KR20080078625A - Heat dissipation sheet - Google Patents
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- KR20080078625A KR20080078625A KR1020080076303A KR20080076303A KR20080078625A KR 20080078625 A KR20080078625 A KR 20080078625A KR 1020080076303 A KR1020080076303 A KR 1020080076303A KR 20080076303 A KR20080076303 A KR 20080076303A KR 20080078625 A KR20080078625 A KR 20080078625A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000009792 diffusion process Methods 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000010409 thin film Substances 0.000 claims abstract description 3
- 230000005855 radiation Effects 0.000 claims abstract 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010408 film Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 4
- 238000009501 film coating Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 발명은 상대적으로 저렴한 알루미늄시트를 사용하여 열확산 방열기능이 우수하면서 제조원가가 현저히 절감됨과 아울러 경질 내열수지로 코팅이 이루어지므로 베이거나 다칠 염려가 없어 취급이 안전 용이하고 작업생산성을 현저히 향상시켜 주도록 하는 방열시트에 관한 것이다.The present invention uses a relatively inexpensive aluminum sheet, excellent heat diffusion and heat dissipation function, while significantly reducing the manufacturing cost, and because the coating is made of a hard heat-resistant resin, there is no fear of being cut or injured, so that it is easy to handle and improves work productivity significantly. It relates to a heat radiation sheet.
이를 실현하기 위한 본 발명은 전자기기에 방열기능을 목적으로 취부되며 일면에 점착제가 도포되고 이형지가 취부되는 열확산 방열시트에 있어서,The present invention for realizing this in the thermal diffusion sheet is attached to the electronic device for the purpose of heat dissipation function, the adhesive is applied to one surface and the release paper is mounted,
열전도성 재질로 되는 금속시트에 경질 내열수지가 얇게 피막코팅되어 이루어짐을 특징으로 한다.Hard heat-resistant resin is a thin film-coated on the metal sheet made of a thermally conductive material.
Description
도 1은 본 발명에 따른 일 실시예의 구성을 보이는 일부 절단 단면도1 is a partial cross-sectional view showing the configuration of an embodiment according to the present invention
도 2는 도 1의 A-A선 일부 단면 상세도Figure 2 is a partial cross-sectional view of the line A-A of Figure 1
*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
1: 본 발명의 방열시트1: heat dissipation sheet of the present invention
10: 금속시트 30: 경질 내열수지10: metal sheet 30: hard heat-resistant resin
2: 점착제 3: 이형지2: adhesive 3: release paper
본 발명은 방열시트에 관한 것으로서, 특히 상대적으로 저렴한 알루미늄시트를 사용하여 열확산 방열기능이 우수하면서 제조원가가 현저히 절감됨과 아울러 경질 내열수지로 코팅이 이루어지므로 베이거나 다칠 염려가 없어 취급이 안전 용이하고 작업생산성을 현저히 향상시켜 주도록 하는 방열시트에 관한 것이다.The present invention relates to a heat dissipation sheet, and in particular, using a relatively inexpensive aluminum sheet, excellent heat diffusion heat dissipation function, while significantly reducing the manufacturing cost, and because the coating is made of a hard heat-resistant resin, easy to handle and safe work It relates to a heat dissipation sheet to significantly improve the productivity.
전자 디스플레이 분야에 사용되는 PDP(Plasma Display Pannel) 등은 고전압 방전구조에 의하여 발열량이 증가함에 따라 원활한 방열 냉각흐름은 기기의 안정성 및 품질특성에 중요한 요소가 된다.PDP (Plasma Display Pannel) used in the field of electronic display has a high heat dissipation due to the high-voltage discharge structure, the smooth heat dissipation cooling flow is an important factor for the stability and quality characteristics of the device.
PDP 유리패널의 최대 허용 동작온도는 90℃이하며 형광영역과 비형광영역 간의 온도차가 10℃ 이상이 되면 PDP 유리패널에 균열이 발생되고 플라즈마 광원을 이용하는 PDP는 내부에 고전압/고전류가 발생하게 된다.The maximum allowable operating temperature of PDP glass panel is 90 ℃ or less. If the temperature difference between fluorescence region and non-fluorescent region is more than 10 ℃, crack occurs in PDP glass panel and PDP using plasma light source generates high voltage / high current inside. .
또한, PDP의 경우 전체면에 걸쳐 방열 냉각이 불균일하게 이루어질 경우, 영상이 국부적으로 굴절 및 왜곡을 일으켜 디스플레이 품질특성을 저하시키게 된다.In addition, in the case of the PDP, if the heat dissipation cooling is unevenly distributed over the entire surface, the image is locally refracted and distorted, thereby degrading display quality characteristics.
또한 슬림박형화 구조가 구현되어야 하는 PDP는 이전의 음극관 화면표시장치보다 협소한 구조로 인해 방열 구조에서 취약한 환경을 갖고 있으며 PDP의 냉각장치로서 팬이 사용되기도 하였으나 이는 PDP의 슬림 박형화에 가장 큰 장애요인이 되고 있는 동시에 소음, 중량증가 및 동력소비 등의 문제를 갖으므로 근래에는 열을 신속히 확산 전달할 수 있는 방열시트가 사용되고 있다.In addition, PDP, which has to be implemented with a slim thin structure, has a weak environment in heat dissipation structure due to the narrower structure than the previous cathode ray tube display device, and a fan is used as a cooling device of the PDP, but this is the biggest obstacle to slim slimming of the PDP. At the same time, since there are problems such as noise, weight increase, and power consumption, a heat dissipation sheet capable of rapidly spreading and transferring heat has recently been used.
종래의 방열시트 중 일 실시예는 알루미늄 시트가 사용되었다.In one embodiment of the conventional heat dissipation sheet, an aluminum sheet is used.
이와 같은 알루미늄 시트는 열전도성이 우수한 장점이 있으나 도체이므로 절연성이 없는 단점이 있을 뿐만 아니라 선단이 예리하여 작업자가 손을 베이거나 다칠 위험이 커서 취급이 대단히 불편하며, 손을 다칠 경우 이물질이 PDP에 오염되어 불량을 발생시키는 문제점이 있었다.Such aluminum sheet has the advantage of excellent thermal conductivity, but it has the disadvantage of not having insulation because it is a conductor, and it is very inconvenient to handle it because the tip is sharp and there is a high risk of cuts or injuries. There was a problem that the contamination caused the defect.
따라서, 근래에는 그래파이트(Graphite)를 이용한 방열시트가 사용되고 있다. 상기 그래파이트 방열시트는 흑연으로 이루어진 흑연층을 흑연이 묻어나지 않도록 도료층으로 얇게 피막처리한 것이다.Therefore, in recent years, a heat dissipation sheet using graphite has been used. The graphite heat dissipation sheet is a thin coating of a graphite layer made of graphite to prevent the graphite from being buried.
그런데 이와 같은 그래파이트 방열시트는 연성이 없어 부서지기 쉬우며 조립용 구멍 타공 형성시 흑연분진이 비산되어 제품을 오염시키므로 구멍 주위를 재차 실링해야 되는 번거로움이 있고 상대적으로 가격이 고가여서 제조원가를 상승시키는 문제점이 있었다.However, such graphite heat dissipation sheet is not ductile, so it is brittle, and graphite dust is scattered when forming holes for assembly, which contaminates the product. Therefore, it is troublesome to seal around the hole again and the manufacturing cost is increased due to relatively high price. There was a problem.
본 발명은 상기한 문제점을 해소하기 위하여 안출된 것으로서,The present invention has been made to solve the above problems,
본 발명의 목적은 상대적으로 저렴한 알루미늄시트를 사용하여 열확산 방열기능이 우수하면서 제조원가가 현저히 절감됨과 아울러 경질 내열수지로 코팅이 이루어지므로 베이거나 다칠 염려가 없어 취급이 안전 용이하고 작업생산성을 현저히 향상시켜 주도록 하는 방열시트를 제공함에 있다.The purpose of the present invention is to use a relatively inexpensive aluminum sheet, excellent heat diffusion and heat dissipation function, while significantly reducing the manufacturing cost, and because the coating is made of a hard heat-resistant resin, there is no fear of being cut or injured, easy to handle and improve work productivity significantly. To provide a heat dissipation sheet to give.
상기한 목적을 달성하는 본 발명에 따른 방열시트는,Heat dissipation sheet according to the present invention to achieve the above object,
전자기기에 방열기능을 목적으로 취부되며 일면에 점착제가 도포되고 이형지가 취부되는 열확산 방열시트에 있어서,In the heat diffusion heat dissipation sheet is attached to the electronic device for the purpose of heat dissipation, the adhesive is applied on one side and the release paper is attached,
열전도성 재질로 되는 금속시트에 경질 내열수지가 얇게 피막코팅되어 이루어짐을 특징으로 한다.Hard heat-resistant resin is a thin film-coated on the metal sheet made of a thermally conductive material.
이하, 본 발명의 방열시트에 대한 실시예를 첨부도면을 참조하여 보다 상세 히 설명한다.Hereinafter, an embodiment of the heat dissipation sheet of the present invention will be described in more detail with reference to the accompanying drawings.
도 1은 본 발명에 따른 일 실시예의 구성을 보이는 일부 절단 단면도, 도 2는 도 1의 A-A선 일부 단면 상세도이다.1 is a partial cross-sectional view showing the configuration of an embodiment according to the present invention, Figure 2 is a partial cross-sectional view of the line A-A of FIG.
도 1 및 도 2에 도시된 바와 같이, 본 발명에 따른 일 실시예의 방열시트(1)는 전자기기에 방열기능을 목적으로 취부되며 일면에 점착제(2)가 도포되고 이형지(3)가 취부되는 열확산 방열시트에 있어서, 열전도성 재질로 되는 금속시트(10)에 경질 내열수지(30)가 얇게 피막코팅되어 이루어지는 것이다.As shown in Figure 1 and 2, the
여기서, 상기 금속시트(10)는 알루미늄(Al) 또는 동(Cu)으로 이루어짐이 바람직하다.Here, the
또한, 상기 경질 내열수지(30)는 절연성과 내열성을 갖으며 피막코팅 두께는 10㎛ ∼ 50㎛ 로 형성됨이 바람직하다. 즉 방열효율에 영향을 미치지 않을 정도록 대단히 얇게 코팅된다.In addition, the hard heat-
상기 경질 내열수지(30)는 에폭시 수지(Epoxy resin)로 이루어짐이 바람직하다.The hard heat-
상기 금속시트(10)는 적용 기기의 사양에 따른 규격으로 절단 및 구멍 타공 후에 경질 내열수지(30)로 피막코팅되어도 무방하다.The
이에 따라 구멍(h) 둘레에도 내열수지 코팅이 이루어진다.Accordingly, the heat-resistant resin coating is also made around the hole h.
상기 금속시트(10)는 모서리가 라운드형성되어도 무방하다.The
이와 같은 구성을 지닌 본 발명에 따른 방열시트(1)의 작용상태를 살펴본다.Look at the working state of the
본 발명에 따른 열확산 방열시트는 상기 금속시트(10)로서 열전도성이 우수하고 상대적으로 저렴한 알루미늄시트를 사용하여 적용 전자기기의 사양에 따라 규격 및 구멍(h)을 형성한 다음 경질 내열수지(30)를 약 20㎛ 내외 두께로 얇게 피막처리하여 이루어진다.The heat diffusion heat dissipation sheet according to the present invention uses the aluminum sheet having excellent thermal conductivity and relatively inexpensive aluminum sheet as the
이와 같은 구성의 열확산 방열시트(1)는 PDP 등에 취부되어 알루미늄의 열전도 특성에 따라 열기를 신속 균등하게 확산 및 방열시켜 주므로 디스플레이 품질을 향상시키며 발열로부터 기기를 보호한다.The thermal diffusion
그리고 알루미늄시트를 사용하면서도 경질 내열수지(30)로 피막코팅이 이루어져 베이거나 다칠 염려가 없으며 열확산 및 방열은 원활하게 이루어진다.And even though the aluminum sheet is used, the coating film is made of a hard heat-
따라서, 취급이 용이하여 안전성을 확보하며 제품의 품질관리가 용이하게 이루어진다.Therefore, the handling is easy to ensure the safety and quality control of the product is made easy.
이와 같은 본 발명은 열확산 방열기능이 우수하면서 제조원가가 절감되고 분진발생이 없으며, 취급이 용이하여 작업성을 현저히 향상시켜 준다.The present invention as described above is excellent in thermal diffusion heat dissipation function, manufacturing cost is reduced, there is no dust generation, easy to handle significantly improves workability.
이상, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조하여 설명하였다.In the above, preferred embodiments of the present invention have been described with reference to the accompanying drawings.
여기서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.Here, the terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, but should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.
이상에서 상세히 살펴본 바와 같이, 본 발명에 따른 방열시트는 상대적으로 저렴한 알루미늄시트를 사용하여 열확산 방열기능이 우수하면서 제조원가가 절감됨과 아울러 경질 내열수지로 코팅이 이루어지므로 베이거나 다칠 염려가 없어 취급이 안전 용이하고 작업생산성을 현저히 향상시켜 주는 뛰어난 효과가 있다.As described in detail above, the heat dissipation sheet according to the present invention is excellent in thermal diffusion heat dissipation function using a relatively inexpensive aluminum sheet while reducing the manufacturing cost and the coating is made of a hard heat-resistant resin, so there is no fear of being cut or injured, so handling is safe. It has an outstanding effect of easy and remarkably improving work productivity.
Claims (5)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080076303A KR20080078625A (en) | 2008-08-05 | 2008-08-05 | Heat dissipation sheet |
| KR1020090030023A KR100969194B1 (en) | 2008-08-05 | 2009-04-07 | Heat dissipation sheet |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020080076303A KR20080078625A (en) | 2008-08-05 | 2008-08-05 | Heat dissipation sheet |
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| KR20080078625A true KR20080078625A (en) | 2008-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020080076303A KR20080078625A (en) | 2008-08-05 | 2008-08-05 | Heat dissipation sheet |
| KR1020090030023A KR100969194B1 (en) | 2008-08-05 | 2009-04-07 | Heat dissipation sheet |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020090030023A KR100969194B1 (en) | 2008-08-05 | 2009-04-07 | Heat dissipation sheet |
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| KR (2) | KR20080078625A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9065160B2 (en) | 2012-02-08 | 2015-06-23 | Hyundai Motor Company | Radiant heat plate for battery cell module and battery cell module having the same |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101219783B1 (en) * | 2010-07-28 | 2013-01-09 | 김남호 | Led lighting device using static current source |
| KR20120065136A (en) | 2010-12-10 | 2012-06-20 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display, manufacturing method and manufacturing equipment thereof |
| KR101883389B1 (en) | 2011-06-13 | 2018-08-31 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
| KR101500482B1 (en) * | 2013-11-06 | 2015-03-09 | (주)유니코엠텍 | Multilayer heat sheet |
| US10820455B2 (en) | 2016-11-22 | 2020-10-27 | Samsung Display Co., Ltd. | Display device |
| KR102191604B1 (en) | 2017-07-06 | 2020-12-15 | 주식회사 엘지화학 | Preparation method for composite material |
| EP3651560A1 (en) | 2017-07-06 | 2020-05-13 | LG Chem, Ltd. | Composite material |
| KR102191613B1 (en) | 2017-09-15 | 2020-12-15 | 주식회사 엘지화학 | Composite material |
| KR102191614B1 (en) | 2017-09-15 | 2020-12-15 | 주식회사 엘지화학 | Composite material |
| KR102184386B1 (en) | 2017-09-15 | 2020-11-30 | 주식회사 엘지화학 | Preparation method for composite material |
| KR102191615B1 (en) | 2017-09-22 | 2020-12-15 | 주식회사 엘지화학 | Composite material |
| KR102259322B1 (en) * | 2019-06-18 | 2021-06-01 | 지티하이테크(주) | Rapid heat-radiating sheet structure for electronic equipment and electronic equipment with the same |
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| JP4459470B2 (en) | 2001-04-06 | 2010-04-28 | 信越化学工業株式会社 | Electronic component heat dissipation structure and heat dissipation sheet used therefor |
| JP3903021B2 (en) * | 2002-04-09 | 2007-04-11 | キヤノン株式会社 | Image forming apparatus and image forming control system |
| KR200381062Y1 (en) * | 2005-01-06 | 2005-04-11 | 주식회사 메틱스 | A thermal conductive sheet using by metal fiber |
| KR100723298B1 (en) * | 2005-08-23 | 2007-05-30 | (주) 나노텍 | Heat dissipation structure using prepreg impregnated with carbon material |
| KR20070079891A (en) * | 2006-02-03 | 2007-08-08 | 김경일 | Heat dissipation sheet |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9065160B2 (en) | 2012-02-08 | 2015-06-23 | Hyundai Motor Company | Radiant heat plate for battery cell module and battery cell module having the same |
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| KR20100017043A (en) | 2010-02-16 |
| KR100969194B1 (en) | 2010-07-09 |
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