CN207460583U - The multi-layer H DI wiring boards of internal layer interconnection - Google Patents
The multi-layer H DI wiring boards of internal layer interconnection Download PDFInfo
- Publication number
- CN207460583U CN207460583U CN201721213605.4U CN201721213605U CN207460583U CN 207460583 U CN207460583 U CN 207460583U CN 201721213605 U CN201721213605 U CN 201721213605U CN 207460583 U CN207460583 U CN 207460583U
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- China
- Prior art keywords
- layer
- wiring board
- wiring boards
- internal layer
- insulated substrate
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Abstract
The utility model is related to the multi-layer H DI wiring boards that the technical field more particularly to internal layer of wiring board interconnect.The utility model is by two clamping devices each circuit board clamping, avoid bonded in the prior art using hot-setting adhesive each wiring board it is this can not secondary separation structure, therefore, even if after the line layer damage in wherein any one layer of wiring board, it still can be by adjusting clamping device the lossless separation of each wiring board, so that intact wiring board can continue to use, production cost greatly reduces；In addition, the two sides of each wiring board are all covered with PET film layer in addition to the place contacted with through hole, copper base and external environment isolation are come, good electronic isolation function is provided, also improves the service life of wiring board.
Description
Technical field
The utility model is related to the multi-layer H DI wiring boards that the technical field more particularly to internal layer of wiring board interconnect.
Background technology
Wiring board as provide electronic components installation with grafting when main supporter, be all electronic products can not or
Scarce part, in recent years information, communication and consumer electrical product manufacturing industry become the whole world grow up the fastest industry it
One, electronic product makes rapid progress, and is continued to develop towards the direction of small, light weight, function complexity, this proposes wiring board
Higher requirement, traditional circuit board manufacturing process improve printed line by reducing line width or the line-spacing of plate face conducting wire
Direction density is developed with adapting to electronic product to lighter, smaller direction, but line width or the decrement of line-spacing are limited, only by carrying
High plate face line density can not meet the growth requirement of electronic product, therefore high-density interconnection technology (High
DensityInterconnect Technology, HDI) it comes into being, high density interconnection technology is by multilayer line superimposed layer
Pressure produces the high density interconnection line plate of slim, multilayer, stabilization, is connected between each sandwich circuit board by hole conductive.It is highly dense
Interconnection line plate is spent since the number of plies is more, if after the line layer damage in wherein any one layer of wiring board, entire high density is mutual
Connection circuit board can not be then continuing with, and it is low as waste disposal, can only to increase the cost of user, and causes the wave of raw material
Take.
The content of the invention
The purpose of this utility model is to provide a kind of multi-layer H DI wiring boards of internal layer interconnection, can decouple and combine and is each
Sandwich circuit board.
The utility model provides the multi-layer H DI wiring boards of internal layer interconnection, including several sandwich circuit boards, adjacent two layers wiring board
The through hole for turning on this two sandwich circuit board is both provided with, two clamping devices is further included, clamps the both ends of each wiring board respectively, often
A clamping device includes stent, the cross bar and two screw rods that are vertically fixed on stent both ends, this two screw rods are movably connected with
Two cross bars clamp each wiring board by adjusting the distance between this two screw rods；Include insulated substrate per sandwich circuit board, absolutely
The both sides of edge base are equipped with copper base and PET film layer successively, and insulated substrate and copper base, which are equipped with, turns on this two layers of copper base
Through hole is bonded between insulated substrate, copper base and PET film layer by thermosetting glue-line.
Wherein, the briquetting for being located at each screw rod one end is further included.
Wherein, the thickness of the PET film layer is 0.05~0.2mm.
Wherein, the thickness of the insulated substrate is 0.5~1mm.
Wherein, the insulated substrate is pet layer.
Wherein, conducting medium is filled in each through hole.
Wherein, two location holes for running through each wiring board are further included.
Wherein, the inner wall of each location hole scribbles insulating materials.
The beneficial effects of the utility model are：The utility model, each circuit board clamping, is avoided by two clamping devices
In the prior art bonded using hot-setting adhesive each wiring board it is this can not secondary separation structure, therefore, even if wherein arbitrary
After line layer damage in one layer of wiring board, still can by adjusting clamping device the lossless separation of each wiring board, thus
Intact wiring board is made to can continue to use, production cost greatly reduces；In addition, the two sides of each wiring board are removed with leading to
The place of hole contact is outer to be all covered with PET film layer, and copper base and external environment isolation are come, provide good electronic isolation
Function also improves the service life of wiring board.
Description of the drawings
Using attached drawing, the utility model is described in further detail, but the embodiment in attached drawing is not formed to the utility model
Any restrictions, without creative efforts, can also be according to following attached for those of ordinary skill in the art
Figure obtains other attached drawings.
Fig. 1 is the structure diagram of the multi-layer H DI wiring boards of the utility model internal layer interconnection.
Fig. 2 is the sectional view of one sandwich circuit board of the utility model.
Include in fig. 1 and 2：1 --- wiring board, 11 --- insulated substrate, 12 --- copper base, 13 --- PET film
Layer, 14 --- through hole, 2 --- stent, 3 --- cross bar, 4 --- screw rod, 5 --- briquetting, 6 --- through hole, 7 --- conduction is situated between
Matter, 8 --- location hole.
Specific embodiment
The utility model is further described with the following Examples.
As depicted in figs. 1 and 2, the multi-layer H DI wiring boards of the utility model internal layer interconnection, including several sandwich circuit boards 1, phase
Adjacent two sandwich circuit boards 1 are both provided with the through hole 6 for turning on this two sandwich circuit board 1, further include two clamping devices, clamp respectively each
The both ends of wiring board 1, each clamping device include stent 2, the cross bar 3 and two screw rods 4 that are vertically fixed on 2 both ends of stent, this
Two screw rods 4 are movably connected with two cross bars 3, and each wiring board 1 is clamped by adjusting the distance between this two screw rods 3；
Include insulated substrate 11 per sandwich circuit board 1, the both sides of insulated substrate 11 are equipped with copper base 12 and PET film layer 13 successively, and insulate base
Layer 11 and copper base 12 are equipped with the through hole 14 for turning on this two layers of copper base 12, insulated substrate 11, copper base 12 and PET film layer
It is bonded between 13 by thermosetting glue-line, by clamping device each circuit board clamping, avoids and utilize hot-setting adhesive in the prior art
Come bond each wiring board 1 it is this can not secondary separation structure, therefore, even if the circuit in wherein any one layer of wiring board 1
It, still can be by adjusting clamping device the lossless separation of each wiring board, so that intact wiring board 1 can be after after layer damage
It is continuous to use, production cost greatly reduces；In addition, the two sides of each wiring board 1 are covered in addition to the place contacted with through hole 6
PET film layer 13 is stamped, copper base 12 and external environment isolation are come, good electronic isolation function is provided, also improves
The service life of wiring board 1.
Preferably, each screw rod one end be equipped with square briquetting, by square briquetting come increase the area of clamping so as to
Increase clamping effect.
Preferably, the thickness of PET film layer 13 is 0.05~0.2mm, and PET film layer 13 is not more thick better, to be controlled
Superior performance could be brought to wiring board in certain thickness range.If PET film layer 13 is blocked up, although its electronic protection
Function is enhanced, but can increase cost；If PET film layer 13 is excessively thin, good electronic protection ability cannot be played.
Preferably, the thickness of insulated substrate 11 is 0.5~1mm.Further, insulated substrate 11 is pet layer.Intermediate
Pet layer coordinates two layers of copper base and two layers of outside PET film layer 13, and may be such that the thickness of wiring board 1 becomes thinner.
In order to improve the electric conductivity between each wiring board 1, conducting medium 7 is filled in each through hole 6.
It sets there are two the location hole 8 for running through each wiring board 1, positioning when may be used as processing and detect can
It is convenient to high-density interconnection circuit board to set multiple location holes 8 in the case where not influencing the function of wiring board 1 as needed
Detection.Further, the inner wall of each location hole 8 scribbles insulating materials, thus can be to avoid during positioning, gold
The pilot pin of category can be each 1 short circuit of wiring board.
Finally it should be noted that above example is only to illustrate the technical solution of the utility model rather than to this reality
With the limitation of novel protected scope, although being explained in detail with reference to preferred embodiment to the utility model, this field it is general
Lead to it will be appreciated by the skilled person that can be modified or replaced equivalently to the technical solution of the utility model, without departing from this
The spirit and scope of utility model technical solution.
Claims (8)
1. the multi-layer H DI wiring boards of internal layer interconnection, including several sandwich circuit boards (1), adjacent two layers wiring board (1), which is both provided with, leads
Lead to the through hole (6) of this two sandwich circuit board (1), which is characterized in that further include two clamping devices, clamp each wiring board respectively
(1) both ends, each clamping device include stent (2), the cross bar (3) and two screw rods that are vertically fixed on stent (2) both ends
(4), this two screw rods (4) are movably connected with two cross bars (3), are pressed from both sides by adjusting the distance between this two screw rods (4)
Tight each wiring board (1)；Include insulated substrate (11) per sandwich circuit board (1), the both sides of insulated substrate (11) are equipped with copper base successively
(12) and PET film layer (13), insulated substrate (11) and copper base (12) are equipped with the through hole for turning on this two layers of copper base (12)
(14), bonded between insulated substrate (11), copper base (12) and PET film layer (13) by thermosetting glue-line.
2. the multi-layer H DI wiring boards of internal layer interconnection according to claim 1, which is characterized in that further include and be located at each screw rod
(4) briquetting (5) of one end.
3. the multi-layer H DI wiring boards of internal layer interconnection according to claim 1, which is characterized in that the PET film layer (13)
Thickness is 0.05~0.2mm.
4. the multi-layer H DI wiring boards of the internal layer interconnection according to claim 1 or 3, which is characterized in that the insulated substrate
(11) thickness is 0.5~1mm.
5. the multi-layer H DI wiring boards of internal layer interconnection according to claim 4, which is characterized in that the insulated substrate (11)
For pet layer.
6. the multi-layer H DI wiring boards of internal layer interconnection according to claim 1, which is characterized in that be filled in each through hole (6)
Conducting medium (7).
7. the multi-layer H DI wiring boards of internal layer interconnection according to claim 1, which is characterized in that further include two through each
The location hole (8) of wiring board (1).
8. the multi-layer H DI wiring boards of internal layer interconnection according to claim 1, which is characterized in that each location hole (8) is interior
Wall scribbles insulating materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721213605.4U CN207460583U (en) | 2017-09-21 | 2017-09-21 | The multi-layer H DI wiring boards of internal layer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721213605.4U CN207460583U (en) | 2017-09-21 | 2017-09-21 | The multi-layer H DI wiring boards of internal layer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207460583U true CN207460583U (en) | 2018-06-05 |
Family
ID=62283695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721213605.4U Active CN207460583U (en) | 2017-09-21 | 2017-09-21 | The multi-layer H DI wiring boards of internal layer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207460583U (en) |
-
2017
- 2017-09-21 CN CN201721213605.4U patent/CN207460583U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 343100 No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Jiangxi hongban Technology Co., Ltd Address before: 343100 Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: Hongban (Jiangxi) Co., Ltd |
|
| CP03 | Change of name, title or address |