CN205058726U - High heat conduction metal matrix composite base plate - Google Patents
High heat conduction metal matrix composite base plate Download PDFInfo
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- CN205058726U CN205058726U CN201520615912.XU CN201520615912U CN205058726U CN 205058726 U CN205058726 U CN 205058726U CN 201520615912 U CN201520615912 U CN 201520615912U CN 205058726 U CN205058726 U CN 205058726U
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- heat conduction
- high heat
- insulation layer
- base plate
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Abstract
The utility model discloses a high heat conduction metal matrix composite base plate, by constituteing in metal substrate (1), composite insulation layer (2) and copper foil (3), wherein, the metal substrate surface have a bump mapping, insulating layer and unsmooth surface bonding have increased the bonding strength of metal substrate with the insulating layer, it packs to contain fibrous high heat conduction one -dimensional in the insulating layer. High thermal insulation one -dimensional material utilizes the structure advantage, forms fast -speed heat conduction network structure in the insulating layer. The utility model discloses compare ordinary metal composite substrate, have good interface bonding power and high radiating efficiency.
Description
Technical field
The utility model relates to a kind of metal substrate, especially a kind of high heat conduction metal-based composite base plate.
Background technology
Along with electronic product is to the development in light, thin, little, the high direction such as integrated, multi-functional, no matter is high integrated circuit or great power LED, requires more and more higher to the heat dispersion of substrate.The quality of substrate heat dispersion directly affects the life-span of element, reduces the reliability of complete machine.
At present, conventional printed circuit substrate is as FR4, CEM3 etc., and be all the non-conductor of heat, the heat produced during element manipulation can not distribute effectively and timely, causes element to be subject to heat ageing, the lost of life.Metal-based compound substrate has superior heat radiation, and electromagnetic wave shielding is good, is suitable as the heat-radiating substrate of electronics, electric product.Traditional metal-based compound substrate is composited by the prepreg of Copper Foil, epoxy resin impregnated glass cloth and the superimposed pressurized that is heated of metal substrate, because insulating barrier heat conductivility is not good, designer tries one's best and reduces the thickness of insulating barrier, cause insulating barrier and metal interface bond strength not, make the heat endurance of the metal-based compound substrate made not high.
Summary of the invention
Technical problem to be solved in the utility model overcomes the deficiencies in the prior art, provides a kind of good heat conductivity and metallic matrix and the high metal-based compound substrate of interfacial dielectric layer bond strength.
The technical scheme that the utility model adopts is: a kind of high heat conduction metal-based composite base plate, is composited by metallic matrix, composite insulation layer and Copper Foil, and described metallic matrix upper surface has Z-Correct bump mapping Z-correct, and upper surface is combined with composite insulation layer; Composite insulation layer comprises high heat conduction one-dimensional material and insulating resin, and high heat conduction one-dimensional material is connected with Copper Foil through insulating resin, forms heat conduction network channel between metallic matrix and Copper Foil.
Wherein, described high heat conduction one-dimensional material is one or more in aluminium oxide, silica, aluminium nitride, silicon nitride, silica whisker.
Wherein, described high heat conduction one-dimensional material is one or more in silicon nitride, boron nitride, aluminium nitride, alumina fibre and quartz glass fibre.
Wherein, described high heat conduction one-dimensional material is one or more in PA, PP, PPS, PBT short fiber.
Wherein, the draw ratio of described high heat conductive insulating one-dimensional material is 10-20, and the diameter of material is less than 3 microns.
Wherein, the volume ratio that the high heat conduction one-dimensional material in described composite insulation layer accounts for whole composite insulation layer is not less than 10%.
Wherein, the thickness of described composite insulation layer is 20-2000 μm.
Wherein, the Z-Correct bump mapping Z-correct height of described metallic matrix upper surface accounts for the 1/4-1/2 of whole insulating barrier.
Wherein, described metallic matrix is copper coin, aluminium sheet, steel plate or galvanized iron sheet.
The beneficial effects of the utility model are: adopt surface to be printed on the metallic matrix of Z-Correct bump mapping Z-correct, improve the bonding strength of metallic matrix and insulating barrier; In addition, in insulating barrier, add high heat conduction one-dimensional material, utilize structural advantage to form heat conduction network, the radiating efficiency of whole insulating barrier can be improved greatly.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model, and wherein 1 represents metallic matrix, and 2 represent composite insulation layer, and 3 represent Copper Foil.
Fig. 2 is the utility model insulation layer structure enlarged drawing, and 4 represent high heat conduction one-dimensional material, and 5 represent insulating resin matrix.
Detailed description of the invention
Below by embodiment, and by reference to the accompanying drawings, the utility model is further described.
Embodiment 1
A kind of metal-based compound substrate, by metallic matrix 1, composite insulation layer 2 with Copper Foil 3 is bonding forms, composite insulation layer 2 is modified epoxies, curing agent, curing accelerator, coupling agent and particle diameter be 3 microns aluminium oxide with account for composite insulation layer cumulative volume 10%, draw ratio is that the aluminium nitride whisker of 8-12 etc. is obtained.Metallic matrix 1 adopts thickness to be the aluminium sheet of 3mm, and the thickness of composite insulation layer 2 is 100 μm, and the thickness of Copper Foil is 35 μm.
Embodiment 2
A kind of metal-based compound substrate, by metallic matrix 1, composite insulation layer 2 with Copper Foil 3 is bonding forms, composite insulation layer 2 is polyimide resins, curing agent, curing accelerator, coupling agent and account for composite insulation layer cumulative volume 10%, quartz glass fibre that draw ratio is 10-15 and account for composite insulation layer cumulative volume 10%, that draw ratio is the silicon nitride crystal whisker of 8-12 etc. is obtained.Metal substrate 1 adopts thickness to be the copper coin of 5mm, and the thickness of composite insulation layer 2 is 500 μm, and the thickness of Copper Foil is 50 μm.
Embodiment 3
A kind of metal-based compound substrate, by metallic matrix 1, composite insulation layer 2 with Copper Foil 3 is bonding forms, composite insulation layer 2 is epoxy resin, curing agent, curing accelerator, coupling agent and account for composite insulation layer cumulative volume 10%, aluminium nitride whisker that draw ratio is 8-12 and account for composite insulation layer cumulative volume 20%, that draw ratio is the PPS of 10-20 etc. is obtained.Metallic matrix 1 adopts thickness to be the steel plate of 8mm, and the thickness of composite insulation layer 2 is 1000 μm, and the thickness of Copper Foil is 70 μm.
The concrete step of preparation process of above-described embodiment is as follows:
(1) mix described solid by organic solvent and obtain the colloid that insulate;
(2) use coating apparatus to be coated on Copper Foil 3 by this insulation colloid, and enclose mould release membrance on surface, through oven drying, at 90 DEG C, dry process 10 minutes, obtains the Copper Foil being coated with semisolid insulating barrier;
(3) the metallic matrix cleaning of accurate Z-Correct bump mapping Z-correct, passivation, dry process will be comprised;
(4) mould release membrance is peeled off, colloid layer is relative with the surface of metallic matrix strip Z-Correct bump mapping Z-correct, hot pressing at 180 DEG C of temperature and 3Mpa pressure, cooling, discharging, i.e. obtained the utility model.
Above-mentioned is certain embodiments have been diagram to of the present utility model and describe; but embodiment of the present utility model is not restricted to the described embodiments; as selected without baseplate material; scribe different Z-Correct bump mapping Z-correct; select different resin matrixes etc.; as long as it reaches technique effect of the present utility model with substantially identical means, all protection domain of the present utility model should be belonged to.
Claims (4)
1. a high heat conduction metal-based composite base plate, be composited by metallic matrix (1), composite insulation layer (2) and Copper Foil (3), it is characterized in that, described metallic matrix upper surface has Z-Correct bump mapping Z-correct, and upper surface is combined with composite insulation layer; Composite insulation layer comprises high heat conduction one-dimensional material and insulating resin, and high heat conduction one-dimensional material is connected with Copper Foil through insulating resin, forms heat conduction network channel between metallic matrix and Copper Foil.
2. the high heat conduction metal-based composite base plate of one according to claim 1, is characterized in that, the draw ratio of described high heat conduction one-dimensional material is 10-20.
3. the high heat conduction metal-based composite base plate of one according to claim 1, is characterized in that, the thickness of described composite insulation layer is 20-2000 μm.
4. the high heat conduction metal-based composite base plate of one according to claim 1, is characterized in that, the Z-Correct bump mapping Z-correct height of the upper surface of described metallic matrix (1) accounts for the 1/4-1/2 of compound inslation layer thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520615912.XU CN205058726U (en) | 2015-08-17 | 2015-08-17 | High heat conduction metal matrix composite base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520615912.XU CN205058726U (en) | 2015-08-17 | 2015-08-17 | High heat conduction metal matrix composite base plate |
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| Publication Number | Publication Date |
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| CN205058726U true CN205058726U (en) | 2016-03-02 |
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| CN201520615912.XU Active CN205058726U (en) | 2015-08-17 | 2015-08-17 | High heat conduction metal matrix composite base plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106515125A (en) * | 2015-09-14 | 2017-03-22 | 汕头大学 | Metal-based composite substrate and preparation process thereof |
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2015
- 2015-08-17 CN CN201520615912.XU patent/CN205058726U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106515125A (en) * | 2015-09-14 | 2017-03-22 | 汕头大学 | Metal-based composite substrate and preparation process thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |