CN104051603B - A kind of manufacturing process of the LED light bar of double-side - Google Patents
A kind of manufacturing process of the LED light bar of double-side Download PDFInfo
- Publication number
- CN104051603B CN104051603B CN201410105630.5A CN201410105630A CN104051603B CN 104051603 B CN104051603 B CN 104051603B CN 201410105630 A CN201410105630 A CN 201410105630A CN 104051603 B CN104051603 B CN 104051603B
- Authority
- CN
- China
- Prior art keywords
- double
- layer
- led light
- light bar
- sided substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Abstract
The present invention provides a kind of manufacturing process of the LED light bar of double-side, and it comprises the following steps：A double-sided substrate is provided, it includes ground floor, the second layer positioned at the ground floor both sides and positioned at second layer outside and the third layer for setting at equal intervals, and several die bond grooves are formed with the double-sided substrate.Compared with prior art, present invention process is simple, and illumination effect is more preferably evenly.
Description
Technical field
The present invention relates to lighting field, more particularly to a kind of manufacturing process of the LED light bar of double-side.
Background technology
With developing rapidly for LED (Light-Emitting Diode, light emitting diode) industries, emerge in large numbers in the world very
Many LED manufacturing enterprises.The manufacturing process of existing LED light bar is complicated, it is necessary to by two processes, one is LED encapsulation, and two are
SMT (surface mount technology, surface mounting technology, abbreviation SMT) paster.Also, LED of the prior art
Bar is most for one side is luminous, and each LED chip in lamp bar is divided by an independent light-emitting particles after packaging.
There is following defect in the prior art：(1) existing production procedure is more and complicated, during production not only significantly
Production cost is improve, and in semicon industry, excessive technological process also can cause huge dirt to environment in production
Dye；(2) the every LEDs particle in existing LED light bar is all self-existent, and granular sensation is had when lighting, and illumination effect is not
It is good, non-uniform light；(3) LED light bar that prior art makes only has one side to light, and illumination effect is bad, and one side is luminous
Lamp bar, its substrate resource utilization is relatively low.
Therefore, it is necessary to be further improved to defect of the prior art.
The content of the invention
It is an object of the invention to provide the manufacture of a kind of process is simple and the LED light bar of the good double-side of illumination effect
Technique.
To reach object defined above, a kind of manufacturing process of the LED light bar of double-side of the invention, it comprises the following steps：
A double-sided substrate is provided, it includes ground floor, the second layer positioned at the ground floor both sides and positioned at described
Two layers of outside and the third layer for setting at equal intervals, are formed with several die bond grooves on the double-sided substrate；
Die bond, LED chip is installed in the die bond groove；
Bonding wire, is electrically connected the both positive and negative polarity on the LED chip surface with the third layer by conductor wire；
Pressing mold, the LED chip surface is pressed in by packaging plastic and phosphor mixture by molding；
Punching, some LED light bars are cut into by the double-sided substrate.
Used as a preferred embodiment of the invention, the third layer includes fixed part and matched moulds portion, the fixed part and
Matched moulds portion is arranged alternately with each other on the surface of the second layer.
Used as a preferred embodiment of the invention, the die bond groove is to pass through institute from the surface of the third layer fixed part
State the second layer to the surface of the ground floor and extend what is formed, the LED chip is installed on the ground floor in the die bond groove.
As a preferred embodiment of the invention, the bonding wire be by conductor wire by the LED chip surface just
Negative pole is electrically connected with the fixed part of the third layer.
Used as a preferred embodiment of the invention, the pressing mold is that packaging plastic and phosphor mixture is whole by being molded
Body is pressed in the LED chip surface on the fixed part.
Used as a preferred embodiment of the invention, the punching is will be described along the centre position of matched moulds portion longitudinal direction
Double-sided substrate cuts into some LED light bars.
Include encapsulation part as a preferred embodiment of the invention, in every LED light bar and positioned at encapsulation part both sides
Exposed portion, the encapsulation part is coated with several LED chips.
Used as a preferred embodiment of the invention, the ground floor of the double-sided substrate is aluminium sheet, and the second layer is to lead
Thermal insulation layer, the third layer is circuit layer.
Used as a preferred embodiment of the invention, the thermally conductive insulating layer is epoxy resin, and the circuit layer is Copper Foil.
Used as a preferred embodiment of the invention, the LED chip on the double-sided substrate two sides is based on the two-sided base
What plate was symmetrical set.
Beneficial effects of the present invention：Compared with prior art, the manufacturing process of the LED light bar of double-side of the invention,
Its process is simple, substantially increases production efficiency；And the LED light bar of technique manufacture of the invention is double-side, is not only sent out
Light effect is good, and causes that the utilization rate of substrate is greatly improved, and light-emitting area of the invention is in strip, and several emitting led
Grain links together, and illumination effect is more preferably evenly.
Brief description of the drawings
Fig. 1 is the manufacturing process flow of the LED light bar of double-side of the present invention；
Fig. 2A (1) is the structural representation of double-sided substrate that is used of LED light bar of double-side of the invention；
Fig. 2A (2) is the part-structure schematic diagram of double-sided substrate in Fig. 2A (1)
Fig. 2A (3) is the A of Fig. 2A (2) to sectional view；
Fig. 2 B be the LED light bar of double-side of the present invention manufacturing process flow in die bond step structural representation；
Fig. 2 C be the LED light bar of double-side of the present invention manufacturing process flow in bonding wire step structural representation；
Fig. 2 D (1) are the structural representations during double-sided substrate of the invention is located at mould；
Fig. 2 D (2) are the structural representations of the double-sided substrate after pressing mold；
Fig. 2 E are the structural representations of the LED light bar of double-side of the invention.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings.
" one embodiment " or " embodiment " referred to herein refers in may be included at least one implementation of the invention
Special characteristic, structure or characteristic." in one embodiment " that different places occur in this manual not refers both to same
Individual embodiment, nor the single or selective embodiment mutually exclusive with other embodiment.
Refer to the manufacturing process flow of Fig. 1 and LED light bar that Fig. 2A -2E, Fig. 1 are double-side of the present invention.Two-sided hair
The manufacturing process of the LED light bar of light specifically includes following steps：
Step S310：One double-sided substrate is provided.Fig. 2A (1) -2A (3) is referred to, Fig. 2A (1) is two-sided hair of the invention
The structural representation of the double-sided substrate that the LED light bar of light is used, Fig. 2A (2) is the part-structure of double-sided substrate in Fig. 2A (1)
Schematic diagram, Fig. 2A (3) is the A of Fig. 2A (2) to sectional view.As shown in Fig. 2A (1) -2A (3), the double-sided substrate 300 includes the
One layer 301, the second layer 302 positioned at the both sides of ground floor 301 and positioned at the outside of the second layer 302 and set at equal intervals several
Third layer 303.Several die bond grooves 304 are formed with the double-sided substrate 300.
The third layer 303 includes fixed part 3031 and matched moulds portion 3032, and the fixed part 3031 and matched moulds portion 3032 exist
The surface of the second layer 302 is arranged alternately with each other.In this embodiment, the die bond groove 304 is from the third layer 303
The surface of fixed part 3031 extends what is formed through the second layer 302 to the surface of the ground floor 301.Wherein, it is described double
The ground floor 301 of face substrate 300 is aluminium sheet, and the second layer 302 is the thermally conductive insulating layer with high thermal conductivity；Described 3rd
Layer 303 is circuit layer, and in this embodiment, the thermally conductive insulating layer is epoxy resin, with heat conductivility higher, the electricity
Road floor is Copper Foil.The present invention is not limited to the thickness of the ground floor 301, the second layer 302 and third layer 303, can be with root
According to actual conditions specific design.
Step S320：Die bond.Fig. 2 B are referred to, during it is the manufacturing process flow of the LED light bar of double-side of the present invention
The structural representation of die bond step.Several LED chips 305 are installed in the die bond groove 304.Fig. 2A and 2B is referred to,
The double-sided substrate 300 is placed on base plate carrier 400 first, one is faced up, dipped from lacquer disk(-sc) using Glue dripping head
Tin cream, then the tin cream point of taking-up invested into the die bond groove 304 of the one side upward of double-sided substrate 300, then by LED chip 305
On the aluminium sheet of the ground floor 301 being placed in the die bond groove 304 for a little having tin cream, eutectic temperature is warmed up to after compacting so that LED chip
The metal of 305 bottom surfaces realizes that eutectic is welded with ground floor aluminium sheet by tin cream, and then completes the LED of the wherein one side of double-sided substrate
Chip 305 is fixed；Upset double-sided substrate, make its it is another face up, repeat above-mentioned die bond step S320, complete the die bond of another side
Technique.In this embodiment, the LED chip 305 is affixed on the aluminium sheet of the ground floor 301 in the die bond groove 304,
Aluminium sheet of the bottom of the LED chip 305 directly with ground floor 301 is in contact, and can thus cause that the LED chip 305 is produced
A raw heat part is directly conducted to the aluminium sheet of the ground floor 301, then is passed heat by the aluminium sheet of the ground floor 301
Derivation is gone, and heat another part that the LED chip 305 is produced also rapidly is conducted by the thermally conductive insulating layer of the second layer 302
To the aluminium sheet of the ground floor 301, and then distributed by the aluminium sheet of ground floor 301 again, accordingly, it is capable to play radiating well
Effect, greatly extends the service life of LED chip.In other embodiments, the LED chip 305 can also be fixed on
The surface of the second layer 302 on the fixed part 3031, the heat conduction radiated directly by the second layer 302 of the LED chip is exhausted
The aluminium sheet that edge layer is directly conducted to heat ground floor 301 reaches the effect of radiating.In this embodiment, in order that obtaining LED
Bar is luminous uniform, and the LED chip 305 on the two sides of the double-sided substrate 300 is symmetrical set based on the double-sided substrate 300,
In other embodiments, the LED chip on the two sides of the double-sided substrate 300 can also arbitrarily be set according to actual conditions.
Step S330：Bonding wire.Fig. 2 C are referred to, during it is the manufacturing process flow of the LED light bar of double-side of the present invention
The structural representation of bonding wire step.First, the double-sided substrate 300 is placed on base plate carrier 500, one is faced up,
The both positive and negative polarity on the surface of the LED chip 305 is electrically connected with the wire in the third layer 303 by conductor wire 306；Upset is double
Face substrate 300, make its it is another face up, by conductor wire 306 by the surface of the LED chip 305 of the another side of double-sided substrate 300
Both positive and negative polarity electrically connected with the wire in the third layer 303 of the another side of double-sided substrate 300, complete bonding wire.Wherein, described
Wire on three layer 303 is electrically connected with external power source, is lighted the LED chip by external power source.
Step S340：Pressing mold.Packaging plastic and phosphor mixture are pressed in the LED chip surface by molding.Please join
Fig. 2 D (1) are read, it is the structural representation during double-sided substrate of the invention is located at mould.Fig. 2 D (2) are referred to, after it is pressing mold
Double-sided substrate partial sectional schematic view.Packaging plastic and fluorescent material is thoroughly mixed first uniformly as encapsulating compound 307,
To be welded the double-sided substrate 300 of conductor wire send into molding board upper mould 501 and lower mould 502 die cavity in, while will encapsulation
Material 307 is put into mould, mould heating post package material 307 is solidified through equipment, then the automatic two-sided base that will be molded of equipment
Plate 300 sends out, and completes pressing mold.The present invention is not limited to the mixed proportion of packaging plastic and fluorescent material, can be according to actual feelings
Depending on condition.Fig. 2 D (2) are referred to, in this embodiment, the encapsulating compound 307 is to be pressed in the fixed part by being molded entirety
The LED chip surface on 3031.
Step S350：Punching.Please continue to refer to Fig. 2 D (2), along the centre position of the longitudinal direction of matched moulds portion 3032 by pressing mold
Double-sided substrate 300 afterwards cuts into some LED light bars 310.Fig. 2 E are referred to, it is the LED of double-side of the invention
The structural representation of bar.Include encapsulation part 311 as shown in Fig. 2 D (2) and 2E, in every LED light bar 310 and positioned at encapsulation part
The exposed portion 312 of 311 both sides, the encapsulation part 311 is coated with several LED chips.In this embodiment, the LED light bar
310 encapsulation part is the mixture of packaging plastic in the present invention and fluorescent material, and the LED chip is luminous to produce a heat part logical
Cross the covering portion 311 to distribute, in the present invention, the exposed portion 312 is a part for double-sided substrate 300, the exposed portion
312 can prevent operator from covering portion 311 is encountered when LED light bar is picked up, it is to avoid cause have artificial impurity to go out in covering portion 311
It is existing, and then influence illumination effect.
In the present invention, the size and dimension to the double-sided substrate is not limited, and is ensureing double-sided substrate peak use rate
On the premise of can be according to the quantity of actually required lamp bar and LED chip depending on.
It should be noted that the manufacture of the similarly suitable single LEDs chip of the manufacture craft of LED light bar of the invention.
The manufacturing process of the LED light bar of double-side of the invention, its process is simple, substantially increases production efficiency；And
And the LED light bar of technique manufacture of the invention is double-side, not only illumination effect is good, and causes the utilization rate of substrate significantly
Improve, light-emitting area of the invention links together in strip, and several emitting led particles, and illumination effect is more preferably evenly.
Described above fully discloses specific embodiment of the invention.It is pointed out that being familiar with the field
Scope of any change that technical staff is done to specific embodiment of the invention all without departing from claims of the present invention.
Correspondingly, the scope of claim of the invention is also not limited only to previous embodiment.
Claims (6)
1. a kind of manufacturing process of the LED light bar of double-side, it is characterised in that：It comprises the following steps：
A double-sided substrate is provided, it includes ground floor, the second layer positioned at the ground floor both sides and positioned at the second layer
Outside and the third layer for setting at equal intervals, are formed with several die bond grooves, the first of the double-sided substrate on the double-sided substrate
Layer is aluminium sheet, and the second layer is thermally conductive insulating layer, and the third layer is circuit layer；
Die bond, installs LED chip in the die bond groove, and the LED chip is affixed on the ground floor in the die bond groove；
Bonding wire, is electrically connected the both positive and negative polarity on the LED chip surface with the third layer by conductor wire；
Pressing mold, the LED chip surface is pressed in by packaging plastic and phosphor mixture by molding；
Punching, some LED light bars are cut into by the double-sided substrate,
The third layer includes fixed part and matched moulds portion, and the fixed part and matched moulds portion alternate on the surface of the second layer
Arrangement,
The die bond groove is that the surface from the surface of the third layer fixed part through the second layer to the ground floor extends
Formed, the LED chip is installed on the ground floor in the die bond groove,
The bonding wire is that the both positive and negative polarity on the LED chip surface and the fixed part of the third layer are electrically connected by conductor wire
Connect.
2. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The pressing mold be by
Packaging plastic and phosphor mixture are by being molded the overall LED chip surface being pressed on the fixed part.
3. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The punching is edge
The double-sided substrate is cut into some LED light bars by the centre position of the matched moulds portion longitudinal direction.
4. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：In every LED light bar
Including encapsulation part and the exposed portion positioned at encapsulation part both sides, the encapsulation part is coated with several LED chips.
5. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The heat conductive insulating
Layer is epoxy resin, and the circuit layer is Copper Foil.
6. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The double-sided substrate
The LED chip on two sides is symmetrical set based on the double-sided substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410105630.5A CN104051603B (en) | 2014-03-20 | 2014-03-20 | A kind of manufacturing process of the LED light bar of double-side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410105630.5A CN104051603B (en) | 2014-03-20 | 2014-03-20 | A kind of manufacturing process of the LED light bar of double-side |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104051603A CN104051603A (en) | 2014-09-17 |
| CN104051603B true CN104051603B (en) | 2017-06-09 |
Family
ID=51504209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410105630.5A Expired - Fee Related CN104051603B (en) | 2014-03-20 | 2014-03-20 | A kind of manufacturing process of the LED light bar of double-side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104051603B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762265A (en) * | 2014-10-27 | 2016-07-13 | 财团法人工业技术研究院 | Light emitting device and method for manufacturing the same |
| CN105235114B (en) * | 2015-10-19 | 2017-04-19 | 厦门多彩光电子科技有限公司 | LED lamp filament die and LED lamp filament preparing method |
| WO2021243673A1 (en) * | 2020-06-05 | 2021-12-09 | Tridonic Gmbh & Co Kg | Led lighting strip and the manufacturing system thereof |
| US20230106003A1 (en) * | 2020-08-21 | 2023-04-06 | Yin-Hu Ko | Led light source device and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
| CN103322525A (en) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
| CN203232909U (en) * | 2013-04-18 | 2013-10-09 | 浙江深度照明有限公司 | Integrated LED package structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091126A (en) * | 2009-10-21 | 2011-05-06 | Shin-Etsu Astech Co Ltd | Light emitting device (cob module) |
| TWM378328U (en) * | 2009-11-10 | 2010-04-11 | Jia-Xiu Lin | LED panel which is easy to be mounted/dismounted and of which illumination can be controlled |
| CN102062323A (en) * | 2010-11-05 | 2011-05-18 | 深圳市聚飞光电股份有限公司 | Method for manufacturing LED lamp bar and LED lamp |
| CN102694081B (en) * | 2011-03-21 | 2014-11-05 | 展晶科技(深圳)有限公司 | Method for manufacturing light emitting diode |
| WO2014040412A1 (en) * | 2012-09-17 | 2014-03-20 | 中国科学院福建物质结构研究所 | Led packaging structure |
-
2014
- 2014-03-20 CN CN201410105630.5A patent/CN104051603B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
| CN203232909U (en) * | 2013-04-18 | 2013-10-09 | 浙江深度照明有限公司 | Integrated LED package structure |
| CN103322525A (en) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104051603A (en) | 2014-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201918430U (en) | Integral heat dissipation structure for LED substrate | |
| CN105161608A (en) | LED lamp filament illuminating strip and preparation method therefor | |
| CN104051603B (en) | A kind of manufacturing process of the LED light bar of double-side | |
| CN201868429U (en) | Embedded-type encapsulating structure of luminous diode | |
| CN102064247A (en) | Packaging method and packaging structure for embedded light emitting diode | |
| US20110084303A1 (en) | Radiant heat structure for pin type power led | |
| CN105932019A (en) | Large power LED structure adopting COB packaging | |
| CN103972222A (en) | LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module | |
| CN202434513U (en) | LED (light emitting diode) array packaging light source module based on lead frame | |
| CN103367346A (en) | Novel high-power LED light source and implementation method thereof | |
| CN103904071B (en) | A kind of manufacturing process of transparency carrier LED lamp bar | |
| WO2016197957A1 (en) | Led light metal frame | |
| CN203150541U (en) | LED light source based on COB packaging | |
| CN103822143A (en) | LED (light emitting diode) street lamp light source module with silicon substrates | |
| CN104091880A (en) | Ultrathin and high-efficiency BT (Bismaleimide Triazine)-type LED (Light-Emitting Diode) filament and manufacturing process thereof | |
| WO2017067149A1 (en) | Led bulb and method for manufacturing same | |
| CN102157508A (en) | Novel LED packaging light-reflecting method and device | |
| CN202473912U (en) | LED array light source without circuit substrate | |
| KR101190281B1 (en) | Led lamp module with the cooling structure and process of the same | |
| TW201429009A (en) | Light emitting diode device and a method for manufacturing heat dissipating substrate | |
| CN202523758U (en) | Wafer structure of light-emitting diode capable of emitting white light directly | |
| CN102537718A (en) | Lamp with light source integrated with radiator and manufacturing method of lamp | |
| CN101847684B (en) | Packaged circuit board with enhanced heat dissipation effect and manufacturing method thereof | |
| CN202423286U (en) | Integrated LED point light source | |
| CN206419687U (en) | A kind of Novel LED light |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190325 Address after: 224000 Yandu District Intelligent Terminal Industrial Park, Yancheng City, Jiangsu Province Patentee after: Yancheng Dongshan Precision Manufacturing Co., Ltd. Address before: 215107 No. 8 Fenghuangshan Road, Dongshan Industrial Park, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou Dongshan Precision Manufacturing Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170609 Termination date: 20200320 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |