CN201351835Y

CN201351835Y - LED tunnel light

Info

Publication number: CN201351835Y
Application number: CNU2008201842878U
Authority: CN
Inventors: 高京泉
Original assignee: SHENZHEN GLITTER GENERAL ELECTRIC CO Ltd
Current assignee: SHENZHEN GLITTER GENERAL ELECTRIC CO Ltd
Priority date: 2008-12-31
Filing date: 2008-12-31
Publication date: 2009-11-25
Anticipated expiration: 2018-12-31

Abstract

The utility model discloses an LED tunnel light, which is characterized in that a ceramic substrate is in contact with the surface of a heating unit, a cooling plate is stuck with the ceramic substrate via heat conducting glue, the ceramic substrate is provided with an LED chip, and light rays produced by the LED chip are refracted out by a light reflector. Geometrical heat dissipating holes are distributed on the cooling plate, and the cooling plate is an aluminum cooling plate or a copper cooling plate. Since the heat dissipating device provided by the utility model takes a high-insulative ceramic substrate instead of the traditional PCB board as the implant of a semiconductor light-emitting device and uses the characteristics of high thermal conductivity and high temperature resistance of ceramics, heat generated by the semiconductor light-emitting device can be quickly conducted to the cooling plate by the ceramic substrate and dissipated via the cooling plate. The heat dissipating device provided by the utility model solves the heat dissipating problems of high-power semiconductor light-emitting devices in the prior art; therefore the temperature difference between the interior and the exterior of the semiconductor light-emitting device using the heat dissipating device does not exceed 10 DEG C, and a good heat dissipating effect is achieved.

Description

A kind of LED tunnel light fixture

Technical field

The utility model relates to lighting field, a kind of LED tunnel light fixture that is specifically related to use in the lighting field.

Background technology

The history of human illumination has experienced very long evolution.Breakthrough along with third generation semiconductor material with wide forbidden band GaN (gallium nitride), semiconductor technology is breeding a new Industrial Revolution again after causing microelectronic revolution---the illumination revolution, its sign is based on the solid-state illumination (also claiming " semiconductor lamp ") of semiconductor light-emitting-diode (LED), will progressively replace incandescent lamp and fluorescent lamp to enter the general lighting field.

The LED solid-state illumination new energy-conserving light source that is considered to throw light on, because under same brightness, the semiconductor lamp power consumption is 1/10 of an ordinary incandescent lamp only, and the life-span can prolong 100 times.In addition, the LED device is a cold light source, but has the light efficiency height, operating voltage is low, power consumption is little, the little planar package of volume, be easy to develop characteristics such as light and thin type product, firm in structure and life-span be long.Harmful substances such as led light source itself is not mercurous, lead, no infrared and ultraviolet pollution can not produce pollution to external world in producing and using.Therefore, semiconductor lamp has characteristics such as energy-saving and environmental protection, life-span are long, non-maintaining, easy to control.No matter from saves energy, reduce the angle of greenhouse gas emission, still from reducing the angle of environmental pollution, LED has the very big potentiality of alternative traditional lighting light source as the novel illumination light source.

Though the tunnel light fixture of LED can be applicable to actual illumination at present, but still faces the lower problem of luminous efficiency,

The utility model content

In view of this, the utility model is to provide a kind of LED tunnel light fixture, to solve the inefficient problem of above-mentioned LED lamp luminescence.

For addressing the above problem, the utility model provides a kind of LED tunnel light fixture, comprising: ceramic substrate, heat sink;

Wherein, described ceramic substrate forms with the heater surface and contacts;

Described heat sink and described ceramic substrate are bonding by heat-conducting glue;

Have led chip on the described ceramic substrate, the light that led chip produces goes out light refraction by light reflector.

Preferably, have the hole on the described heat sink, ceramic substrate places this hole, and is by heat-conducting glue that heat sink and ceramic substrate is bonding.

Preferably, described ceramic substrate comprises at least one conductive layer with conducting channel, has the hole on the described ceramic substrate and is used at least one heater is connected to described conducting channel.

Preferably, further comprise: the positive and negative electrode lead-out wire; Described positive and negative electrode lead-out wire is connected with described conducting channel, and described positive and negative electrode lead-out wire passes through silicone insulation.

Preferably, described heat sink is aluminium heat sink or copper heat sink.

LED tunnel light fixture in the utility model can converge the light of light source, has improved light intensity.

Description of drawings

Fig. 1 is the structure chart of the utility model device;

Fig. 2 is the LED Tunnel Lamp composition of signing an undertaking.

The specific embodiment

For clearly demonstrating the technical scheme in the utility model, provide preferred embodiment below and be described with reference to the accompanying drawings.

The utility model provides a kind of heat abstractor, this device adopt have high insulation, the ceramic substrate of high heat conduction and good characteristic such as high temperature resistant contacts with heater as heat-conducting plate, and the heat of heater generation is conducted to heat sink rapidly, dispel the heat.

Heat abstractor provided by the utility model is formed schematic diagram, and as shown in Figure 1, this device comprises: ceramic substrate 101, heat sink 102;

Wherein, give heat sink for the heat that heater is produced conducts rapidly, ceramic substrate forms with the heater surface and contacts, and the heat that heater is produced conducts to heat sink; Heat sink and ceramic substrate are bonding by heat-conducting glue.

In the utility model embodiment, can perforate on heat sink, ceramic substrate is placed this hole, by heat-conducting glue that heat sink and ceramic substrate is bonding then, in other embodiment of the utility model, also this ceramic substrate can be placed the heat sink surface, by heat-conducting glue that heat sink and ceramic substrate is bonding.

Heat-conducting glue is a kind of media that transmits heat, in the utility model embodiment, heat-conducting glue generally refers to thermal conductivity factor degree centigrade (W/MK) above heat conductive silica gel when reaching 3 watts/meter, in other embodiment of the utility model, also can adopt bonding ceramic substrate of heat-conducting glue and heat sink, not influence realization of the present utility model by other Heat Conduction Material preparations.

Because described heater is generally electronic device, therefore, require described ceramic substrate to comprise the conductive layer that at least one has conducting channel, the conducting channel by conductive layer between each electronic device realizes the interconnection between electronic device, and with being connected of external circuit; In order to realize being connected of heater and conducting channel, have hole 103 on the described ceramic substrate and be used at least one heater is connected to described conducting channel.

In the utility model embodiment, for the ease of described heater being connected by described conducting channel and external circuit, also drawn the positive outside wire 105 and the negative outside wire 106 of conducting channel, insulated by silica gel 104 between positive outside wire and the negative outside wire; The positive and negative electrode lead-out wire is used for being connected of conducting channel and external circuit.

In the utility model embodiment, heat sink generally adopts metal to make, and heat sink can be aluminium heat sink or copper heat sink; Also can adopt other materials to make in other embodiments with thermal conductive resin, such as, graphite, the heat that produces when adopting which kind of material preparation heat sink to depend on to work and the cost of product with heater.

Wherein,, generally be prepared into circle or square, also can determine the shape of heat sink by person skilled for the shape no requirement (NR) of heat sink.

The thickness of heat sink and ceramic substrate depends on the power of heater, and the heat that produces, and heat is many more, and the thickness of heat sink and ceramic substrate generally needs corresponding increasing, but does not get rid of other possibilities, and concrete thickness is determined by the technical staff.

For the ease of this heat abstractor being fixed on other devices, also have the hole on the heat sink and be used to install screw 107,108; Wherein, screw 107,108 is a CARBURIZING FURNACE FOR STAINLESS FASTENER in utility model embodiment, and this CARBURIZING FURNACE FOR STAINLESS FASTENER can also further conduct to heat on other devices that are connected with heat abstractor, better heater is dispelled the heat.

This heat abstractor is used for LED tunnel light fixture, forms structure chart as shown in Figure 2, comprise that LED luminescence chip 21, lamp body 22 have heat abstractor on lamp body 22, light reflector 23.Light reflector 23 can and reflect light optically focused, realizes the optically focused of light, overcomes the low problem of light fixture light intensity.

Because heat abstractor provided by the utility model adopts the ceramic substrate of high insulation to replace the implant of traditional pcb board as light emitting semiconductor device, ceramic high heat conduction, resistant to elevated temperatures characteristics have been utilized, the heat that makes light emitting semiconductor device produce can conduct to heat sink by ceramic substrate rapidly, and dispels the heat by heat sink.Compare with existing radiating mode, adopt heat abstractor provided by the utility model can not increase the size of light-emitting device (light emitting semiconductor device), and reached the desired radiating efficiency of light-emitting device, and as long as light emitting semiconductor device just contacts with ceramic substrate and can dispel the heat, the problem that heat abstractor lost efficacy can not appear, thereby solved high power semi-conductor luminescent device heat dissipation problem in the prior art, make the light emitting semiconductor device inside of adopting this device be no more than 10C, reach better heat radiating effect with the external temperature gap.

For the LED light fixture of being set forth among each embodiment of the utility model, all within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.

Claims

1, a kind of LED tunnel light fixture is characterized in that, comprising: ceramic substrate, heat sink;

2, LED according to claim 1 tunnel light fixture is characterized in that have the hole on the described heat sink, ceramic substrate places this hole, and is by heat-conducting glue that heat sink and ceramic substrate is bonding.

3, LED according to claim 1 and 2 tunnel light fixture is characterized in that described ceramic substrate comprises at least one conductive layer with conducting channel, has the hole on the described ceramic substrate and is used at least one heater is connected to described conducting channel.

4, LED according to claim 3 tunnel light fixture is characterized in that, further comprises: the positive and negative electrode lead-out wire; Described positive and negative electrode lead-out wire is connected with described conducting channel, and described positive and negative electrode lead-out wire passes through silicone insulation.

5, LED according to claim 1 and 2 tunnel light fixture is characterized in that described heat sink is aluminium heat sink or copper heat sink.