CN208247630U - A kind of aluminum-based copper-clad plate - Google Patents
A kind of aluminum-based copper-clad plate Download PDFInfo
- Publication number
- CN208247630U CN208247630U CN201820745864.XU CN201820745864U CN208247630U CN 208247630 U CN208247630 U CN 208247630U CN 201820745864 U CN201820745864 U CN 201820745864U CN 208247630 U CN208247630 U CN 208247630U
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- layer
- aluminum
- thermally conductive
- clad plate
- felt layers
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Abstract
The utility model discloses a kind of aluminum-based copper-clad plate, including aluminum substrate, it is characterized in that: being provided with glass felt layers above the aluminum substrate, insulating layer is provided with above the glass felt layers, heat-conducting layer is provided with above the insulating layer, copper foil layer is provided with above the heat-conducting layer, the corner of inside four of the aluminum substrate is provided with mounting hole, the mounting hole is through to copper foil layer, epoxy resin is provided on the glass felt layers, resin particle is provided on the inside of the insulating layer, the heat-conducting layer is made of the first thermally conductive polyimide layer and the second thermally conductive polyimide layer, the first thermally conductive polyimide layer and the second thermally conductive polyimide layer are located at the two sides of insulating layer.The machining property of aluminum-based copper-clad plate can be improved in the utility model, is unlikely to deform in processing, dimensionally stable.
Description
Technical field
The utility model discloses a kind of aluminum-based copper-clad plate, belongs to technical field of copper clad laminate.
Background technique
Basic material one of of the copper-clad plate as PCB is to soak supporting material with resin, and one or both sides are coated with copper
Foil mainly plays interconnection, insulation and support to pcb board through a kind of board-like material made of hot pressing.Existing aluminium base
Often there is deformation in processing in copper-clad plate, so that deviation occur in the size produced and the size originally designed, so that can go out
Now a large amount of waste product is now badly in need of solving the problems, such as this.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of aluminum-based copper-clad plate, with solution
Certainly the problems mentioned above in the background art.
To achieve the above object, the utility model provides following technical solution to realize:
A kind of aluminum-based copper-clad plate, including aluminum substrate, it is characterized in that: glass felt layers are provided with above the aluminum substrate, institute
It states and is provided with insulating layer above glass felt layers, heat-conducting layer is provided with above the insulating layer, is set above the heat-conducting layer
It is equipped with copper foil layer, the corner of inside four of the aluminum substrate is provided with mounting hole, and the mounting hole is through to copper foil layer, institute
It states and is provided with epoxy resin on glass felt layers, resin particle is provided on the inside of the insulating layer, the heat-conducting layer is thermally conductive by first
Polyimide layer and the second thermally conductive polyimide layer composition, the first thermally conductive polyimide layer and the second thermally conductive polyimide layer
It is located at the two sides of insulating layer, the thickness of the first thermally conductive polyimide layer and the thickness one of the second thermally conductive polyimide layer
Sample, the bottom surface of the aluminum substrate and the upper surface of copper foil layer are provided with release protective film, the release protective film by it is interior outward
It successively include erosion resistant coating, antioxidation coating and waterproof layer, the erosion resistant coating is made of polyethylene coating, and the waterproof layer is by aeroge
Material is made.
As preferred: the inner surface of the mounting hole is provided with soft epoxy resin glue and insulating coating.
As preferred: the weight of the epoxy resin accounts for the one third of the weight of glass felt layers.
As preferred: the two sides of the glass felt layers are provided with adhesive.
As preferred: the copper foil layer is laminated structure.
As preferred: the aluminum substrate is made of the higher H22 type aluminium of pliability.
The utility model has the beneficial effects that
By being provided with mounting hole, does not need to be punched out again after entire copper-clad plate is bonded, avoid and covered in punching
There is the problem of deformation in copper sheet, and the inner surface in mounting hole is provided with soft epoxy resin glue, improves the machinery of aluminum substrate
Processability prevents the problem of size distortion occur in processing, by being provided with glass felt layers and being provided on glass felt layers
Epoxy resin improves the machining property and dimensional stability of glass felt layers, by be provided with the first thermally conductive polyimide layer and
Second thermally conductive polyimide layer, improves the thermal conductivity of copper-clad plate, by being provided with release protective film, prevent copper-clad plate occur into
The problem of water, surface oxidation and corrosion；Using aluminum substrate made of H22 type aluminium, improve the buckle resistance of aluminum substrate, make its
Size distortion is less prone to when processing.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of aluminum-based copper-clad plate of the utility model；
Fig. 2 is the structural schematic diagram of the release protective film of the utility model.
Appended drawing reference: 1, aluminum substrate；2, glass felt layers；3, insulating layer；4, heat-conducting layer；41, the second thermally conductive polyimide layer；
42, the first thermally conductive polyimide layer；5, copper foil layer；6, release protective film；61, waterproof layer；62, antioxidation coating；63, erosion resistant coating；
7, mounting hole；8, epoxy resin；9, resin particle.
Specific embodiment
A kind of aluminum-based copper-clad plate of the utility model is described further referring to Figures 1 and 2.
A kind of aluminum-based copper-clad plate, including aluminum substrate 1, it is characterized in that: the top of the aluminum substrate 1 is provided with glass felt layers 2,
The top of the glass felt layers 2 is provided with insulating layer 3, and the top of the insulating layer 3 is provided with heat-conducting layer 4, the heat-conducting layer 4
Top is provided with copper foil layer 5, and the corner of inside four of the aluminum substrate 1 is provided with mounting hole 7, and the mounting hole 7 runs through
To copper foil layer 5, epoxy resin 8 is provided on the glass felt layers 2, the inside of the insulating layer 3 is provided with resin particle 9, described
Heat-conducting layer 4 is made of the first thermally conductive polyimide layer 42 and the second thermally conductive polyimide layer 41, the first thermally conductive polyimides
Layer 42 and the second thermally conductive polyimide layer 41 are located at the two sides of insulating layer 3, the thickness of the first thermally conductive polyimide layer 42
Degree is of uniform thickness with the second thermally conductive polyimide layer 41, and the bottom surface of the aluminum substrate 1 and the upper surface of copper foil layer 5 are provided with
Release protective film 6, the release protective film 6 by it is interior outward successively include erosion resistant coating 63, antioxidation coating 62 and waterproof layer 61, it is described
Erosion resistant coating 63 is made of polyethylene coating, and the waterproof layer 61 is made of aerogel material, and the inner surface of the mounting hole 7 is set
It is equipped with soft epoxy resin glue and insulating coating, the weight of the epoxy resin 8 accounts for the one third of the weight of glass felt layers 2,
The two sides of the glass felt layers 2 are provided with adhesive, and the copper foil layer 5 is laminated structure, and the aluminum substrate 1 uses pliability
Higher H22 type aluminium is made.
By being provided with mounting hole 7, does not need to be punched out again after entire copper-clad plate is bonded, avoid and covered in punching
There is the problem of deformation in copper sheet, by being provided with soft epoxy resin glue in the inner surface of mounting hole 7, improves the machine of aluminum substrate 1
Tool processability prevents the problem of size distortion occur in processing, by being provided with glass felt layers 2 and setting on glass felt layers 2
It is equipped with epoxy resin 8, improves the machining property and dimensional stability of glass felt layers 2, it is sub- by being provided with the first thermally conductive polyamides
Amine layer 42 and the second thermally conductive polyimide layer 41, improve the thermal conductivity of copper-clad plate, by being provided with release protective film 6, prevent
There is the problem of water inlet, surface oxidation and corrosion in copper-clad plate；Using aluminum substrate 1 made of H22 type aluminium, aluminum substrate 1 is improved
Buckle resistance makes it be less prone to size distortion in processing.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of aluminum-based copper-clad plate, including aluminum substrate, it is characterized in that: glass felt layers are provided with above the aluminum substrate, it is described
It is provided with insulating layer above glass felt layers, heat-conducting layer, the top setting of the heat-conducting layer are provided with above the insulating layer
There is copper foil layer, the corner of inside four of the aluminum substrate is provided with mounting hole, and the mounting hole is through to copper foil layer, described
It is provided with epoxy resin on glass felt layers, resin particle is provided on the inside of the insulating layer, the heat-conducting layer is thermally conductive poly- by first
Imide layer and the second thermally conductive polyimide layer composition, the first thermally conductive polyimide layer and the second thermally conductive polyimide layer point
Not Wei Yu insulating layer two sides, the thickness of the first thermally conductive polyimide layer and the thickness one of the second thermally conductive polyimide layer
Sample, the bottom surface of the aluminum substrate and the upper surface of copper foil layer are provided with release protective film, the release protective film by it is interior outward
It successively include erosion resistant coating, antioxidation coating and waterproof layer, the erosion resistant coating is made of polyethylene coating, and the waterproof layer is by aeroge
Material is made.
2. a kind of aluminum-based copper-clad plate according to claim 1, it is characterized in that: the inner surface of the mounting hole be provided with it is soft
Property epoxide-resin glue.
3. a kind of aluminum-based copper-clad plate according to claim 1, it is characterized in that: the weight of the epoxy resin accounts for glass felt layers
Weight one third.
4. a kind of aluminum-based copper-clad plate according to claim 1, it is characterized in that: the two sides of the glass felt layers are provided with glue
Stick.
5. a kind of aluminum-based copper-clad plate according to claim 1, it is characterized in that: the copper foil layer is laminated structure.
6. a kind of aluminum-based copper-clad plate according to claim 1, it is characterized in that: the aluminum substrate is higher using pliability
H22 type aluminium is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820745864.XU CN208247630U (en) | 2018-05-18 | 2018-05-18 | A kind of aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820745864.XU CN208247630U (en) | 2018-05-18 | 2018-05-18 | A kind of aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208247630U true CN208247630U (en) | 2018-12-18 |
Family
ID=66481484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820745864.XU Active CN208247630U (en) | 2018-05-18 | 2018-05-18 | A kind of aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208247630U (en) |
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2018
- 2018-05-18 CN CN201820745864.XU patent/CN208247630U/en active Active
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