CN212305752U - High temperature resistant alumina ceramic circuit board - Google Patents
High temperature resistant alumina ceramic circuit board Download PDFInfo
- Publication number
- CN212305752U CN212305752U CN202020838415.7U CN202020838415U CN212305752U CN 212305752 U CN212305752 U CN 212305752U CN 202020838415 U CN202020838415 U CN 202020838415U CN 212305752 U CN212305752 U CN 212305752U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board body
- alumina ceramic
- high temperature
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000741 silica gel Substances 0.000 claims abstract description 16
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 16
- 239000003063 flame retardant Substances 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 239000004519 grease Substances 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 6
- 230000002035 prolonged effect Effects 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000011224 oxide ceramic Substances 0.000 description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a high temperature resistance alumina ceramic circuit board, which comprises a circuit board body, the circuit board body includes alumina ceramic substrate, the surface of alumina ceramic substrate has high heat conduction silica gel piece through adhesive bonding, the top of high heat conduction silica gel piece has fire-retardant copper foil phenolic paper through adhesive bonding, the bottom of alumina ceramic substrate has heat dissipation copper sheet layer through adhesive bonding, the bottom of circuit board body has been paintd the heat dissipation silicone grease layer, the mounting hole has all been seted up in the four corners at circuit board body surface top. The utility model discloses an alumina ceramics substrate, high heat conduction silica gel piece, fire-retardant copper clad paper, heat dissipation copper sheet layer and heat dissipation silicone grease layer's cooperation is used, can make the circuit board body possess good heat dispersion, can carry out good heat conduction to the high temperature that receives moreover, can not make electronic equipment receive the harm of high temperature, has prolonged the life of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high temperature resistant alumina ceramic circuit board.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed circuit board, etc., the circuit board makes the circuit miniaturized, visualized, play an important role in the batch production of fixed circuit and the optimization of electrical apparatus overall arrangement, but current alumina ceramic circuit board does not possess high temperature resistance, may cause the damage to its surperficial electronic equipment after long-time use, thereby reduced the life of circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant alumina ceramic circuit board possesses high temperature resistance's advantage, has solved current alumina ceramic circuit board and has not possessed high temperature resistance performance, probably causes the damage to the electronic equipment on its surface after long-time use to circuit board life's problem has been reduced.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistance alumina ceramic circuit board, includes the circuit board body, the circuit board body includes alumina ceramic substrate, the surface of alumina ceramic substrate has high heat conduction silica gel piece through adhesive bonding, the top of high heat conduction silica gel piece has fire-retardant copper foil phenolic paper that covers through adhesive bonding, the bottom of alumina ceramic substrate has the heat dissipation copper sheet layer through adhesive bonding.
Preferably, the bottom of the circuit board body is coated with a heat dissipation silicone layer, and four corners of the top of the surface of the circuit board body are provided with mounting holes.
Preferably, the left side of the surface of the circuit board body is adhered with a label through an adhesive, and the surface of the label is sprayed with product parameters.
Preferably, four corners of the circuit board body are all subjected to arc transition treatment.
Preferably, the edge of the circuit board body is coated with a sealing ring, and the sealing ring is in close contact with the circuit board body.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses an alumina ceramics substrate, high heat conduction silica gel piece, fire-retardant copper clad paper, heat dissipation copper sheet layer and heat dissipation silicone grease layer's cooperation is used, can make the circuit board body possess good heat dispersion, can carry out good heat conduction to the high temperature that receives moreover, can not make electronic equipment receive the harm of high temperature, has prolonged the life of circuit board.
2. The utility model can provide good conductivity, mechanical strength and high temperature resistance for the circuit board body by arranging the alumina ceramic substrate, can rapidly conduct heat to the heat generated by the work of the circuit board body by arranging the high heat-conducting silica gel sheet, can avoid the firing probability caused by high temperature by arranging the flame-retardant copper foil-coated phenolic paper, ensures the fire resistance of the circuit board body, can rapidly conduct heat to the heat at the bottom of the alumina ceramic substrate by arranging the heat-radiating copper plate layer, can well conduct heat to the heat-radiating copper plate layer by arranging the heat-radiating silica gel layer, plays a good heat-radiating effect, can better ensure the convenience of installation by arranging the mounting hole, can explain the product parameters of the circuit board body by arranging the label, can seal and protect the edge of the circuit board body by arranging the sealing ring, the service life of the circuit board body is prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic sectional view of the structure of the present invention;
fig. 3 is a schematic view of the internal connection structure of the circuit board body of the present invention.
In the figure: 1. a circuit board body; 101. an alumina ceramic substrate; 102. a high thermal conductivity silicone sheet; 103. flame-retardant copper-clad phenolic paper; 104. a heat-dissipating copper plate layer; 2. a heat-dissipating silicone layer; 3. mounting holes; 4. a label; 5. And (5) sealing rings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The components of the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known by the technical manual or by the conventional experimental method.
Referring to fig. 1-3, a high temperature resistant alumina ceramic circuit board comprises a circuit board body 1, a heat dissipation silicone layer 2 is coated on the bottom of the circuit board body 1, good heat conduction can be performed on a heat dissipation copper plate layer 104 through the heat dissipation silicone layer 2, good heat dissipation effect is achieved, mounting holes 3 are formed in four corners of the top of the surface of the circuit board body 1, mounting convenience can be better guaranteed by the arrangement of the mounting holes 3, a label 4 is bonded on the left side of the surface of the circuit board body 1 through an adhesive, product parameters are sprayed on the surface of the label 4, product parameters of the circuit board body 1 can be described by the arrangement of the label 4, arc transition processing is performed on the four corners of the circuit board body 1, a sealing ring 5 is wrapped on the edge of the circuit board body 1, the sealing ring 5 is in close contact with the circuit board body 1, and by the arrangement of the sealing ring 5, the edge of the circuit board body 1 can be protected in a sealing mode, the service life of the circuit board body 1 is prolonged, the circuit board body 1 comprises an alumina ceramic substrate 101, the alumina ceramic substrate 101 is arranged to provide good conductivity, mechanical strength and high temperature resistance for the circuit board body 1, a high-heat-conduction silica gel sheet 102 is bonded on the surface of the alumina ceramic substrate 101 through an adhesive, the high-heat-conduction silica gel sheet 102 is arranged to conduct heat quickly to heat generated by the operation of the circuit board body 1, a flame-retardant copper foil-clad phenolic paper 103 is bonded on the top of the high-heat-conduction silica gel sheet 102 through the adhesive, the flame-starting probability caused by high temperature can be avoided through the flame-retardant copper foil-clad phenolic paper 103, the fireproof performance of the circuit board body 1 is guaranteed, a heat-dissipation copper plate layer 104 is bonded on the bottom of the alumina ceramic substrate 101 through the adhesive, and the heat-, can carry out quick heat conduction to the heat of alumina ceramics substrate 101 bottom, use through the cooperation of alumina ceramics substrate 101, high heat conduction silica gel piece 102, fire-retardant copper clad laminate phenolic paper 103, heat dissipation copper sheet layer 104 and heat dissipation silicone grease layer 2, can make circuit board body 1 possess good heat dispersion, can carry out good heat conduction to the high temperature that receives moreover, can not make electronic equipment receive the harm of high temperature, prolonged the life of circuit board.
When in use, the aluminum oxide ceramic substrate 101 can provide good conductivity, mechanical strength and high temperature resistance for the circuit board body 1, the high heat-conducting silica gel sheet 102 can conduct heat quickly to the heat generated by the work of the circuit board body 1, the flame-retardant copper foil-clad phenolic paper 103 can avoid the fire probability caused by high temperature, the fireproof performance of the circuit board body 1 is ensured, the heat at the bottom of the aluminum oxide ceramic substrate 101 can conduct heat quickly through the heat-radiating copper plate layer 104, the heat-radiating copper plate layer 104 can conduct heat well through the heat-radiating silica gel layer 2, a good heat-radiating effect is achieved, the installation convenience can be better ensured through the installation hole 3, the product parameters of the circuit board body 1 can be explained through the label 4, the edge of the circuit board body 1 can be sealed and protected through the sealing ring 5, the service life of the circuit board body 1 is prolonged.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a high temperature resistant alumina ceramic circuit board, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises an alumina ceramic substrate (101), wherein a high-heat-conductivity silica gel sheet (102) is bonded on the surface of the alumina ceramic substrate (101) through an adhesive, a flame-retardant copper foil-clad phenolic paper (103) is bonded on the top of the high-heat-conductivity silica gel sheet (102) through the adhesive, and a heat-dissipation copper plate layer (104) is bonded on the bottom of the alumina ceramic substrate (101) through the adhesive.
2. The high temperature resistant alumina ceramic circuit board of claim 1, wherein: the heat dissipation circuit board is characterized in that a heat dissipation silicone grease layer (2) is coated on the bottom of the circuit board body (1), and mounting holes (3) are formed in four corners of the top of the surface of the circuit board body (1).
3. The high temperature resistant alumina ceramic circuit board of claim 1, wherein: the circuit board is characterized in that a label (4) is adhered to the left side of the surface of the circuit board body (1) through an adhesive, and product parameters are sprayed on the surface of the label (4).
4. The high temperature resistant alumina ceramic circuit board of claim 1, wherein: four corners of the circuit board body (1) are all subjected to arc transition treatment.
5. The high temperature resistant alumina ceramic circuit board of claim 1, wherein: the edge cladding of circuit board body (1) has sealing washer (5), sealing washer (5) and circuit board body (1) in close contact with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020838415.7U CN212305752U (en) | 2020-05-19 | 2020-05-19 | High temperature resistant alumina ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020838415.7U CN212305752U (en) | 2020-05-19 | 2020-05-19 | High temperature resistant alumina ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212305752U true CN212305752U (en) | 2021-01-05 |
Family
ID=73967966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020838415.7U Expired - Fee Related CN212305752U (en) | 2020-05-19 | 2020-05-19 | High temperature resistant alumina ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212305752U (en) |
-
2020
- 2020-05-19 CN CN202020838415.7U patent/CN212305752U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210106 Address after: 413000 East Changchun Road, Ziyang District, Yiyang City, Hunan Province Patentee after: Hunan Chaosheng Electronic Technology Co.,Ltd. Address before: 4 / F, unit 2, building 256, 89 Shuangqiao Road, Chenghua District, Chengdu, Sichuan 610066 Patentee before: Luo Lichuan |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210105 |