CN214927744U - High-heat-dissipation aluminum-based copper-clad plate - Google Patents
High-heat-dissipation aluminum-based copper-clad plate Download PDFInfo
- Publication number
- CN214927744U CN214927744U CN202120959770.4U CN202120959770U CN214927744U CN 214927744 U CN214927744 U CN 214927744U CN 202120959770 U CN202120959770 U CN 202120959770U CN 214927744 U CN214927744 U CN 214927744U
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- China
- Prior art keywords
- plate
- copper
- aluminum
- clad
- end plate
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- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 97
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 97
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 239000004411 aluminium Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 15
- 239000002365 multiple layer Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011090 solid board Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Images
Abstract
The utility model discloses a high heat dissipation aluminum-based copper clad plate, which comprises an aluminum-based copper clad plate and a heat dissipation mechanism, the heat dissipation mechanism consists of an end plate A, an end plate B, a connecting plate, a copper rod and a copper foil, wherein the end plate A and the end plate B are symmetrically arranged on one side surface of the aluminum-based copper-clad plate, a connecting plate is fixedly connected between the end plate A and the end plate B, a copper rod is fixedly connected between the bottom end of the connecting plate and the aluminum-based copper-clad plate, copper foils are attached to the surfaces of the end plate A, the end plate B and the connecting plate, the surface of the aluminum-based copper-clad plate is provided with a heat dissipation mechanism, an end plate A and an end plate B of the heat dissipation mechanism are matched with a connecting plate and a copper rod, a gap layer is formed on the surface of the aluminum-based copper-clad plate, the copper foil covers the surfaces of the end plate A, the end plate B and the connecting plate for covering, and then the surface of the aluminum-based copper-clad plate is provided with a heat dissipation mechanism with a bulge and a gap, so that the aluminum-based copper-clad plate can be assisted to dissipate heat from the gap.
Description
Technical Field
The utility model relates to an aluminium base copper-clad plate technical field, in particular to aluminium base copper-clad plate of high heat dissipation metal.
Background
An aluminum-based copper clad laminate, i.e., an aluminum substrate, is one of raw materials, and is a plate-shaped material prepared by using electronic glass fiber cloth or other reinforcing materials, soaking resin, single resin and the like as an insulating bonding layer, coating copper foil on one surface or two surfaces of the insulating bonding layer and performing hot pressing, and is called a copper-clad laminate aluminum substrate, which is called an aluminum-based copper clad laminate for short.
Patent number CN201921111124.1 discloses a high heat dissipation aluminium-based copper-clad plate of metal, including aluminium basic unit, aluminium basic unit's inside is equipped with heat dissipation mechanism, all be equipped with the heat-conducting layer on two surfaces of aluminium basic unit, the outside of two heat-conducting layers all is equipped with the copper foil, aluminium basic unit's one end joint has the U-shaped mount, a plurality of wind scoopers have been seted up to U-shaped mount center department, the inside of wind scooper is equipped with the dust guard, the utility model discloses can be through setting up miniature fan in aluminium-based copper-clad plate one end, through the wind scooper, blow in heat dissipation mechanism with outside air, give off the heat of aluminium basic unit through main heat dissipation pipe, give off the temperature on copper foil surface through vice cooling tube, and then make the inside heat of aluminium-based copper-clad plate in time spill, very big improvement the life of aluminium-based copper-clad plate of metal.
1. The aluminum-based copper-clad plate body in the prior art is simple in structure, and when the aluminum-based copper-clad plate is used, the surface of the plate body is lack of a good heat dissipation mechanism, so that the aluminum-based copper-clad plate is easy to generate high heat when used, and therefore the high-heat-dissipation metal aluminum-based copper-clad plate is provided.
2. The aluminum-based copper-clad plate body in the prior art is simple in hierarchical structure and lacks of a better internal fixation mechanism, and is easy to deform and damage when stressed, so that the use of the plate is influenced, and therefore the high-heat-dissipation metal aluminum-based copper-clad plate is provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a high heat dissipation aluminum-based copper-clad plate of metal, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high heat dissipation aluminium base copper-clad plate of metal, includes aluminium base copper-clad plate, still includes heat dissipation mechanism, heat dissipation mechanism comprises end plate A, end plate B, connecting plate, copper pole and copper foil, a side surface symmetry of aluminium base copper-clad plate is provided with end plate A and end plate B, and fixedly connected with connecting plate between end plate A and the end plate B, fixedly connected with copper pole between the bottom of connecting plate and the aluminium base copper-clad plate, and the surface laminating of end plate A, end plate B and connecting plate has the copper foil.
Furthermore, a multi-layer internal fixing plate is embedded in the aluminum-based copper-clad plate, and a multi-layer aluminum plate is fixed between one side of the surface of the multi-layer internal fixing plate and the inner wall of the aluminum-based copper-clad plate; the aluminum-based copper-clad plate is internally provided with the multiple-layer internal fixing plate and the multiple-layer aluminum plate, the multiple-layer internal fixing plate made of the copper material is matched with the multiple-layer aluminum plate to form a multiple-layer increasing structure in the aluminum-based copper-clad plate, and the plate body strength of the aluminum-based copper-clad plate can be improved.
Furthermore, the rod body of the copper rod is a rectangular hollow rod body, and a rectangular cavity is formed between the rod body of the copper rod and the connecting plate; a gap is arranged in the middle of the copper rod of the rectangular hollow rod body to assist in dissipating heat, and a rectangular cavity formed between the rod body of the copper rod and the connecting plate can also dissipate heat of the aluminum-based copper-clad plate.
Furthermore, the plate body height of the connecting plate is half of that of the end plate A; and a gap is formed between the thin connecting plate and the aluminum-based copper-clad plate when the thin connecting plate is fixed between the end plate A and the end plate B.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses a surface at aluminium base copper-clad plate is provided with heat dissipation mechanism, and end plate A and end plate B cooperation connecting plate and copper pole of heat dissipation mechanism are formed with the interstitial layer on aluminium base copper-clad plate's surface, and the copper foil then covers and cover on the surface of end plate A, end plate B and connecting plate, and then aluminium base copper-clad plate's surface has the protruding heat dissipation mechanism that takes gapped can assist aluminium base copper-clad plate to carry out the heat effluvium from the clearance.
2. The utility model discloses an inside at aluminium base copper-clad plate is provided with, double-deck internal solid board and double-deck aluminum plate, and the double-deck internal solid board cooperation double-deck aluminum plate of copper product increases the structure at the inside double-deck of forming of aluminium base copper-clad plate, can promote aluminium base copper-clad plate's plate body intensity.
Drawings
Fig. 1 is an explosion diagram of the high heat dissipation aluminum-based copper-clad plate of the utility model.
Fig. 2 is the utility model relates to a heat dissipation mechanism schematic diagram of high heat dissipation aluminum-based copper-clad plate.
Fig. 3 is a cross-sectional view of the high heat dissipation aluminum-based copper-clad plate of the utility model.
In the figure: 1. an aluminum-based copper-clad plate; 2. a heat dissipation mechanism; 201. an end plate A; 202. an end plate B; 203. a connecting plate; 204. a copper rod; 205. copper foil; 3. a multi-layer inner fixing plate; 4. a multi-layer aluminum plate.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, a high heat dissipation aluminum-based copper-clad plate of metal, including aluminum-based copper-clad plate 1, still include heat dissipation mechanism 2, heat dissipation mechanism 2 comprises end plate a201, end plate B202, connecting plate 203, copper pole 204 and copper foil 205, a side surface symmetry of aluminum-based copper-clad plate 1 is provided with end plate a201 and end plate B202, and fixedly connected with connecting plate 203 between end plate a201 and the end plate B202, fixedly connected with copper pole 204 between the bottom of connecting plate 203 and the aluminum-based copper-clad plate 1, and the surface laminating of end plate a201, end plate B202 and connecting plate 203 has copper foil 205.
Wherein, a multi-layer internal fixing plate 3 is embedded in the aluminum-based copper-clad plate 1, and a multi-layer aluminum plate 4 is fixed between one side of the surface of the multi-layer internal fixing plate 3 and the inner wall of the aluminum-based copper-clad plate 1; be provided with in aluminium base copper-clad plate 1's inside, multiple layer internal fixation board 3 and multiple layer aluminum plate 4, the multiple layer internal fixation board 3 cooperation multiple layer aluminum plate 4 of copper material increases the structure at aluminium base copper-clad plate 1 inside formation multiple layer, can promote aluminium base copper-clad plate 1's plate body intensity.
The rod body of the copper rod 204 is a rectangular hollow rod body, and a rectangular cavity is formed between the rod body of the copper rod 204 and the connecting plate 203; a gap is arranged in the middle of the copper rod 204 of the rectangular hollow rod body to assist in dissipating heat, and a rectangular cavity formed between the rod body of the copper rod 204 and the connecting plate 203 can also dissipate heat of the aluminum-based copper-clad plate 1.
The plate body height of the connecting plate 203 is half of that of the end plate A201; and a gap is formed between the thin connecting plate 203 and the aluminum-based copper-clad plate 1 when the end plate A201 and the end plate B202 are fixed.
It should be noted that, the utility model relates to a high heat dissipation aluminum-based metal copper-clad plate, be provided with heat dissipation mechanism 2 on the surface of aluminum-based copper-clad plate 1, end plate A201 and end plate B202 of heat dissipation mechanism 2 cooperate connecting plate 203 and copper pole 204, be formed with the clearance layer on the surface of aluminum-based copper-clad plate 1, and copper foil 205 covers and covers at the surface of end plate A201, end plate B202 and connecting plate 203, and then there is protruding heat dissipation mechanism 2 with the clearance on the surface of aluminum-based copper-clad plate 1 can assist aluminum-based copper-clad plate 1 to carry out the heat to spill out from the clearance; be provided with in aluminium base copper-clad plate 1's inside, multiple layer internal fixation board 3 and multiple layer aluminum plate 4, the multiple layer internal fixation board 3 cooperation multiple layer aluminum plate 4 of copper material increases the structure at aluminium base copper-clad plate 1 inside formation multiple layer, can promote aluminium base copper-clad plate 1's plate body intensity.
The utility model relates to a high heat dissipation aluminum-based copper clad laminate, which comprises a copper clad laminate 1 and an aluminum-based copper clad laminate; 2. a heat dissipation mechanism; 201. an end plate A; 202. an end plate B; 203. a connecting plate; 204. a copper rod; 205. copper foil; 3. a multi-layer inner fixing plate; 4. the structure and principle of the clad aluminum plate are known to those skilled in the art through technical manuals or through routine experiments.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides a high heat dissipation aluminium base copper-clad plate of metal, includes aluminium base copper-clad plate (1), its characterized in that: still include heat dissipation mechanism (2), heat dissipation mechanism (2) comprises end plate A (201), end plate B (202), connecting plate (203), copper pole (204) and copper foil (205), a side surface symmetry of aluminium base copper-clad plate (1) is provided with end plate A (201) and end plate B (202), and fixedly connected with connecting plate (203) between end plate A (201) and end plate B (202), fixedly connected with copper pole (204) between the bottom of connecting plate (203) and aluminium base copper-clad plate (1), and the surface laminating of end plate A (201), end plate B (202) and connecting plate (203) has copper foil (205).
2. The high-heat-dissipation metal aluminum-based copper-clad plate according to claim 1, characterized in that: a composite-layer internal fixing plate (3) is embedded into the aluminum-based copper-clad plate (1), and a composite-layer aluminum plate (4) is fixed between one side of the surface of the composite-layer internal fixing plate (3) and the inner wall of the aluminum-based copper-clad plate (1).
3. The high-heat-dissipation metal aluminum-based copper-clad plate according to claim 1, characterized in that: the rod body of copper pole (204) is the hollow body of rod of rectangle, and is formed with the rectangle chamber between the body of rod of copper pole (204) and connecting plate (203).
4. The high-heat-dissipation metal aluminum-based copper-clad plate according to claim 1, characterized in that: the plate body height of the connecting plate (203) is half of that of the end plate A (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120959770.4U CN214927744U (en) | 2021-05-07 | 2021-05-07 | High-heat-dissipation aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120959770.4U CN214927744U (en) | 2021-05-07 | 2021-05-07 | High-heat-dissipation aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214927744U true CN214927744U (en) | 2021-11-30 |
Family
ID=79062683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120959770.4U Expired - Fee Related CN214927744U (en) | 2021-05-07 | 2021-05-07 | High-heat-dissipation aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214927744U (en) |
-
2021
- 2021-05-07 CN CN202120959770.4U patent/CN214927744U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211130 |