CN208962612U - A kind of high dielectric constant double side flexible copper coated board - Google Patents
A kind of high dielectric constant double side flexible copper coated board Download PDFInfo
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- CN208962612U CN208962612U CN201821005718.XU CN201821005718U CN208962612U CN 208962612 U CN208962612 U CN 208962612U CN 201821005718 U CN201821005718 U CN 201821005718U CN 208962612 U CN208962612 U CN 208962612U
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- Prior art keywords
- dielectric constant
- high dielectric
- layer
- copper
- coated
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 239000010949 copper Substances 0.000 title claims abstract description 40
- 239000011889 copper foil Substances 0.000 claims abstract description 48
- 229920001721 polyimide Polymers 0.000 claims abstract description 34
- 239000004642 Polyimide Substances 0.000 claims abstract description 31
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 26
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 25
- 239000007800 oxidant agent Substances 0.000 claims abstract description 25
- 230000001590 oxidative effect Effects 0.000 claims abstract description 25
- 239000000945 filler Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 229920006332 epoxy adhesive Polymers 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000003490 calendering Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 85
- 238000000034 method Methods 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Abstract
The utility model provides a kind of high dielectric constant double side flexible copper coated board, include: single-side coated copper plate, be coated on the high dielectric constant gluing oxidant layer of the single-side coated copper plate and be overlaid on another single-side coated copper plate of the high dielectric constant gluing oxidant layer, the single-side coated copper plate includes copper foil layer and the thermoset polyimide layer for being coated on the copper foil layer surface, and the thermosetting property is stated polyimide layer and is disposed adjacent with the high dielectric constant gluing oxidant layer；High dielectric constant double side flexible copper coated board provided by the utility model with excellent heat resistance, flexibility and processability, and can press at low temperature, be not necessarily to high temperature press, reduce manufacturing cost.
Description
Technical field
The utility model relates to technical field of copper clad laminate more particularly to a kind of high dielectric constant double side flexible copper coated boards.
Background technique
With the development of science and technology with the raising of living standards of the people, electronics and IT products and component towards small-sized
Change, intelligent and lightness direction is developed.High performance electronic component usually needs the capacitor of large capacity, and capacitor
Amount of capacity is directly proportional to the dielectric constant of used medium material and surface area.So needing to be easy in high power capacitor
The high dielectric constant flexibility coat copper plate of large area processing.
Currently, being usually to be covered using high dielectric constant filler filling epoxy adhesive preparation high dielectric constant three-layer process flexibility
Copper sheet prepares two layer method flexibility coat copper plate of high dielectric constant using high dielectric constant filler filled polyimide resin, as in
Method disclosed in state's patent CN20188601U, CN101934619A and United States Patent (USP) US6150456.These methods are no doubt
High dielectric constant flexibility coat copper plate can be obtained, but on the one hand due to being filled with a large amount of Gao Jie in adhesive or insulating basement membrane
Electric constant filler is easy to cause the insulating properties, peel strength, reduction of pliability of flexibility coat copper plate, it is difficult to meet increasingly developed
Flexible printed circuit technical requirements；On the other hand high dielectric constant filler is added in polyimide resin prepare two layer method flexibilities
Copper-clad plate needs to press at 300 DEG C or more when preparing dual platen, this high temperature press ability for needing price extremely expensive
It realizes, it is serious to improve manufacturing cost, it is unfavorable for promoting, the high dielectric constant three-layer process without high temperature press two-sided is scratched
Property copper-clad plate again have the shortcomings that heat resistance deficiency.
Utility model content
The purpose of the utility model is to overcome the defect of the prior art, provides a kind of high dielectric constant double-faced flexible and cover
Copper sheet with excellent heat resistance, flexibility and processability, and can press at low temperature, be not necessarily to high temperature press, reduce manufacture
Cost.
The utility model is realized in this way:
The utility model provides a kind of high dielectric constant double side flexible copper coated board, comprising: single-side coated copper plate, be coated on it is described
The high dielectric constant gluing oxidant layer of single-side coated copper plate and another single side for being overlaid on the high dielectric constant gluing oxidant layer cover copper
Plate, the single-side coated copper plate include copper foil layer and the thermoset polyimide layer for being coated on the copper foil layer surface, the heat
Solidity is stated polyimide layer and is disposed adjacent with the high dielectric constant gluing oxidant layer.
Further, the copper foil layer is any one in rolled copper foil or electrolytic copper foil, and the thickness of the copper foil layer
It is 5-70 μm.
Further, the high dielectric constant gluing oxidant layer be high dielectric constant filler filling Halogen-free epoxy adhesive or
Any one in acrylic acid adhesive.Preferably, the thickness of the high dielectric constant gluing oxidant layer is poly- greater than the thermosetting property
The thickness of imide layer.Most preferably, the dielectric layer of high dielectric constant with a thickness of 25-50 μm.Preferably, the high dielectric
The Halogen-free epoxy adhesive of constant filler filling or the dielectric constant of acrylic acid adhesive are all larger than 10.Preferably, the Gao Jie
Electric constant filler is using at least one of inorganic filler, including ceramics, barium titanate, lead titanates, barium strontium titanate.
Further, the thermoset polyimide layer is by being coated on the polyimide acid of copper foil surface through imidization
After formed, the Thermocurable polyimide film layer with a thickness of 5-35 μm.Preferably 5-15 μm.
The utility model has the advantages that
High dielectric constant double side flexible copper coated board provided by the utility model, insulating layer use common Thermocurable polyimide
Layer, does not add inorganic filler, has good heat resistance, dimensional stability, physical mechanical property and processability.By Gao Jie electricity
Constant adhesive is placed between two layers of one-sided copper-clad plate, and low temperature pressing may be implemented, be not necessarily to high temperature roll squeezer, manufacturing cost
It is low, and heat resistance can be effectively improved.Moreover, because thermoset polyimide layer good flame resistance, contacts with air on the outside, and glue
Adhesive layer poor fire, few with air contact area in inside, therefore, which has excellent anti-flammability.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for high dielectric constant double side flexible copper coated board that the utility model embodiment 1 provides；
1, copper foil layer in figure；2, thermoset polyimide layer；3, dielectric layer of high dielectric constant；4, Thermocurable polyimide
Layer；5, copper foil layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
All other embodiment obtained, fall within the protection scope of the utility model.
Embodiment 1
In the present embodiment, a kind of double side flexible copper coated board structure is provided, structure as shown in Figure 1, be divided into 5 layers of structure,
From top to bottom it is followed successively by copper foil layer 1, thermoset polyimide layer 2, high dielectric constant gluing oxidant layer 3, thermoset polyimide layer
4, copper foil layer 5.The high dielectric constant gluing oxidant layer 3 is the Halogen-free epoxy adhesive of Filled with Barium Titanate, and the copper foil layer 1 is
Rolled copper foil, the copper foil layer 5 are electrolytic copper foil.
The copper foil layer 1 with a thickness of 5 μm, the copper foil layer 5 with a thickness of 8 μm, the thermoset polyimide layer 2
With a thickness of 5 μm, the thermoset polyimide layer 4 with a thickness of 10 μm, the high dielectric constant gluing oxidant layer 3 with a thickness of 25
μm。
Embodiment 2
In the present embodiment, a kind of double side flexible copper coated board structure is provided, structure as shown in Figure 1, be divided into 5 layers of structure,
From top to bottom it is followed successively by copper foil layer 1, thermoset polyimide layer 2, high dielectric constant gluing oxidant layer 3, thermoset polyimide layer
4, copper foil layer 5.The high dielectric constant gluing oxidant layer 3 is the Halogen acrylic acid adhesive of ceramic filler, and the copper foil layer 1 is
Rolled copper foil, the copper foil layer 5 are rolled copper foil.
The copper foil layer 1 with a thickness of 15 μm, the copper foil layer 5 with a thickness of 15 μm, the thermoset polyimide layer 2
With a thickness of 10 μm, the thermoset polyimide layer 4 with a thickness of 12 μm, the thickness of the high dielectric constant gluing oxidant layer 3
It is 35 μm.
Embodiment 3
In the present embodiment, a kind of double side flexible copper coated board structure is provided, structure as shown in Figure 1, be divided into 5 layers of structure,
From top to bottom it is followed successively by copper foil layer 1, thermoset polyimide layer 2, high dielectric constant gluing oxidant layer 3, thermoset polyimide layer
4, copper foil layer 5.The high dielectric constant gluing oxidant layer is the Halogen-free epoxy adhesive of lead titanates filling, and the copper foil layer 1 is
Electrolytic copper foil, the copper foil layer 5 are electrolytic copper foil.
The copper foil layer 1 with a thickness of 35 μm, the copper foil layer 5 with a thickness of 50 μm, the thermoset polyimide layer 2
With a thickness of 15 μm, the thermoset polyimide layer 4 with a thickness of 15 μm, the thickness of the high dielectric constant gluing oxidant layer 3
It is 45 μm.
Embodiment 4
In the present embodiment, a kind of double side flexible copper coated board structure is provided, structure as shown in Figure 1, be divided into 5 layers of structure,
From top to bottom it is followed successively by copper foil layer 1, thermoset polyimide layer 2, high dielectric constant gluing oxidant layer 3, thermoset polyimide layer
4, copper foil layer 5.The high dielectric constant gluing oxidant layer is the Halogen-free epoxy adhesive of lead titanates filling, and the copper foil layer 1 is
Electrolytic copper foil, the copper foil layer 5 are electrolytic copper foil.
The copper foil layer 1 with a thickness of 70 μm, the copper foil layer 5 with a thickness of 50 μm, the thermoset polyimide layer 2
With a thickness of 35 μm, the thermoset polyimide layer 4 with a thickness of 10 μm, the thickness of the high dielectric constant gluing oxidant layer 3
It is 50 μm.
Experimental example
The high dielectric constant double side flexible copper coated board that the utility model embodiment 1-4 is provided is tested as follows, specifically
Performance is shown in Table 1:
(1) it peel strength: is tested by IPC-TM-6502.4.9 method.
(2) resistance to dip solderability: double side flexible copper coated board is cut into 5cm × 5cm sample, is impregnated 5 minutes in 300 DEG C of tin,
Layering blistering is seen whether.
(3) it dimensional stability: is tested by IPC-TM-6502.2.4 method.
(4) dielectric constant: SPDR method tests dielectric constant under the conditions of 1MHz.
(5) it anti-flammability: is tested by UL94 method.
Table 1
By upper table 1 it is found that the double side flexible copper coated board of the utility model dielectric constant with higher and good removing
Intensity, heat resistance, dimensional stability and anti-flammability.Moreover, because being bonded two layers of one-sided copper-clad plate using adhesive, press
Temperature is low, usually at 100 DEG C hereinafter, having preferable cost advantage.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection scope within.
Claims (6)
1. a kind of high dielectric constant double side flexible copper coated board characterized by comprising single-side coated copper plate is coated on the single side
The high dielectric constant gluing oxidant layer of copper-clad plate and another single-side coated copper plate for being overlaid on the high dielectric constant gluing oxidant layer,
The single-side coated copper plate includes copper foil layer and the thermoset polyimide layer for being coated on the copper foil layer surface, the thermosetting property
Polyimide layer is stated to be disposed adjacent with the high dielectric constant gluing oxidant layer；The thickness of the high dielectric constant gluing oxidant layer is greater than
The thickness of the thermoset polyimide layer；The high dielectric constant gluing oxidant layer is the Halogen ring of high dielectric constant filler filling
Any one in oxygen adhesive or acrylic acid adhesive, the Halogen-free epoxy adhesive or third of the high dielectric constant filler filling
The dielectric constant of olefin(e) acid adhesive is all larger than 10.
2. high dielectric constant double side flexible copper coated board as described in claim 1, which is characterized in that the copper foil layer is calendering copper
Any one in foil or electrolytic copper foil, and the copper foil layer with a thickness of 5-70 μm.
3. high dielectric constant double side flexible copper coated board as described in claim 1, which is characterized in that the high dielectric constant
Layer with a thickness of 25-50 μm.
4. high dielectric constant double side flexible copper coated board as described in claim 1, which is characterized in that the high dielectric constant filler
Using at least one of inorganic filler, including ceramics, barium titanate, lead titanates, barium strontium titanate.
5. high dielectric constant double side flexible copper coated board as described in claim 1, which is characterized in that the Thermocurable polyimide
Layer with a thickness of 5-35 μm.
6. high dielectric constant double side flexible copper coated board as claimed in claim 5, which is characterized in that the Thermocurable polyimide
Layer with a thickness of 5-15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821005718.XU CN208962612U (en) | 2018-06-26 | 2018-06-26 | A kind of high dielectric constant double side flexible copper coated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821005718.XU CN208962612U (en) | 2018-06-26 | 2018-06-26 | A kind of high dielectric constant double side flexible copper coated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208962612U true CN208962612U (en) | 2019-06-11 |
Family
ID=66748228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821005718.XU Active CN208962612U (en) | 2018-06-26 | 2018-06-26 | A kind of high dielectric constant double side flexible copper coated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208962612U (en) |
-
2018
- 2018-06-26 CN CN201821005718.XU patent/CN208962612U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high dielectric constant double-sided flexible copper clad laminate Effective date of registration: 20211216 Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021420000146 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230106 Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021420000146 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A kind of double-sided flexible copper clad plate with high dielectric constant Effective date of registration: 20230109 Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023420000010 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023420000010 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high dielectric constant double-sided flexible copper clad plate Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980007119 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |