaching layer 110, and the circuit board 200 includes a front circuit layer 210, a double-sided board conducting layer 220 and a back circuit layer 230, which are sequentially disposed, the front circuit layer 210 is further disposed on the first solder resist layer 120, the double-sided board conducting layer 220 is disposed with a plurality of via holes 221, and the via holes 221 are used for electrically connecting the front circuit layer 210 and the back circuit layer 230. The front circuit layer 210 is used for connecting electronic components, the double-sided board conduction layer 220 is a solder resist protection layer, and the double-sided board conduction layer 220 is used for conducting the front circuit layer 210 and the back circuit layer 230; the back circuit layer 230 is used to realize electrical connection outside the front circuit layer 210.

Referring to fig. 4, the conductive adhesive assembly 300 is disposed on the back circuit layer 230, the conductive adhesive assembly 300 includes a conductive adhesive layer 310 and a pure glue layer 320, a first adhesive surface of the conductive adhesive layer 310 is attached to a side surface of the back circuit layer 230 away from the double-sided board conductive layer 220, a second adhesive surface of the conductive adhesive layer 310 is attached to the pure glue layer 320, the conductive adhesive layer 310 is provided with a plurality of conductive points 311, the pure glue layer 320 is provided with a plurality of conductive holes 321, and the conductive points 311 are disposed in the conductive holes 321 in a one-to-one correspondence manner; the conducting point 311 is disposed in the conducting hole 321, that is, after the assembly and the attachment, the conducting point is located in the conducting hole, so that the back circuit layer 230 is conducted with the back metal layer, and the front circuit layer and the back circuit layer are electrically connected. The pure glue layer is double-sided solid pure glue with a carrier.

Referring to fig. 5, the backside attachment assembly 400 includes a backside metal layer 410 and a second solder mask layer 420, the backside metal layer 410 is laminated on a side of the pure glue layer 320 away from the conductive adhesive layer 310, and the backside metal layer 410 is further disposed on the second solder mask layer 420. It should be noted that the back metal layer 410 is used to electrically connect the back circuit layer 230, so that the whole flexible circuit board is electrically conductive; the second solder mask layer 420 is a cover film for protecting the back surface of the flexible circuit board from being damaged, so that the service life of the circuit board is prolonged, and the second solder mask layer 420 plays an insulating role.

So, can replace traditional tin cream pad to when making circuit board and back metal level pressfitting, not hard up or the problem of aversion can not appear, avoid appearing the unreliable condition of flexible line way board, and can also avoid the unstable problem of electronic components welding, improved flexible line way board's stability and reliability. Meanwhile, the conductive bonding layer is arranged, so that the conductive impedance of the flexible circuit board can be reduced, the voltage drop of the conductive copper foil layer is further reduced, and the loss generated in the using process is reduced.

Referring to fig. 5, the back metal layer includes a braided wire metal wire layer or a pure copper foil layer. The pure copper foil layer 410 is divided into a plurality of copper foil strips 411 by a whole roll of pure copper foil, a space is respectively arranged between each copper foil strip 411, each copper foil strip 411 is respectively laminated on one side surface of the pure adhesive layer away from the conductive adhesive layer, and each copper foil strip 411 is respectively arranged on the second solder mask layer. So, can guarantee the circuit of each copper foil strip 411 electricity connection department through setting up many to make the electronic components on this circuit switch on, realize LED flexible circuit board's the function of switching on.

The width of the back metal layer is 1mm to 20 mm. The thickness of the copper foil strip is 0.025 mm-10 mm. The thickness of the conductive bonding layer is 15 um-100 um. The thickness of the pure glue layer is 20 um-100 um. Thus, the stability and reliability of the flexible circuit board can be ensured.

It should be further noted that each of the conducting points is arranged in a matrix. The conductive adhesive layer is a conductive adhesive layer or a conductive solvent layer.

In this embodiment, referring to fig. 2, a plurality of solder windows are formed on the first solder mask layer 120, and a space is respectively disposed between each solder window. The LED flexible circuit board further comprises a plurality of electronic components, and the electronic components are welded in the welding windows in a one-to-one correspondence mode. Therefore, each electronic component can be ensured to be correspondingly welded in the welding windowing on the first solder mask layer 120, the welding stability of the electronic component is improved, and the stability of the flexible circuit board is further improved.

Furthermore, the plurality of welding windows comprise a plurality of first welding windows, a plurality of second welding windows, a plurality of third welding windows and a plurality of fourth welding windows, wherein intervals are respectively arranged among the first welding windows, intervals are respectively arranged among the second welding windows, intervals are respectively arranged among the third welding windows, intervals are respectively arranged among the fourth welding windows, and the first welding windows are arranged in a 1-shaped manner; and the first welding window is of an elliptical structure; therefore, it should be further noted that the first welding window is used for welding the LED patch, and the elliptical structure is arranged, so that the welding position of the LED patch can be enlarged, and the welding speed and efficiency can be improved.

The third welding window and the fourth welding window are arranged between every two adjacent second welding windows, and it needs to be noted that the third welding window and the fourth welding window are used for welding a resistor and a capacitor, so that the stability and the reliability of electric connection of the resistor and the capacitor can be ensured.

It can be understood that the process for producing the multilayer infinite-length LED flexible circuit board is as follows: the pure copper foil is cut into infinite-length straight strips, widened and thickened according to the requirements of customers, and arranged on the whole roll of infinite-length pure copper foil layer with the carrier, so that the electrical performance required by the customers is achieved; adhering conductive pure glue or printing conductive solvent to a front double-layer or multi-layer circuit board (the double-layer or multi-layer circuit board is a conductive circuit board formed by a copper deposition electroplating process) and a copper surface on the back to form a conduction point; and then combining with a pure glue layer with opened conduction points (pure glue, wherein the pure glue comprises double-sided pure glue with a carrier or a conductive solvent, and the opening mode comprises drilling, punching and the like). And combining the pure glue adhered with the conduction points, the double-layer or multi-layer circuit board and the infinite-length pure copper foil layer with the carrier on the back, rolling, heating and shaping the whole roll, and performing surface treatment by combining a high-temperature laminating and baking mode to form a finished product of the multilayer infinite-length LED flexible circuit board with the double-layer main line on the back surface and infinite extension.

Specifically, the production process comprises the following steps:

s1, cutting the pure copper foil into infinite-length straight strips;

s2, adhering and arranging a plurality of infinite-length straight-strip-shaped pure copper foils on the carrier of the pure adhesive layer, widening and thickening the pure copper foils according to the requirements of customers to form a whole roll of infinite-length pure copper foil layer on the back surface, and achieving the electrical performance required by the customers;

s3, attaching the first solder mask layer of the single solder mask windowing layer to the front surface of the single double-layer or multi-layer circuit board;

s4, attaching conductive adhesive or printing conductive solvent to the back (copper surface) of the double-layer or multi-layer circuit board to form a conduction point;

s5, laminating the double-layer or multi-layer circuit board pasted with the conductive adhesive or printed with the conductive points by using the conductive solvent and the pure rubber layer;

s6, attaching the double-layer or multi-layer circuit board pasted with pure glue (the pure glue comprises double-sided pure glue with a carrier) to the whole roll of infinite-length pure copper foil layer with the carrier on the reverse side;

s7, rolling, heating and shaping the whole roll;

s8, laminating at high temperature to enable the double-layer or multi-layer circuit board to be conducted with the whole roll of infinite-length pure copper foil layer with the carrier on the reverse side, baking at high temperature and curing to form a complete multi-layer infinite-length LED flexible circuit board with the double-layer main line on the reverse side;

and S9, welding the electronic component on the surface of the double-layer or multi-layer circuit layer to form a multi-layer infinite-length LED flexible circuit board light-emitting belt body with a double-layer main line on the reverse side of the whole body.

And S10, if the electronic component is not welded on the surfaces of the double-layer or multi-layer circuit layers, forming a finished product of the multi-layer infinite-length LED flexible circuit board with the double-layer main line on the back surface of the whole.

Therefore, the whole roll of infinitely-extending multilayer infinite-length LED flexible circuit board with the pure copper foil of which the reverse side is a double-layer main line can be cut into low-voltage whole-roll multilayer infinite-length LED flexible circuit boards of which the length is 0.5 meter, 1.0 meter, 1.5 meter or infinite length at will, so that the low-voltage infinite length is realized, and the width and the thickness of the pure copper foil layer can be increased at will to ensure that the electrical performance of the product can achieve no voltage drop; the reliability of the electronic components welded on the surface of the LED flexible circuit board after the OSP or gold immersion or silver immersion or tin immersion treatment is higher; the interconnection of the electrical performance of the multilayer circuit is realized, the multilayer infinite-length LED flexible circuit board adopting the double-layer main line is softer and more flexible to mount, the blank that the electrical performance of the low-voltage circuit board in the field of LED lamp belts is transmitted in a long distance without voltage drop is filled, and the industrial standard is updated.

It should be further noted that the finished product of the multilayer infinite-length LED flexible circuit board with the reverse side being a double-layer main line can be cut in the length direction. The double-layer or multi-layer circuit board is communicated with the infinite-length pure copper foil layer with the carrier on the reverse surface by using the conductive adhesive or the conductive solvent, and the infinite-length pure copper foil layer and the double-layer or multi-layer circuit board have better stability by laminating the pure adhesive and baking at high temperature. The production quality of the multilayer infinite-length LED flexible circuit board is improved; meanwhile, the characteristic of infinite extension of the whole roll can be realized; the multilayer infinite-length LED flexible circuit board has smaller voltage drop when in circuit connection, improves the electrical performance of long-distance transmission of the low-voltage circuit board, reduces the installation cost and improves the production efficiency.

The utility model discloses compare in prior art's advantage and beneficial effect as follows:

the utility model relates to a multilayer infinite length LED flexible circuit board through setting up electrically conductive adhesive linkage and pure glue film, can replace traditional tin cream pad to when making circuit board and back metal level pressfitting, the insecure condition of flexible circuit board can not appear becoming flexible or the problem of aversion, and can also avoid the unstable problem of electronic components welding, improved flexible circuit board's stability and reliability. Meanwhile, the conductive bonding layer is arranged, so that the conductive impedance of the flexible circuit board can be reduced, the voltage drop of the conductive copper foil layer is further reduced, and the loss generated in the using process is reduced.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A multilayer infinite length LED flexible circuit board, comprising:

the front side attaching assembly comprises a character attaching layer and a first solder mask layer, and the character attaching layer is attached to a first side surface of the first solder mask layer;

the circuit board is provided with a second side face, far away from the character attaching layer, of the first solder mask layer, and comprises a front circuit layer, a double-sided board conduction layer and a back circuit layer which are sequentially arranged, the front circuit layer is also arranged on the first solder mask layer, a plurality of conducting holes are formed in the double-sided board conduction layer, and the conducting holes are used for enabling the front circuit layer and the back circuit layer to be electrically connected;

the conductive bonding assembly is arranged on the back circuit layer and comprises a conductive bonding layer and a pure glue layer, a first bonding surface of the conductive bonding layer is attached to one side surface, away from the double-sided board conduction layer, of the back circuit layer, a second bonding surface of the conductive bonding layer is attached to the pure glue layer, a plurality of conduction points are arranged on the conductive bonding layer, a plurality of conductive holes are arranged on the pure glue layer, and the conduction points are arranged in the conductive holes in a one-to-one correspondence manner; and

the attached subassembly in back, the attached subassembly in back includes back metal level and second solder mask, back metal level laminate fit the pure glue film is kept away from on the side of conductive bonding layer, the back metal level still set up in on the second solder mask.

2. The multilayer infinite length LED flexible circuit board of claim 1, wherein the back metal layer comprises a layer of braided wire or a layer of pure copper foil.

3. The multilayer infinite length LED flexible circuit board of claim 2, wherein the pure copper foil layer is cut into a plurality of copper foil strips by a whole roll of pure copper foil, a space is respectively arranged between the copper foil strips, the copper foil strips are respectively pressed on one side surface of the pure adhesive layer away from the conductive adhesive layer, and the copper foil strips are respectively arranged on the second solder mask layer.

4. The multilayer infinite length LED flexible circuit board of claim 2, wherein the back metal layer has a width of 1mm to 20 mm.

5. The multilayer infinite length LED flexible circuit board of claim 3, wherein the copper foil strip has a thickness of 0.025mm to 10 mm.

6. The multilayer infinite length LED flexible circuit board according to claim 1, wherein the conductive adhesive layer is a conductive glue layer or a conductive solvent layer.

7. The multilayer infinite length LED flexible circuit board of claim 1, wherein the thickness of the conductive adhesive layer is 15um to 100 um.

8. The multilayer infinite length LED flexible circuit board of claim 1, wherein the thickness of the clear adhesive layer is 20um to 100 um.

9. The multilayer infinite length LED flexible circuit board of claim 1, wherein a plurality of solder windows are formed in the first solder mask layer, and a space is respectively provided between each solder window.

10. The multilayer infinite length LED flexible circuit board of claim 9, further comprising a plurality of electronic components, each of the electronic components being soldered in one-to-one correspondence in the solder windows, respectively.

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