CN219181914U

CN219181914U - Metal and graphene material heat radiation structure

Info

Publication number: CN219181914U
Application number: CN202222563059.4U
Authority: CN
Inventors: 周锐; 陈国富
Original assignee: Wangshi Technology Co ltd
Current assignee: Wangshi Technology Co ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-06-13
Anticipated expiration: 2032-09-27

Abstract

The utility model discloses a metal and graphene material heat dissipation structure which comprises a PCB assembly, a heating element, a metal heat dissipation sheet, heat conduction silica gel and a graphene patch, wherein the metal heat dissipation sheet is detachably connected to the PCB assembly, the heating element is positioned between the lower end face of the metal heat dissipation sheet and the upper end face of the PCB assembly, the heat conduction silica gel is attached to the heating element, and the graphene patch is attached to the upper end face of the metal heat dissipation sheet. Compared with the prior art, the utility model discloses utilize metal fin as supporting carrier, graphene materials leading heat dissipation function, the last tapping hole that has of metal fin simultaneously can satisfy screw fastening assembly demand, improved the complete machine again and fallen and transport the impact strength in the use, the local boss on the metal fin can be as far as near the fin and the distance between the components and parts that generate heat, make the heat conduction silica gel that the heat conduction was used become thinner or change with the heat conduction silicone grease, further reduced material cost, improve heat conduction efficiency.

Description

Metal and graphene material heat radiation structure

Technical Field

The utility model relates to the technical field of electronic element heat dissipation, in particular to a heat dissipation structure of metal and graphene materials.

Background

With the development of the times, the performance requirements of people on electrical equipment are gradually improved, and meanwhile, the heat dissipation requirements of the electrical equipment in the use process are also continuously increased.

As shown in fig. 1, which is a structural diagram of the prior art, in order to ensure a good heat dissipation effect, a conventional heat dissipation structure of an electrical apparatus in the prior art adopts a metal heat dissipation fin with an aluminum extrusion structure to increase the heat dissipation area of the surface of the structure, or utilizes two sandwich heat dissipation fins of a heating element to realize two-sided heat dissipation so as to meet the heat dissipation requirement of the heating element, but the aluminum extrusion profile of the conventional heat dissipation structure needs to be matched with an independent nut rivet, so that the self-weight bias cost is high. The increase of the whole weight is not tight enough between the whole structures, and meanwhile, the thickness of the heat dissipation structure is higher, so that the component part and the heat dissipation whole structure are larger, and the whole structure is not suitable for transportation and packaging, so that there is room for improvement.

Disclosure of Invention

The utility model aims to provide a metal and graphene material heat dissipation structure which can greatly reduce material cost and overall quality and improve impact strength while improving overall heat dissipation efficiency.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: including PCB subassembly and heating element, heating element is located PCB subassembly up end still includes metal fin, heat conduction silica gel and graphite alkene paster, the metal fin can dismantle the connection and be in on the PCB subassembly, heating element is located metal fin lower terminal surface with between the PCB subassembly up end, heat conduction silica gel attached in on the heating element, graphite alkene paster attached in metal fin up end.

Further, a plurality of connection bosses are arranged at the upper edge of the metal radiating fin, threaded holes are formed in the connection bosses, through holes corresponding to the connection bosses are formed in the PCB assembly, and the metal radiating fin is detachably connected with the PCB assembly through radiating fin fixing screws and the threaded holes.

Further, a heat conduction boss is arranged at the position, opposite to the heat conduction silica gel, of the lower end face of the metal radiating fin.

Further, the metal radiating fin is attached with the aluminum extrusion radiating fin and a fixing plate are further arranged above the end face of the graphene patch, independent nuts are arranged on the lower end face of the fixing plate and the lower end face of the aluminum extrusion radiating fin, and the independent nuts are in threaded connection with the radiating fin fixing screws.

Compared with the prior art, the utility model has the following beneficial effects: according to the structure, the thin metal radiating fins are used as supporting carriers, the graphene material is used for leading the radiating function, the overall radiating efficiency is greatly improved, meanwhile, the metal radiating fins are provided with the connecting bosses, so that the screw fastening assembly requirement can be met, the material cost and the weight of the whole machine are greatly reduced, the impact strength of the whole machine in the falling and transportation use processes is improved, the heat conducting bosses on the metal radiating fins can be as close to the distance between the radiating fins and heating components as possible, the heat conducting silica gel for heat conduction can be thinner or changed into heat conducting silica gel, the material cost is further reduced, the heat conducting efficiency is improved, the design material and the assembly cost are low, the heat conducting efficiency is high, and the structural stability is good.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic diagram of an exploded structure of example 1 of the present utility model;

FIG. 3 is a schematic view of the structure of FIG. 2 in partial cross section in the present utility model;

FIG. 4 is a schematic diagram of an exploded structure of example 2 of the present utility model;

wherein, the names corresponding to the reference numerals are:

graphene patch 1, metal radiating fins 2, heat conduction boss 201, connection boss 202, heat conduction silica gel 3, PCB assembly 4, radiating fin fixing screw 5, heating element 6, fixing plate 7, aluminum extrusion radiating fin 8 and independent nut 9.

Detailed Description

The utility model will be further illustrated by the following description and examples, which include but are not limited to the following examples.

Example 1

Referring to fig. 2-4, the heat dissipation structure of metal and graphene materials in this embodiment includes a graphene patch 1, a metal heat dissipation sheet 2, a heat generating component 6 and a PCB component 4, where the heat generating component 6 is fixedly connected to the middle of the upper end surface of the PCB component 4, the metal heat dissipation sheet 2 is attached to the upper end surface of the PCB component 4 and fixes the heat generating component 6 in the middle, a heat conducting silica gel 3 is disposed between the heat generating component 6 and the metal heat dissipation sheet 2, the size of the heat conducting silica gel 3 is adapted to the size of the heat generating component 6, a heat conducting boss 201 is disposed on the metal heat dissipation sheet 2, the boss of the heat conducting boss 201 is opposite to the heat conducting silica gel 3, the heat conducting boss 201 can improve tightness between the heat conducting silica gel 3 and the heat generating component 6, so as to facilitate heat dissipation, and then a graphene patch 1 for soaking and dissipating heat of the heat generating component is attached to the other surface of the metal heat dissipation sheet 2.

Preferably, the thickness of the metal radiating fin 2 is thin, and is provided with connecting bosses 202, the number of the connecting bosses 202 is three, two symmetrically arranged connecting bosses 202 are arranged on one side of the metal radiating fin 2, one connecting boss 202 is arranged in the middle of the other side of the metal radiating fin, a threaded hole is formed in the connecting boss 202, a through hole opposite to the threaded hole is formed in the PCB assembly 4, the radiating fin fixing screw 5 penetrates through the through hole to be in threaded connection with the threaded hole, and the PCB assembly 4 and the metal radiating fin 2 can be connected and combined through the radiating fin fixing screw 5.

The utility model discloses a structure is when assembling, at first paste graphene paster 1 on metal fin 2, later place heat conduction silica gel 3 on the heating element 6 on PCB subassembly 4, and the connection boss 202 on the reuse metal fin 2 is in the same place with the fin fixed screw 5 at the PCB subassembly 4 back, realizes holistic assembly fastening, because heat conduction boss 201 on the metal fin 2, can make the heat conduction silica gel 3 adoption that the heat conduction needs thinner, increases the stability of structure.

Example 2

In this embodiment a metal and graphene material heat radiation structure, including graphite alkene paster 1, metal fin 2, generate heat components and parts 6, aluminium extrusion fin and PCB subassembly 4, generate heat components and parts 6 fixed connection is at PCB subassembly 4 up end middle part, PCB subassembly 4 lower terminal surface is provided with fixed plate 7, and metal fin 2 laminating is at PCB subassembly 4 up end and will generate heat components and parts 6 are fixed in the centre, be provided with heat conduction silica gel 3 between generate heat components and parts 6 and metal fin 2, the size of heat conduction silica gel 3 and the size looks adaptation of generating heat components and parts 6, and be provided with heat conduction boss 201 on metal fin 2, heat conduction boss 201 protruding department is relative with heat conduction silica gel 3, heat conduction boss 201 can improve the compactness between heat conduction silica gel 3 and the components and parts that generate heat 6, then be equipped with the graphite alkene paster 1 that is used for generating heat components and parts, the thickness of metal fin 2 is slim, and be provided with connection boss 202, the quantity of connecting the three is three, be provided with two sides of metal fin 2 and two sides 202 and be provided with two symmetrical connection boss 202 and have the heat conduction boss 3, the heat conduction boss 3 is provided with the heat dissipation nut 8 on the end face-piece is also provided with the independent nut through the heat dissipation nut 9 on the metal fin 2, the heat radiation nut is connected with the independent nut 9 and is provided with on the heat radiation nut 8, the heat radiation piece is connected with the heat radiation piece 8 through the independent nut 9, and is connected with the heat radiation nut 9.

The utility model discloses a structure is when assembling, at first paste graphene paster 1 on metal fin 2, later scribble heat conduction silicone grease on the heating element 6 on PCB subassembly 4, and the connection boss 202 on the reuse metal fin 2 is in the same place with the fin fixed screw 5 at the PCB subassembly 4 back, and fin fixed screw 5 passes connection boss 202 and the fixed plate 7 of top and the crowded fin 8 threaded connection of aluminium are in the same place, realize holistic assembly fastening.

The above embodiment is only one of the preferred embodiments of the present utility model, and all the modifications or color-rendering that are not substantially made in the spirit and scope of the main body design of the present utility model are still consistent with the present utility model, and should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a metal and graphene material heat radiation structure, includes PCB subassembly (4) and heating element (6), heating element (6) are located PCB subassembly (4) up end, its characterized in that: still include metal fin (2), heat conduction silica gel (3) and graphite alkene paster (1), metal fin (2) can dismantle and connect on PCB subassembly (4), heating element (6) are located between terminal surface under metal fin (2) and PCB subassembly (4) up end, heat conduction silica gel (3) attach in on heating element (6), graphite alkene paster (1) attach metal fin (2) up end.

2. The heat dissipation structure of metal and graphene materials of claim 1, wherein: the utility model discloses a PCB assembly, including metal fin (2), PCB assembly (4), metal fin (2) top edge department is provided with a plurality of connection boss (202), be provided with the screw hole on connection boss (202), be provided with on PCB assembly (4) respectively with the through-hole that connection boss (202) corresponds, metal fin (2) pass through fin set screw (5) with the screw hole with PCB assembly (4) can dismantle and be connected.

3. The heat dissipation structure of metal and graphene materials of claim 2, wherein: and a heat conduction boss (201) is arranged at the position, opposite to the heat conduction silica gel (3), of the lower end surface of the metal radiating fin (2).

4. A metal and graphene material heat dissipation structure according to claim 3, wherein: the graphene radiator is characterized in that an aluminum extrusion radiating fin (8) and a fixing plate (7) are further arranged above the end face of the graphene patch (1) attached to the metal radiating fin (2), an independent nut (9) is arranged on the lower end face of the fixing plate (7) and the lower end face of the aluminum extrusion radiating fin (8), and the independent nut (9) is in threaded connection with the radiating fin fixing screw (5).