CN210406053U - Aluminum-based copper-clad plate with high heat dissipation and dust prevention - Google Patents
Aluminum-based copper-clad plate with high heat dissipation and dust prevention Download PDFInfo
- Publication number
- CN210406053U CN210406053U CN201921425419.6U CN201921425419U CN210406053U CN 210406053 U CN210406053 U CN 210406053U CN 201921425419 U CN201921425419 U CN 201921425419U CN 210406053 U CN210406053 U CN 210406053U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- insulating layer
- aluminum
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of aluminum substrates, and discloses an aluminum-based copper-clad laminate with high heat dissipation and dust prevention, which comprises an aluminum substrate, wherein an insulating layer is fixed at the top of the aluminum substrate, a connecting rod is installed at the top of the insulating layer, a circuit board is fixed at the top of the connecting rod, an inserting rod penetrates through the circuit board, the bottom end of the inserting rod is connected with a pressing sheet below the circuit board, a spring is connected between the pressing sheet and the insulating layer, the top of the inserting rod is connected with a frame, and the top of the frame is covered with a dust-proof net, the utility model improves the heat dissipation effect by separating the circuit board from the insulating layer and increasing the contact area of the circuit board and the external cold air, the up-and-down movement of the pressing sheet can generate air flow when being vibrated, the hot air between the circuit board and the insulating layer is discharged to, the problem of aluminium base copper clad laminate heat dissipation not good influence use is solved.
Description
Technical Field
The utility model belongs to the technical field of aluminium base board, concretely relates to aluminium base copper clad laminate with high heat dissipation, dirt-proof.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer, and is commonly used in LED lighting products. There are two sides, white one side is the welding LED pin, and the another side presents aluminium true qualities, generally can scribble and contact with heat conduction part after the heat conduction mortar, ceramic substrate etc. still at present, application number CN 201821870733.0's a high-efficient LED aluminium base board of dust-protection type only dispels the heat through fin and heat absorption post, and the radiating effect is not good, easily influences the stability of circuit operation because of the circuit board high temperature.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a have high heat dissipation, dirt-proof aluminium base and cover copper foil board to it is not good to solve the contrast file radiating effect, easily influences the problem of the stability of circuit operation because of the circuit board high temperature.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an aluminium base copper-clad laminate with high heat dissipation, dirt-proof, includes aluminium base board, the top of aluminium base board is fixed with the insulating layer, the connecting rod is installed at the top of insulating layer, the top of connecting rod is fixed with the circuit board, the inside of circuit board runs through there is the inserted bar, the bottom of inserted bar and the below that is located the circuit board are connected with the preforming, be connected with the spring between preforming and the insulating layer, the top of inserted bar is connected with the frame, and the top of frame covers there is the dust screen, the outer wall of aluminium base board is fixed with the mounting panel, and the mounting hole has been seted up to the.
Preferably, the circuit board is provided with a jack matched with the inserted link, and the outer wall of the inserted link is sleeved with a baffle sheet on the top side of the inner part of the jack.
Preferably, the outer wall of the aluminum substrate is connected with radiating fins, and the annular array of the radiating fins is connected with the outer wall of the aluminum substrate.
Preferably, the side wall of the radiating fin is provided with an arc, and the outer wall of the radiating fin is smooth.
Preferably, the top of the circuit board is fixed with a dustproof adhesive film, and the size of the dustproof adhesive film is matched with the top area of the circuit board.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses a with circuit board and insulating layer separation increase circuit board and external cold air area of contact's mode, improved the radiating effect, the up-and-down motion of preforming can produce the air current when receiving the vibration, with the outside discharge of hot-air between circuit board and the insulating layer, further improves the device's radiating effect, has solved the problem that the aluminium base covers the not good influence use of copper foil board heat dissipation.
(2) The utility model discloses an installed dustproof glued membrane and dust screen in the top and the top of circuit board, avoided the dust directly to fall on the device influence the operation of circuit, the frame can play the guard action to the device simultaneously, does benefit to increase of service life, solves aluminium base and covers the problem that the line operation is stable for the copper foil board easily accumulates the dust.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is an internal schematic view of the jack of the present invention;
FIG. 3 is a schematic view of the frame of the present invention connected to a dust screen;
in the figure: the circuit board comprises an aluminum substrate 1, an insulating layer 2, a connecting rod 3, a circuit board 4, an inserting rod 5, a pressing sheet 6, a spring 7, a frame 8, a dust screen 9, a radiating fin 10, an arc 11, a dust-proof glue film 12, a jack 13, a blocking sheet 14 and a mounting plate 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a high-heat-dissipation and dustproof aluminum-based copper-clad plate comprises an aluminum substrate 1, an insulating layer 2 is fixed on the top of the aluminum substrate 1, a connecting rod 3 is installed on the top of the insulating layer 2, a circuit board 4 is fixed on the top of the connecting rod 3, the circuit board 4 is separated from the insulating layer 2 by the connecting rod 3, the contact area of the circuit board 4 and outside cold air is increased, heat dissipation is facilitated, an inserting rod 5 penetrates through the inside of the circuit board 4, a pressing sheet 6 is connected to the bottom end of the inserting rod 5 and located below the circuit board 4, a spring 7 is connected between the pressing sheet 6 and the insulating layer 2, a frame 8 is connected to the top of the inserting rod 5, a dustproof net 9 covers the top of the frame 8, a mounting plate 15 is fixed on the outer wall of the aluminum substrate 1, a mounting hole is formed in the mounting plate 15, the dustproof net 9 can prevent dust from falling on the circuit board, meanwhile, the spring 7 plays a role in inhibiting the movement of the inserted rod 5, the inserted rod 5 moves while the pressing sheet 6 moves inside the circuit board 4 and the insulating layer 2, and due to the sheet structure of the pressing sheet 6, air flow can be generated in the movement process of the pressing sheet to discharge hot air between the circuit board 4 and the insulating layer 2 to the outside, so that the heat dissipation effect of the device is improved.
In order to further improve the heat dissipation effect, in this embodiment, preferably, the circuit board 4 is provided with a jack 13 matching with the insert rod 5, the outer wall of the insert rod 5 and the top side of the inner portion of the jack 13 are sleeved with a blocking piece 14, and when the blocking piece 14 is lifted in the jack 13, the movement of the air flow can be promoted.
In order to facilitate heat dissipation of the aluminum substrate 1, in the present embodiment, preferably, the heat sink 10 is connected to the outer wall of the aluminum substrate 1, and the heat sink 10 is annularly arrayed with the outer wall of the aluminum substrate 1, so that the heat sink 10 facilitates heat dissipation from the aluminum substrate 1.
In order to increase the heat dissipation area of the heat sink 10, in the present embodiment, preferably, the side wall of the heat sink 10 is formed with an arc 11, and the outer wall of the heat sink 10 is smooth.
In order to improve the dustproof effect of the circuit board 4, in the embodiment, preferably, a dustproof adhesive film 12 is fixed on the top of the circuit board 4, and the size of the dustproof adhesive film 12 is matched with the top area of the circuit board 4.
The utility model discloses a theory of operation and use flow: the utility model discloses a when using, the mounting hole in the accessible screw through mounting panel 15 is installed, dust screen 9 and dustproof glued membrane 12 can prevent that the dust from falling on circuit board 4, the device receives when vibrating, inserted bar 5 can stretch out and draw back in the inside of jack 13, spring 7 plays the inhibitory action to the motion of inserted bar 5 simultaneously, preforming 6 is at the inside motion of circuit board 4 and insulating layer 2 in the time of inserted bar 5 motion, because preforming 6's sheet structure, can produce the outside discharge of hot-air between circuit board 4 and the insulating layer 2 of air current in its motion process, separation blade 14 is when jack 13 inside goes up and down, can promote the motion of air current, improve the device's radiating effect, frame 8 can play the guard action to the top of circuit board 4, unload the power through the flexible of inserted bar 5 and spring 7's buffering, do benefit to the life who prolongs the device.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an aluminium base copper-clad laminate with high heat dissipation, dirt-proof, its characterized in that, includes aluminium base board, the top of aluminium base board is fixed with the insulating layer, the connecting rod is installed at the top of insulating layer, the top of connecting rod is fixed with the circuit board, the inside of circuit board runs through there is the inserted bar, the bottom of inserted bar and the below that is located the circuit board are connected with the preforming, be connected with the spring between preforming and the insulating layer, the top of inserted bar is connected with the frame, and the top of frame covers there is the dust screen, the outer wall of aluminium base board is fixed with the mounting panel, and the mounting hole has been seted up to.
2. The aluminum-based copper-clad laminate with high heat dissipation and dust prevention of claim 1, wherein: the circuit board is characterized in that a jack matched with the inserted link is formed in the circuit board, and a separation blade is sleeved on the outer wall of the inserted link and located on the top side of the inner portion of the jack.
3. The aluminum-based copper-clad laminate with high heat dissipation and dust prevention of claim 1, wherein: the outer wall of the aluminum substrate is connected with radiating fins, and the radiating fins are annularly arrayed with the outer wall of the aluminum substrate.
4. The aluminum-based copper-clad laminate with high heat dissipation and dust prevention of claim 3, wherein: the side wall of the radiating fin is provided with an arc, and the outer wall of the radiating fin is smooth.
5. The aluminum-based copper-clad laminate with high heat dissipation and dust prevention of claim 1, wherein: the top of the circuit board is fixed with a dustproof adhesive film, and the size of the dustproof adhesive film is matched with the top area of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921425419.6U CN210406053U (en) | 2019-08-29 | 2019-08-29 | Aluminum-based copper-clad plate with high heat dissipation and dust prevention |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921425419.6U CN210406053U (en) | 2019-08-29 | 2019-08-29 | Aluminum-based copper-clad plate with high heat dissipation and dust prevention |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210406053U true CN210406053U (en) | 2020-04-24 |
Family
ID=70339986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921425419.6U Active CN210406053U (en) | 2019-08-29 | 2019-08-29 | Aluminum-based copper-clad plate with high heat dissipation and dust prevention |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210406053U (en) |
-
2019
- 2019-08-29 CN CN201921425419.6U patent/CN210406053U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5453187B2 (en) | Backlight unit | |
| CN201288973Y (en) | LED road lamp | |
| CN210406053U (en) | Aluminum-based copper-clad plate with high heat dissipation and dust prevention | |
| CN109587940B (en) | High-heat-dissipation aluminum-based copper-clad plate | |
| US6722419B1 (en) | Computer cooler | |
| CN206401355U (en) | A kind of anti-static LED aluminium substrate | |
| CN110290407B (en) | Television set-top box | |
| CN213694291U (en) | Flexible circuit board with heat dissipation layer | |
| CN109257870A (en) | A kind of double-layer PCB board component of perfect heat-dissipating | |
| WO2021013161A1 (en) | Backlight assembly and television | |
| CN206904645U (en) | A kind of LED lamp tube of lamp housing integration | |
| CN219181914U (en) | Metal and graphene material heat radiation structure | |
| CN210511088U (en) | Novel LED drive heat radiation structure | |
| CN220606169U (en) | Single-sided resin glue-pouring aluminum substrate | |
| CN214228726U (en) | Simulation circuit board with heat dissipation mechanism | |
| CN218830758U (en) | Heat dissipation type circuit board | |
| CN221081686U (en) | Double-sided electronic circuit board | |
| CN214745048U (en) | LED lamp board that radiating efficiency is high | |
| CN215073143U (en) | High-efficient radiating multilayer circuit board | |
| CN218634631U (en) | Circuit board and liquid heater | |
| CN209731700U (en) | A kind of ceramic aluminum substrate | |
| CN220606179U (en) | PCB board paster packaging structure | |
| CN218784296U (en) | Water ion structure for hair drier | |
| CN210381729U (en) | A quick heat absorption structure of aluminum alloy panel beating for video encoder | |
| CN211040688U (en) | L ED lamp with long service life |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |