CN206743674U - A kind of double-faced flexible wiring board - Google Patents
A kind of double-faced flexible wiring board Download PDFInfo
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- CN206743674U CN206743674U CN201720643092.4U CN201720643092U CN206743674U CN 206743674 U CN206743674 U CN 206743674U CN 201720643092 U CN201720643092 U CN 201720643092U CN 206743674 U CN206743674 U CN 206743674U
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Abstract
A kind of double-faced flexible wiring board of disclosure, including insulated substrate, the upper surface of the insulated substrate is sequentially provided with top conductive line layer and top insulating film layer, its lower surface is sequentially provided with bottom conductive line layer and bottom insulation film layer, multipair first through hole is located on the top insulating film layer, each pair first through hole includes positive pole through hole and negative pole through hole, so that element is solderable thereon and to turn on the series connection realized between element with top conductive line layer, the both ends of the top insulating film layer are respectively equipped with a pair of end portions through hole, each pair end through hole includes positive pole through hole and negative pole through hole, the top conductive line layer and insulated substrate and the positive pole through hole in the through hole of end, position corresponding to negative pole through hole forms half pore structure, so that top conductive line layer realizes turned in parallel with bottom conductive line layer in a postwelding.The application sets bottom conductive line layer in the lower surface of insulating substrate, the shortcomings that avoiding traditional one-sided circuit board, reduces the thickness of wiring board.
Description
Technical field
The application is related to flexible PCB technical field, more particularly to a kind of double-faced flexible wiring board.
Background technology
Flexible PCB referred to as " soft board ", FPC is commonly called as in industry, is the printed circuit made of flexible insulating substrate
Plate, there is the advantages of many rigid printed circuit boards do not possess.Such as it can be folded etc. with free bend, convolution.Utilize flexible electrical
Road plate can be substantially reduced the volume of electronic product, be applicable the need that electronic product develops to high density, miniaturization, highly reliable direction
Will.Therefore, flexible PCB is in fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital cameras
Or it is widely used on product.
Light bar is the more popular field of flexible PCB application.So-called light bar, refer to LED with special
Processing technology is welded on flexible PCB, reconnects electrical source luminescent, and it has the characteristics that service life length, energy-conserving and environment-protective.With
People's living standards continue to improve, LED is widely used in decorative lighting place, such as neon light, large-scale day
Line wiring board, captions advertisement, signboard, smallpox illumination etc..But flexible PCB is one side line used by light bar traditionally
Road, use juxtaposed wire producing single-sided circuit board as the patent of invention of Application No. 201010232537.2 discloses one kind
Method, the circuit board prepared using this method is single-sided circuit board, and the problem of this single-sided circuit board is present is, with LED
After lamp combines to form light bar, single-sided circuit board must be connected wire in addition by the light bar when powering, and not only increase the body of light bar
Product, and manually-operated complexity can be increased.Because manual operation has error, for a long time using rear wire and LED
Loose contact easily causes the intermittent failure of light bar so that the service life of light bar declines.
Therefore, in view of the shortcomings of the prior art, it is necessary to which this is improved.
Utility model content
In view of this, the purpose of this utility model is overcome the deficiencies in the prior art, there is provided one kind can effectively reduce line
Road plate thickness and the double-faced flexible wiring board that element and wiring board contact stabilization can be improved.
In order to solve the above-mentioned technical problem, the utility model is realized using following scheme：
A kind of double-faced flexible wiring board, the conducting for element（Element includes but is not limited to LED, resistance）, including it is exhausted
Edge basic unit, the upper surface of the insulated substrate are sequentially provided with top conductive line layer and top insulating film layer, and its lower surface is successively
Provided with bottom conductive line layer and bottom insulation film layer（Top insulating film layer and bottom insulation film layer are preferably PET film.Lead at top
The upper surface that electric line layer and top insulating film layer are arranged on insulated substrate is the upper surface for being fixedly installed on insulated substrate；Bottom
The lower surface that conductive circuit layer and bottom insulation film layer are arranged on insulated substrate is the lower surface for being fixedly installed on insulated substrate, such as
Each interlayer passes through adhesive bond）, multipair first through hole is located on the top insulating film layer, and each pair first through hole is led to including positive pole
Hole and negative pole through hole so that element is solderable thereon and to turn on the series connection realized between element with top conductive line layer, described
The both ends of top insulating film layer are respectively equipped with a pair of end portions through hole, and each pair end through hole includes positive pole through hole and negative pole through hole, institute
State the corresponding position of top conductive line layer and insulated substrate and the positive pole through hole in the through hole of end, negative pole through hole and form half bore knot
Structure so that top conductive line layer realizes turned in parallel with bottom conductive line layer in a postwelding, and paired first through hole is set
Between two pairs of end through holes.
When the positive wire and cathode conductor in the external world are welded in the through hole of end, the confession of top conductive line layer can be realized
The power supply of electricity and bottom conductive line layer.It is series connection to be welded between each element of top conductive line layer, and electric current is by positive pole
Wire is flowed into by the positive pole through hole of one pair of which end through hole, is flowed out from the negative pole through hole of another pair end through hole, from negative pole
The electric current of through hole outflow returns to cathode conductor by bottom conductive line layer.When the end of a plurality of wiring board is joined together to form
During longer wiring board（Here connection is construed as continuous continual integraty connection, i.e., in process of production, production
Go out length and be several times as much as above-mentioned wiring board）, because bottom conductive line layer is in parallel with top conductive line layer, therefore, bottom is led
Electric line layer can give the top conductive line layer power supply of each section of wiring board respectively, so as to substitute of the prior art use
The lower surface of wiring board connects wire and solves the problems, such as power supply, substantially reduces the thickness of wiring board, bottom conductive line layer is straight
The lower surface for being bonded in insulated substrate is connect, there is higher connective stability.
Top conductive line layer and bottom conductive line layer are formed usually using the technique of etching or punching, in order to prevent work
Skill error prevents top conductive line layer corresponding to the through hole of end and bottom conductive line layer from turning on parallel connection.In the application,
Led on the top insulating film layer, close to the paired first through hole of one pair of which end through hole, the corresponding top of its positive pole through hole
Electric line layer and insulated substrate form half pore structure or complete opening structure；Lead on the top insulating film layer, close to another pair end
The paired first through hole in hole, top conductive line layer corresponding to its negative pole through hole and insulated substrate form half pore structure or complete opening knot
Structure.By as above technological means, it can not realize that conducting is in parallel in top conductive line layer corresponding to the through hole of end and insulated substrate
In the case of, the conducting of top conductive line layer and insulated substrate can be also realized by the first through hole of close end through hole.
First through hole on the insulating film layer of top rolls punching by equipment and formed, when needing to prepare the longer circuit of length
Plate, if need to be punched to the rolling of the wiring board completion a cycle of this length, the bulky of equipment, cost is very high.For
Such case is avoided, on top insulating film layer described herein, between two pairs of end through holes, provided with logical among at least one set
Hole, every group of intermediate throughholes include two pairs of sizes intermediate throughholes consistent with paired end through hole respectively, and paired first is logical
Hole is arranged between paired end through hole and groups of intermediate throughholes.On the insulating film layer of top, set among at least one set of
Through hole, that is, the cycle is punched between paired end through hole and paired intermediate throughholes for a rolling, in a wiring board
On, at least one set of above-mentioned intermediate throughholes addressed are set（Namely the top insulating film layer of a wiring board is at least through two rollings
The pressure punching cycle is made）, the volume and cost of equipment can be greatly lowered.In addition, intermediate throughholes are one group, namely two pairs,
So that when producing the wiring board of continuous length, during above-mentioned wiring board as twice such as production length（Equivalent to two lines road plate
End is connected）, one group of end through hole can be formed（That is two pairs of end through holes）, can be at one group of end when applied to different scenes
The position of portion's through hole（Between two pairs of intermediate throughholes）Wiring board is cut off, so as to form two lines road plate, adapts to different demands.
Further, integrated cost, factor of production etc., the length of the wiring board is 0.5 ~ 1.5m.Preferably, the line
The length of road plate pair is 1m.
In order to improve illumination effect when wiring board to be applied to light bar, the top insulating film layer is provided with one layer of colored painting
Layer.Coloured coating can be red coatings, green coating, yellow coating etc., relative with LED etc. glow color by coating
Should, illumination effect can be greatly improved.
Further, the application provides a kind of wiring board of specific conducting wire：The bottom conductive line layer includes edge
The cathode metal layer and negative metal layer of the alternate setting of wiring board length direction；The top conductive line layer includes end metal
Layer and the first intermediate metal layer being arranged between terminal metal layer；
First intermediate metal layer includes the first metal layer, second metal layer and the 3rd Z-shaped gold medal of alternate setting
Belong to layer, the both ends of the 3rd metal level are relative with cathode metal layer and negative metal layer respectively, and it is close to terminal metal layer
Set；The first metal layer is relative with negative metal layer, and the second metal layer is relative with cathode metal layer, first gold medal
Belong to layer and second metal layer to set close to the 3rd metal level and both mutual dislocations；The first metal layer and second metal layer structure
The first intermediate metal layer is formed into a unit and repeated arrangement alternate with the 3rd metal level；
The terminal metal layer includes short side metal level and long side metal level, the short side metal of one pair of which terminal metal layer
Layer is relative with negative metal layer, and long side metal level is relative with cathode metal layer, and long side metal level is relative with negative metal layer
One end of the 3rd metal level shift to install；The short side metal level of another pair terminal metal layer is relative with cathode metal layer, long side
Metal level is relative with negative metal layer, and one end dislocation of long side metal level threeth metal level relative with cathode metal layer is set
Put；
Paired first through hole is relative with long side metal level and the 3rd metal level respectively, with the 3rd metal level and the first metal
Layer is relative, relative with the first metal layer and second metal layer, relative with second metal layer and the 3rd metal level so that each element can
Series connection is formed by first through hole installation in the circuit board；Paired end through hole respectively with long side metal level and short side metal level
Relatively so that top conductive line layer and bottom conductive line layer can turn on parallel connection.
Further, the application provides the wiring board of another specific conducting wire：The bottom conductive line layer includes
Along the cathode metal layer and negative metal layer of the alternate setting of wiring board length direction；The top conductive line layer includes end gold
Belong to layer, second intermediate metal layer consistent with intermediate throughholes group number being arranged between terminal metal layer, and be arranged on end
The first intermediate metal layer between metal level and the second intermediate metal layer；
First intermediate metal layer includes the first metal layer, second metal layer and the 3rd Z-shaped gold medal of alternate setting
Belong to layer, the both ends of the 3rd metal level are relative with cathode metal layer and negative metal layer respectively, and it is close to terminal metal layer
Set；The first metal layer is relative with negative metal layer, and the second metal layer is relative with cathode metal layer, first gold medal
Belong to layer and second metal layer to set close to the 3rd metal level and both mutual dislocations；The first metal layer and second metal layer structure
The first intermediate metal layer is formed into a unit and repeated arrangement alternate with the 3rd metal level；
Second intermediate metal layer is Z-shaped, and its both ends is relative with cathode metal layer and negative metal layer respectively, and its two
Side is respectively close to the 3rd metal level and spaced；
The terminal metal layer includes short side metal level and long side metal level, the short side metal of one pair of which terminal metal layer
Layer is relative with negative metal layer, and long side metal level is relative with cathode metal layer, and long side metal level is relative with negative metal layer
One end of the 3rd metal level shift to install；The short side metal level of another pair terminal metal layer is relative with cathode metal layer, long side
Metal level is relative with negative metal layer, and one end dislocation of long side metal level threeth metal level relative with cathode metal layer is set
Put；
Paired first through hole is relative with long side metal level and the 3rd metal level respectively, with the 3rd metal level and the first metal
Layer is relative, relative with the first metal layer and second metal layer, and threeth metal level relative with second metal layer and the 3rd metal level
It is relative with the second intermediate metal layer so that each element can be installed to be formed in the circuit board by first through hole and connected；Paired end
Portion's through hole is relative with long side metal level and short side metal level respectively so that top conductive line layer and bottom conductive line layer can be led
Logical parallel connection, groups of intermediate throughholes are relative with the second intermediate metal layer.
The application provides a kind of continuous double-faced flexible wiring board, is formed by connecting by a plurality of above-mentioned wiring board addressed（This
In connection be construed as continuous continual integraty connection, i.e., in process of production, produce length be several times as much as it is above-mentioned
The wiring board addressed）.Further, the paired end through hole of the connection end of the wiring board of adjacent connection and close end through hole
Paired first through hole put solder(ing) paste respectively.
Compared with prior art, the utility model has the advantages that：The application uses double-sided symmetrical structure, exhausted
The lower surface of edge base material sets bottom conductive line layer, the shortcomings that avoiding traditional one-sided circuit board, reduces the thickness of wiring board
Degree so that its application is wider.End through hole corresponds to top conductive line layer and insulated substrate forms half pore structure, and top is led
Electric line layer and bottom conductive circuit from contact area it is big, point postwelding connective stability is high.By setting among at least one set of
Through hole, the cost of equipment can be substantially reduced, realize the preparation of the longer wiring board of length.
Brief description of the drawings
Fig. 1 is the circuit board structure schematic diagram of embodiment 1；
Fig. 2 is the top conductive line layer structural representation of embodiment 1（Through hole is top insulating film layer and top conductive in figure
The corresponding relation of line layer is illustrated, and top insulating film layer is not drawn in figure）；
Fig. 3 is Fig. 2 partial structural diagrams；
Fig. 4 is Fig. 2 partial structural diagrams；
Fig. 5 is the bottom conductive line layer structural representation of embodiment 1；
Fig. 6 is first through hole, end through hole and the intermediate throughholes and top conductive line layer of the top insulating film layer of embodiment 1
Corresponding relation schematic diagram；
Fig. 7 is Fig. 6 partial schematic diagram；
Fig. 8 is Fig. 6 partial schematic diagram；
Fig. 9 is the two lines road board connecting structure schematic diagram of embodiment 2；
Figure 10 is the wiring board end construction schematic diagram of embodiment 3；
Figure 11 is the wiring board end construction schematic diagram of embodiment 4；
Figure 12 is the circuit board structure schematic diagram of embodiment 5.
Embodiment
In order to allow those skilled in the art to more fully understand the technical solution of the utility model, below in conjunction with the accompanying drawings to this
Utility model is further elaborated.
Embodiment 1
As shown in Fig. 1 ~ 8, a kind of double-faced flexible wiring board, for the conducting of element, the element includes LED and electricity
Resistance, including insulated substrate 100, the upper surface of the insulated substrate 100 are sequentially provided with top conductive line layer 200 and top insulation
Film layer 300, its lower surface are sequentially provided with bottom conductive line layer 400 and bottom insulation film layer 500.
As shown in Fig. 2 ~ 5, the bottom conductive line layer 400 includes the positive pole gold along the alternate setting of wiring board length direction
Belong to layer 410 and negative metal layer 420；The top conductive line layer 200 includes terminal metal layer 210, is arranged on end metal
The second intermediate metal layer 230 between layer 210, and be arranged between the intermediate metal layer 230 of terminal metal layer 210 and second
First intermediate metal layer 220.
The first metal layer 221 of first intermediate metal layer 220 including alternate setting, second metal layer 222 and Z-shaped
The 3rd metal level 223, the both ends of the 3rd metal level 223 respectively with cathode metal layer 410 and the phase of negative metal layer 420
It is right, and it is set close to terminal metal layer 210；The first metal layer 221 is relative with negative metal layer 420, second gold medal
It is relative to belong to layer 222 and cathode metal layer 410, the first metal layer 221 and second metal layer 222 are close to the 3rd metal level 223
And both mutual dislocations are set；The first metal layer 221 and second metal layer 222 form a unit and with the 3rd metal level
223 alternate repeated arrangements form the first intermediate metal layer 220.
Second intermediate metal layer 230 is Z-shaped, its both ends respectively with cathode metal layer 410 and the phase of negative metal layer 420
It is right, and its both sides is respectively close to the 3rd metal level 223 and spaced.
The terminal metal layer 210 includes short side metal level 212 and long side metal level 211, one pair of which terminal metal layer
Short side metal level 212 and negative metal layer 420 it is relative, long side metal level 211 is relative with cathode metal layer 410, and long side gold
One end of category layer 211 threeth metal level 223 relative with negative metal layer 420 shifts to install；Another pair terminal metal layer
Short side metal level 212 is relative with cathode metal layer 410, and long side metal level 211 is relative with negative metal layer 420, and long side metal
One end of 211 threeth metal level 223 relative with cathode metal layer 410 of layer shifts to install.
As shown in Fig. 6 ~ 8, multipair first through hole 310, each pair first through hole 310 are located on the top insulating film layer 300
Including positive pole through hole 311 and negative pole through hole 312（Positive pole through hole and negative pole through hole herein is comparatively, electric current flows into element
For positive pole through hole, flow out element for negative pole through hole）So that element is solderable to lead thereon and with top conductive line layer 200
The logical series connection realized between element（Element is welded in the first through hole of each pair, for the LED and resistance in element, according to
It is actually needed and is allocated adjustment）.The both ends of the top insulating film layer 300 are respectively equipped with a pair of end portions through hole 320, per opposite end
Portion's through hole 320 includes positive pole through hole 321 and negative pole through hole 322, the top conductive line layer 200 and insulated substrate 100 and end
Position corresponding to positive pole through hole 321, negative pole through hole 322 in portion's through hole forms half pore structure（As shown in figure 8, half pore structure makes
Obtain part corresponding to positive pole through hole 321 and negative pole through hole 322 and expose top conductive line layer 200 and bottom conductive line layer
400）So that top conductive line layer 200 realizes turned in parallel with bottom conductive line layer 400 in a postwelding.
As shown in fig. 6, on the top insulating film layer, between two pairs of end through holes, provided with one group of intermediate throughholes 330, in
Between through hole 330 include two pairs of sizes intermediate throughholes consistent with paired end through hole 320 respectively, paired first through hole
310 are arranged between paired end through hole 320 and groups of intermediate throughholes 330.
Paired first through hole 310 is relative with the metal level 223 of long side metal level 211 and the 3rd respectively, with the 3rd metal level
223 and the first metal layer 221 it is relative, it is relative with the first metal layer 221 and second metal layer 222, with second metal layer 222 and the
Three metal levels 223 are relative, relative with the 3rd metal level 223 and the second intermediate metal layer 230 so that each element can be logical by first
Hole installation forms series connection in the circuit board；Paired end through hole 320 respectively with long side metal level 211 and short side metal level 212
Relatively so that top conductive line layer 200 and bottom conductive line layer 400 can turn on parallel connection, groups of intermediate throughholes 330 and
Two intermediate metal layers 230 are relative.
The length of above-mentioned wiring board is 1m.
Embodiment 2
As shown in figure 9, being formed by connecting by the wiring board described in a plurality of embodiment 1, connection here is interpreted as continuously not
In process of production the integraty connection of interruption, i.e., produce length and be several times as much as above-mentioned wiring board.Two sections shown in Fig. 9
Interval between wiring board be present, this is to preferably express the annexation of both ends and the technique of painting that uses, actual production
It is upper that interval is not present.The paired end through hole of the connection end of every wiring board and the paired first through hole point close to end through hole
Other solder(ing) paste.
Embodiment 3
The present embodiment is similar to Example 1, and difference is, as shown in Figure 10, on the top insulating film layer 300, close
The paired first through hole of one pair of which end through hole 320, top conductive line layer and insulated substrate shape corresponding to its positive pole through hole
Help pore structure（As shown in Figure 10, complete opening structure make it that bottom conductive line layer 400 is exposed in part corresponding to positive pole through hole）；Institute
State on the insulating film layer of top, close to the paired first through hole of another pair end through hole, top conductive line corresponding to its negative pole through hole
Road floor and insulated substrate form complete opening structure.
Embodiment 4
The present embodiment is similar to Example 1, and difference is, as shown in figure 11, on the top insulating film layer 300, close
The paired first through hole of one pair of which end through hole 320, top conductive line layer and insulated substrate shape corresponding to its positive pole through hole
Into half pore structure（As shown in figure 11, half pore structure make it that bottom conductive line layer 400 and top are exposed in part corresponding to positive pole through hole
Portion's conductive circuit layer 200）；Lead on the top insulating film layer, close to the paired first through hole of another pair end through hole, its negative pole
Top conductive line layer corresponding to hole and insulated substrate form half pore structure.
Embodiment 5
The present embodiment is similar with embodiment 1 or embodiment 3 or embodiment 4, and difference is, as shown in figure 12, in end gold
The first intermediate metal layer 220 is provided only between category layer 210.Paired first through hole 310 respectively with long side metal level 211 and the 3rd
Metal level 223 is relative, and the first metal layer 221 and second metal layer relative with the 3rd metal level 223 and the first metal layer 221
222 is relative, relative with the metal level 223 of second metal layer 222 and the 3rd so that each element can be arranged on circuit by first through hole
Series connection is formed on plate；Paired end through hole 320 is relative with long side metal level 211 and short side metal level 212 respectively so that top
Conductive circuit layer 200 and bottom conductive line layer 400 can turn on parallel connection.
Above-described embodiment is only wherein specific implementation of the present utility model, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the utility model patent scope can not be interpreted as.It should be pointed out that the ordinary skill for this area
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are apparent
Alternative forms belong to the scope of protection of the utility model.
Claims (10)
1. a kind of double-faced flexible wiring board, for the conducting of element, including insulated substrate, the upper surface of the insulated substrate is successively
Provided with top conductive line layer and top insulating film layer, its lower surface is sequentially provided with bottom conductive line layer and bottom insulating film
Layer, multipair first through hole is located on the top insulating film layer, each pair first through hole includes positive pole through hole and negative pole through hole so that
Element is solderable thereon and to turn on the series connection realized between element with top conductive line layer, it is characterised in that the top is exhausted
The both ends of velum layer are respectively equipped with a pair of end portions through hole, and each pair end through hole includes positive pole through hole and negative pole through hole, the top
Conductive circuit layer and insulated substrate and the positive pole through hole in the through hole of end, negative pole through hole half pore structure of corresponding position formation, make
Obtain top conductive line layer and realize turned in parallel in a postwelding with bottom conductive line layer, paired first through hole is arranged on two pairs
Between the through hole of end.
2. double-faced flexible wiring board according to claim 1, it is characterised in that on the top insulating film layer, close to it
The paired first through hole of middle a pair of end portions through hole, top conductive line layer corresponding to its positive pole through hole and insulated substrate form half bore
Structure or complete opening structure；On the top insulating film layer, close to the paired first through hole of another pair end through hole, its negative pole through hole
Corresponding top conductive line layer and insulated substrate form half pore structure or complete opening structure.
3. double-faced flexible wiring board according to claim 1, it is characterised in that on the top insulating film layer, two opposite ends
Between portion's through hole, provided with least one set of intermediate throughholes, every group of intermediate throughholes include two pairs of sizes respectively with paired end through hole
Consistent intermediate throughholes, paired first through hole are arranged between paired end through hole and groups of intermediate throughholes.
4. according to the double-faced flexible wiring board described in claim 1 or 2 or 3, it is characterised in that the length of the wiring board is
0.5~1.5m。
5. double-faced flexible wiring board according to claim 4, it is characterised in that the length of the wiring board is 1m.
6. double-faced flexible wiring board according to claim 1, it is characterised in that the top insulating film layer is provided with one layer
Coloured coating.
7. double-faced flexible wiring board according to claim 1, it is characterised in that along the bottom conductive line layer includes
The cathode metal floor and negative metal floor of the alternate setting of road plate length direction；The top conductive line layer includes terminal metal layer
And the first intermediate metal layer being arranged between terminal metal layer；
First intermediate metal layer includes the first metal layer, second metal layer and the 3rd Z-shaped metal level of alternate setting,
The both ends of 3rd metal level are relative with cathode metal layer and negative metal layer respectively, and it is set close to terminal metal layer；
The first metal layer is relative with negative metal layer, and the second metal layer is relative with cathode metal layer, the first metal layer
Set with second metal layer close to the 3rd metal level and both mutual dislocations；The first metal layer and second metal layer form one
Individual unit and repeated arrangement alternate with the 3rd metal level the first intermediate metal layer of formation；
The terminal metal layer includes short side metal level and long side metal level, the short side metal level of one pair of which terminal metal layer with
Negative metal layer is relative, and long side metal level is relative with cathode metal layer, and long side metal level it is relative with negative metal layer
One end of three metal levels shifts to install；The short side metal level of another pair terminal metal layer is relative with cathode metal layer, long side metal
Layer is relative with negative metal layer, and one end of long side metal level threeth metal level relative with cathode metal layer shifts to install；
Paired first through hole is relative with long side metal level and the 3rd metal level respectively, with the 3rd metal level and the first metal layer phase
To, it is relative with the first metal layer and second metal layer, relative with second metal layer and the 3rd metal level so that each element can pass through
First through hole installation forms series connection in the circuit board；Paired end through hole respectively with long side metal level and short side metal level phase
It is right so that top conductive line layer and bottom conductive line layer can turn on parallel connection.
8. double-faced flexible wiring board according to claim 3, it is characterised in that along the bottom conductive line layer includes
The cathode metal floor and negative metal floor of the alternate setting of road plate length direction；The top conductive line layer includes end metal
Layer, second intermediate metal layer consistent with intermediate throughholes group number being arranged between terminal metal layer, and it is arranged on end gold
Belong to the first intermediate metal layer between layer and the second intermediate metal layer；
First intermediate metal layer includes the first metal layer, second metal layer and the 3rd Z-shaped metal level of alternate setting,
The both ends of 3rd metal level are relative with cathode metal layer and negative metal layer respectively, and it is set close to terminal metal layer；
The first metal layer is relative with negative metal layer, and the second metal layer is relative with cathode metal layer, the first metal layer
Set with second metal layer close to the 3rd metal level and both mutual dislocations；The first metal layer and second metal layer form one
Individual unit and repeated arrangement alternate with the 3rd metal level the first intermediate metal layer of formation；
Second intermediate metal layer is Z-shaped, and its both ends is relative with cathode metal layer and negative metal layer respectively, and its both sides point
Not close to the 3rd metal level and spaced；
The terminal metal layer includes short side metal level and long side metal level, the short side metal level of one pair of which terminal metal layer with
Negative metal layer is relative, and long side metal level is relative with cathode metal layer, and long side metal level it is relative with negative metal layer
One end of three metal levels shifts to install；The short side metal level of another pair terminal metal layer is relative with cathode metal layer, long side metal
Layer is relative with negative metal layer, and one end of long side metal level threeth metal level relative with cathode metal layer shifts to install；
Paired first through hole is relative with long side metal level and the 3rd metal level respectively, with the 3rd metal level and the first metal layer phase
To, it is relative with the first metal layer and second metal layer, relative with second metal layer and the 3rd metal level, with the 3rd metal level and the
Two intermediate metal layers are relative so that each element can be installed to be formed in the circuit board by first through hole and connected；Paired end leads to
Hole is relative with long side metal level and short side metal level respectively so that top conductive line layer and bottom conductive line layer can turn on simultaneously
Connection, groups of intermediate throughholes are relative with the second intermediate metal layer.
9. a kind of double-faced flexible wiring board, it is characterised in that as the wiring board connection described in a plurality of any one of claim 1 ~ 8
Into.
10. double-faced flexible wiring board according to claim 9, it is characterised in that the connection end of the wiring board of adjacent connection
Paired end through hole and put solder(ing) paste respectively close to the paired first through hole of end through hole.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720643092.4U CN206743674U (en) | 2017-06-05 | 2017-06-05 | A kind of double-faced flexible wiring board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720643092.4U CN206743674U (en) | 2017-06-05 | 2017-06-05 | A kind of double-faced flexible wiring board |
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| CN206743674U true CN206743674U (en) | 2017-12-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072044A (en) * | 2017-06-05 | 2017-08-18 | 广东顺德施瑞科技有限公司 | A kind of double-faced flexible wiring board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072044A (en) * | 2017-06-05 | 2017-08-18 | 广东顺德施瑞科技有限公司 | A kind of double-faced flexible wiring board |
| CN107072044B (en) * | 2017-06-05 | 2024-04-12 | 广东顺德施瑞科技有限公司 | Double-sided flexible circuit board |
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