CN110234199A - A kind of high temperature resistant pcb board and its manufacture craft - Google Patents
A kind of high temperature resistant pcb board and its manufacture craft Download PDFInfo
- Publication number
- CN110234199A CN110234199A CN201910630159.4A CN201910630159A CN110234199A CN 110234199 A CN110234199 A CN 110234199A CN 201910630159 A CN201910630159 A CN 201910630159A CN 110234199 A CN110234199 A CN 110234199A
- Authority
- CN
- China
- Prior art keywords
- pcb
- raw sheet
- pcb board
- copper
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000003292 glue Substances 0.000 claims abstract description 30
- 239000004593 Epoxy Substances 0.000 claims abstract description 29
- 238000005266 casting Methods 0.000 claims abstract description 25
- 239000004519 grease Substances 0.000 claims abstract description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 25
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 238000010030 laminating Methods 0.000 claims description 19
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 229910052698 phosphorus Inorganic materials 0.000 claims description 14
- 239000011574 phosphorus Substances 0.000 claims description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 229910052582 BN Inorganic materials 0.000 claims description 12
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 12
- 239000003063 flame retardant Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 11
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920002050 silicone resin Polymers 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 208000003351 Melanosis Diseases 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 7
- 238000007688 edging Methods 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 229920000877 Melamine resin Polymers 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 2
- 230000000191 radiation effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 17
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 241000446313 Lamella Species 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- YCIVSJFIXXVSRH-UHFFFAOYSA-N amino-methyl-phenylsilicon Chemical compound C[Si](N)C1=CC=CC=C1 YCIVSJFIXXVSRH-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000006854 communication Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000029142 excretion Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229960001866 silicon dioxide Drugs 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000029152 Small face Diseases 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of high temperature resistant pcb boards, including PCB raw sheet, one side surface of PCB raw sheet is coated with casting glue and forms encapsulating glue-line, another side surface is fixed with radiating fin by thermal grease layer, the surface through-thickness of PCB raw sheet is provided with uniformly distributed hot via hole, PCB raw sheet includes substrate, and the both side surface of substrate is fixed with copper-clad plate by prepreg；The invention also discloses the manufacture crafts of the pcb board.The present invention is by using modified epoxy as pcb board substrate, close heat conduction network is formed in substrate, by opening up hot via hole and setting radiating fin on PCB raw sheet, the heat that power device generates when working is reached at the top of PCB raw sheet in copper-clad plate by device outer case and encapsulating glue-line, it is conducted heat in the copper-clad plate of board bottom portion by hot via hole, radiating fin substrate is transferred to by raw sheet again, it is transmitted in ambient enviroment by radiating fin again, reach good heat conduction and heat radiation effect, the high temperature resistance of pcb board is improved from many aspects such as pcb board ontology, surfaces.
Description
Technical field
The invention belongs to pcb board manufacturing technology fields, and in particular, to a kind of high temperature resistant pcb board and its manufacture craft.
Background technique
Printed circuit board (PrintedCircuitBoard, PCB) is almost the basis of any electronic product, is appeared in several
In each electronic equipment, it is, in general, that they are also all integrated if having electronic component in some equipment
On the PCB of different sizes.Other than the various components of fixation, the main function of PCB is to provide the company between every component
Connect circuit.As electronic equipment becomes increasingly complex, the component needed is more and more, and the route of PCB surface is also got over component
Come more intensive.Due to the high density of electronic product, multi-functional, high-power and microelectronics integrated technology high speed development, so that
The power density of power electronic devices and calorific value increase substantially, and thus lead to thermal diffusivity, the heat resistance of power electronic devices
The problems such as become more and more prominent.
The Chinese patent of Patent No. CN201710474923.4 discloses a kind of pcb board processing for exempting to paste heat-resisting material
Technique, by printing peelable glue (pasting red glue) using print tin cream technology generations on the pcb board for completing first time process of surface treatment
And tin spray process, no exhaust gas generate, energy-saving and emission-reduction reduce production cost, improve production efficiency.But due to this application system
The pcb board obtained is only to have carried out the processing of print tin cream on surface, so that requirement is not achieved in pcb board in terms of heat resistance.
Summary of the invention
The purpose of the present invention is to provide a kind of high temperature resistant pcb board and its manufacture crafts, by using modified epoxy
As pcb board substrate, close heat conduction network is formed in substrate, by opening up hot via hole and setting radiating fin on PCB raw sheet
Piece, the heat that power device generates when working are reached at the top of PCB raw sheet in copper-clad plate by device package casing and encapsulating glue-line,
It is conducted heat in the copper-clad plate of board bottom portion by hot via hole, then radiating fin substrate is transferred to by raw sheet, then by radiating fin
Piece is transmitted in ambient enviroment, reaches good heat conduction and heat radiation effect, improves pcb board from many aspects such as pcb board ontology, surfaces
High temperature resistance.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of high temperature resistant pcb board, including PCB raw sheet, one side surface of PCB raw sheet are coated with casting glue and form encapsulating glue-line,
Another side surface is fixed with radiating fin by thermal grease layer, and radiating fin is distributed in thermal grease layer；The table of PCB raw sheet
Face through-thickness is provided with uniformly distributed hot via hole, and PCB raw sheet includes substrate, and the both side surface of substrate is fixed with by prepreg
Copper-clad plate；
The pcb board is made of following steps:
The first step etches glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side, milling
Plate and melanism drying-plate, obtain copper-clad plate；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg；
Third step, in sequence by substrate, prepreg and copper-clad plate closed assembly in laminating machine heat up press, adjust lamination
Pressure parameter in machine is 2.95Mpa, 172-175 DEG C of laminating temperature；
4th step, demoulding, obtain PCB raw sheet, coat one layer of casting glue in one side surface of PCB raw sheet, after solidification, are formed and filled
Adhesive layer；
5th step is obtained after dry in another side surface of PCB raw sheet by the fixed radiating fin of coating thermal grease layer
High temperature resistant pcb board.
Further, the encapsulating glue-line with a thickness of 0.1mm；Thermal grease layer with a thickness of 0.15mm.
Further, the substrate with a thickness of 0.3mm；Prepreg with a thickness of 0.1mm；Copper-clad plate is glass fibre
Epoxy resin copper-clad plate material, thickness of copper-clad plate 0.2mm.
Further, the pore size of the hot via hole is 0.2mm, pitch of holes 1-1.2mm；Radiating fin aluminium is closed
Golden material, with a thickness of 0.7mm, the spacing of radiating fin is 3-3.5mm.
Further, the prepreg use illiquidity PP piece, prepreg with a thickness of 0.1mm.
Further, the substrate is made by the following method:
S1, phosphorus-containing flame-retardant epoxy resin is weighed, is added in there-necked flask, be heated to 35-40 DEG C, epoxy resin is added,
300r/min mixing 30min；The mass ratio of phosphorus-containing flame-retardant epoxy resin and epoxy resin is 1:1-1.2；
S2, acetone and dimethylformamide is added, melamine is added after 300r/min mixing 30min, mix 15min,
The mixture for adding boron nitride and silicon carbide, under the revolving speed of 3000r/min, modified epoxy tree is made in high-speed stirred 60min
Rouge；
The additional amount of the mixture of boron nitride and silicon carbide is the quality of 16-18%, BN and the SiC of resin compound quality
Than for 9:1；
S3, modified epoxy is put into cold pressing 10min molding in mold, then is transferred to 160 DEG C of dry 50- in baking oven
60min, then be transferred to 160 DEG C of hot pressing 55-65min in hot press and obtain substrate to being fully cured.
Further, the casting glue is prepared by the following method:
1) 100g methyl phenyl silicone resin, 24-30g butyl acetate are weighed and mixes dispersion 30- under the revolving speed of 2000r/min
1.6-2g methyltrimethoxysilane, 2.4-3g phenyltrimethoxysila,e is added in 40min, continues to disperse 30- after adding
40min；
2) γ-(2,3- the third oxygen of the epoxy) propyl trimethoxy silicane for adding 1.6-2g butyl titanate, 0.3-0.4g, mentions
High revolving speed is to 3000r/min, high-speed stirred 25-30min；
3) it is eventually adding 80-90g normal octane, 2000r/min stirs 30-40min, and casting glue is made.
8, a kind of manufacture craft of high temperature resistant pcb board, which comprises the steps of:
The first step etches glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side, milling
Plate and melanism drying-plate, obtain copper-clad plate；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg；
Third step, in sequence by substrate, prepreg and copper-clad plate closed assembly in laminating machine heat up press, adjust lamination
Pressure parameter in machine is 2.95Mpa, 172-175 DEG C of laminating temperature；
After 4th step, demoulding, PCB raw sheet is obtained, one layer of casting glue is coated in one side surface of PCB raw sheet, after solidification, is formed
Encapsulating glue-line；
5th step is obtained after dry in another side surface of PCB raw sheet by the fixed radiating fin of coating thermal grease layer
High temperature resistant pcb board.
Beneficial effects of the present invention:
Hot via hole is provided on PCB raw sheet of the invention, and a side surface of PCB raw sheet is fixed with heat dissipation by heat-conducting silicone grease
Fin, the heat that power device generates when working reach copper-clad plate at the top of PCB raw sheet by device package casing and encapsulating glue-line
On, then conducted heat in the copper-clad plate of board bottom portion by hot via hole, the heat that such device generates is transferred to by raw sheet again
Radiating fin substrate, then be transmitted in ambient enviroment by radiating fin, by the cooperation of hot via hole and radiating fin, reach good
Heat conduction and heat radiation effect, to improve the high temperature resistance of pcb board；
Pcb board substrate of the invention is made of modified epoxy, is contained in the molecular structure of phosphorus-containing flame-retardant epoxy resin
Have ignition-proof element phosphorus, there are dehydration, crosslinking in when burning, at carbon the effects of, carbon forming rate can be improved and oxygen index (OI) is higher than, meanwhile, table
The formation of face carbon-coating can prevent the generation of flammable volatile matter, reduce the thermal degradation of material, play excellent flame-retarded efficiency；?
The mixture of boron nitride and silicon carbide is added in hybrid resin, SiC can be filled between BN lamella since particle granules are small
In gap, on the one hand due to the volume excretion of SiC, the original arrangement mode of BN lamella is changed, on the other hand, different dimensional
The filler hydridization of (SiC is graininess, and BN is sheet) is spent using the gap that can be reduced in material, is overlapped more closely knit thermally conductive logical
Road advantageously reduces scattering of the phonon in communication process, forms close heat conduction network；Hybrid systems overlap to be formed it is more closely knit
BN-SiC-BN heat filling network, be more advantageous to phonon propagation, significantly improve thermal conductivity, heat conducted in time,
To reduce the pyrolysis carbonization speed of material, the heat resistance of substrate is improved, meanwhile, since to hinder SiC particle straight by BN in system
Overlap joint is connect, so ensure that the good electrical insulating property of material；Furthermore the hot mistake being arranged on the high-termal conductivity cooperation pcb board of substrate
Hole and radiating fin can further enhance thermally conductive, heat dissipation effect, realize high thermal conductivity from many aspects such as pcb board ontology, surfaces
Property；
The present invention is potted PCB raw sheet using heat-resist casting glue, and aminomethyl phenyl silicon tree is used in casting glue
Rouge is as main base object, and phenyl content is 16-18%, phenyl group position in methyl phenyl silicone resin in methyl phenyl silicone resin
Larger, difficult decomposition under high temperature is hindered, therefore obtained casting glue is heat-resist, and phenyl content more high temperature tolerance is better；In addition,
Since phenyl group steric hindrance is larger, crosslinking is incomplete, the casting glue coefficient of expansion and hardness are increased with the raising of phenyl content, therefore
Selecting phenyl content is the methyl phenyl silicone resin of 16-18%, and obtained casting glue hardness is suitable, and (your the A hardness that continues is 68-74
Degree), thermal expansion coefficient is small (less than 100), and temperature tolerance is increased to 295-300 DEG C；The encapsulating glue-line can generate power device
Heat immediately quickly conduction on PCB raw sheet；
For the present invention by using modified epoxy as pcb board substrate, substrate is interior to form close heat conduction network, passes through
Hot via hole and setting radiating fin are opened up on PCB raw sheet, the heat that power device generates when working passes through device package casing
It reaches in the top copper-clad plate of PCB raw sheet, is conducted heat in the copper-clad plate of board bottom portion by hot via hole, then pass through with encapsulating glue-line
Raw sheet is transferred to radiating fin substrate, then is transmitted in ambient enviroment by radiating fin, reaches good heat conduction and heat radiation effect, from
The high temperature resistance of many aspects such as pcb board ontology, surface raising pcb board.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is a kind of structural schematic diagram of high temperature resistant pcb board of the present invention；
Fig. 2 is the structural schematic diagram of PCB raw sheet of the present invention.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
Logical technical staff all other embodiment obtained without creative efforts belongs to what the present invention protected
Range.
A kind of high temperature resistant pcb board, please refers to shown in Fig. 1-2, including PCB raw sheet 1, and 1 one side surface of PCB raw sheet is coated with filling
Sealing forms encapsulating glue-line 2, and another side surface is fixed with radiating fin 4 by thermal grease layer 3, specifically, radiating fin 4 is equal
It is distributed in thermal grease layer 3；The surface through-thickness of PCB raw sheet 1 is provided with uniformly distributed hot via hole 10, and PCB raw sheet 1 includes substrate
11, the both side surface of substrate 11 is fixed with copper-clad plate 13 by prepreg 12；
Encapsulating glue-line 2 with a thickness of 0.1mm；Thermal grease layer 3 with a thickness of 0.15mm；
Substrate 11 with a thickness of 0.3mm；Prepreg 12 with a thickness of 0.1mm；Copper-clad plate 13 is glass fibre epoxy tree
Rouge copper-clad plate material, copper-clad plate 13 is with a thickness of 0.2mm；
The pore size of hot via hole 10 is 0.2mm, pitch of holes 1-1.2mm；Radiating fin 4 selects aluminum alloy material, thick
Degree is 0.7mm, and the spacing of radiating fin 4 is 3-3.5mm；
The heat that power device generates when working is reached by device package casing and encapsulating glue-line 2 to be covered at the top of PCB raw sheet 1
It on copper sheet 13, then is conducted heat in board bottom portion copper-clad plate 13 by hot via hole 10, the heat that such device generates passes through again
PCB raw sheet is transferred to 4 substrate of radiating fin, then is transmitted in ambient enviroment by radiating fin 4；
Prepreg 12 use illiquidity PP piece, prepreg 12 with a thickness of 0.1mm；Prepreg 12 is before lamination
By cut draw in the way of be processed into special shaped profile；Using the low illiquidity PP piece of mobility, which has tree
The features such as rouge fluidity is low, flexible, heat resistance and excellent electrical property, and by cut draw in the way of process special shaped profile, it is real
The technical process for first forming and pressing afterwards is showed, shape forms after pressing, time numerical control mill sharp processing is no longer needed to, so that PCB exists
Gummosis is resolved after pressing, ensure that after pcb board lamination joint face without gummosis and pressing it is close；
The substrate 11 is made by the following method:
S1, phosphorus-containing flame-retardant epoxy resin is weighed, is added in there-necked flask, be heated to 35-40 DEG C, epoxy resin is added,
300r/min mixing 30min；The mass ratio of phosphorus-containing flame-retardant epoxy resin and epoxy resin is 1:1-1.2；
S2, acetone and dimethylformamide is added, melamine is added after 300r/min mixing 30min, mix 15min,
The mixture for adding boron nitride and silicon carbide, under the revolving speed of 3000r/min, modified epoxy tree is made in high-speed stirred 60min
Rouge；
Wherein, the additional amount of the mixture of boron nitride and silicon carbide is 16-18%, BN and the SiC of resin compound quality
Mass ratio be 9:1；The additional amount of acetone, dimethylformamide and melamine be respectively resin compound quality 70%,
60% and 45%；
S3, modified epoxy is put into cold pressing 10min molding in mold, then is transferred to 160 DEG C of dry 50- in baking oven
60min, then be transferred to 160 DEG C of hot pressing 55-65min in hot press and obtain substrate 11 to being fully cured；
Preferably, before being pressed together, hot via hole 10 is opened up on substrate 11；
Contain ignition-proof element phosphorus in the molecular structure of phosphorus-containing flame-retardant epoxy resin, there are dehydration, crosslinking in when burning, make at carbon etc.
With, carbon forming rate can be improved to 40-50%, while material oxygen index (OI) being made to be higher than 30%, meanwhile, the formation of material surface carbon-coating
The generation that can prevent flammable volatile matter reduces the thermal degradation of material, plays excellent flame-retarded efficiency；Add in hybrid resin
Enter the mixture of boron nitride and silicon carbide, SiC can be filled in the gap between BN lamella, a side since particle granules are small
Face changes the original arrangement mode of BN lamella due to the volume excretion of SiC, and on the other hand, (SiC is to different dimensions
Granular, BN is sheet) filler hydridization using the gap that can be reduced in composite material, overlap more closely knit thermal conducting path, have
Conducive to scattering of the phonon in communication process is reduced, close heat conduction network is formed；Hybrid systems overlap to form more closely knit BN-
SiC-BN heat filling network is more advantageous to phonon propagation, significantly improves thermal conductivity, heat is conducted in time, thus
The pyrolysis carbonization speed for reducing material, improves the heat resistance of substrate, meanwhile, it is directly taken in system since BN hinders SiC particle
It connects, so ensure that the good electrical insulating property of material；
The casting glue is prepared by the following method:
(1) 100g methyl phenyl silicone resin, 24-30g butyl acetate are weighed and mixes dispersion under the revolving speed of 2000r/min
1.6-2g methyltrimethoxysilane, 2.4-3g phenyltrimethoxysila,e is added in 30-40min, continues to disperse 30- after adding
40min；
(2) γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane of 1.6-2g butyl titanate, 0.3-0.4g are added,
Revolving speed is improved to 3000r/min, high-speed stirred 25-30min；
(3) it is eventually adding 80-90g normal octane, 2000r/min stirs 30-40min, and casting glue is made；
Phenyl content is 16-18% in methyl phenyl silicone resin, and phenyl group steric hindrance is larger in methyl phenyl silicone resin, high
The lower difficult decomposition of temperature, therefore phenyl content more high temperature tolerance is better；In addition, being filled since phenyl group steric hindrance is larger, crosslinking is incomplete
The sealing coefficient of expansion and hardness are increased with the raising of phenyl content, therefore selecting phenyl content is the aminomethyl phenyl silicon of 16-18%
Resin, obtained casting glue hardness is suitable (your the A hardness that continues is 68-74 degree), and thermal expansion coefficient is small (less than 100), and temperature tolerance mentions
Height arrives 295-300 DEG C；
The manufacture craft of the pcb board, includes the following steps:
The first step etches glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side, milling
Plate and melanism drying-plate, obtain copper-clad plate 13；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg
12；
Third step, in sequence by substrate 11, prepreg 12 and 13 closed assembly of copper-clad plate in laminating machine heat up press, tool
Body, use silicagel pad as crucial buffer layer in lamination process, silica gel pad is placed between mold and copper-clad plate 13,
Play the role of being uniformly distributed pressure in pressing；Adjusting the pressure parameter in laminating machine is 2.95Mpa, laminating temperature 172-175
℃；
After 4th step, demoulding, PCB raw sheet is obtained, one layer of casting glue is coated in one side surface of PCB raw sheet, after solidification, is formed
Encapsulating glue-line 2；
5th step is obtained after dry in another side surface of PCB raw sheet by the fixed radiating fin 4 of coating thermal grease layer 3
To high temperature resistant pcb board.
Embodiment 1
Substrate 11 is made by the following method:
S1, phosphorus-containing flame-retardant epoxy resin is weighed, be added in there-necked flask, be heated to 35 DEG C, epoxy resin, 300r/ is added
Min mixing 30min；The mass ratio of phosphorus-containing flame-retardant epoxy resin and epoxy resin is 1:1；
S2, acetone and dimethylformamide is added, melamine is added after 300r/min mixing 30min, mix 15min,
The mixture for adding boron nitride and silicon carbide, under the revolving speed of 3000r/min, modified epoxy tree is made in high-speed stirred 60min
Rouge；
Wherein, the additional amount of the mixture of boron nitride and silicon carbide is the matter of 16%, the BN and SiC of resin compound quality
Amount is than being 9:1；
S3, modified epoxy is put into cold pressing 10min molding in mold, then is transferred to 160 DEG C of dry 50min in baking oven,
It is transferred to 160 DEG C of hot pressing 55min in hot press again and obtains substrate 11 to being fully cured.
Embodiment 2
Substrate 11 is made by the following method:
S1, phosphorus-containing flame-retardant epoxy resin is weighed, be added in there-necked flask, be heated to 40 DEG C, epoxy resin, 300r/ is added
Min mixing 30min；The mass ratio of phosphorus-containing flame-retardant epoxy resin and epoxy resin is 1:1.2；
S2, acetone and dimethylformamide is added, melamine is added after 300r/min mixing 30min, mix 15min,
The mixture for adding boron nitride and silicon carbide, under the revolving speed of 3000r/min, modified epoxy tree is made in high-speed stirred 60min
Rouge；
Wherein, the additional amount of the mixture of boron nitride and silicon carbide is the matter of 18%, the BN and SiC of resin compound quality
Amount is than being 9:1；
S3, modified epoxy is put into cold pressing 10min molding in mold, then is transferred to 160 DEG C of dry 60min in baking oven,
It is transferred to 160 DEG C of hot pressing 65min in hot press again and obtains substrate 11 to being fully cured.
Comparative example 1
Substrate is made using common epoxy resin.
Following performance test is done to the obtained substrate of embodiment 1-2 and comparative example 1: using plane heat source method testing substrates
Heating conduction, according to the mechanical property of GBT 528-2009 testing substrates, test result is as follows table 1:
Table 1
| Embodiment 1 | Embodiment 2 | Comparative example 1 | |
| Thermal conductivity/W (mK)-1 | 0.88 | 0.86 | 0.2 |
It is found that the thermal conductivity of substrate made from embodiment 1-2 is 0.86-0.88W (mK)-1, compared to common epoxy
Substrate made from resin, heating conduction are significantly promoted, and illustrate that substrate produced by the present invention has good thermally conductive, thermal diffusivity
Energy；
Embodiment 3
The casting glue is prepared by the following method:
(1) 100g methyl phenyl silicone resin, 24g butyl acetate are weighed and mixes dispersion under the revolving speed of 2000r/min
1.6g methyltrimethoxysilane, 2.4g phenyltrimethoxysila,e is added in 30min, continues to disperse 30-40min after adding；
(2) γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane of 1.6g butyl titanate, 0.3g are added, improves and turns
Speed is to 3000r/min, high-speed stirred 25min；
(3) it is eventually adding 80g normal octane, 2000r/min stirs 30min, and casting glue is made.
Embodiment 4
The casting glue is prepared by the following method:
(1) 100g methyl phenyl silicone resin, 30g butyl acetate are weighed and mixes dispersion under the revolving speed of 2000r/min
2g methyltrimethoxysilane, 3g phenyltrimethoxysila,e is added in 40min, continues to disperse 40min after adding；
(2) γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane of 2g butyl titanate, 0.4g are added, revolving speed is improved
To 3000r/min, high-speed stirred 30min；
(3) it is eventually adding 90g normal octane, 2000r/min stirs 40min, and casting glue is made；
Following performance test: temperature tolerance done to casting glue made from embodiment 3,4, temperature when test thermal weight loss is up to 10%
Degree；Hardness is tested by GB/T 531.1-2008；Thermal expansion coefficient: it is tested by GB/T 1036-2008, test result is as follows table
2:
Table 2
| Embodiment 3 | Embodiment 4 | |
| Temperature tolerance/DEG C | 295 | 300 |
| Continue your A hardness/degree | 68 | 74 |
| Thermal expansion coefficient | 98 | 96 |
It is found that obtained casting glue hardness is suitable (your the A hardness that continues is 68-74 degree), thermal expansion coefficient is small (less than 100),
Temperature tolerance is increased to 295-300 DEG C.
Embodiment 5
Pcb board is made of following steps:
The first step etches glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side, milling
Plate and melanism drying-plate, obtain copper-clad plate 13；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg
12；
Third step, in sequence by substrate 11 made from embodiment 1, prepreg 12 and 13 closed assembly of copper-clad plate in laminating machine
Interior heating pressing, adjusting the pressure parameter in laminating machine is 2.95Mpa, 172 DEG C of laminating temperature；
After 4th step, demoulding, PCB raw sheet is obtained, coats encapsulating made from one layer of embodiment 3 in one side surface of PCB raw sheet
Glue after solidification, forms encapsulating glue-line 2；
5th step is obtained after dry in another side surface of PCB raw sheet by the fixed radiating fin 4 of coating thermal grease layer 3
To high temperature resistant pcb board.
Embodiment 6
Pcb board is made of following steps:
The first step etches glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side, milling
Plate and melanism drying-plate, obtain copper-clad plate 13；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg
12；
Third step, in sequence by substrate 11 made from embodiment 1, prepreg 12 and 13 closed assembly of copper-clad plate in laminating machine
Interior heating pressing, adjusting the pressure parameter in laminating machine is 2.95Mpa, 175 DEG C of laminating temperature；
After 4th step, demoulding, PCB raw sheet is obtained, coats encapsulating made from one layer of embodiment 3 in one side surface of PCB raw sheet
Glue after solidification, forms encapsulating glue-line 2；
5th step is obtained after dry in another side surface of PCB raw sheet by the fixed radiating fin 4 of coating thermal grease layer 3
To high temperature resistant pcb board.
Comparative example 2
Using substrate made from comparative example 1 as pcb board substrate.
Comparative example 3
Hot via hole and setting radiating fin are not started on PCB raw sheet.
Following performance test is done to pcb board made from embodiment 5,6: will be assembled on pcb board during power, by power device
Part energization 10min tests device junction temperature, test result is as follows table 3:
Table 3
| Embodiment 5 | Embodiment 6 | Comparative example 2 | Comparative example 3 | |
| Device junction temperature/DEG C | 93.2 | 91.4 | 124.3 | 130.5 |
It is found that pcb board device produced by the present invention makes temperature drop to 91.4-93.2 DEG C, there is good heat conduction and heat radiation
Ability, can be immediately by heat derives into external environment, to improve the temperature tolerance of pcb board.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (8)
1. a kind of high temperature resistant pcb board, which is characterized in that including PCB raw sheet (1), (1) one side surface of PCB raw sheet is coated with encapsulating
Glue forms encapsulating glue-line (2), and another side surface is fixed with radiating fin (4) by thermal grease layer (3), and radiating fin (4) is equal
It is distributed on thermal grease layer (3)；The surface through-thickness of PCB raw sheet (1) is provided with uniformly distributed hot via hole (10), PCB raw sheet (1)
Including substrate (11), the both side surface of substrate (11) is fixed with copper-clad plate (13) by prepreg (12)；
The pcb board is made of following steps:
The first step, by glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side etching, milling plate and
Melanism drying-plate obtains copper-clad plate (13)；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg (12)；
Third step, in sequence by substrate (11), prepreg (12) and copper-clad plate (13) closed assembly in laminating machine heat up press,
Adjust laminating machine in pressure parameter be 2.95Mpa, 172-175 DEG C of laminating temperature；
4th step, demoulding, obtain PCB raw sheet (1), coat one layer of casting glue in (1) one side surface of PCB raw sheet, after solidification, are formed
Encapsulating glue-line (2)；
5th step fixes radiating fin (4) by coating thermal grease layer (3) in PCB raw sheet (1) another side surface, after dry,
Obtain high temperature resistant pcb board.
2. a kind of high temperature resistant pcb board according to claim 1, which is characterized in that the encapsulating glue-line (2) with a thickness of
0.1mm；Thermal grease layer (3) with a thickness of 0.15mm.
3. a kind of high temperature resistant pcb board according to claim 1, which is characterized in that the substrate (11) with a thickness of
0.3mm；Prepreg (12) with a thickness of 0.1mm；Copper-clad plate (13) is glass-epoxy copper-clad plate material, copper-clad plate
(13) with a thickness of 0.2mm.
4. a kind of high temperature resistant pcb board according to claim 1, which is characterized in that the pore size of the hot via hole (10)
For 0.2mm, pitch of holes 1-1.2mm；Radiating fin (4) selects aluminum alloy material, with a thickness of 0.7mm, between radiating fin (4)
Away from for 3-3.5mm.
5. a kind of high temperature resistant pcb board according to claim 1, which is characterized in that the prepreg (12) uses non-streaming
Dynamic property PP piece, prepreg (12) with a thickness of 0.1mm.
6. a kind of high temperature resistant pcb board according to claim 1, which is characterized in that the substrate (11) is made by the following method
At:
S1, phosphorus-containing flame-retardant epoxy resin is weighed, be added in there-necked flask, be heated to 35-40 DEG C, epoxy resin, 300r/ is added
Min mixing 30min；The mass ratio of phosphorus-containing flame-retardant epoxy resin and epoxy resin is 1:1-1.2；
S2, acetone and dimethylformamide is added, is added melamine after 300r/min mixing 30min, mixing 15min, then plus
The mixture for entering boron nitride and silicon carbide, under the revolving speed of 3000r/min, modified epoxy is made in high-speed stirred 60min；
The additional amount of the mixture of boron nitride and silicon carbide is that the mass ratio of 16-18%, BN and the SiC of resin compound quality are
9:1；
S3, modified epoxy is put into cold pressing 10min molding in mold, then is transferred to 160 DEG C of dry 50-60min in baking oven, then
It is transferred to 160 DEG C of hot pressing 55-65min in hot press and obtains substrate (11) to being fully cured.
7. a kind of high temperature resistant pcb board according to claim 1, which is characterized in that the casting glue is prepared by the following method:
1) 100g methyl phenyl silicone resin, 24-30g butyl acetate are weighed and mixes dispersion 30- under the revolving speed of 2000r/min
1.6-2g methyltrimethoxysilane, 2.4-3g phenyltrimethoxysila,e is added in 40min, continues to disperse 30- after adding
40min；
2) γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane of 1.6-2g butyl titanate, 0.3-0.4g are added, improves and turns
Speed is to 3000r/min, high-speed stirred 25-30min；
3) it is eventually adding 80-90g normal octane, 2000r/min stirs 30-40min, and casting glue is made.
8. a kind of manufacture craft of high temperature resistant pcb board, which comprises the steps of:
The first step, by glass-epoxy copper-clad plate by edging cleaning, drying-plate dehumidifying, drilling, single side etching, milling plate and
Melanism drying-plate obtains copper-clad plate (13)；
Second step, by illiquidity PP piece by cut draw in the way of be processed into the shape contours of needs, obtain prepreg (12)；
Third step, in sequence by substrate (11), prepreg (12) and copper-clad plate (13) closed assembly in laminating machine heat up press,
Adjust laminating machine in pressure parameter be 2.95Mpa, 172-175 DEG C of laminating temperature；
After 4th step, demoulding, PCB raw sheet (1) is obtained, coats one layer of casting glue, after solidification, shape in (1) one side surface of PCB raw sheet
At encapsulating glue-line (2)；
5th step fixes radiating fin (4) by coating thermal grease layer (3) in PCB raw sheet (1) another side surface, after dry,
Obtain high temperature resistant pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910630159.4A CN110234199B (en) | 2019-07-12 | 2019-07-12 | High-temperature-resistant PCB and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910630159.4A CN110234199B (en) | 2019-07-12 | 2019-07-12 | High-temperature-resistant PCB and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110234199A true CN110234199A (en) | 2019-09-13 |
| CN110234199B CN110234199B (en) | 2021-11-19 |
Family
ID=67855013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910630159.4A Active CN110234199B (en) | 2019-07-12 | 2019-07-12 | High-temperature-resistant PCB and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110234199B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112937015A (en) * | 2021-02-06 | 2021-06-11 | 厦门艾维逸新材料有限公司 | Hard woven cloth with texture and production process and application thereof |
| CN113873748A (en) * | 2021-09-28 | 2021-12-31 | 广东合通建业科技股份有限公司 | Circuit board of transparent LED display screen and manufacturing process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120287582A1 (en) * | 2011-05-11 | 2012-11-15 | Patrizio Vinciarelli | Panel-Molded Electronic Assemblies |
| CN204929385U (en) * | 2015-09-02 | 2015-12-30 | 深圳市领德辉科技有限公司 | Novel protective structure of PCB circuit board |
| CN106476390A (en) * | 2017-01-03 | 2017-03-08 | 山东金宝科创股份有限公司 | A kind of preparation method of paper-based copper-coated board |
| CN106797112A (en) * | 2014-10-23 | 2017-05-31 | 株式会社自动网络技术研究所 | The manufacture method of circuit structure and circuit structure |
| CN208462136U (en) * | 2018-07-16 | 2019-02-01 | 湖北荣宝电子科技有限公司 | A kind of pcb board convenient for heat dissipation |
-
2019
- 2019-07-12 CN CN201910630159.4A patent/CN110234199B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120287582A1 (en) * | 2011-05-11 | 2012-11-15 | Patrizio Vinciarelli | Panel-Molded Electronic Assemblies |
| CN106797112A (en) * | 2014-10-23 | 2017-05-31 | 株式会社自动网络技术研究所 | The manufacture method of circuit structure and circuit structure |
| CN204929385U (en) * | 2015-09-02 | 2015-12-30 | 深圳市领德辉科技有限公司 | Novel protective structure of PCB circuit board |
| CN106476390A (en) * | 2017-01-03 | 2017-03-08 | 山东金宝科创股份有限公司 | A kind of preparation method of paper-based copper-coated board |
| CN208462136U (en) * | 2018-07-16 | 2019-02-01 | 湖北荣宝电子科技有限公司 | A kind of pcb board convenient for heat dissipation |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112937015A (en) * | 2021-02-06 | 2021-06-11 | 厦门艾维逸新材料有限公司 | Hard woven cloth with texture and production process and application thereof |
| CN113873748A (en) * | 2021-09-28 | 2021-12-31 | 广东合通建业科技股份有限公司 | Circuit board of transparent LED display screen and manufacturing process |
| CN113873748B (en) * | 2021-09-28 | 2022-05-10 | 广东合通建业科技股份有限公司 | Circuit board of transparent LED display screen and manufacturing process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110234199B (en) | 2021-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103066186B (en) | The insulating barrier of ceramic chip composite structure, aluminium base and manufacture method thereof | |
| CN106467668B (en) | Organic silicon resin aluminum-based copper-clad plate and preparation method thereof | |
| CN103722807A (en) | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof | |
| CN110234199A (en) | A kind of high temperature resistant pcb board and its manufacture craft | |
| CN109206854A (en) | A kind of boron nitride/epoxy resin composite material preparation method with three-dimensional structure | |
| CN105819882A (en) | Ceramic metal composite substrate and production method thereof | |
| CN109575523A (en) | A kind of highly thermal-conductive resin composition for copper-clad plate | |
| CN104733399A (en) | Layer-shaped high thermal conductive and insulating base plate and preparation method thereof | |
| CN105131897B (en) | High heat conductive insulating Adhesive composition, high thermal conductivity aluminum matrix plate and its preparation technology | |
| CN102692000A (en) | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate | |
| CN108949056A (en) | A kind of preparation method of heat-conducting interface material and products thereof | |
| CN104002524A (en) | Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate | |
| CN113861665A (en) | High-thermal-conductivity boron nitride/polyurethane thermal-conductivity composite material and preparation method thereof | |
| CN102153975B (en) | Adhesive, preparation method thereof, mica tape containing same and laminated board containing same | |
| CN105199619A (en) | Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate | |
| CN106587970A (en) | Radiation radiating LED (Light-Emitting Diode) ceramic substrate and preparation method thereof | |
| CN108715671A (en) | A kind of high heat conducting nano heat conducting film and preparation method thereof | |
| CN102775734A (en) | Halogen-free resin composition and prepreg prepared by using same | |
| CN110370750B (en) | High-thermal-conductivity copper-clad plate and preparation method thereof | |
| KR101531630B1 (en) | Thin-heat film and heat-radiation sheet comparing the same | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| CN108156752A (en) | A kind of manufacturing method of circuit board, mobile terminal and circuit board | |
| CN103192577A (en) | High-thermal-conductivity copper-clad plate manufacturing method | |
| CN107599602A (en) | A kind of preparation method of high thermal conductivity aluminum matrix plate copper-clad plate | |
| CN102786771A (en) | Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee after: ShenZhen Brightpcb Co.,Ltd. Address before: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MINGZHENGHONG ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240205 Address after: 413000 Changchun Industrial Park, Ziyang District, Yiyang, Hunan Patentee after: YIYANG MINGZHENGHONG ELECTRONICS CO.,LTD. Country or region after: China Address before: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: ShenZhen Brightpcb Co.,Ltd. Country or region before: China |