CN107599602A - A kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate - Google Patents
A kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate Download PDFInfo
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- CN107599602A CN107599602A CN201610552991.3A CN201610552991A CN107599602A CN 107599602 A CN107599602 A CN 107599602A CN 201610552991 A CN201610552991 A CN 201610552991A CN 107599602 A CN107599602 A CN 107599602A
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Abstract
The invention discloses a kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate, including thermal conductive insulation glue coating, pre- thermal-adhering aluminium sheet, heat-press step.By the way that electrolytic copper foil directly is fitted into surface treated surface of aluminum plate, interlayer sandwiched thermal conductive insulation glue, the copper-clad plate has higher radiating efficiency, reduces the high defect rate caused by the fragility of glass-fiber-fabric the present invention.
Description
Technical field
The present invention relates to copper-clad plate production technical field, and in particular to a kind of preparation side of high thermal conductivity aluminum matrix plate copper-clad plate
Method.
Background technology
Heat conduction aluminum substrate is typically made up of copper foil, thermally conductive insulating layer, heat-dissipating aluminium plate three parts.Thermally conductive insulating layer is aluminium base
Core, it directly affects the combination property of aluminium base.At present, thermally conductive insulating layer is mostly using epoxy resin as matrix,
Increase the thermal conductivity of insulating barrier by adding the inorganic particulate with high heat conductance.The quality of thermally conductive insulating layer heat conductivility is main
To depend on heat filling thermal conductivity itself, particle shape and amount of filling.Therefore selection good heat conductivity, nontoxic, cheap
Inorganic filler be improve aluminium base heat conductivility key.In addition, research is found, carrying out that surface is modified to inorganic particulate can be with
Improve the combination property of heat-conductive composite material.
Existing aluminum-based copper-clad plate, the three-decker being generally made up of copper foil, insulating barrier, aluminium sheet, insulating barrier use glass
Cloth impregnating resin system, it is molded through high temperature semi-solid preparation, although this insulating trip has the effect of heat conduction and insulation concurrently simultaneously, it is lacked
Sunken part is：1. the thermal resistance of glass-fiber-fabric is big, poor radiation, is difficult to the needs that meet high-power, high radiating electronic product；2. plus
Easily occur the brittleness problems of glass layer of cloth during work, cause product rejection rate to increase.
The content of the invention
It is an object of the invention to overcome defect present in prior art, there is provided a kind of high thermal conductivity aluminum matrix plate copper-clad plate
Preparation method, by the way that electrolytic copper foil directly is fitted into surface treated surface of aluminum plate, interlayer sandwiched thermal conductive insulation glue, this covers
Copper coin has higher radiating efficiency.
To realize above-mentioned technique effect, the technical scheme is that：A kind of preparation side of high thermal conductivity aluminum matrix plate copper-clad plate
Method, it is characterised in that comprise the following steps：
S1：Thermal conductive insulation glue is uniformly coated on electrolytic copper foil hair side, is heated to 70~80 DEG C of 2~4h of insulation, removing is led
Solvent in heat insulation glue；
S2：Electrolytic copper foil obtained by S1 is heated to 140~150 DEG C, then 7~12min of insulation will have been coated with heat conductive insulating
The copper foil of glue is pasted with surface treated aluminium sheet；
S3：Composite members obtained by S2 are placed in hot-press solidifying in hot press, hot-press solidifying process conditions are：Hot pressing temperature 140
~160 DEG C, 2~3Mpa of hot pressing pressure, 40~80min of hot pressing time.
Preferable technical scheme is that the composition and weight fraction of thermal conductive insulation glue are：20~50 parts of epoxy resin is blended, consolidates
5~10 parts of agent, 40~80 parts of dimethylformamide, radiating 10~20 parts of filler, radiate filler in containing 0.5~2% it is dilute
Native oxide.
Preferable technical scheme is that rare earth oxide is selected from least one of lanthana and cerium oxide.
Preferable technical scheme is that blending epoxy resin is epoxy resin and glycidyl amine-ether type high-temperature resistant epoxy oxygen tree
Fat mixes, and the percentage by weight of blending epoxy resin epoxy resin is 70~85%.
Preferable technical scheme is that filler also includes in hollow glass micropearl, glass powder, silicon nitride powder, boron nitride
It is at least one.
Preferable technical scheme is that filler is mixed by glass powder and rare earth oxide.
The advantages of the present invention are：
The present invention by electrolytic copper foil by directly fitting to surface treated surface of aluminum plate, interlayer sandwiched heat conductive insulating
Glue, the copper-clad plate have higher radiating efficiency, reduce the high defect rate caused by the fragility of glass-fiber-fabric.
Embodiment
With reference to embodiment, the embodiment of the present invention is further described.Following examples are only used for more
Add and clearly demonstrate technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1
The preparation method of high thermal conductivity aluminum matrix plate copper-clad plate comprises the following steps in embodiment 1：
S1：Thermal conductive insulation glue is uniformly coated on electrolytic copper foil hair side, 70 DEG C of insulation 4h is heated to, removes thermal conductive insulation glue
In solvent；
S2：Electrolytic copper foil obtained by S1 is heated to 140 DEG C, then insulation 12min will have been coated with the copper foil of thermal conductive insulation glue
Pasted with surface treated aluminium sheet；
S3：Composite members obtained by S2 are placed in hot-press solidifying in hot press, hot-press solidifying process conditions are：Hot pressing temperature 140
DEG C, hot pressing pressure 3Mpa, hot pressing time 40min.
The composition and weight fraction of thermal conductive insulation glue be：20 parts of epoxy resin, 10 parts of curing agent, dimethylformamide is blended
40 parts, radiating 20 parts of filler, radiate filler in be free of rare earth oxide.
Blending epoxy resin is that epoxy resin and glycidyl amine-ether type high-temperature-resistant epoxy resin mix, and ring is blended
The percentage by weight of oxygen tree fat epoxy resin is 70%.
Filler is hollow glass micropearl.
Embodiment 2
The difference of embodiment 2 and embodiment 1 is：The preparation method of high thermal conductivity aluminum matrix plate copper-clad plate comprises the following steps：
S1：Thermal conductive insulation glue is uniformly coated on electrolytic copper foil hair side, 80 DEG C of insulation 2h is heated to, removes thermal conductive insulation glue
In solvent；
S2：Electrolytic copper foil obtained by S1 is heated to 150 DEG C, insulation 7min then will have been coated with the copper foil of thermal conductive insulation glue with
Surface treated aluminium sheet is pasted；
S3：Composite members obtained by S2 are placed in hot-press solidifying in hot press, hot-press solidifying process conditions are：Hot pressing temperature 160
DEG C, hot pressing pressure 2Mpa, hot pressing time 80min.
The composition and weight fraction of thermal conductive insulation glue be：50 parts of epoxy resin, 5 parts of curing agent, dimethylformamide is blended
80 parts, radiating 10 parts of filler, radiate filler in contain 2% rare earth oxide.
Rare earth oxide is lanthana.
Blending epoxy resin is that epoxy resin and glycidyl amine-ether type high-temperature-resistant epoxy resin mix, and ring is blended
The percentage by weight of oxygen tree fat epoxy resin is 85%.
The ratio between filler also glass powder and boron nitride, two kinds of filler weights are 1: 1.
Embodiment 3
The difference of embodiment 3 and embodiment 1 is that the preparation method of high thermal conductivity aluminum matrix plate copper-clad plate comprises the following steps：
S1：Thermal conductive insulation glue is uniformly coated on electrolytic copper foil hair side, 75 DEG C of insulation 3h is heated to, removes thermal conductive insulation glue
In solvent；
S2：Electrolytic copper foil obtained by S1 is heated to 145 DEG C, insulation 9min then will have been coated with the copper foil of thermal conductive insulation glue with
Surface treated aluminium sheet is pasted；
S3：Composite members obtained by S2 are placed in hot-press solidifying in hot press, hot-press solidifying process conditions are：Hot pressing temperature 150
DEG C, hot pressing pressure 2.5Mpa, hot pressing time 60min.
The composition and weight fraction of thermal conductive insulation glue be：35 parts of epoxy resin, 7 parts of curing agent, dimethylformamide is blended
60 parts, radiating 15 parts of filler, radiate filler in contain 1.2% rare earth oxide.
Rare earth oxide is that lanthana and cerium oxide are mixed with weight ratio 1: 2.
Blending epoxy resin is that epoxy resin and glycidyl amine-ether type high-temperature-resistant epoxy resin mix, and ring is blended
The percentage by weight of oxygen tree fat epoxy resin is 77%.
Filler is mixed by glass powder and rare earth oxide.
Comparative example
Copper-clad plate is prepared using glass-fiber-fabric dipping thermal conductive insulation glue in comparative example, other technological parameters are the same as embodiment 1.
The physical property of sheet material obtained by embodiment and comparative example is contrasted：
Result of the test：The radiating efficiency of embodiment 2,3 is higher by embodiment 5%, and the radiating efficiency of embodiment 1 is worse than embodiment
2 and 3, the fragility of comparative example copper-clad plate is larger.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate, it is characterised in that comprise the following steps：
S1：Thermal conductive insulation glue is uniformly coated on electrolytic copper foil hair side, 70~80 DEG C of 2~4h of insulation is heated to, it is exhausted to remove heat conduction
Solvent in edge glue；
S2：Electrolytic copper foil obtained by S1 is heated to 140~150 DEG C, then 7~12min of insulation will have been coated with thermal conductive insulation glue
Copper foil is pasted with surface treated aluminium sheet；
S3：Composite members obtained by S2 are placed in hot-press solidifying in hot press, hot-press solidifying process conditions are：Hot pressing temperature 140~160
DEG C, 2~3Mpa of hot pressing pressure, 40~80min of hot pressing time.
2. the preparation method of high thermal conductivity aluminum matrix plate copper-clad plate according to claim 1, it is characterised in that thermal conductive insulation glue
Composition and weight fraction are：20~50 parts of epoxy resin, 5~10 parts of curing agent, 40~80 parts of dimethylformamide, radiating is blended
10~20 parts of filler, radiate filler in contain 0.5~2% rare earth oxide.
3. the preparation method of high thermal conductivity aluminum matrix plate copper-clad plate according to claim 2, it is characterised in that rare earth oxide is
Selected from least one of lanthana and cerium oxide.
4. the preparation method of high thermal conductivity aluminum matrix plate copper-clad plate according to claim 3, it is characterised in that blending epoxy resin
Mixed for epoxy resin and glycidyl amine-ether type high-temperature-resistant epoxy resin, the weight of epoxy resin epoxy resin is blended
It is 70~85% to measure percentage.
5. the preparation method of high thermal conductivity aluminum matrix plate copper-clad plate according to claim 4, it is characterised in that filler also includes sky
At least one of heart glass microballoon, glass powder, silicon nitride powder, boron nitride.
6. the preparation method of high thermal conductivity aluminum matrix plate copper-clad plate according to claim 5, it is characterised in that filler is by glass powder
Mixed with rare earth oxide.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610552991.3A CN107599602A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate |
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| CN201610552991.3A CN107599602A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753225A (en) * | 2018-04-28 | 2018-11-06 | 苏州捷德瑞精密机械有限公司 | A kind of room temperature curing metal repairing agent and preparation method thereof |
| CN112297541A (en) * | 2020-10-29 | 2021-02-02 | 河南省科学院应用物理研究所有限公司 | Aluminum-based copper-clad plate and preparation method thereof |
-
2016
- 2016-07-11 CN CN201610552991.3A patent/CN107599602A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753225A (en) * | 2018-04-28 | 2018-11-06 | 苏州捷德瑞精密机械有限公司 | A kind of room temperature curing metal repairing agent and preparation method thereof |
| CN112297541A (en) * | 2020-10-29 | 2021-02-02 | 河南省科学院应用物理研究所有限公司 | Aluminum-based copper-clad plate and preparation method thereof |
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Addressee: Jiangyin's application interface Co. Ltd. Document name: Notification of before Expiration of Request of Examination as to Substance |
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Application publication date: 20180119 |