CN208370105U - A kind of electronic component damping electronic heat sink - Google Patents
A kind of electronic component damping electronic heat sink Download PDFInfo
- Publication number
- CN208370105U CN208370105U CN201821053950.0U CN201821053950U CN208370105U CN 208370105 U CN208370105 U CN 208370105U CN 201821053950 U CN201821053950 U CN 201821053950U CN 208370105 U CN208370105 U CN 208370105U
- Authority
- CN
- China
- Prior art keywords
- installation
- heat dissipation
- inner panel
- electronic
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of electronic component damping electronic heat sinks, belong to electronic heat sink field, a kind of electronic component damping electronic heat sink, including installation heat dissipation base and installation radiating bottom plate, installation radiating bottom plate both ends are respectively connected with installation foot, installation heat dissipation base both ends are respectively connected with lower installation foot, the mutually close one end of the lower installation foot of a pair, which is dug, sliding slot, bottom end is connected with the first compressed spring in sliding slot, installation heat dissipation base both ends, which are dug, mounting groove, bottom is equipped with fastening block in mounting groove, digging on fastening block and installation heat dissipation base has corresponding threaded hole, fastening block is connected with the second compressed spring far from one end of mounting groove slot bottom, the one end of second compressed spring far from fastening block is connect with the lower end of upper installation foot, while the heat dissipation of electron device may be implemented, also has the function of damping, when Electronic device can be protected when by violent shake, and the electronic heat sink itself is also hardly damaged.
Description
Technical field
The utility model relates to electronic heat sink fields, more specifically to a kind of electronic component damping electronics
Radiator.
Background technique
Electronic device can generate a large amount of heat when working, and these extra heats quickly cannot be dispersed and be accumulated
Generate high temperature, it is likely that the equipment to work can be damaged, at this moment electronic heat sink just can efficiently solve this problem.Electronics
Radiator is the device to radiate for high-power electronic component, most of to be all formed into aluminium alloy extrusions, according to first device
Part size cuts into the size of needs, and aluminium alloy extrusions usually has groove structure or hollow cavity.
Chinese utility model Publication No. CN205987672U discloses a kind of electronic heat sink, which includes
Heat-radiating substrate is equipped at intervals with several thermal columns on the lateral surface of heat-radiating substrate, is wholely set on the medial surface of heat-radiating substrate
There is mounting base, has connection double coated film in the lower surface bonds of mounting base, be bonded in the upper surface of mounting base thermally conductive
Double coated film, the upper surface of mounting base are additionally provided with electronic component positioning pin, and it is fixed that electronic heat sink is additionally provided on mounting base
The outer peripheral surface in position hole, heat-radiating substrate is equipped with installation groove.The electronic heat sink of the utility model, heat dissipation area is big, heat dissipation effect
Fruit is good, and heat dissipation effect is not influenced by wind direction, and heat dissipation is stablized；It can quickly and easily be adhesively fixed, grasp with electronic component and body
Make simply, it is time saving and energy saving.
Existing electronic heat sink damping effect is bad, and the work of protection electronic device cannot be played when by violent shake
With, and its own is also easy to be damaged.
Utility model content
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of this utility model is to provide a kind of electronic component dampings
Electronic heat sink also has the function of damping while the heat dissipation of electron device may be implemented in it, energy when by violent shake
Electronic device is enough protected, and the electronic heat sink itself is also hardly damaged.
2. technical solution
To solve the above problems, the utility model adopts the following technical scheme.
A kind of electronic component damping electronic heat sink, including installation heat dissipation base and installation radiating bottom plate, the peace
Dress radiating bottom plate both ends are respectively connected with installation foot, and the installation heat dissipation base both ends are respectively connected with lower installation foot, it is a pair of described in
The mutually close one end of lower installation foot, which is dug, sliding slot, and sliding slot is located on the inside of installation heat dissipation base, bottom end connection in the sliding slot
There is the first compressed spring, the installation heat dissipation base both ends, which are dug, mounting groove, and mounting groove is located at outside installation heat dissipation base
Side, bottom is equipped with fastening block in the mounting groove, and digging on the fastening block and installation heat dissipation base has corresponding threaded hole,
Fastening screw is inserted in the threaded hole, the fastening block is connected with the second compressed spring, institute far from one end of mounting groove slot bottom
It states the one end of the second compressed spring far from fastening block to connect with the lower end of upper installation foot, the installation heat dissipation base and installation heat dissipation
It is equipped with thermal conductive silicon blob of viscose between bottom plate, the second heat dissipation inner panel, institute are connected between the installation heat dissipation base and thermal conductive silicon blob of viscose
It states and is connected with the first heat dissipation inner panel between installation radiating bottom plate and thermal conductive silicon blob of viscose, the first heat dissipation inner panel is close to heat conductive silica gel
The left and right ends of block are respectively connected with sliding block, and the sliding block is slidably connected with sliding slot, and sliding block is connect with the first compressed spring upper end,
While the heat dissipation of electron device may be implemented in it, also have the function of damping, electronics can be protected when by violent shake
Device, and the electronic heat sink itself is also hardly damaged.
Further, digging on the first heat dissipation inner panel and the second heat dissipation inner panel has multiple heat release holes, multiple described
Heat release hole is evenly spaced on the first heat dissipation inner panel and the second heat dissipation inner panel, improves heat dissipation effect.
Further, thermal conductive silicon rubber mat is connected between the first heat dissipation inner panel and installation radiating bottom plate, described second
It is equally connected with thermal conductive silicon rubber mat between heat dissipation inner panel and installation heat dissipation base, so that connection is in close contact between the two, is improved
Heating conduction.
Further, it is connected with extension spring between the lower installation foot upper end and installation radiating bottom plate, reinforces damping effect
Fruit.
Further, the installation heat dissipation base and installation radiating bottom plate surface are coated with thermal dispersant coatings, the heat-radiation coating
Digging on layer has multiple apertures, and multiple apertures are evenly spaced on thermal dispersant coatings, and thermal dispersant coatings can be effective while heat dissipation
Heat dissipation base and installation radiating bottom plate surface are installed in protection, and multiple apertures on thermal dispersant coatings improve heat dissipation effect.
3. beneficial effect
Compared with the prior art, utility model has the advantages that
(1) while the heat dissipation of electron device may be implemented in this programme, also has the function of damping, when acutely being shaken
When can protect electronic device, and the electronic heat sink itself is also hardly damaged.
Digging on (2) first heat dissipation inner panels and the second heat dissipation inner panel has multiple heat release holes, and multiple heat release holes are uniformly arranged
On the first heat dissipation inner panel and the second heat dissipation inner panel, heat dissipation effect is improved.
Thermal conductive silicon rubber mat, the second heat dissipation inner panel and installation are connected between (3) first heat dissipation inner panels and installation radiating bottom plate
It is equally connected with thermal conductive silicon rubber mat between heat dissipation base, so that connection is in close contact between the two, improves heating conduction.
(4) it is connected with extension spring between installation foot upper end and installation radiating bottom plate under, reinforces damping effect.
(5) installation heat dissipation base and installation radiating bottom plate surface are coated with thermal dispersant coatings, there is multiple cutting on thermal dispersant coatings
Aperture, multiple apertures are evenly spaced on thermal dispersant coatings, thermal dispersant coatings radiate while can effectively protect installation heat dissipation base and
Radiating bottom plate surface is installed, multiple apertures on thermal dispersant coatings improve heat dissipation effect.
Detailed description of the invention
Fig. 1 is the positive structure schematic of the utility model；
Fig. 2 is structural schematic diagram at A in Fig. 1；
Fig. 3 is structural schematic diagram at B in Fig. 1.
Figure label explanation:
1 installation heat dissipation base, 2 installation radiating bottom plates, 3 first heat dissipation inner panels, 4 second heat dissipation inner panels, 5 thermal conductive silicon blob of viscoses, 6
Upper installation foot, 7 lower installation feet, 8 sliding blocks, 9 first compressed springs, 10 sliding slots, 11 mounting grooves, 12 second compressed springs, 13 fastenings
Screw, 14 threaded holes, 15 fastening blocks, 16 heat release holes.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model；The technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe；Obviously；The described embodiments are only a part of the embodiments of the utility model；Rather than whole
Embodiment, based on the embodiments of the present invention；Those of ordinary skill in the art are without making creative work
Every other embodiment obtained；It fall within the protection scope of the utility model.
In the description of the present invention, it should be noted that term " on ", "lower", "inner", "outside" " top/bottom end " etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.In addition, term " first ", " second " are only used for description mesh
, it is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " being provided with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, can also be with
It is to be detachably connected, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be with
Indirectly connected through an intermediary, it can be the connection inside two elements.For the ordinary skill in the art, may be used
The concrete meaning of above-mentioned term in the present invention is understood with concrete condition.
Embodiment 1:
It please refers to Fig. 1-3, a kind of electronic component damping electronic heat sink, including installation heat dissipation base 1 and installation dissipates
Hot bottom plate 2, installation 2 both ends of radiating bottom plate are respectively connected with installation foot 6, and installation 1 both ends of heat dissipation base are respectively connected with lower installation foot
7, the mutually close one end of the lower installation foot 7 of a pair, which is dug, sliding slot 10, and sliding slot 10 is located at 1 inside of installation heat dissipation base, sliding slot 10
Interior bottom end is connected with the first compressed spring 9, and installation 1 both ends of heat dissipation base, which are dug, mounting groove 11, and mounting groove 11 is located at peace
1 outside of heat dissipation base is filled, bottom is equipped with fastening block 15 in mounting groove 11, and digging on fastening block 15 and installation heat dissipation base 1 has phase
Corresponding threaded hole 14 is inserted with fastening screw 13 in threaded hole 14, and fastening block 15 is connected with far from one end of 11 slot bottom of mounting groove
Second compressed spring 12, the one end of the second compressed spring 12 far from fastening block 15 are connect with the lower end of upper installation foot 6, installation heat dissipation
It is equipped with thermal conductive silicon blob of viscose 5 between pedestal 1 and installation radiating bottom plate 2, installs and is connected between heat dissipation base 1 and thermal conductive silicon blob of viscose 5
Second heat dissipation inner panel 4, installs and is connected with the first heat dissipation inner panel 3 between radiating bottom plate 2 and thermal conductive silicon blob of viscose 5, the first heat dissipation inner panel 3
Left and right ends close to thermal conductive silicon blob of viscose 5 are respectively connected with sliding block 8, and sliding block 8 is slidably connected with sliding slot 10, and sliding block 8 and the first pressure
The connection of 9 upper end of contracting spring also has the function of damping, when acutely being trembled while the heat dissipation of electron device may be implemented in it
Electronic device can be protected when dynamic, and the electronic heat sink itself is also hardly damaged.
Digging on first heat dissipation inner panel 3 and the second heat dissipation inner panel 4 has multiple heat release holes 16, and multiple heat release holes 16 are uniformly arranged
Cloth improves heat dissipation effect on the first heat dissipation inner panel 3 and the second heat dissipation inner panel 4.
Thermal conductive silicon rubber mat, the second heat dissipation inner panel 4 and installation are connected between first heat dissipation inner panel 3 and installation radiating bottom plate 2
It is equally connected with thermal conductive silicon rubber mat between heat dissipation base 1, so that connection is in close contact between the two, improves heating conduction.
It is connected with extension spring between lower 7 upper end of installation foot and installation radiating bottom plate 2, reinforces damping effect.
Installation heat dissipation base 1 and installation 2 surface of radiating bottom plate are coated with thermal dispersant coatings, there is multiple small cutting on thermal dispersant coatings
Hole, multiple apertures are evenly spaced on thermal dispersant coatings, and thermal dispersant coatings can effectively protect installation heat dissipation base 1 and peace while heat dissipation
2 surface of radiating bottom plate is filled, multiple apertures on thermal dispersant coatings improve heat dissipation effect.
Those skilled in the art select suitable tool that electronic component is mounted on installation 2 upper end of radiating bottom plate, utilize
Radiating bottom plate 2, first is installed and radiates the heat dissipation of inner panel 3, second inner panel 4, installation heat dissipation base 1 and thermal conductive silicon blob of viscose 5 to electronics member
Device radiates, and when violent shake by up and down direction, installation radiating bottom plate 2 squeezes thermally conductive with the first heat dissipation inner panel 3
The sliding block 8 of silica gel block 5, the first heat dissipation 3 both ends of inner panel is slided along sliding slot 10, the compression of the first compressed spring 9, on lower installation foot 7
The extension spring at end stretches, and the second compressed spring 12 compression of upper 6 lower end of installation foot, at the same time, thermal conductive silicon blob of viscose 5 also occurs
Certain deformation, good damping effect unscrew fastening screw 13, can be by installation heat dissipation base 1 and installation 2 phase of radiating bottom plate point
From replacement inner body, compared with the scheme of Publication No. CN205987672U, the heat dissipation of electron device is may be implemented in this programme
While, also have the function of damping, electronic device, and the electronic heat sink itself can be protected when by violent shake
It is hardly damaged.
It is described above；The only preferable specific embodiment of the utility model；But the protection scope of the utility model is not
It is confined to this；Anyone skilled in the art is within the technical scope disclosed by the utility model；It is practical according to this
Novel technical solution and its improvement design is subject to equivalent substitution or change；It should all cover in the protection scope of the utility model
It is interior.
Claims (5)
1. a kind of electronic component damping electronic heat sink, including installation heat dissipation base (1) and installation radiating bottom plate (2),
Be characterized in that: installation radiating bottom plate (2) both ends are respectively connected with installation foot (6), and installation heat dissipation base (1) both ends are equal
It is connected with lower installation foot (7), the mutually close one end of a pair of lower installation foot (7), which is dug, to be had sliding slot (10), and sliding slot (10) position
On the inside of installation heat dissipation base (1), the interior bottom end of the sliding slot (10) is connected with the first compressed spring (9), installation heat dissipation bottom
Seat (1) both ends, which are dug, to be had mounting groove (11), and mounting groove (11) is located on the outside of installation heat dissipation base (1), the mounting groove
(11) interior bottom is equipped with fastening block (15), and digging on the fastening block (15) and installation heat dissipation base (1) has corresponding screw thread
Hole (14) is inserted with fastening screw (13) in the threaded hole (14), the fastening block (15) far from mounting groove (11) slot bottom one
End is connected with the second compressed spring (12), second compressed spring (12) one end and upper installation foot far from fastening block (15)
(6) lower end connection, is equipped with thermal conductive silicon blob of viscose (5) between the installation heat dissipation base (1) and installation radiating bottom plate (2), described
Be connected with the second heat dissipation inner panel (4) between installation heat dissipation base (1) and thermal conductive silicon blob of viscose (5), the installation radiating bottom plate (2) and
The first heat dissipation inner panel (3) is connected between thermal conductive silicon blob of viscose (5), first heat dissipation inner panel (3) is close to thermal conductive silicon blob of viscose (5)
Left and right ends are respectively connected with sliding block (8), and the sliding block (8) is slidably connected with sliding slot (10), and sliding block (8) and the first compressed spring
(9) upper end connects.
2. a kind of electronic component damping electronic heat sink according to claim 1, it is characterised in that: described first dissipates
Digging on hot inner panel (3) and the second heat dissipation inner panel (4) has multiple heat release holes (16), and multiple heat release holes (16) are uniformly arranged
In the first heat dissipation inner panel (3) and the second heat dissipation inner panel (4).
3. a kind of electronic component damping electronic heat sink according to claim 1, it is characterised in that: described first dissipates
Thermal conductive silicon rubber mat is connected between hot inner panel (3) and installation radiating bottom plate (2), second heat dissipation inner panel (4) and installation are radiated
Pedestal is equally connected with thermal conductive silicon rubber mat between (1).
4. a kind of electronic component damping electronic heat sink according to claim 1, it is characterised in that: the lower installation
Extension spring is connected between foot (7) upper end and installation radiating bottom plate (2).
5. a kind of electronic component damping electronic heat sink according to claim 1, it is characterised in that: the installation dissipates
Hot pedestal (1) and installation radiating bottom plate (2) surface are coated with thermal dispersant coatings, and digging on the thermal dispersant coatings has multiple apertures, more
A aperture is evenly spaced on thermal dispersant coatings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821053950.0U CN208370105U (en) | 2018-07-04 | 2018-07-04 | A kind of electronic component damping electronic heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821053950.0U CN208370105U (en) | 2018-07-04 | 2018-07-04 | A kind of electronic component damping electronic heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208370105U true CN208370105U (en) | 2019-01-11 |
Family
ID=64924535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821053950.0U Active CN208370105U (en) | 2018-07-04 | 2018-07-04 | A kind of electronic component damping electronic heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208370105U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110198037A (en) * | 2019-06-19 | 2019-09-03 | 河北腾瑞电力设备科技有限公司 | A kind of power electronics type three-phase imbalance intelligent regulating device |
-
2018
- 2018-07-04 CN CN201821053950.0U patent/CN208370105U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110198037A (en) * | 2019-06-19 | 2019-09-03 | 河北腾瑞电力设备科技有限公司 | A kind of power electronics type three-phase imbalance intelligent regulating device |
| CN110198037B (en) * | 2019-06-19 | 2023-01-10 | 河北腾瑞电力设备科技有限公司 | Power electronic type intelligent three-phase imbalance adjusting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205389320U (en) | Heat dissipation shield assembly | |
| CN204333581U (en) | A kind of novel plug box | |
| CN208370105U (en) | A kind of electronic component damping electronic heat sink | |
| CN101325862A (en) | Cabinet, radiating device and method for installing the radiating device | |
| CN106403356B (en) | Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment | |
| CN203464213U (en) | LED (Light Emitting Diode) projection lamp radiator | |
| CN208370104U (en) | A kind of electronic heat sink of cooling electronic component | |
| CN209726886U (en) | A kind of temperature-uniforming plate | |
| CN207835617U (en) | A kind of video camera of plastic shell | |
| CN207316673U (en) | LED ceiling lamp with radiator structure | |
| CN209105043U (en) | A kind of radiating assembling structure of Switching Power Supply | |
| CN210925685U (en) | Tank body heat dissipation device | |
| CN106714504B (en) | Remote Radio Unit, installation part and RF communication system | |
| CN208370106U (en) | A kind of electronic heat sink convenient for adjusting size | |
| CN203933354U (en) | Novel switched power supply | |
| CN204026609U (en) | A kind of LED Down lamp | |
| CN209104852U (en) | A kind of Domestic charger of high efficiency and heat radiation | |
| CN208370103U (en) | A kind of electronic component auxiliary radiating device | |
| CN210488453U (en) | Outdoor industrial computer of heat dissipation efficient | |
| CN105324017B (en) | A kind of radiator of display | |
| CN207185042U (en) | A kind of automobile controller high heat conduction aluminium alloy heat radiator | |
| CN205912420U (en) | Heat dissipation device | |
| CN205485830U (en) | Computer case | |
| CN209419366U (en) | A kind of motor radiating piece mechanism | |
| CN211047399U (en) | Heat-dissipation insulation fixing device for electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |