CN208247627U - A kind of nitridation copper-clad plate - Google Patents
A kind of nitridation copper-clad plate Download PDFInfo
- Publication number
- CN208247627U CN208247627U CN201820746610.XU CN201820746610U CN208247627U CN 208247627 U CN208247627 U CN 208247627U CN 201820746610 U CN201820746610 U CN 201820746610U CN 208247627 U CN208247627 U CN 208247627U
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- China
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- copper
- layer
- clad plate
- downside
- nitration case
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Abstract
The utility model discloses a kind of nitridation copper-clad plate, including copper-clad plate ontology, it is characterized in that: the copper-clad plate ontology includes bottom plate, core layer, heat-conducting layer, copper foil layer and nitration case, the bottom plate is located at the downside of core layer, the core layer is located at the downside of heat-conducting layer, the heat-conducting layer is located at the downside of copper foil layer, the copper foil layer is located at the downside of nitration case, the copper foil layer is made of several copper foils, the heat-conducting layer is made of the thermally conductive glue material of boron nitride and PP solidification glue material, the lower end of the core layer is provided with several semiconductor chilling plates, the semiconductor chilling plate is bonded by adhesive, the surface of the nitration case is provided with oxide layer, the thickness of the nitration case is greater than the thickness of oxide layer, the upper and lower ends of the copper sheet ontology are provided with protective film.The utility model can be improved the anti-flammability of copper-clad plate and prevent copper-clad plate surface from the phenomenon that oxidation turns yellow occur.
Description
Technical field
The utility model discloses a kind of nitridation copper-clad plate, belongs to technical field of copper clad laminate.
Background technique
With the rapid development of electronics industry, the volume size of electronic product is smaller and smaller, power is increasing, solves to dissipate
The problem of heat has been mentioned a new height, this is a huge challenge to electronics industry design, especially LED
Illumination aspect, it is particularly problematic.Conventional thickness of copper-clad plate is thick, and thermal diffusivity is bad, and surface is easy to happen showing for oxidation flavescence
As the development trend of electronics industry can not be adapted to.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of nitridation copper-clad plate, with solution
Certainly the problems mentioned above in the background art.
To achieve the above object, the utility model provides following technical solution to realize:
A kind of nitridation copper-clad plate, including copper-clad plate ontology, it is characterized in that: the copper-clad plate ontology include bottom plate, core layer,
Heat-conducting layer, copper foil layer and nitration case, the bottom plate are located at the downside of core layer, and the core layer is located at the downside of heat-conducting layer, institute
The downside that heat-conducting layer is located at copper foil layer is stated, the copper foil layer is located at the downside of nitration case, and the copper foil layer is by several copper foils
Composition, the heat-conducting layer is made of the thermally conductive glue material of boron nitride and PP solidification glue material, if the lower end of the core layer is provided with
Dry semiconductor chilling plate, the semiconductor chilling plate are bonded by adhesive, and the surface of the nitration case is provided with oxide layer,
The thickness of the nitration case is greater than the thickness of oxide layer, and the upper and lower ends of the copper sheet ontology are provided with protective film.
As preferred: the core layer folds the core group that the mixing of compound and glass fibre is constituted using impregnation wood pulp paper layer
At.
As preferred: the semiconductor chilling plate is circular configuration.
As preferred: the protective film is release protective film.
As preferred: being provided with adhesive layer between the core layer and bottom plate.
As preferred: the copper sheet ontology is square structure.
The utility model has the beneficial effects that
By being provided with nitration case and the surface of nitration case be provided with oxide layer, prevent copper foil layer in copper-clad plate with
Air makes copper-clad plate surface turn yellow there is a phenomenon where aoxidizing；By being provided with core layer, fire-retardant work is played to copper-clad plate
With by being provided with semiconductor chilling plate and heat-conducting layer, semiconductor chilling plate complements each other with heat-conducting layer, carries out for bottom plate scattered
Heat improves the service life of copper-clad plate.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for nitrogenizing copper-clad plate of the utility model.
Appended drawing reference: 1, bottom plate；2, semiconductor chilling plate；3, core layer；4, heat-conducting layer；5, copper foil layer；6, nitration case；7,
Oxide layer；8, protective film.
Specific embodiment
Nitridation copper-clad plate a kind of to the utility model is described further referring to Fig.1.
A kind of nitridation copper-clad plate, including copper-clad plate ontology, it is characterized in that: the copper-clad plate ontology includes bottom plate 1, core layer
3, heat-conducting layer 4, copper foil layer 5 and nitration case 6, the bottom plate 1 are located at the downside of core layer 3, and the core layer 3 is located at heat-conducting layer 4
Downside, the heat-conducting layer 4 is located at the downside of copper foil layer 5, and the copper foil layer 5 is located at the downside of nitration case 6, the copper foil layer 5
It is made of several copper foils, the heat-conducting layer 4 is made of the thermally conductive glue material of boron nitride and PP solidification glue material, the core layer
3 lower end is provided with several semiconductor chilling plates 2, and the semiconductor chilling plate 2 is bonded by adhesive, the nitration case 6
Surface be provided with oxide layer 7, the thickness of the nitration case 6 is greater than the thickness of oxide layer 7, the upper and lower ends of the copper sheet ontology
It is provided with protective film 8, the core layer 3 folds the core composition that the mixing of compound and glass fibre is constituted using impregnation wood pulp paper layer,
The semiconductor chilling plate 2 is circular configuration, and the protective film 8 is release protective film, is set between the core layer 3 and bottom plate 1
It is equipped with adhesive layer, the copper sheet ontology is square structure.
By being provided with nitration case 6 and the surface of nitration case 6 being provided with oxide layer 7, the copper foil in copper-clad plate is prevented
Layer 5, there is a phenomenon where aoxidizing, makes copper-clad plate surface turn yellow with air；By being provided with core layer 3, copper-clad plate is played fire-retardant
Effect, by being provided with semiconductor chilling plate 2 and heat-conducting layer 4, semiconductor chilling plate 2 complements each other with heat-conducting layer 4, be bottom plate
1 radiates, and improves the service life of copper-clad plate.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of nitridation copper-clad plate, including copper-clad plate ontology, it is characterized in that: the copper-clad plate ontology includes bottom plate, core layer, leads
Thermosphere, copper foil layer and nitration case, the bottom plate are located at the downside of core layer, and the core layer is located at the downside of heat-conducting layer, described
Heat-conducting layer is located at the downside of copper foil layer, and the copper foil layer is located at the downside of nitration case, and the copper foil layer is by several copper foil groups
At the heat-conducting layer is made of the thermally conductive glue material of boron nitride and PP solidification glue material, and the lower end of the core layer is provided with several
A semiconductor chilling plate, the semiconductor chilling plate are bonded by adhesive, and the surface of the nitration case is provided with oxide layer, institute
The thickness for stating nitration case is greater than the thickness of oxide layer, and the upper and lower ends of the copper sheet ontology are provided with protective film.
2. a kind of nitridation copper-clad plate according to claim 1, it is characterized in that: the core layer is folded using impregnation wood pulp paper layer
The core composition that the mixing of compound and glass fibre is constituted.
3. a kind of nitridation copper-clad plate according to claim 1, it is characterized in that: the semiconductor chilling plate is circular configuration.
4. a kind of nitridation copper-clad plate according to claim 1, it is characterized in that: the protective film is release protective film.
5. a kind of nitridation copper-clad plate according to claim 1, it is characterized in that: being provided with glue between the core layer and bottom plate
Adhesion coating.
6. a kind of nitridation copper-clad plate according to claim 1, it is characterized in that: the copper sheet ontology is square structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746610.XU CN208247627U (en) | 2018-05-18 | 2018-05-18 | A kind of nitridation copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746610.XU CN208247627U (en) | 2018-05-18 | 2018-05-18 | A kind of nitridation copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208247627U true CN208247627U (en) | 2018-12-18 |
Family
ID=66480305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820746610.XU Expired - Fee Related CN208247627U (en) | 2018-05-18 | 2018-05-18 | A kind of nitridation copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208247627U (en) |
-
2018
- 2018-05-18 CN CN201820746610.XU patent/CN208247627U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181218 |