CN213534092U - Aluminum-based copper-clad plate with efficient heat dissipation - Google Patents

Abstract

The utility model relates to a high-efficient radiating aluminium base copper-clad plate, including conducting layer, adhesive linkage, metal substrate, heat conduction material layer and heat dissipation layer, conducting layer, adhesive linkage, metal substrate, heat conduction material layer and heat dissipation layer are by last from lower floor's folding setting, metal substrate includes first microstructural face, one side of metal substrate orientation heat conduction material layer is located to first microstructural face, first microstructural face includes a plurality of parallel arrangement's first heat conduction groove. The utility model discloses can effectively improve the radiating efficiency of aluminium base copper-clad plate.

Description

Aluminum-based copper-clad plate with efficient heat dissipation

Technical Field

The utility model relates to a circuit board technical field particularly, relates to a high-efficient radiating aluminium base copper-clad plate.

Background

An aluminum-based copper clad laminate, i.e., an aluminum substrate, is one of raw materials, and is a plate-shaped material prepared by using electronic glass fiber cloth or other reinforcing materials, soaking resin, single resin and the like as an insulating bonding layer, coating copper foil on one surface or two surfaces of the insulating bonding layer and performing hot pressing, and is called a copper-clad laminate aluminum substrate, which is called an aluminum-based copper clad laminate for short.

The aluminum-based copper-clad plate is used as a substrate material in the manufacturing of the printed circuit board, has the functions of interconnection conduction, insulation and support for the printed circuit board, has great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in a circuit, and the performance, the quality, the processability in the manufacturing, the manufacturing level, the manufacturing cost, the long-term reliability and the stability of the printed circuit board depend on the aluminum-based copper-clad plate to a great extent.

At present, an aluminum substrate is widely applied to an LED lighting board, an LED lamp can generate a large amount of heat during working, the temperature of the substrate rises rapidly, and if the heat is not dissipated in time, the heat is ineffective due to overheating, so that the brightness and the service life of the LED are reduced. Therefore, the heat dissipation performance of the aluminum substrate is important. Along with the integration level of LED lamp plate is higher and higher, the single structure of current aluminium base board, and the radiating effect can't satisfy the market demand.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the not enough of prior art, provide a high-efficient radiating aluminium base copper-clad plate.

The utility model provides a high-efficient radiating aluminium base copper-clad plate, includes conducting layer, adhesive linkage, metal substrate, heat conduction material layer and heat dissipation layer, conducting layer, adhesive linkage, metal substrate, heat conduction material layer and heat dissipation layer are by last from the setting of lower stromatolite, metal substrate includes a microstructure face, one side that metal substrate orientation heat conduction material layer is located to first microstructure face, first microstructure face includes a plurality of parallel arrangement's first heat-conducting groove.

Furthermore, the heat dissipation layer comprises a second microstructure surface, the second microstructure surface is arranged on one side, facing the heat conduction material layer, of the heat dissipation layer, and the second microstructure surface comprises a plurality of second heat conduction grooves which are arranged in parallel.

Further, the extending direction of the first heat conduction groove is orthogonal to the extending direction of the second heat conduction groove.

Further, the distance between the first heat conduction grooves and the distance between the second heat conduction grooves are equal.

Further, the cross sections of the first heat conduction groove and the second heat conduction groove are trapezoidal, circular arc or triangular.

Further, the conducting layer is a copper foil.

Further, the metal substrate is an aluminum substrate.

Further, the heat conducting material layer is a boron nitride heat conducting adhesive layer.

Further, the heat dissipation layer is made of graphite.

Compared with the prior art, the beneficial effects of the utility model are that: the metal substrate is provided with a first microstructure surface on one side facing the heat conducting material layer, the heat dissipation layer is provided with a second microstructure surface on one side facing the heat conducting material layer, and the first microstructure surface and the second microstructure surface are respectively provided with a plurality of first heat conducting grooves and second heat conducting grooves, so that the contact area between the metal substrate and the heat dissipation layer and the heat conducting material layer can be effectively increased, on one hand, heat can be more quickly transferred from the metal substrate to the heat dissipation layer through the heat conducting material layer and is dissipated out through the heat dissipation layer, and the heat dissipation efficiency is improved; on the other hand, the contact area is increased, so that the connection strength among the metal substrate, the heat conducting material layer and the heat dissipation layer can be improved, and the integral structure is more stable. The extending directions of the first microstructure surface and the second microstructure surface are orthogonal, so that heat can be uniformly dissipated, and the heat dissipation effect is further improved.

Drawings

Fig. 1 is a schematic structural view of the cover film with high connection strength of the present invention.

Fig. 2 is a top view of the first microstructure surface of the high-connection-strength cover film of the present invention.

Fig. 3 is a top view of the second microstructure surface of the high bonding strength cover film of the present invention.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

As shown in fig. 1 to fig. 3, in a preferred embodiment, the aluminum-based copper-clad plate with high heat dissipation efficiency of the present invention mainly comprises a conductive layer 1, an adhesive layer 2, a metal substrate 3, a heat conductive material layer 4, and a heat dissipation layer 5, wherein the conductive layer 1, the adhesive layer 2, the metal substrate 3, the heat conductive material layer 4, and the heat dissipation layer 5 are stacked from top to bottom. The metal substrate 3 includes a first microstructure surface 6, the first microstructure surface 6 is disposed on a side of the metal substrate 3 facing the heat conductive material layer 4, the first microstructure surface 6 includes a plurality of first heat conductive grooves 7 arranged in parallel, the first heat conductive grooves 7 are formed as groove bodies recessed toward an inner side of the metal substrate 3, and in specific implementation, a cross section of the first heat conductive groove 7 may be trapezoidal, circular arc, or triangular, but is not limited thereto. The contact area between the metal substrate 3 and the heat conduction material layer 4 can be increased by arranging the first heat conduction groove 7, so that heat can be transmitted from the metal substrate 3 to the heat conduction material layer 4 more quickly, and the heat dissipation efficiency is improved.

The heat dissipation layer 5 is provided with a second microstructure surface 8, the second microstructure surface 8 is arranged on one side of the heat dissipation layer 5 facing the heat conduction material layer 4, and the second microstructure surface 8 comprises a plurality of second heat conduction grooves 9 which are arranged in parallel. The second heat conduction groove 9 is formed as a groove body recessed toward the inner side of the heat dissipation layer, and in specific implementation, the cross section of the second heat conduction groove 9 may be a trapezoid, an arc, or a triangle, but is not limited thereto. The contact area between the heat dissipation layer 5 and the heat conduction material layer 4 can be increased by arranging the second heat conduction groove 9, so that heat can be quickly transferred from the heat conduction material layer 4 to the heat dissipation layer 5, and the heat dissipation efficiency is improved.

It should be understood that, in the implementation, the first microstructure surface 6 and the second microstructure surface 8 may be formed by etching, or by plating, stamping, etc. which are commonly used in the art, and are not limited herein.

In this embodiment, the extending directions of the first heat-conducting grooves 7 and the second heat-conducting grooves 9 are orthogonal, so that heat can be uniformly dissipated, and the heat dissipation effect can be improved. Preferably, the distance between the first heat conduction grooves 7 is equal to the distance between the second heat conduction grooves 9, so that heat is further uniformly dissipated, and the heat dissipation efficiency is improved.

It should be noted that, in this embodiment, the conductive layer 1 is preferably a copper foil, the metal substrate 3 is preferably an aluminum substrate, and the heat conductive material layer 4 is preferably a boron nitride heat conductive adhesive, which has excellent heat conductivity and is suitable for heat dissipation of a high-power device. The heat dissipation layer 5 preferably adopts graphite, and the graphite material has ultrahigh heat conductivity, so that the heat dissipation layer 5 can dissipate a large amount of heat generated by the metal substrate 3 in time, and the heat dissipation performance is excellent.

The utility model discloses set up first microstructure face 6 in the one side that metal substrate 3 faces heat conducting material layer 4, set up second microstructure face 8 in the one side that heat dissipation layer 5 faces heat conducting material layer 4, set up a plurality of first heat conduction grooves 7 and second heat conduction grooves 9 on first microstructure face 6 and the second microstructure face 8 respectively, can effectively increase the area of contact between metal substrate 3 and heat dissipation layer 5 and heat conducting material layer 4, can make the heat more fast transmit to heat dissipation layer 5 from metal substrate 3 through heat conducting material layer 4 on the one hand, and dispel the heat through heat dissipation layer 5, thus improve the radiating efficiency; on the other hand, the contact area is increased, so that the connection strength among the metal substrate 3, the heat conduction material layer 4 and the heat dissipation layer 5 can be improved, and the integral structure is more stable. The extending directions of the first microstructure surface 6 and the second microstructure surface 8 are orthogonal, so that heat can be uniformly dissipated, and the heat dissipation effect is further improved.

In the description of the present invention, it is to be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims (9)

1. The utility model provides a high-efficient radiating aluminium base copper-clad plate, includes conducting layer, adhesive linkage, metal substrate, heat conduction material layer and heat dissipation layer, conducting layer, adhesive linkage, metal substrate, heat conduction material layer and heat dissipation layer are by last from the setting of lower stromatolite, its characterized in that, metal substrate includes a microstructure face, one side that metal substrate faced heat conduction material layer is located to first microstructure face, first microstructure face includes a plurality of parallel arrangement's first heat conduction groove.

2. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 1, wherein the heat dissipation layer comprises a second microstructure surface, the second microstructure surface is arranged on one side of the heat dissipation layer facing the heat conductive material layer, and the second microstructure surface comprises a plurality of second heat conduction grooves which are arranged in parallel.

3. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 2, wherein the extending direction of the first heat-conducting groove is orthogonal to the extending direction of the second heat-conducting groove.

4. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 2, wherein the distance between the first heat-conducting grooves is equal to the distance between the second heat-conducting grooves.

5. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 2, wherein the cross sections of the first heat conduction groove and the second heat conduction groove are trapezoidal, circular arc or triangular.

6. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 1, wherein the conductive layer is a copper foil.

7. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 1, wherein the metal substrate is an aluminum substrate.

8. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 1, wherein the heat conducting material layer is a boron nitride heat conducting adhesive layer.

9. The aluminum-based copper-clad plate with efficient heat dissipation according to claim 1, wherein the heat dissipation layer is graphite.

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