CN208370104U - A kind of electronic heat sink of cooling electronic component - Google Patents
A kind of electronic heat sink of cooling electronic component Download PDFInfo
- Publication number
- CN208370104U CN208370104U CN201821053947.9U CN201821053947U CN208370104U CN 208370104 U CN208370104 U CN 208370104U CN 201821053947 U CN201821053947 U CN 201821053947U CN 208370104 U CN208370104 U CN 208370104U
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- Prior art keywords
- heat sink
- heat
- mounting base
- support column
- electronic
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Abstract
The utility model discloses a kind of electronic heat sinks of cooling electronic component, belong to electronic heat sink field, a kind of electronic heat sink of cooling electronic component, heat-radiating substrate including being connected to mounting base upper end, mounting base upper end, which is dug, mounting groove, bottom end, which is dug, in mounting groove multiple heat release holes and multiple through-holes, heat conductive rod is equipped in through-hole, heat conductive rod is connect with through-hole wall, mounting base upper end is connected with positioning device, positioning device includes a pair of of support column, a pair of of support column is connect with mounting base upper end, support column is equipped with heat sink close to one end of mounting groove, and there is telescoping tube between support column and heat sink, the first lock-screw is connected on telescoping tube, telescoping tube inner end is connected with the first compressed spring, multiple heat-conducting blocks are connected on heat sink, the stickup of bond plies in existing scheme is substituted for folder Tight positioning device, good positioning effect are not easy to twist, and facilitate and separate electronic device with mounting base.
Description
Technical field
The utility model relates to electronic heat sink fields, more specifically to a kind of electricity of cooling electronic component
Sub- radiator.
Background technique
Electronic device can generate a large amount of heat when working, and these extra heats quickly cannot be dispersed and be accumulated
Generate high temperature, it is likely that the equipment to work can be damaged, at this moment electronic heat sink just can efficiently solve this problem.Electronics
Radiator is the device to radiate for high-power electronic component, most of to be all formed into aluminium alloy extrusions, according to first device
Part size cuts into the size of needs, and aluminium alloy extrusions usually has groove structure or hollow cavity.
Chinese utility model Publication No. CN205987672U discloses a kind of electronic heat sink, which includes
Heat-radiating substrate is equipped at intervals with several thermal columns on the lateral surface of heat-radiating substrate, is wholely set on the medial surface of heat-radiating substrate
There is mounting base, has connection double coated film in the lower surface bonds of mounting base, be bonded in the upper surface of mounting base thermally conductive
Double coated film, the upper surface of mounting base are additionally provided with electronic component positioning pin, and it is fixed that electronic heat sink is additionally provided on mounting base
The outer peripheral surface in position hole, heat-radiating substrate is equipped with installation groove.The electronic heat sink of the utility model, heat dissipation area is big, heat dissipation effect
Fruit is good, and heat dissipation effect is not influenced by wind direction, and heat dissipation is stablized；It can quickly and easily be adhesively fixed, grasp with electronic component and body
Make simply, it is time saving and energy saving.
Though the electronic heat sink heat dissipation effect in above scheme is good, it fixes electronics device using heat-conducting double-sided film
Part is easy to produce twisting offset, and locating effect is bad, and when needing repairing, and is not easy to separate electronic device with mounting base.
Utility model content
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of this utility model is to provide a kind of cooling electronic component use
Electronic heat sink, the stickup of the bond plies in existing scheme is substituted for the positioning device of clamping by it, good positioning effect,
It is not easy to twist, and facilitates and separate electronic device with mounting base.
2. technical solution
To solve the above problems, the utility model adopts the following technical scheme.
A kind of electronic heat sink of cooling electronic component, the heat-radiating substrate including being connected to mounting base upper end, institute
Stating mounting base upper end and digging has mounting groove, and bottom end, which is dug, in the mounting groove multiple heat release holes and multiple through-holes, and multiple
Heat release hole and through-hole, which are intervally arranged in mounting base lower end, the through-hole, is equipped with heat conductive rod, the heat conductive rod and through-hole wall
Connection, the mounting base upper end are connected with positioning device, and the positioning device includes a pair of of support column, a pair of support column
It is connect with mounting base upper end, and a pair of of support column is located at left and right sides of mounting groove, the support column is close to mounting groove
One end is equipped with heat sink, and has telescoping tube between support column and heat sink, and the first lock-screw, institute are connected on the telescoping tube
It states telescoping tube inner end and is connected with the first compressed spring, multiple heat-conducting blocks are connected on the heat sink, and multiple heat-conducting blocks are uniform
It is arranged in the side of heat sink, the stickup of the bond plies in existing scheme is substituted for the positioning device of clamping by it, positioning
Effect is good, is not easy to twist, and facilitates and separate electronic device with mounting base.
Further, the heat sink is expansion plate, and the second lock-screw is connected on heat sink, on the heat sink
End is connected with baffle, convenient for adjusting the height of heat sink, adapts to the electronic device of different height.
Further, the heat sink inner end is connected with multiple second compressed springs, and multiple second compressed springs are uniform
It is arranged in heat sink inner end, unscrews the second lock-screw, heat sink can extend automatically, not need manually to pull.
Further, the heat sink and baffle are carved with corrugated anti-skid chequer close to one end of mounting groove, make electronics device
It is difficult to slide between part and heat sink.
Further, the heat release hole is inverted trapezoidal, and the heat release hole heat dissipation effect of inverted trapezoidal is more preferable.
3. beneficial effect
Compared with the prior art, utility model has the advantages that
(1) stickup of the bond plies in existing scheme is substituted for the positioning device of clamping, locating effect by this programme
It is good, it is not easy to twist, and facilitate and separate electronic device with mounting base.
(2) heat sink is expansion plate, and the second lock-screw is connected on heat sink, and heat sink upper end is connected with baffle,
Convenient for adjusting the height of heat sink, the electronic device of different height is adapted to.
(3) heat sink inner end is connected with multiple second compressed springs, and multiple second compressed springs are evenly spaced in heat dissipation
The second lock-screw is unscrewed in plate inner end, and heat sink can extend automatically, does not need manually to pull.
(4) heat sink and baffle are carved with corrugated anti-skid chequer close to one end of mounting groove, make electronic device and heat sink
Between it is difficult to slide.
(5) heat release hole is inverted trapezoidal, and the heat release hole heat dissipation effect of inverted trapezoidal is more preferable.
Detailed description of the invention
Fig. 1 is structural schematic diagram when the utility model is unfolded；
Fig. 2 is structural schematic diagram at A in Fig. 1；
Fig. 3 is structural schematic diagram when the utility model is shunk；
Fig. 4 is structural schematic diagram at B in Fig. 3；
Fig. 5 is the structural schematic diagram of the utility model heat sink；
Fig. 6 is the structural schematic diagram in reference scheme.
Figure label explanation:
1 mounting base, 2 heat-radiating substrates, 3 support columns, 4 mounting grooves, 5 heat conductive rods, 6 heat release holes, 7 telescoping tubes, 8 first compressions
Spring, 9 first lock-screws, 10 second lock-screws, 11 heat-conducting blocks, 12 heat sinks, 13 baffles, 14 second compressed springs.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model；The technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe；Obviously；The described embodiments are only a part of the embodiments of the utility model；Rather than whole
Embodiment, based on the embodiments of the present invention；Those of ordinary skill in the art are without making creative work
Every other embodiment obtained；It fall within the protection scope of the utility model.
In the description of the present invention, it should be noted that term " on ", "lower", "inner", "outside" " top/bottom end " etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.In addition, term " first ", " second " are only used for description mesh
, it is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " being provided with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, can also be with
It is to be detachably connected, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be with
Indirectly connected through an intermediary, it can be the connection inside two elements.For the ordinary skill in the art, may be used
The concrete meaning of above-mentioned term in the present invention is understood with concrete condition.
Embodiment 1:
Fig. 1-6, a kind of electronic heat sink of cooling electronic component are please referred to, including is connected to 1 upper end of mounting base
Heat-radiating substrate 2,1 upper end of mounting base, which is dug, mounting groove 4, and bottom end, which is dug, in mounting groove 4 multiple heat release holes 6 and multiple logical
Hole, and multiple heat release holes 6 and through-hole are intervally arranged in 1 lower end of mounting base, heat release hole 6 is inverted trapezoidal, the heat release hole 6 of inverted trapezoidal
Heat dissipation effect is more preferable, and heat conductive rod 5 is equipped in through-hole, and heat conductive rod 5 is connect with through-hole wall, and 1 upper end of mounting base is connected with positioning
Device, positioning device include a pair of of support column 3, and a pair of of support column 3 is connect with 1 upper end of mounting base, and a pair of of support column 3 is distinguished
Positioned at 4 left and right sides of mounting groove, support column 3 is equipped with heat sink 12, and support column 3 and heat sink 12 close to one end of mounting groove 4
Between have telescoping tube 7, the first lock-screw 9 is connected on telescoping tube 7,7 inner end of telescoping tube is connected with the first compressed spring 8, dissipate
Multiple heat-conducting blocks 11 are connected on hot plate 12, and multiple heat-conducting blocks 11 are evenly spaced in the side of heat sink 12, it is by existing side
The stickup of bond plies in case is substituted for the positioning device of clamping, and good positioning effect is not easy to twist, and facilitates electronics device
Part is separated with mounting base 1.
Heat sink 12 is expansion plate, and the second lock-screw 10 is connected on heat sink 12, and 12 upper end of heat sink is connected with
Baffle 13 adapts to the electronic device of different height convenient for adjusting the height of heat sink 12, and 12 inner end of heat sink is connected with multiple the
Two compressed springs 14, and multiple second compressed springs 14 are evenly spaced in 12 inner end of heat sink, unscrew the second lock-screw 10, dissipate
Hot plate 12 can extend automatically, not need manually to pull, and heat sink 12 and baffle 13 are carved with corrugated close to one end of mounting groove 4
Anti-skid chequer makes difficult to slide between electronic device and heat sink 12.
Electronic device is placed in mounting groove 4, the first lock-screw 9 is unscrewed, the first compressed spring 8 in compressive state
Elongation is extended with telescoping tube 7, and telescoping tube 7 and 8 collective effect of the first compressed spring push heat sink 12 to electronic device, is dissipated
Hot plate 12 tightens the first lock-screw 9 tightly against electronic device outer end, and the corrugated anti-skid chequer set is carved on heat sink 12 makes electricity
It is difficult to slide between sub- device and heat sink 12, for slightly larger electronic device, it can first unscrew the second lock-screw 10, in pressure
Second compressed spring 14 of contracting state extends, and extends with heat sink 12, and the length for adjusting heat sink 12 enables baffle 13
It offsets with electronic device side top, tightens the second lock-screw 10, then unscrew the first lock-screw 9, electronic device is consolidated
Fixed, the heat that heat sink 12 combines the heat-conducting block 11 of its side connection to generate when can effectively operate to electronic device radiates,
Guarantee the stable operation of electronic device, this programme is on the basis of the scheme of publication number CN205987672U, by bond plies
Stickup be substituted for the positioning device of clamping, good positioning effect is not easy to twist, and facilitates and divide electronic device and mounting base 1
From.
It is described above；The only preferable specific embodiment of the utility model；But the protection scope of the utility model is not
It is confined to this；Anyone skilled in the art is within the technical scope disclosed by the utility model；It is practical according to this
Novel technical solution and its improvement design is subject to equivalent substitution or change；It should all cover in the protection scope of the utility model
It is interior.
Claims (5)
1. a kind of electronic heat sink of cooling electronic component, the heat-radiating substrate including being connected to mounting base (1) upper end
(2), it is characterised in that: mounting base (1) upper end, which is dug, to be had mounting groove (4), and the interior bottom end cutting of mounting groove (4) has more
A heat release hole (6) and multiple through-holes, and multiple heat release holes (6) and through-hole are intervally arranged in mounting base (1) lower end, the through-hole
In be equipped with heat conductive rod (5), the heat conductive rod (5) connect with through-hole wall, and mounting base (1) upper end is connected with to position and fill
It sets, the positioning device includes a pair of of support column (3), and a pair of support column (3) connect with mounting base (1) upper end, and one
Support column (3) is located at left and right sides of mounting groove (4), the support column (3) is equipped with heat dissipation close to the one end of mounting groove (4)
Plate (12), and have telescoping tube (7) between support column (3) and heat sink (12), the first locking screw is connected on the telescoping tube (7)
It follows closely (9), telescoping tube (7) inner end is connected with the first compressed spring (8), is connected with multiple heat-conducting blocks on the heat sink (12)
(11), and multiple heat-conducting blocks (11) are evenly spaced in the sides of heat sink (12).
2. a kind of electronic heat sink of cooling electronic component according to claim 1, it is characterised in that: the heat dissipation
Plate (12) is expansion plate, and the second lock-screw (10) are connected on heat sink (12), and heat sink (12) upper end is connected with
Baffle (13).
3. a kind of electronic heat sink of cooling electronic component according to claim 2, it is characterised in that: the heat dissipation
Plate (12) inner end is connected with multiple second compressed springs (14), and multiple second compressed springs (14) are evenly spaced in heat sink
(12) inner end.
4. a kind of electronic heat sink of cooling electronic component according to claim 2, it is characterised in that: the heat dissipation
Corrugated anti-skid chequer is carved in one end of plate (12) and baffle (13) close mounting groove (4).
5. a kind of electronic heat sink of cooling electronic component according to claim 1, it is characterised in that: the heat dissipation
Hole (6) is inverted trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821053947.9U CN208370104U (en) | 2018-07-04 | 2018-07-04 | A kind of electronic heat sink of cooling electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821053947.9U CN208370104U (en) | 2018-07-04 | 2018-07-04 | A kind of electronic heat sink of cooling electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208370104U true CN208370104U (en) | 2019-01-11 |
Family
ID=64924524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821053947.9U Active CN208370104U (en) | 2018-07-04 | 2018-07-04 | A kind of electronic heat sink of cooling electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208370104U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116110863A (en) * | 2023-04-13 | 2023-05-12 | 深圳辰达行电子有限公司 | Low-voltage high-current groove type MOS device |
| CN117320264A (en) * | 2023-11-29 | 2023-12-29 | 广州贵宇光电材料科技有限公司 | Thermoelectric separation structure of metal substrate and manufacturing process thereof |
-
2018
- 2018-07-04 CN CN201821053947.9U patent/CN208370104U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116110863A (en) * | 2023-04-13 | 2023-05-12 | 深圳辰达行电子有限公司 | Low-voltage high-current groove type MOS device |
| CN116110863B (en) * | 2023-04-13 | 2023-06-16 | 深圳辰达行电子有限公司 | Low-voltage high-current groove type MOS device |
| CN117320264A (en) * | 2023-11-29 | 2023-12-29 | 广州贵宇光电材料科技有限公司 | Thermoelectric separation structure of metal substrate and manufacturing process thereof |
| CN117320264B (en) * | 2023-11-29 | 2024-02-27 | 广州贵宇光电材料科技有限公司 | Thermoelectric separation structure of metal substrate and manufacturing process thereof |
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