KR20050019232A - Heat conduction sheet - Google Patents
Heat conduction sheet Download PDFInfo
- Publication number
- KR20050019232A KR20050019232A KR1020030056877A KR20030056877A KR20050019232A KR 20050019232 A KR20050019232 A KR 20050019232A KR 1020030056877 A KR1020030056877 A KR 1020030056877A KR 20030056877 A KR20030056877 A KR 20030056877A KR 20050019232 A KR20050019232 A KR 20050019232A
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- heat dissipation
- sensitive adhesive
- sheet
- adhesive layer
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
Description
본 발명은 고분자 물질을 포함하는 필름 또는 시트의 제조에 관하여, 특히 파워 트랜지스터, 플라스마 디스플레이 패널(PDP) 등의 전자 기기류의 발열원과 알루미늄 냉각 핀 등의 히트 싱크 사이에 끼워 넣어 간극을 메꿈으로써 효율적으로 열을 발산하는 방열 시트에 관한 것이다.BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to the production of a film or sheet containing a polymer material, particularly by filling a gap between a heat source of an electronic device such as a power transistor or a plasma display panel (PDP) and a heat sink such as an aluminum cooling fin. It is related with the heat radiating sheet which radiates heat.
최근, 전자 기기의 고성능화, 소형화로 발전, 이에 동반된 반도체를 비롯한 전자 부품의 고밀도화, 고기능화에 의해, 전자 부품 자체가 대량의 열을 발생하도록 되어 있다. 이 열을 그대로 방치해 두면 해당 전자 부품의 품질을 열화시키거나 해당 전자 부품을 손상하기 때문에, 전자 부품이 발생시키는 열을 효율적으로 제거하기 위한 장치 또는 기구가 필요하다.In recent years, due to high performance and miniaturization of electronic devices, high density and high functionality of electronic components including semiconductors, the electronic components themselves generate a large amount of heat. If the heat is left as it is, the quality of the electronic component is deteriorated or the electronic component is damaged. Therefore, an apparatus or mechanism for efficiently removing the heat generated by the electronic component is required.
현재, 전자 기기 속의 발열원이 발생하는 열을 제거하는 방법으로써, 전자 기기류의 발열원과 알루미늄 냉각핀 사이에 방열재를 끼워 넣고 있다. 여기서 사용하는 방열재는 실리콘 방열 시트, 아크릴계 방열 감압(感壓) 접착제 시트, 우레탄계 방열 감압 접착제 시트 등이 있다. 이들 방열재는 유연한 고분자 재료에 열전도도가 큰 충전재를 혼합한 것이다.At present, a heat dissipating material is sandwiched between a heat generating source of an electronic device and an aluminum cooling fin as a method of removing heat generated by a heat generating source in an electronic device. The heat dissipation material used here is a silicone heat dissipation sheet, an acrylic heat dissipation pressure sensitive adhesive sheet, a urethane type heat dissipation pressure sensitive adhesive sheet, or the like. These heat dissipating materials mix | blend the filler with high thermal conductivity with a flexible polymer material.
전술한 종래의 실리콘 방열 시트, 아크릴계 방열 감압 접착제 시트, The above-mentioned conventional silicone heat dissipation sheet, acrylic heat dissipation pressure sensitive adhesive sheet,
우레탄계 방열 감압 접착제 시트는, 열전도도가 낮아 전자기기류의 Urethane type heat dissipation pressure sensitive adhesive sheet has low thermal conductivity
발열원을 효과적으로 감소시키지 못하는 문제점이 있다.There is a problem that does not effectively reduce the heat source.
본 발명은 전술한 사정을 감안한 것이며, 본 발명의 목적은 발열원과 알루미늄 냉각핀 등의 히트 싱크 사이의 고정이 가능하며, 또한 방열 성능이 우수한 방열 시트와 그 제조 방법, 및 방열 시트를 이용한 플라스마 디스플레이 패널을 제공하는 것이다.SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a heat dissipation sheet capable of fixing between a heat source and a heat sink such as an aluminum cooling fin and having excellent heat dissipation performance, a method of manufacturing the same, and a plasma display using the heat dissipation sheet. To provide a panel.
본 발명은 감압 접착제의 성능을 가짐과 동시에, 전자 기기류의 발열원과 알루미늄 냉각핀 등의 히트 싱크 사이에 끼워 넣어 간극을 매꿈으로써 효율적으로 열을 방출시키는 방열 시트에 관한 것이며, 본 발명의 상기 목적은 GRAPHITE 방열 시트의 표면 또는 표면의 일부에 감압 접착제층을 접착함으로써 달성된다. 여기서, 상기 감압 접착제층는 아크릴계 점착제 또는 우레탄계 점착제로 구성되는 것이 바람직하며, 또한 이 감압 접착제층에 방열성 충전제가 배합되는 것이 효과적이다. The present invention relates to a heat dissipation sheet having a performance of a pressure-sensitive adhesive and simultaneously dissipating heat by sandwiching a gap between a heat source of an electronic device and a heat sink such as an aluminum cooling fin. It is achieved by adhering a pressure-sensitive adhesive layer to the surface or a part of the surface of the GRAPHITE heat dissipation sheet. Here, it is preferable that the said pressure sensitive adhesive layer is comprised from an acrylic adhesive or a urethane type adhesive, and it is effective that a heat dissipation filler is mix | blended with this pressure sensitive adhesive layer.
또한, 본 발명의 방열 시트를 플라스마 디스플레이 패널과 방열판 사이에 밀착시켜 끼우고, 상기 방열 시트의 감압 접착층에 의해 상기 플라스마 디스플레이 패널과 상기 방열판을 고정하는 플라스마 디스플레이 패널 표시 장치를 제작할 수 있다.Further, the heat dissipation sheet of the present invention can be inserted in close contact between the plasma display panel and the heat dissipation plate, and a plasma display panel display device can be manufactured which fixes the plasma display panel and the heat dissipation plate by the pressure-sensitive adhesive layer of the heat dissipation sheet.
이하 본 발명의 실시 형태에 관하여, 도면을 참조하면서 상세히 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail, referring drawings.
도 1은 본 발명이 방열 시트(1)의 구조를 도시한 단면 개략도이다. 본 발명의 방열 시트(1)는 도 1에 도시된 바와 같이 GRAPHITE 방열층(2)과 감압 접착제층(3)으로 구성된다. 감압 접착제층(3)은 주로 전자 기기류의 발열원과 알루미늄 냉각핀 등의 히트 싱크 사이에 본 발명의 방열 시트(1)를 고정하는 역할을 담당한다. GRAPHITE 방열층(2)은 상기 전자 기기류의 발열원으로부터 나오는 열을 효율적으로 상기 히트 싱크로 전달하는 역할을 담당한다, 따라서 감압 접착제층(3)은 GRAPHITE 방열층(2)의 표면 또는 표면의 일부에 접착된다.1 is a schematic cross-sectional view showing the structure of a heat dissipation sheet 1 according to the present invention. The heat dissipation sheet 1 of the present invention is composed of a GRAPHITE heat dissipation layer 2 and a pressure-sensitive adhesive layer 3 as shown in FIG. The pressure sensitive adhesive layer 3 mainly plays a role of fixing the heat dissipation sheet 1 of the present invention between a heat source of electronic equipment and a heat sink such as an aluminum cooling fin. The GRAPHITE heat dissipation layer 2 plays a role of efficiently transferring heat from the heat generating source of the electronic device to the heat sink, so that the pressure-sensitive adhesive layer 3 adheres to the surface or part of the surface of the GRAPHITE heat dissipation layer 2. do.
상기와 같이 GRAPHITE 방열층의 표면에 형성된 감압 접착제층은, 유연하며, 감압 접착제층의 성능을 가지면서도 열전도성이 우수한 방열 시트로 이루어진다. As described above, the pressure-sensitive adhesive layer formed on the surface of the GRAPHITE heat dissipation layer is made of a heat dissipation sheet that is flexible and has excellent thermal conductivity while having the performance of the pressure-sensitive adhesive layer.
본 발명에 의한 방열 시트 전체의 열전도율은 내부의 GRAPHITE 방열층의Thermal conductivity of the entire heat dissipation sheet according to the present invention is the
열전도율보다 약간 저하한다. Slightly lower than the thermal conductivity.
이것은 충전제를 배합하지 않은 갑압 접착제층의 열전도율이 낮기 때문에, 이 열전도율의 저하를 억제하기 위해 감압 접착제층의 두께를 얇게 하고, 가능한 범위 내에서 감압 접착제층 속에 충전제를 배합하는 것이 바람직하다. 구체적으로 감압 접착제층의 두께는 GRAPHITE 방열층 두께의 30% 이하가 되도록 제조하는 것이 바람직하다.Since the heat conductivity of the pressure-sensitive adhesive layer which does not mix | blend filler is low, in order to suppress this fall of heat conductivity, it is preferable to make thickness of a pressure-sensitive adhesive layer thin, and to mix | blend a filler in a pressure-sensitive adhesive layer as much as possible. Specifically, the thickness of the pressure-sensitive adhesive layer is preferably manufactured so as to be 30% or less of the thickness of the GRAPHITE heat dissipation layer.
또한, 감압 접착제로는 충전제를 배합함으로써 열전도율이 개선되는 것이면 좋고, 상기 아크릴계 또는 우레탄계의 감압 접착제층에 한정되는 것은 아니다.In addition, as a pressure sensitive adhesive, what is necessary is just to improve thermal conductivity by mix | blending a filler, It is not limited to the said acrylic type or urethane type pressure sensitive adhesive layer.
본 발명의 청구항 1에 기재된 발명은, GRAPHITE 방열층의 표면 또는 The invention described in claim 1 of the present invention is a surface of a GRAPHITE heat dissipation layer or
표면의 일부에 감압 접착제층을 접착시킴으로써, 높은 열전도율과 감압 접착제의 성능을 가지는 방열 시트를 제공할 수 있다. By adhering a pressure-sensitive adhesive layer to a part of the surface, a heat radiation sheet having high thermal conductivity and performance of the pressure-sensitive adhesive can be provided.
종래의 방열 시트로는 열전도도가 낮아, 전자기기류의 발열원을 효과적으로The thermal conductivity of the conventional heat dissipation sheet is low, effectively reducing the heat source of the electromagnetic stream
감소시키지 못한것에 비교하여 본 발명의 방열 시트는 종래의 방열 시트Compared with not reducing the heat dissipation sheet of the present invention is a conventional heat dissipation sheet
대비 열전도율 특성이 수배 에서 수백배 까지 향상시킬 수 있어 방열 성능이 우수한 전자 기기류의 열설계가 가능하다. Thermal conductivity can be improved from several times to hundreds of times, enabling thermal design of electronic devices with excellent heat dissipation.
도 1은 본 발명의 방열 SHEET 구조를 도시하는 단면 개략도이다. 1 is a cross-sectional schematic diagram showing a heat radiation sheet structure of the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030056877A KR20050019232A (en) | 2003-08-18 | 2003-08-18 | Heat conduction sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030056877A KR20050019232A (en) | 2003-08-18 | 2003-08-18 | Heat conduction sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050019232A true KR20050019232A (en) | 2005-03-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030056877A KR20050019232A (en) | 2003-08-18 | 2003-08-18 | Heat conduction sheet |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1530412A2 (en) | 2003-10-14 | 2005-05-11 | Advanced Energy Technology Inc. | Method for applying heat spreaders to plasma display panels |
| EP1530413A2 (en) | 2003-10-14 | 2005-05-11 | Advanced Energy Technology Inc. | Heat spreader for emissive display device |
| EP1673754A2 (en) | 2003-10-14 | 2006-06-28 | Advanced Energy Technology Inc. | Heat spreader for display device |
| US7276273B2 (en) | 2003-10-14 | 2007-10-02 | Advanced Energy Technology Inc. | Heat spreader for display device |
| KR100798833B1 (en) * | 2004-01-13 | 2008-01-28 | 제팬 마텍스 카부시키가이샤 | A Heat Spreader |
| US20100132871A1 (en) * | 2008-11-28 | 2010-06-03 | Fuji Polymer Industries Co., Ltd. | Thermal diffusion sheet and method for mounting the same |
| TWI384937B (en) * | 2007-03-29 | 2013-02-01 | Polymatech Co Ltd | Thermally conductive sheet and method of manufacturing the same |
| CN103747651A (en) * | 2013-12-19 | 2014-04-23 | 昆山欣海韵贸易有限公司 | Double-surfaced adhesive tape packaging graphite heat-radiating fin |
| US9253924B2 (en) | 2005-06-27 | 2016-02-02 | Graftech International Holdings Inc. | Optimized frame system for a display device |
| US9250462B2 (en) | 2005-06-27 | 2016-02-02 | Graftech International Holdings Inc. | Optimized frame system for a liquid crystal display device |
| US9253932B2 (en) | 2005-06-27 | 2016-02-02 | Graftech International Holdings Inc. | Display device having improved properties |
| KR20160128583A (en) | 2015-04-29 | 2016-11-08 | 전준모 | Artificial language bypassing underwater |
| US9761403B2 (en) | 2003-10-14 | 2017-09-12 | Advanced Energy Technologies Llc | Heat spreader for plasma display panel |
-
2003
- 2003-08-18 KR KR1020030056877A patent/KR20050019232A/en not_active Application Discontinuation
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1530412A2 (en) | 2003-10-14 | 2005-05-11 | Advanced Energy Technology Inc. | Method for applying heat spreaders to plasma display panels |
| EP1530413A2 (en) | 2003-10-14 | 2005-05-11 | Advanced Energy Technology Inc. | Heat spreader for emissive display device |
| EP1673754A2 (en) | 2003-10-14 | 2006-06-28 | Advanced Energy Technology Inc. | Heat spreader for display device |
| US7276273B2 (en) | 2003-10-14 | 2007-10-02 | Advanced Energy Technology Inc. | Heat spreader for display device |
| US9761403B2 (en) | 2003-10-14 | 2017-09-12 | Advanced Energy Technologies Llc | Heat spreader for plasma display panel |
| KR100798833B1 (en) * | 2004-01-13 | 2008-01-28 | 제팬 마텍스 카부시키가이샤 | A Heat Spreader |
| US9253924B2 (en) | 2005-06-27 | 2016-02-02 | Graftech International Holdings Inc. | Optimized frame system for a display device |
| US9250462B2 (en) | 2005-06-27 | 2016-02-02 | Graftech International Holdings Inc. | Optimized frame system for a liquid crystal display device |
| US9253932B2 (en) | 2005-06-27 | 2016-02-02 | Graftech International Holdings Inc. | Display device having improved properties |
| TWI384937B (en) * | 2007-03-29 | 2013-02-01 | Polymatech Co Ltd | Thermally conductive sheet and method of manufacturing the same |
| US8273209B2 (en) * | 2008-11-28 | 2012-09-25 | Fuji Polymer Industries Co., Ltd. | Thermal diffusion sheet and method for mounting the same |
| US20100132871A1 (en) * | 2008-11-28 | 2010-06-03 | Fuji Polymer Industries Co., Ltd. | Thermal diffusion sheet and method for mounting the same |
| CN103747651A (en) * | 2013-12-19 | 2014-04-23 | 昆山欣海韵贸易有限公司 | Double-surfaced adhesive tape packaging graphite heat-radiating fin |
| KR20160128583A (en) | 2015-04-29 | 2016-11-08 | 전준모 | Artificial language bypassing underwater |
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