CN217705015U

CN217705015U - High-thermal-conductivity aluminum-based copper-clad plate

Info

Publication number: CN217705015U
Application number: CN202221676353.XU
Authority: CN
Inventors: 卢俊
Original assignee: Jinyun Lanpu Semiconductor Co ltd
Current assignee: Jinyun Lanpu Semiconductor Co ltd
Priority date: 2022-07-01
Filing date: 2022-07-01
Publication date: 2022-11-01
Anticipated expiration: 2032-07-01

Abstract

The utility model discloses a high heat conduction aluminium base copper-clad plate, including aluminium base copper-clad plate main part, the equal fixedly connected with copper sheet crane span structure in both sides of aluminium base copper-clad plate main part, the inside of aluminium base copper-clad plate main part includes aluminium base board, the top of aluminium base board has the copper foil layer through the adhesive bonding, the top of copper foil layer has the HDPE layer through the adhesive bonding, the bottom fixedly connected with heat-conducting layer of aluminium base board. This aluminium base copper-clad plate of high heat conduction, through setting up heat-conducting plate one, heat-conducting plate two, the heat conduction strip, the heat conduction pole, the coolant liquid, the heat dissipation layer, heat conduction stick and heating panel, can be quick effectual with heat conduction to the inside on heat dissipation layer, cool down the processing of dispelling the heat to it through the coolant liquid, it can improve the heat-conducting effect of aluminium base copper-clad plate to set up a plurality of heat conduction structures, heat conduction heat dissipation goes on simultaneously, can improve the life and the work efficiency of aluminium base copper-clad plate, thereby current user's user demand has been satisfied.

Description

High-thermal-conductivity aluminum-based copper-clad plate

Technical Field

The utility model relates to an aluminium base copper-clad plate technical field specifically is an aluminium base copper-clad plate of high heat conduction.

Background

An aluminum-based copper clad laminate, i.e., an aluminum substrate, is one of raw materials, and is a plate-shaped material prepared by using electronic glass fiber cloth or other reinforcing materials, soaking resin, single resin and the like as an insulating bonding layer, coating copper foil on one surface or two surfaces of the insulating bonding layer and performing hot pressing, and is called a copper-clad laminate aluminum substrate, which is called an aluminum-based copper clad laminate for short.

The utility model discloses a contrast file (utility model name: a high heat conduction aluminium base copper-clad plate, patent number: CN 208247651U) this copper-clad plate increases the PET protection film on copper foil layer surface, can protect the surface of copper foil layer, avoid the fish tail to produce the influence to the electric conductivity of copper-clad plate, can tear it when using the copper-clad plate, copper foil layer adopts electrolytic copper to make, thereby obtain the copper foil that copper content is high, improve the electric conductivity of copper-clad plate, prepreg that epoxy glass fiber cloth made not only has good fire-retardant, the electrical insulation can, and can also improve the anti warpage ability of copper-clad plate, utilize phenolic resin can with copper foil layer, prepreg, the heat-conducting layer bonds firmly, and be provided with the arch on prepreg, can increase heat radiating area, and can also make prepreg and heat-conducting layer bond firmly, and cooperate heat conduction filler and heat-conducting layer can be quick with heat transfer to the aluminium base plate on with heat conduction, through the radiating area of aluminium base plate bottom surface, can increase its area of contact with the air, and the arch corresponds with the radiating area, can reduce the distance, thereby realize quick heat dissipation, the graphite flake has good heat conductivity of good heat conduction performance, the aluminium-clad plate can improve the good heat transmission, the aluminium-clad plate of the good heat transmission, and the aluminium base plate of the good heat transmission, the good heat transmission of good heat transmission, the good heat transmission can be concentrated performance of the good heat-clad plate, and the good heat-clad plate of the good heat transmission, the good heat transmission of the good heat transmission can be made of the good heat-clad plate, the good heat transmission, the good heat-clad plate has good heat transmission, the good heat-insulating effect of the good heat-clad plate, the good heat-clad plate has good heat transmission, the good heat-proof machine.

However, the technical scheme who provides in the above-mentioned patent when aluminium base copper-clad plate carries out heat conduction heat dissipation, because the structure that conducts heat is less, can lead to the heat conduction effect slower, can not be timely conduct and dispel the heat to can reduce aluminium base copper-clad plate's heat conductivity, unsatisfied current user's user demand.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high heat conduction aluminium base copper-clad plate to the technical scheme who proposes in proposing above-mentioned patent in solving above-mentioned background art, when aluminium base copper-clad plate carries out heat conduction heat dissipation, because the structure of heat conduction volume is less, can lead to heat conduction effect slower, can not be timely conduct and dispel the heat, thereby can reduce the heat conductivity of aluminium base copper-clad plate, unsatisfied current user demand's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high heat conduction aluminium base copper-clad plate, includes aluminium base copper-clad plate main part, the equal fixedly connected with copper sheet crane span structure in both sides of aluminium base copper-clad plate main part, the inside of aluminium base copper-clad plate main part includes aluminium base board, the top of aluminium base board has the copper foil layer through the adhesive bonding, the top of copper foil layer has the HDPE layer through the adhesive bonding, the bottom fixedly connected with heat-conducting layer of aluminium base board, the bottom fixedly connected with insulating layer of heat-conducting layer, the bottom fixedly connected with heat dissipation layer of insulating layer.

The heat dissipation layer is characterized in that a first heat conduction plate is arranged inside the insulation layer, a second heat conduction plate is fixedly connected to the top of the first heat conduction plate, a heat conduction strip is fixedly connected to the top of the second heat conduction plate, a heat conduction rod is fixedly connected to the bottom of the first heat conduction plate, and cooling liquid and a heat conduction rod are arranged inside the heat dissipation layer.

Preferably, the top of the HDPE layer is bonded with a corrosion-resistant layer through an adhesive, and a phenolic resin paint layer is arranged inside the corrosion-resistant layer.

Preferably, the top of the second heat conducting plate penetrates through the heat conducting layer and is fixedly connected with the bottom of the heat conducting layer.

Preferably, the top of the heat conducting strip penetrates through the heat conducting layer and is fixedly connected with the heat conducting layer.

Preferably, the bottom of the heat conducting rod penetrates through the heat dissipation layer and is fixedly connected with the top of the heat conducting rod, and the position close to the bottom of the heat conducting rod and the heat conducting rod are located inside the cooling liquid.

Preferably, the first heat conducting plate and the joints between the heat conducting rod and the insulating layer and between the heat radiating layer and the heat conducting rod are fixedly connected with insulating gaskets.

Preferably, the bottom of the heat dissipation layer is fixedly connected with a heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that:

this aluminium base copper-clad plate of high heat conduction, through setting up heat-conducting plate one, heat-conducting plate two, the heat conduction strip, the heat conduction pole, the coolant liquid, the heat dissipation layer, heat conduction stick and heating panel, can be quick effectual with heat conduction to the inside on heat dissipation layer, cool down the processing of dispelling the heat to it through the coolant liquid, it can improve the heat-conducting effect of aluminium base copper-clad plate to set up a plurality of heat conduction structures, heat conduction heat dissipation goes on simultaneously, can improve the life and the work efficiency of aluminium base copper-clad plate, thereby current user's user demand has been satisfied.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a sectional view of the structure of the present invention;

fig. 3 is an enlarged partial view of a in fig. 2 according to the present invention;

fig. 4 is a partially enlarged view of B in fig. 2 according to the present invention;

fig. 5 is a structural sectional view of the corrosion-resistant layer of the present invention;

FIG. 6 is a top view of the present invention;

fig. 7 is a bottom view of the structure of the present invention.

In the figure: 1. an aluminum-based copper-clad plate main body; 2. a copper foil layer; 3. a HDPE layer; 4. a corrosion resistant layer; 5. a heat conductive layer; 6. an insulating layer; 7. a heat dissipation layer; 8. a first heat conducting plate; 9. a second heat conducting plate; 10. a heat conducting strip; 11. a heat conducting rod; 12. cooling liquid; 13. an insulating gasket; 14. a heat dissipation plate; 15. a heat conducting rod; 16. a phenolic resin paint layer; 17. an aluminum substrate; 18. copper sheet crane span structure.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides an aluminium base copper-clad plate of high heat conduction, including aluminium base copper-clad plate main part 1, the equal fixedly connected with copper sheet crane span structure 18 in both sides of aluminium base copper-clad plate main part 1, aluminium base copper-clad plate main part 1's inside includes aluminium base board 17, aluminium base board 17's top has copper foil layer 2 through the adhesive bonding, copper foil layer 2's top has HDPE layer 3 through the adhesive bonding, HDPE layer 3 is high density polyethylene, can promote the heat conductivity, aluminium base board 17's bottom fixedly connected with heat-conducting layer 5, the bottom fixedly connected with insulating layer 6 of heat-conducting layer 5, the bottom fixedly connected with heat dissipation layer 7 of insulating layer 6.

The inside of insulating layer 6 is provided with heat-conducting plate 8, the top fixedly connected with heat-conducting plate two 9 of heat-conducting plate 8, the top fixedly connected with heat conduction strip 10 of heat-conducting plate two 9, the bottom fixedly connected with heat conduction pole 11 of heat-conducting plate 8, the inside of heat dissipation layer 7 is provided with coolant liquid 12 and heat conduction stick 15, the inside that leans on bottom position and heat conduction stick 15 to be located coolant liquid 12 of heat conduction pole 11, the heat is through heat conduction strip 10, heat-conducting plate two 9, heat-conducting plate 8 and heat conduction pole 11 transmit heat conduction stick 15 department, carry out cooling thermal treatment to it through coolant liquid 12.

The top on HDPE layer 3 bonds through the adhesive has corrosion resistant layer 4, the inside of corrosion resistant layer 4 is provided with phenolic resin lacquer layer 16, can make aluminium-based copper-clad plate have corrosion resistant characteristics, thereby improve aluminium-based copper-clad plate's life, the top of heat-conducting plate two 9 run through to the inside of heat-conducting layer 5 and with the bottom fixed connection of heat-conducting layer 5, the top of heat conduction strip 10 run through to the inside of heat-conducting layer 5 and with heat-conducting layer 5 fixed connection, the bottom of heat-conducting rod 11 run through to the inside of heat dissipation layer 7 and with the top fixed connection of heat-conducting rod 15, the equal fixedly connected with insulating gasket 13 in junction between heat-conducting plate one 8 and heat-conducting rod 11 and insulating layer 6 and the heat dissipation layer 7, the bottom fixedly connected with heating panel 14 of heat dissipation layer 7, the design of heating panel 14, can play supplementary radiating effect.

In summary, the following steps: this aluminium base copper-clad plate of high heat conduction, through setting up heat-conducting plate one 8, heat-conducting plate two 9, heat conduction strip 10, heat conduction rod 11, coolant liquid 12, heat dissipation layer 7, heat conduction stick 15 and heating panel 14, can be quick effectual conduct the heat to the inside of heat dissipation layer 7, cool down the processing of dispelling the heat to it through coolant liquid 12, it can improve the heat-conducting effect of aluminium base copper-clad plate to set up a plurality of heat conduction structures, the heat conduction heat dissipation goes on simultaneously, can improve the life and the work efficiency of aluminium base copper-clad plate, thereby current user's user demand has been satisfied.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high heat conduction aluminium base copper-clad plate, includes aluminium base copper-clad plate main part (1), its characterized in that: both sides of the aluminum-based copper-clad plate main body (1) are fixedly connected with copper sheet bridges (18), the aluminum-based copper-clad plate main body (1) comprises an aluminum substrate (17), the top of the aluminum substrate (17) is bonded with a copper foil layer (2) through an adhesive, the top of the copper foil layer (2) is bonded with an HDPE layer (3) through an adhesive, the bottom of the aluminum substrate (17) is fixedly connected with a heat conduction layer (5), the bottom of the heat conduction layer (5) is fixedly connected with an insulation layer (6), and the bottom of the insulation layer (6) is fixedly connected with a heat dissipation layer (7);

the heat dissipation layer is characterized in that a first heat conduction plate (8) is arranged inside the insulation layer (6), a second heat conduction plate (9) is fixedly connected to the top of the first heat conduction plate (8), heat conduction strips (10) are fixedly connected to the top of the second heat conduction plate (9), heat conduction rods (11) are fixedly connected to the bottom of the first heat conduction plate (8), and cooling liquid (12) and heat conduction rods (15) are arranged inside the heat dissipation layer (7).

2. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, characterized in that: the top of HDPE layer (3) has corrosion resistant layer (4) through the adhesive bonding, the inside of corrosion resistant layer (4) is provided with phenolic resin lacquer layer (16).

3. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, characterized in that: the top of the second heat conduction plate (9) penetrates through the heat conduction layer (5) and is fixedly connected with the bottom of the heat conduction layer (5).

4. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, characterized in that: the top of the heat conducting strip (10) penetrates into the heat conducting layer (5) and is fixedly connected with the heat conducting layer (5).

5. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, characterized in that: the bottom of the heat conducting rod (11) penetrates into the heat dissipation layer (7) and is fixedly connected with the top of the heat conducting rod (15), and the position, close to the bottom, of the heat conducting rod (11) and the heat conducting rod (15) are located inside the cooling liquid (12).

6. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, characterized in that: and insulating gaskets (13) are fixedly connected at the joints between the first heat conducting plate (8) and the first heat conducting rod (11) and the insulating layer (6) and the heat dissipation layer (7).

7. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, characterized in that: the bottom of the heat dissipation layer (7) is fixedly connected with a heat dissipation plate (14).